CN202120980U - Light emitting diode packaging unit - Google Patents
Light emitting diode packaging unit Download PDFInfo
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- CN202120980U CN202120980U CN201120151872XU CN201120151872U CN202120980U CN 202120980 U CN202120980 U CN 202120980U CN 201120151872X U CN201120151872X U CN 201120151872XU CN 201120151872 U CN201120151872 U CN 201120151872U CN 202120980 U CN202120980 U CN 202120980U
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- support
- guide block
- pedestal
- encapsulation unit
- shrinkage pool
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- 238000004806 packaging method and process Methods 0.000 title 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 80
- 238000005538 encapsulation Methods 0.000 claims abstract description 55
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- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model provides a light emitting diode encapsulation unit contains light emitting diode crystalline grain, pedestal and supporting structure. The base body comprises a first concave hole, and the support structure comprises a first support and a second support. The first bracket and the second bracket are respectively provided with a first end and a second end. The second end of the first support and the second end of the second support are turned over to the bottom surface of the seat body from the outer side of the seat body, and the area of the second end of the first support turned over to the bottom surface of the seat body is larger than the area of the second end of the second support turned over to the bottom surface of the seat body. The design can enlarge the heat dissipation area of the first bracket for bearing the LED crystal grains, thereby improving the heat dissipation efficiency and prolonging the service life.
Description
Technical field
The utility model relates to a kind of semiconductor subassembly, relates in particular to a kind of photoemissive luminescence component that is applicable to that has a potential barrier or surface potential barrier at least.
Background technology
The earth is faced with the challenge of energy shortage and environmental pollution, impels energy-conservation and environmental protection to be regarded as one of important development strategy by various countries.Though led technology was invented in a large amount of exploitations in the sufficient various countries of the energy and not serious as yet epoch of environmental pollution; But along with the problem of energy and environment is on the rise; Light-emitting diode becomes the star of the energy-conserving and environment-protective that attract the attention of millions of people; No matter the light-emitting diode product of dealer or the scholar development diversification of racking one's brains invariably provides popular and uses in daily life.
Light-emitting diode, utilizes high power to produce enough brightness and replaces existing illumination towards the high power technical development in the process of evolution.The heat that high power produces concentrates on small-sized intragranular; In case temperature raises, related causing connects surface temperature rising, the sharp decrease in efficiency of penetrating of fluorescent material, not only quickens the deterioration of crystal grain itself and encapsulating material at last; And cause luminous efficiency to descend, have a strong impact on the useful life of light-emitting diode.
Taiwan patent No. M397599 promptly is the support improvement heat dissipation problem to light-emitting diode; Learn but anatomize: preceding case metallic support heat radiation is difficult for; Because carry the heat energy that first metallic support of crystal grain must conduct the overwhelming majority; When first, second metallic support folds in the area of pedestal bottom surface when all identical, first metallic support certainly will can't conduct most heat energy in real time, causes heat energy to continue to accumulate on intragranular.Preceding case is not done the Electrostatic Discharge protection, and light-emitting diode does not have the design of preventing electro-static discharge, in case the static of accumulation is triggered, will produces high immediate current and destroy light-emitting diode, the running of electronic product arround the static of retention also can continue to disturb.
There is the dealer to propose to utilize guard assembly to prevent the destruction of static discharge at present; The common practice promptly is that guard assembly and LED crystal particle are put together; Though the protection light-emitting diode exempts from and destroyed by static discharge; But the thickness of guard assembly itself will stop the light source that LED crystal particle produces, and have a strong impact on the luminous efficiency of light-emitting diode.
In view of this, how to research and develop improvement, how to enlarge area of dissipation, reduce heat energy accumulation and preventing electro-static discharge, real target for the required effort research and development of relevant industry to the existing shortcoming of above-mentioned existing LED encapsulation unit.
