CN202155654U - Improved weldability tester - Google Patents
Improved weldability tester Download PDFInfo
- Publication number
- CN202155654U CN202155654U CN2011202626399U CN201120262639U CN202155654U CN 202155654 U CN202155654 U CN 202155654U CN 2011202626399 U CN2011202626399 U CN 2011202626399U CN 201120262639 U CN201120262639 U CN 201120262639U CN 202155654 U CN202155654 U CN 202155654U
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- CN
- China
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- control panel
- tin stove
- pcb
- timer
- infrared
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- Expired - Lifetime
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Abstract
The utility model discloses an improved weldability tester, which comprises a tin stove. A control panel is mounted on a side wall of the tin stove, and a timer, a buzzer and a temperature regulator are mounted on the control panel. An infrared receiver and an infrared transmitter are mounted on two sides of the top of the tin stove, the timer is mounted on the control panel of the tin stove, and accordingly, weldability detection of a PCB (printed circuit board) can be carried out. The PCB is dipped in tin liquid of the tin stove, when penetrating through a space between the infrared receiver and the infrared transmitter, the PCB blocks infrared signals, at the moment, the control panel generates corresponding induction signals and controls the timer to start timing, and after set time is up, the buzzer starts alarming to remind an operator of taking out the PCB. Detection time of weldability detection can be accurately controlled, and the problem that testing results are not ideal or accurate is effectively avoided. Compared with the prior art, the improved weldability tester has the advantages of precise testing time debugging, accurate temperature control, alarming and prompting effect and the like.
Description
Technical field
The utility model relates to the solderability tester, particularly a kind of modified form solderability tester.
Background technology
Become the most important and crucial part of electronics and IT products as the carrier of various components and parts and the hinge pcb board of circuit signal transmission; The quality of its quality and reliability level have determined the quality and reliability of whole set equipment; Because the environmental requirement of the highdensity development trend of PCB and unleaded and Halogen, the various Problem of Failure of failure welding, plate bursting, layering, CAF or the like have appearred in increasing PCB.
And the problem that pcb board occurred is relevant with the weldability and the thermal stress of pcb board usually.Weldability is meant adopting certain welding procedure to comprise under the conditions such as welding method, welding material, welding conditions and Welding Structure form, obtains the complexity of good welding point; Thermal stress is that dilatancy or contraction distortion everywhere is inconsistent owing to the member inhomogeneous temperature contrast that exists of being heated, and retrains each other and the internal stress that produces.
Weldability and thermal stress for pcb board need detect it through the solderability tester of special use, and the solderability tester is a kind of instrumentation that is used for pcb board solderability and thermal stress test.
But present solderability tester does not have the testing time to show; In the process of welding property testing, thermal stress test, need provide stopwatch for oneself and be used for timing or roughly evaluation time completion test, so can cause testing the undesirable and inaccurate problem of test result of effect.
The utility model content
For this reason, the purpose of the utility model is to provide a kind of modified form solderability tester, does not have the testing time to show to solve traditional solderability tester, when testing, can cause testing the undesirable and inaccurate problem of test result of effect.
For realizing above-mentioned purpose, the utility model mainly adopts following technical scheme:
A kind of modified form solderability tester comprises tin stove (1), and a control panel (4) is installed on the sidewall of said tin stove (1), and timer (5), buzzer (6) and temperature regulator (7) are installed on this control panel (4).
Wherein said tin stove (1) top one side is equipped with infrared remote receiver (2), and opposite side is equipped with infrared transmitter (3), and said infrared remote receiver (2) is corresponding with infrared transmitter (3) position, and all is connected with control panel (4).
The utility model is equipped with infrared remote receiver and infrared transmitter through the both sides, top at the tin stove, on the control panel of tin stove, timer is installed, when pcb board is carried out the solderability detection; Pcb board is immersed in the tin liquor of tin stove, when pcb board passes between infrared remote receiver and the infrared transmitter, infrared signal is blocked; This moment, control panel produced corresponding induced signal, and the control timer picks up counting, and computing time is behind setting-up time; Buzzer begins to report to the police, and pcb board is taken out in prompting.
