CN202135449U - Mounting structure of chip mounter - Google Patents
Mounting structure of chip mounter Download PDFInfo
- Publication number
- CN202135449U CN202135449U CN201120237740U CN201120237740U CN202135449U CN 202135449 U CN202135449 U CN 202135449U CN 201120237740 U CN201120237740 U CN 201120237740U CN 201120237740 U CN201120237740 U CN 201120237740U CN 202135449 U CN202135449 U CN 202135449U
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- Prior art keywords
- chip mounter
- suction nozzle
- mounting head
- links
- nozzle
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Abstract
The utility model discloses a mounting structure of a chip mounter, comprising a mounting head and a material tape reel used in cooperation with the mounting head. The mounting head comprises at least two suction nozzle structures, suction nozzle pedestals corresponding to the suction nozzle structures, and a first adjusting structure used for adjusting the distance between the suction nozzle pedestals; the suction nozzle structures are arranged on the suction nozzle pedestals; the suction nozzle pedestals are connected with the adjusting structure; the material tape reel comprises material tape holes used for putting an LED component, and a second adjusting structure used for adjusting the distance between the material tape holes; and the second adjusting structure is connected with the material tape holes. Through the mounting structure of a chip mounter, the whole mounting process is simpler; production efficiency is substantially increased; and the requirement of large scale and line production is satisfied. Meanwhile, the mounting structure of a chip mounter also has the advantages such as simple structure and low cost; and the mounting structure of a chip mounter has strong market competitiveness.
Description
Technical field
The utility model relates to electronics mounting technology field, and particularly a kind of chip mounter mounts structure.
Background technology
Chip mounter is called " placement equipment ", " surface mount system " again.On the SMT production line, chip mounter generally is configured in after point gum machine or the screen process press, is to be placed on a kind of equipment on the PCB pad to Surface Mount Component, exactly through the structure that mounts that is arranged on the chip mounter.Full-automatic or the semi-automatic pattern of the many employings of existing chip mounter.
In electronics mounting technology field, chip mounter since it placement speed that possesses fast, mount accurately, advantages such as labour intensity is low, steady quality, be used widely.Present chip mounter adopts high speed optical centering chip mounter more, and its structure is as shown in Figure 1: said chip mounter comprises a mounting head 10, paster platform 20.Wherein, Said paster platform 20 is used to lay pcb board spare; The nozzle structure of said mounting head (generally comprise and be no more than 5 nozzle structures) is used for Surface Mount Component, is picked up from strip; Under the transmission of guide rail or leading screw, nozzle structure is placed on Surface Mount Component, on the corresponding pad of pcb board in turn exactly then.In the process of mounting, the motion of mounting head is driven by high-speed motor, and whole paster process is very fast, and the scope of application is very extensive.
In recent years, along with the development of LED lighting, LED light-emitting lamp, the chip mounter of prior art is when mounting large-sized led circuit plate; Have certain deficiency: large-sized its length of led circuit plate is generally more than 60 centimetres, and the LED components and parts major part that distributes above all adopts matrix form clocklike to distribute, and it is comparatively single to mount the kind of LED components and parts of use; But enormous amount; In the paster process, if adopt the chip mounter of prior art, because the nozzle structure on its mounting head is less; Promptly carry out paster one time; Can be mounted on the led circuit plate the LED component number seldom, having a strong impact on production efficiency, be unfavorable for the demand of streamlined operation.
In view of this, a kind of new mounting technology that is used for large scale led circuit plate need be provided.
The utility model content
In view of the weak point of above-mentioned prior art, the purpose of the utility model is to provide a kind of structure that mounts of chip mounter, is carrying out large scale led circuit plate when mounting, the problem of inefficiency with the chip mounter that solves prior art.
In order to achieve the above object, the utility model has been taked following technical scheme:
A kind of chip mounter mount structure, be used for the led circuit plate is mounted, wherein, the said structure that mounts comprises: mounting head and the strip dish that is used with mounting head;
Wherein, Said mounting head comprises: N nozzle structure, the suction nozzle base corresponding with nozzle structure, be used to regulate first adjustment structure of distance between the suction nozzle base; Said nozzle structure is arranged on the suction nozzle base, and said suction nozzle base links to each other with adjustment structure, and N is the natural number greater than 10;
Said material list dish comprises: be used to place the LED components and parts the strip hole, be used to regulate second adjustment structure of distance between the strip hole, said second adjustment structure links to each other with the strip hole.