The utility model content
In order to solve the desirable not to the utmost part of above-mentioned prior art, the utility model provides a kind of LED encapsulation unit, comprises LED crystal particle, pedestal, supporting structure and lead, and wherein: pedestal has first shrinkage pool.Supporting structure has first support and second support, and first support and second support have first end and second end respectively.First end of first support and first end of second support stretch into first shrinkage pool of pedestal, and LED crystal particle is arranged at first end of first support, and second end of first support and second end of second support turn down to the pedestal bottom surface from the pedestal outside.Lead electrically connects LED crystal particle, first support and second support.And the area that second end of first support folds in the pedestal bottom surface turns down to the area of pedestal bottom surface greater than second end of second support.
Said LED encapsulation unit, wherein, pedestal further has second shrinkage pool, and is provided with the electrostatic defending assembly in second shrinkage pool.
Said LED encapsulation unit, wherein, the electrostatic defending assembly is arranged at first end of first support.
Said LED encapsulation unit, wherein, the electrostatic defending assembly is arranged at first end of second support.
Said LED encapsulation unit, wherein, second end of first support turns down to pedestal base area half greater than the pedestal base area.
Said LED encapsulation unit wherein, respectively is formed with kink between first end of first support and second end and between first end of second support and second end, and kink offers a plurality of perforates.
Therefore; The main purpose of the utility model provides a kind of LED encapsulation unit; The area that folds in the pedestal bottom surface through first support, second end turns down to the design of the area of pedestal bottom surface greater than second support, second end; Increase to carry the area of dissipation of first support of LED crystal particle by this, avoid light-emitting diode accumulation heat energy, and then promote radiating efficiency, increase the service life.
Another purpose of the utility model provides a kind of LED encapsulation unit; Second shrinkage pool can further be set with ccontaining electrostatic defending assembly; Electrostatic discharge protective is provided; And the light source that the LED crystal particle in first shrinkage pool is produced can not stop by the electrostatic defending assembly in second shrinkage pool and promote luminous efficiency, and provides LED encapsulation unit manufacturing process required vision localization simultaneously, avoids the situation that assembly can't precisely put in place in the processing procedure to take place.
In addition, the utility model also provides another kind of LED encapsulation unit, comprises LED crystal particle, pedestal, lead, first guide block and second guide block, and wherein: pedestal has first shrinkage pool.First guide block and second guide block respectively have a pair of side, upper bottom surface and bottom surface; The upper bottom surface of the upper bottom surface of first guide block and second guide block extends into first shrinkage pool; LED crystal particle is arranged at the upper bottom surface of first guide block, and first guide block and second guide block partly are coated in the pedestal.Lead electrically connects LED crystal particle, first guide block and second guide block.And a side of first guide block and the bottom surface of first guide block expose to pedestal, and a side of second guide block and the bottom surface of second guide block expose to pedestal, and the bottom surface area of first guide block is greater than the bottom surface area of second guide block.
Said LED encapsulation unit, wherein, pedestal further has second shrinkage pool, is provided with the electrostatic defending assembly in second shrinkage pool.
Said LED encapsulation unit, wherein, the electrostatic defending assembly is arranged at the upper surface of first guide block.
Said LED encapsulation unit, wherein, the electrostatic defending assembly is arranged at the upper surface of second guide block.
Therefore, the main purpose of the utility model provides a kind of LED encapsulation unit, sees through the design of the first guide block bottom surface area greater than the second guide block bottom surface area, increases the area of dissipation of first guide block that carries LED crystal particle.And, the shortest heat dissipation path is provided between the upper bottom surface of first, second guide block and the bottom surface, first, second guide block can be derived the heat energy that accumulates on LED crystal particle rapidly.By this, avoid light-emitting diode accumulation heat energy, and then promote radiating efficiency, increase the service life.
Another purpose of the utility model provides a kind of LED encapsulation unit; Can further set up second shrinkage pool with ccontaining electrostatic defending assembly; Electrostatic discharge protective is provided; And the light source that the LED crystal particle that the electrostatic defending assembly that places second shrinkage pool can not stopped place first shrinkage pool produces and promote luminous efficiency, and provide LED encapsulation unit manufacturing process required vision localization simultaneously, avoid the situation that assembly can't precisely put in place in the processing procedure to take place.
