CN206161794U - Circuit board weldbility test platform - Google Patents
Circuit board weldbility test platform Download PDFInfo
- Publication number
- CN206161794U CN206161794U CN201621122464.0U CN201621122464U CN206161794U CN 206161794 U CN206161794 U CN 206161794U CN 201621122464 U CN201621122464 U CN 201621122464U CN 206161794 U CN206161794 U CN 206161794U
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- circuit board
- melting furnace
- test platform
- control panel
- tin melting
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Abstract
The utility model discloses a circuit board weldbility test platform, include: specimen grip holds the device, unleadedly melts the tin stove, dries in the air and puts the board and observe the laboratory bench, specimen grip holds the device and includes base, support column, crossbeam, lift post and anchor clamps, and unleaded melting is equipped with control panel, soldering tin groove and switch on the tin stove, it sets up district, time setting district to be equipped with counter, alarm, temperature on the control panel, soldering tin groove both sides are equipped with infra -red transmitter and infrared receiver, and infra -red transmitter and infrared receiver are connected with the controller, but soldering tin is equipped with PC and signal processor above observing the laboratory bench, and the signal processor input is connected with the linear displacement sensor who sets up above the lift post, signal processor's output and PC are connected. The utility model discloses simulation welding process, linear displacement sensor catches the force variation, and it is interior through image recording appearance software formation weldbility curve, the rapidity and the intensity of negotiating curve judgement weldbility to pass to the PC.
Description
Technical field
The utility model is related to circuit board testing device, specifically a kind of circuit board solderability test platform.
Background technology
Microelectronics industry is developed rapidly, and being increasingly miniaturized for chip package not only promote the highly dense of printed circuit board
Degree, multiple stratification direction are developed, while also proposing tightened up requirement, circuit board matter to techniques such as the solderabilities of printed circuit board
The quality of amount determines the quality and reliability of whole set equipment with reliable level, due to the highdensity development trend of circuit board with
And it is unleaded with Halogen environmental requirement, there is the problems such as failure welding, plate bursting, layering in increasing circuit board.At the same time,
The lead-free process of electronic product is to solderability more and more higher.Solderability test is, by selection sample, to be simulated welding process,
According to test result judgement sample solderability quality.The conventional method of testing of solderability is that test sample product are immersed in tin stove, one
Take out after fixing time, by 30 power microscopes, check and climb tin area, it is qualified that generally definition climb tin area to reach more than 95%.This
Method of testing is simple, low cost, but its test preciseness is poor, is affected larger by artificial subjective factor, is easily caused test
As a result it is inaccurate.
Utility model content
Utility model purpose：For the problem and shortage of above-mentioned presence of the prior art, the purpose of this utility model is
A kind of circuit board solderability test platform is provided.Simulation welding process, linear displacement transducer catches the change of power, passes to PC
It is interior that solderable linearity curve is formed by image recorder software, the rapidity and intensity of solderability are judged by curve.
Technical scheme：To reach above-mentioned purpose, a kind of circuit board solderability test platform described in the utility model, bag
Include：Sample clamping device, unleaded tin melting furnace, hang plate and observation experiment platform；It is left that sample clamping device is arranged on unleaded tin melting furnace
Side, hangs the top that plate is located at unleaded tin melting furnace and observation experiment platform, and the sample clamping device includes base, support column, horizontal
Beam, lifting column and fixture, the support column is arranged on base top, and the base is provided with elevating control button, and crossbeam is fixed
Arrange on the support columns, lifting column is installed on crossbeam, the lifting column is provided with linear displacement transducer, and lifting column lower section is installed
Fixture, the unleaded tin melting furnace is provided with control panel, solder bath and power switch, and the control panel and power switch are arranged on nothing
Lead tin melting furnace left side, the control panel is provided with counter, alarm, temperature setting area, set of time area, the solder bath two
Side is provided with infrared transmitter and infrared remote receiver, and the infrared transmitter is corresponding with infrared remote receiver position, described infrared
Emitter and infrared remote receiver are connected with controller, described to be provided with PC and signal processor, institute above scolding tin observation experiment platform
State signal processor input and be connected with the linear displacement transducer being arranged on above lifting column, the output of the signal processor
End is connected with PC.
Further, the base top is provided with detected sample rest area.Sample to be measured is placed into
Face, facilitates operating personnel that sample is placed on fixture.
Further, the fixture is corresponding up and down with the position of solder bath.Ensure that fixture is clamped to after testing sample accurate
Really fall in solder bath.