Described chip mounter mount structure, wherein, said first adjustment structure comprises chassis, first guide rail that links to each other with the chassis and second guide rail, said first, second guide rail links to each other with the suction nozzle base respectively.
Described chip mounter mount structure, wherein, said first adjustment structure comprises that one is used for accurately regulating the ruler of suction nozzle base distance.
Described chip mounter mount structure, wherein, said mounting head comprises that also one is used to drive the transmission device of nozzle structure motion, said transmission device links to each other with nozzle structure.
Described chip mounter mount structure, wherein, said transmission device is a leading screw.
Described chip mounter mount structure, wherein, the said structure that mounts comprises that also one confirms the image collecting device of locating information on the led circuit plate, said image collecting device links to each other with mounting head.
Described chip mounter mount structure, wherein, said image collector is changed to CCD.
The chip mounter that the utility model provides mount structure, it comprises mounting head and the strip dish that is used with mounting head; Wherein, Said mounting head comprises: at least 2 nozzle structures, the suction nozzle base corresponding with nozzle structure, be used to regulate first adjustment structure of distance between the suction nozzle base; Said nozzle structure is arranged on the suction nozzle base, and said suction nozzle base links to each other with adjustment structure; Said material list dish comprises: be used to place the LED components and parts the strip hole, be used to regulate second adjustment structure of distance between the strip hole, said second adjustment structure links to each other with the strip hole.Through the structure that mounts of said chip mounter, make the whole process that mounts to oversimplify more, and improved production efficiency greatly, satisfy requirement extensive, the streamlined operation.Simultaneously, the structure that mounts of said chip mounter also has simple in structure, low cost and other advantages, has very strong market competitiveness.
Description of drawings
Fig. 1 is the sketch map of the chip mounter of prior art.
Fig. 2 is the sketch map of the mounting head that mounts structure of the chip mounter of the utility model.
Fig. 3 is the enlarged diagram of A part among Fig. 2.
Fig. 4 is the sketch map of the strip dish that mounts structure of the utility model.
Embodiment
The utility model provides a kind of structure that mounts of chip mounter, and it comprises mounting head and the strip dish that is used with mounting head.For the purpose, technical scheme and the effect that make the utility model is clearer, clear and definite, below with reference to accompanying drawing and give an actual example to the utility model further explain.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
See also Fig. 2, Fig. 2 is the sketch map of the mounting head that mounts structure of the chip mounter of the utility model.As shown in the figure; The said mounting head that mounts structure comprises: at least 2 nozzle structures 100, the suction nozzle base 200 corresponding with nozzle structure 100, be used to regulate first adjustment structure 300 of distance between the suction nozzle base 200; Said nozzle structure 100 is arranged on the suction nozzle base 200, and said suction nozzle base 200 links to each other with adjustment structure 300.
Particularly, said nozzle structure 100 is used for drawing the LED components and parts from the strip dish, and is mounted on the led circuit plate.Said suction nozzle base 200 is used for nozzle structure 100 is fixed on mounting head, and said first adjustment structure 300 is used to regulate the distance between the suction nozzle base 200.Because the LED components and parts major part on each led circuit plate all adopts matrix form clocklike to distribute, its distance each other generally all is a fixed value.Therefore, when mounting, can regulate the distance between the nozzle structure, so that N nozzle structure can mount simultaneously, with enhance productivity (in embodiments of the present invention, N is 36) according to the spacing of the LED components and parts on the circuit board.Said first adjustment structure 300 can adopt various forms, as long as can adjust the distance between the nozzle structure.
See also Fig. 3, in the utility model embodiment, said first adjustment structure comprises chassis 310, first guide rail 320 that links to each other with chassis 310 and second guide rail 330, and said first, second guide rail 320,330 links to each other with the suction nozzle base respectively.Said first guide rail 320 and second guide rail 330 are used to guide nozzle structure to move along first guide rail 320 and second guide rail 330, can also be provided with the fixed block that is used for fixing the nozzle structure position on the said guide rail.So, we just can adjust nozzle structure-regulate the distance between the nozzle structure along the direction of guide rail as required.