The utility model can accurately be grasped the detection time that solderability detects, and has effectively avoided the undesirable and inaccurate problem of test result of test effect.Compared with prior art, the utlity model has testing time debugging accurately, advantages such as temperature precise control and alarm.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Identifier declaration among the figure: tin stove 1, infrared remote receiver 2, infrared transmitter 3, control panel 4, timer 5, buzzer 6, temperature regulator 7.
The specific embodiment
For setting forth the thought and the purpose of the utility model, will combine accompanying drawing and specific embodiment that the utility model is done further explanation below.
See also shown in Figure 1ly, Fig. 1 is the structural representation of the utility model.The utility model provides a kind of modified form solderability tester; A timer is installed on the control panel of tin stove; Through this timer the testing time of solderability test is controlled; Effectively guarantee the result of its detection, avoided the undesirable and inaccurate problem of test result of test effect.
The utility model modified form solderability tester wherein; Include tin stove 1, a control panel 4 is installed on the sidewall of said tin stove 1, timer 5, buzzer 6 and temperature regulator 7 are installed on this control panel 4; Said tin stove 1 top one side is equipped with infrared remote receiver 2; Opposite side is equipped with infrared transmitter 3, and said infrared remote receiver 2 is corresponding with infrared transmitter 3 positions, and all is connected with control panel 4.
The utility model operation principle is: at first with clip pcb board is clamped, passed between above-mentioned infrared remote receiver 2, the infrared transmitter 3, it is immersed in the tin liquor in the tin stove 1; When pcb board is blocked the infrared ray between infrared remote receiver 2 and the infrared transmitter 3; Produce corresponding signal feedback to control panel 4, control panel 4 produces control signal control timer 5 and picks up counting, and the timing here is countdown; When it makes zero; Control buzzer 6 is reported to the police, and the pcb board that will be arranged in tin liquor with prompting takes out, and accomplishes solderability and detects.
Be used for controlling and adjusting the tin liquor temperature of tin stove 1 for 7 of temperature regulators, so that realize thermal stress test to pcb board.
More than be that a kind of modified form solderability tester that the utility model is provided has carried out detailed introduction; Used concrete example among this paper the structural principle and the embodiment of the utility model are set forth, above embodiment just is used to help to understand the method and the core concept thereof of the utility model; Simultaneously, for one of ordinary skill in the art, according to the thought of the utility model, the part that on the specific embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the utility model.
Claims (2)
1. a modified form solderability tester comprises tin stove (1), it is characterized in that on the sidewall of said tin stove (1) control panel (4) being installed, and timer (5), buzzer (6) and temperature regulator (7) are installed on this control panel (4).
2. modified form solderability tester according to claim 1; It is characterized in that said tin stove (1) top one side is equipped with infrared remote receiver (2); Opposite side is equipped with infrared transmitter (3), and said infrared remote receiver (2) is corresponding with infrared transmitter (3) position, and all is connected with control panel (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202626399U CN202155654U (en) | 2011-07-22 | 2011-07-22 | Improved weldability tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202626399U CN202155654U (en) | 2011-07-22 | 2011-07-22 | Improved weldability tester |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202155654U true CN202155654U (en) | 2012-03-07 |
Family
ID=45763303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202626399U Expired - Lifetime CN202155654U (en) | 2011-07-22 | 2011-07-22 | Improved weldability tester |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202155654U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113514670A (en) * | 2021-04-21 | 2021-10-19 | 芜湖雅葆轩电子科技股份有限公司 | PCB thermal stress test method |
-
2011
- 2011-07-22 CN CN2011202626399U patent/CN202155654U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113514670A (en) * | 2021-04-21 | 2021-10-19 | 芜湖雅葆轩电子科技股份有限公司 | PCB thermal stress test method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District manhole Street Ho 518000 Shenzhen city Guangdong Province four West Industrial Park second building Patentee after: Shenzhen Xinghe circuit Limited by Share Ltd Address before: Baoan District manhole Street Ho 518000 Shenzhen city Guangdong Province four West Industrial Park second building Patentee before: Galaxy Circuit Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170626 Address after: 435000, Hubei province Huangshi economic and Technological Development Zone Jinshan Road 189 B building R & D office 101 Patentee after: Huangshi Xinghe circuit Co., Ltd. Address before: Baoan District manhole Street Ho 518000 Shenzhen city Guangdong Province four West Industrial Park second building Patentee before: Shenzhen Xinghe circuit Limited by Share Ltd |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120307 |