Description of drawings
Figure 1A is first preferred embodiment that proposes according to the utility model, is the LED encapsulation unit schematic perspective view;
Figure 1B is along the online generalized section of A-A according to the first preferred embodiment LED encapsulation unit shown in Figure 1A;
Fig. 1 C is another generalized section of LED encapsulation unit according to first preferred embodiment of the utility model proposition;
Fig. 1 D is first preferred embodiment that proposes according to the utility model, is arranged at the schematic perspective view of first end of first support for the electrostatic defending assembly;
Fig. 1 E is first preferred embodiment that proposes according to the utility model, is arranged at the schematic perspective view of first end of second support for the electrostatic defending assembly;
Fig. 1 F is first preferred embodiment that proposes according to the utility model, offers the schematic perspective view of perforate in kink for first, second support;
Fig. 2 A is second preferred embodiment that proposes according to the utility model, is the LED encapsulation unit schematic perspective view;
Fig. 2 B be shown in Fig. 2 A the second preferred embodiment LED encapsulation unit along the online generalized section of B-B;
Fig. 2 C is second preferred embodiment that proposes according to the utility model, is arranged at the schematic perspective view of the upper surface of first guide block for the electrostatic defending assembly;
Fig. 2 D is second preferred embodiment that proposes according to the utility model, is arranged at the schematic perspective view of the upper surface of second guide block for the electrostatic defending assembly.
[primary clustering symbol description]
First shrinkage pool 21
Supporting structure 30
First end 311,321
Second end 312,322
Kink 313,323
Perforate 33
Electrostatic defending assembly E
Area A 1, A2, At, B 1, B2
Embodiment
Because the utility model discloses a kind of LED encapsulation unit, light-emitting diode principle and the technology wherein utilized have been that those of ordinary skills can understand, so with hereinafter explanation, no longer do complete description.Simultaneously,, express the structural representation relevant, also do not need, in advance statement according to the complete drafting of actual size with the utility model characteristic with the accompanying drawing that is hereinafter contrasted.
Please refer to Figure 1A, is first preferred embodiment that proposes according to the utility model, is the LED encapsulation unit schematic perspective view.It is example that the LED encapsulation unit of first preferred embodiment adopts surface-mounting LED (Surface Mount Device LED, SMD LED) aspect.
LED encapsulation unit comprises LED crystal particle 10, pedestal 20, supporting structure 30 and lead 40.LED crystal particle 10, first support 31 and second support 32 electrically connect with lead 40 respectively, and lead 40 is except providing electric energy transmitting, more as the bridge that conducts heat energy to the second support 32.LED crystal particle 10 is that the mode of utilizing electric energy to be converted into luminous energy produces light, and sends the light of different wave length according to material different.Pedestal 20 approximate rectangular cubes, and include the first cup-shaped shrinkage pool 21, first shrinkage pool 21 that runs through pedestal 20 provides the light of LED crystal particle 10 generations to pass through.Supporting structure 30 comprises first support 31 and second support 32; And first, second support 31,32 is conduction and heat transfer material; And all be that the one ejection formation is a sheet, first, second support 31,32 copper materials such as employing brass, bronze or copper alloy are example in the present embodiment.LED crystal particle 10 luminous needed electric energy promptly are to be transmitted by first, second support 31,32, present embodiment be with first support 31 as the P utmost point, and with second support 32 as the N utmost point.In addition the heat energy that produces of LED crystal particle 10 promptly is by first, second support 31,32 conduction, connects surface temperature (Junction Temperature) with what reduce LED crystal particle 10.
Seeing also Figure 1B, is that LED encapsulation unit shown in Figure 1 is along the online generalized section of A-A.First support 31 and second support 32 have first end 311,321 and second end 312,322 respectively; First end 311 of first support 31 and first end 321 of second support 32 are inserted into first shrinkage pool, 21 belows from pedestal 20 2 sides respectively, and first end 311,321 of first, second support 31,32 is not at a distance of a spacing, connect each other mutually.LED crystal particle 10 is that second end 322 of second end 312 and second support 32 that utilizes heat-conducting glue or ashbury metal to be arranged at first end, 311, the first supports 31 of first support 31 is externally turned on one's side from pedestal 20 two-phases toward each other mutually and rolled over to pedestal 20 bottom surfaces 24.The area that second end 312 of first support 31 folds in pedestal 20 bottom surfaces 24 is defined as A1, and second end 322 of second support 32 turns down to the area of pedestal 20 bottom surfaces 24 and is defined as A2, can know that by figure A1 is greater than A2.