Further, said first adjustment structure can also comprise that one is used for accurately regulating the ruler 340 of suction nozzle base distance, and is as shown in Figure 3.Through the scale above the ruler 340, we just can accomplish accurately to regulate the distance between the nozzle structure, simultaneously, can also the records of values of the distance of being regulated be got off, and are convenient to further management and streamlined operation.
Please continue to consult Fig. 4, it is the sketch map of the strip dish that mounts structure of the utility model.As shown in the figure, said material list dish comprises: be used to place the LED components and parts strip hole 400, be used to regulate second adjustment structure 500 of distance between the strip hole 400, said second adjustment structure 500 links to each other with strip hole 400.After we adjust the distance between the nozzle structure on the mounting head according to the spacing of the LED components and parts on the led circuit plate; Because nozzle structure also need pick up the LED components and parts on the strip dish; In order to make said nozzle structure to pick up simultaneously; Just can pass through second adjustment structure 500, press the distance between the nozzle structure, regulate the distance between the strip hole.Wherein, second adjustment structure 500 can adopt the pattern identical with first adjustment structure, and is simple in order to describe here, just superfluous having stated no longer.
Further, said mounting head can also comprise that one is used to drive the transmission device of nozzle structure motion, and said transmission device links to each other with nozzle structure, and in the present embodiment, said drive mechanism is a leading screw.
In addition, can also an image collecting device be installed on mounting head, be used for the located in connection hole on the active catching circuits plate; Obtain locating information on the led circuit plate; According to this locating information, can conveniently regulate between the nozzle structure, and the distance between the strip hole 400.In the utility model embodiment; Said image collecting device can be CCD; Also can be high power optical alignment instrument, said high power optical alignment instrument can directly be caught the anchor point on the pcb board, adjusts the position of the nozzle structure of mounting head automatically; Make said nozzle structure to mount simultaneously, improved placement speed greatly.Be with being appreciated that; Also can connect said image collecting device through computer; Calculate the moving parameter between the spacing of spacing and nozzle structure of the LED components and parts on the circuit board, thereby control the adjusting of distance between the nozzle structure, more can guarantee the accuracy of its adjusting.
Further; The said structure that mounts can also comprise an autocompensation installation; When said nozzle structure (is example with 36 nozzle structures) is being drawn the LED components and parts on the strip dish, severally be not drawn to the LED components and parts if having, be that which nozzle structure is not drawn to the LED components and parts just said autocompensation installation can perceive; So; Autocompensation installation is just controlled the nozzle structure that is not drawn to the LED components and parts, goes to pick up on the strip dish, till all nozzle structures all are drawn to the LED components and parts again.
It is understandable that; Concerning those of ordinary skills; Can be equal to replacement or change according to the technical scheme and the utility model design thereof of the utility model, and all these changes or replacement all should belong to the protection range of the appended claim of the utility model.
Claims (8)
- A chip mounter mount structure, be used for the led circuit plate is mounted, it is characterized in that the said structure that mounts comprises: mounting head and the strip dish that is used with mounting head;Wherein, Said mounting head comprises: at least 2 nozzle structures, the suction nozzle base corresponding with nozzle structure, be used to regulate first adjustment structure of distance between the suction nozzle base; Said nozzle structure is arranged on the suction nozzle base, and said suction nozzle base links to each other with adjustment structure;Said material list dish comprises: be used to place the LED components and parts the strip hole, be used to regulate second adjustment structure of distance between the strip hole, said second adjustment structure links to each other with the strip hole.
- Chip mounter according to claim 1 mount structure, it is characterized in that said first adjustment structure comprises chassis, first guide rail that links to each other with the chassis and second guide rail, said first, second guide rail links to each other with the suction nozzle base respectively.
- Chip mounter according to claim 1 mount structure, it is characterized in that said first adjustment structure comprises that one is used for accurately regulating the ruler of suction nozzle base distance.
- Chip mounter according to claim 1 mount structure, it is characterized in that said mounting head comprises that also one is used to drive the transmission device of nozzle structure motion, said transmission device links to each other with nozzle structure.