Further, the unleaded tin melting furnace top is additionally provided with clear glass protective plate.The design of clear glass protective plate,
When circuit board can be prevented to be dipped into solder bath, liquid spills, and accidentally injures to staff.
Further, the PC Built-in Image recorder software.Linear displacement transducer catches the change of power, passes to PC
Solderable linearity curve is formed by image recorder software in machine, abscissa is the time, and ordinate is power, then judged by curve
The rapidity and intensity of solderability.
Above-mentioned technical proposal can be seen that the beneficial effects of the utility model：
（1）A kind of circuit board solderability test platform described in the utility model, by sample clamping device, unleaded molten tin
Stove, hang plate and observation experiment platform sets gradually in the same horizontal line, simulate welding process, linear displacement transducer catches
The change of power, passes in PC and forms solderable linearity curve by image recorder software, and abscissa is the time, and ordinate is power,
Then the rapidity and intensity of solderability are judged by curve.
（2）A kind of circuit board solderability test platform described in the utility model, unleaded tin melting furnace is provided with infrared ray and sends out
Emitter and infrared receiver, sense that circuit board sample is placed in unleaded tin melting furnace, by signal transmission to controller, control
Further control counter is counted device to the time that circuit board infiltrates, it is not necessary to manual time-keeping, reduces the timing of staff
Error and workload.
Description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure：1- sample clamping devices, the unleaded tin melting furnaces of 2-, 3- hang plate, 4- observation experiment platforms, 11- bases, 11a- liters
Drop control button, 12- support columns, 13 crossbeams, 14- lifting columns, 15 fixtures, 16- linear displacement transducers, 17- detected samples
Rest area, 21- control panels, 22- solder baths, 23- power switches, 211- counters, 212- alarms, 213- temperature settings area,
214- set of time area, 24- infrared transmitters, 25- infrared remote receivers, 41-PC machines, 42- signal processors.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment, the utility model is further elucidated.
Embodiment
A kind of circuit board solderability test platform as shown in Figure 1, including：Sample clamping device 1, unleaded tin melting furnace 2, dry in the air
Put plate 3 and observation experiment platform 4；Sample clamping device 1 is arranged on the left side of unleaded tin melting furnace 2, hangs plate 3 and is located at unleaded tin melting furnace 2
With the top of observation experiment platform 4, the sample clamping device 1 include base 11, support column 12, crossbeam 13, lifting column 14 and folder
Tool 15, the support column 12 is arranged on the top of base 11, and the base 11 is provided with elevating control button 11a, and crossbeam 13 is fixed
It is arranged on support column 12, lifting column 14 is installed on crossbeam 13, the lifting column 14 is provided with linear displacement transducer 16, lifts
The lower section installs fixture 15 of post 14, the unleaded tin melting furnace 2 is provided with control panel 21, solder bath 22 and power switch 23, the control
Making sheet 21 and power switch 23 are arranged on the left side of unleaded tin melting furnace 2, and the control panel 21 is provided with counter 211, alarm
212nd, temperature setting area 213, set of time area 214, the both sides of the solder bath 22 are provided with infrared transmitter 24 and infrared remote receiver
25, the infrared transmitter 24 is corresponding with the position of infrared remote receiver 25, the infrared transmitter 24 and infrared remote receiver 25 with
Control panel 21 connects, and the top of the observation experiment platform 4 is provided with PC 41 and signal processor 42, and the signal processor 42 is input into
Hold and be connected with the linear displacement transducer 16 for being arranged on the top of lifting column 14, output end and the PC 41 of the signal processor 42
Connection.
The top of base 11 described in the present embodiment is provided with detected sample rest area 17.Sample to be measured is placed into
Face, facilitates operating personnel that sample is placed on fixture 15.
Fixture 15 described in the present embodiment is corresponding up and down with the position of solder bath 2.
The top of unleaded tin melting furnace 2 described in the present embodiment is additionally provided with clear glass protective plate 26.
The Built-in Image recorder software of PC 41 described in the present embodiment.
The specific works step of circuit board solderability test platform is as follows in the present embodiment：
1）. from product to be measured or material, sample is extracted, visually inspect sample, should be without dirty, defect, deformation etc. is bad.
2）. sample is put on detected sample rest area 17 and stands 30 minutes, be allowed to be adapted with environment epidemic disaster.
3）. the power switch 23 of unleaded tin melting furnace 2 is opened, the temperature of solder bath 22 is set as 245 DEG C, and wait has heated up
Into.