- Chip mounter according to claim 4 mount structure, it is characterized in that said transmission device is a leading screw.
- Chip mounter according to claim 1 mount structure, it is characterized in that the said structure that mounts also comprises the image collecting device that obtains locating information on the led circuit plate, said image collecting device links to each other with mounting head.
- Chip mounter according to claim 6 mount structure, it is characterized in that said image collector is changed to CCD.
- Chip mounter according to claim 1 mount structure, it is characterized in that nozzle structure is 36.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120237740U CN202135449U (en) | 2011-07-07 | 2011-07-07 | Mounting structure of chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120237740U CN202135449U (en) | 2011-07-07 | 2011-07-07 | Mounting structure of chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202135449U true CN202135449U (en) | 2012-02-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120237740U Expired - Fee Related CN202135449U (en) | 2011-07-07 | 2011-07-07 | Mounting structure of chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202135449U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102271468A (en) * | 2011-07-07 | 2011-12-07 | 余耀国 | Mounting structure of mounter |
| CN102724862A (en) * | 2012-07-04 | 2012-10-10 | 方强 | Chip mounter for light emitting diode (LED) lamp panel and mounting head of chip mounter |
| CN105979763A (en) * | 2016-07-15 | 2016-09-28 | 中山市鸿菊自动化设备制造有限公司 | Novel suction nozzle rod structure of surface mounted machine |
| CN103596416B (en) * | 2013-01-09 | 2017-01-11 | 中山市鸿菊自动化设备制造有限公司 | High-speed array chip mounter |
| CN108135121A (en) * | 2018-01-30 | 2018-06-08 | 深圳市易通自动化设备有限公司 | A kind of chip mounter |
| CN109178924A (en) * | 2018-08-01 | 2019-01-11 | 东莞盛翔精密金属有限公司 | A kind of varied angle becomes the blanking machine of spacing |
| CN109890196A (en) * | 2019-03-30 | 2019-06-14 | 深圳市亚的斯自动化设备有限公司 | It is a kind of can it is convenient adjust suction nozzle spacing mounting head |
| CN110602938A (en) * | 2019-09-23 | 2019-12-20 | 中电智能卡有限责任公司 | Module implanting device and module implanting machine |
-
2011
- 2011-07-07 CN CN201120237740U patent/CN202135449U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102271468A (en) * | 2011-07-07 | 2011-12-07 | 余耀国 | Mounting structure of mounter |
| CN102724862A (en) * | 2012-07-04 | 2012-10-10 | 方强 | Chip mounter for light emitting diode (LED) lamp panel and mounting head of chip mounter |
| CN102724862B (en) * | 2012-07-04 | 2015-09-30 | 深圳信息职业技术学院 | A kind of LED lamp panel chip mounter and mounting head thereof |
| CN103596416B (en) * | 2013-01-09 | 2017-01-11 | 中山市鸿菊自动化设备制造有限公司 | High-speed array chip mounter |
| CN105979763A (en) * | 2016-07-15 | 2016-09-28 | 中山市鸿菊自动化设备制造有限公司 | Novel suction nozzle rod structure of surface mounted machine |
| CN105979763B (en) * | 2016-07-15 | 2018-08-31 | 中山市鸿菊自动化设备制造有限公司 | A kind of novel suction nozzle rod structure of chip mounter |
| CN108135121A (en) * | 2018-01-30 | 2018-06-08 | 深圳市易通自动化设备有限公司 | A kind of chip mounter |
| CN108135121B (en) * | 2018-01-30 | 2024-01-16 | 深圳市易通自动化设备有限公司 | Chip mounter |
| CN109178924A (en) * | 2018-08-01 | 2019-01-11 | 东莞盛翔精密金属有限公司 | A kind of varied angle becomes the blanking machine of spacing |
| CN109890196A (en) * | 2019-03-30 | 2019-06-14 | 深圳市亚的斯自动化设备有限公司 | It is a kind of can it is convenient adjust suction nozzle spacing mounting head |
| CN110602938A (en) * | 2019-09-23 | 2019-12-20 | 中电智能卡有限责任公司 | Module implanting device and module implanting machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120201 Termination date: 20120707 |