4）. tin stove is reached after design temperature, and temperature stabilization, sample is placed in fixture 15 and is fixed, and clicks lifting
Control button 11a, sample immersion solder bath 22, continues 3S.
5）. sample is taken out, is placed on and is hung cooling on plate 3.
6）, image recorder software form solderable linearity curve, experiment is finished, and closes power supply in time, cleaning Experimental Area and
Place.
Embodiment is merely to illustrate the utility model rather than limits scope of the present utility model, is reading this practicality
After new, those skilled in the art fall within what the application claims were limited to various equivalences of the present utility model
Scope.
Claims (5)
1. a kind of circuit board solderability test platform, it is characterised in that：Including：Sample clamping device（1）, unleaded tin melting furnace（2）、
Hang plate（3）With observation experiment platform（4）；Sample clamping device（1）It is arranged on unleaded tin melting furnace（2）Left side, hangs plate（3）It is located at
Unleaded tin melting furnace（2）With observation experiment platform（4）Top, the sample clamping device（1）Including base（11）, support column
（12）, crossbeam（13）, lifting column（14）And fixture（15）, the support column (12) be arranged on base (11) top, the base
(11) elevating control button (11a) is provided with, crossbeam (13) is fixedly installed on support column (12), crossbeam（13）It is upper that lifting is installed
Post（14）, the lifting column (14) is provided with installs fixture (15) below linear displacement transducer (16), lifting column (14), described
Unleaded tin melting furnace (2) is provided with control panel (21), solder bath (22) and power switch (23), and the control panel (21) and power supply are opened
Close (23) and be arranged on unleaded tin melting furnace (2) left side, the control panel (21) is provided with counter (211), alarm (212), temperature
Degree setting area (213), set of time area (214), solder bath (22) both sides are provided with infrared transmitter (24) and infrared receiver
Device (25), the infrared transmitter (24) is corresponding with infrared remote receiver (25) position, the infrared transmitter (24) and infrared
Receiver (25) and control panel（21）Connection, the observation experiment platform（4）Top is provided with PC（41）And signal processor（42）,
The signal processor（42）Input be arranged on lifting column（14）The linear displacement transducer of top（16）Connection, the letter
Number processor（42）Output end and PC（41）Connection.
2. a kind of circuit board solderability test platform according to claim 1, it is characterised in that：The base（11）Top
It is provided with detected sample rest area（17）.
3. a kind of circuit board solderability test platform according to claim 1, it is characterised in that：The fixture（15）With weldering
Molten tin bath（22）Position it is corresponding up and down.
4. a kind of circuit board solderability test platform according to claim 1, it is characterised in that：The unleaded tin melting furnace
（2）Top is additionally provided with clear glass protective plate（26）.
5. a kind of circuit board solderability test platform according to claim 1, it is characterised in that：The PC（41）It is built-in
Image recorder software.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621122464.0U CN206161794U (en) | 2016-10-14 | 2016-10-14 | Circuit board weldbility test platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621122464.0U CN206161794U (en) | 2016-10-14 | 2016-10-14 | Circuit board weldbility test platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206161794U true CN206161794U (en) | 2017-05-10 |
Family
ID=58653092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621122464.0U Active CN206161794U (en) | 2016-10-14 | 2016-10-14 | Circuit board weldbility test platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206161794U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590630A (en) * | 2018-11-23 | 2019-04-09 | 歌尔股份有限公司 | Solderability detection device |
| CN109590631A (en) * | 2018-11-23 | 2019-04-09 | 歌尔股份有限公司 | Solderability detection method |
| CN113359005A (en) * | 2021-05-18 | 2021-09-07 | 深圳市海创嘉科技有限公司 | Clamp and method for testing needle points of PCBA (printed circuit board assembly) |
-
2016
- 2016-10-14 CN CN201621122464.0U patent/CN206161794U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590630A (en) * | 2018-11-23 | 2019-04-09 | 歌尔股份有限公司 | Solderability detection device |
| CN109590631A (en) * | 2018-11-23 | 2019-04-09 | 歌尔股份有限公司 | Solderability detection method |
| WO2020103575A1 (en) * | 2018-11-23 | 2020-05-28 | 歌尔股份有限公司 | Solderability testing device |
| CN113359005A (en) * | 2021-05-18 | 2021-09-07 | 深圳市海创嘉科技有限公司 | Clamp and method for testing needle points of PCBA (printed circuit board assembly) |
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