In addition, see also Fig. 1 C, another generalized section of LED encapsulation unit of the utility model first preferred embodiment.Pedestal 20 bottom surfaces 24 areas are defined as At, can be known by figure, and A1 is greater than 1/2 At, and the area A 1 of this moment is equally greater than area A 2.Present embodiment LED crystal particle 10 is on first end 311 that is arranged at as first support 31 of the P utmost point, the heat energy that the most of LED crystal particle 10 of first support, 31 conduction is produced.No matter the design of Figure 1B and Fig. 1 C; All be by the area of dissipation that increases by first support 31; Let in good time the deriving of heat energy, avoid LED crystal particle 10 accumulation heat energy, and then promote the radiating efficiency of LED crystal particle 10 and prolong to use and receive the life-span via first support 31.
In addition, in the present embodiment, second shrinkage pool 22 can further on pedestal 20, be set up, shown in Fig. 1 D and Fig. 1 E.Second shrinkage pool 22 that runs through pedestal 20 provides electrostatic defending assembly E to be provided with, second shrinkage pool 22 arbitrary corner 23 that the position can be positioned at pedestal 20 is set.Static discharge (Electrical Static Discharge; ESD) be the injury that general electronic building brick the most often meets with; Static discharge is meant the mobile rapidly phenomenon of electric charge that produces between two objects of different potentials; The immediate current that is produced causes the nonvolatil damage of LED encapsulation unit, and static injury is again that accumulation forms the time point that can't anticipation takes place.Present embodiment sees through electrostatic defending assembly E and promptly can be used to prevent and treat static discharge destruction LED encapsulation unit.And the light source that the LED crystal particle 10 in first shrinkage pool 21 is produced can not stopped by the electrostatic defending assembly E in second shrinkage pool 22, and then promotes the luminous efficiency of LED encapsulation unit.Second shrinkage pool 22 of aforementioned pedestal 20 more can provide the vision identification in the process of making LED encapsulation unit, and each assembly of LED encapsulation unit can precisely be put in place.Present embodiment with the electrostatic defending component design become to include discharge loop integrated circuit (Integrated Circuits, IC).
Design shown in Fig. 1 D is to represent second shrinkage pool 22 of pedestal 20 to be arranged on first support, 31 places, makes the electrostatic defending assembly E that is arranged in second shrinkage pool 22 conflict first end 311 of first support 31 to carry out electrostatic discharge protective.And the design shown in Fig. 1 E then is to represent second shrinkage pool 22 of pedestal 20 to be arranged on second support, 32 places, makes conflict first end 321 of second support 32 of the electrostatic defending assembly E that is arranged in second shrinkage pool 22 carry out electrostatic discharge protective.
In addition, in order further to increase the efficient of heat radiation, can on the kink of support, form perforate.Shown in Fig. 1 F; Be formed with kink 313,323 turning down separately between first end 311 of first support 31 and second end 312 and between first end 321 of second support 32 and second end 322; And offer perforate 33 separately in kink 313,323, use the efficient that increases heat radiation.
The present embodiment LED encapsulation unit is carried by heat-radiating substrate (accompanying drawing is not drawn), is the best with the heat-radiating substrate that adopts copper material, and copper, its heat dissipation characteristics of belonging to metal material are comparatively outstanding.First, second support the 31, the 32nd is welded on the heat-radiating substrate, makes first, second support 31,32 with the heat energy of heat energy via the generation of heat-radiating substrate conduction LED encapsulation unit, and then reaches the purpose of heat radiation.
In addition, please refer to Fig. 2 A, is the schematic perspective view of the LED encapsulation unit of second preferred embodiment that proposes according to the utility model.The LED encapsulation unit of second preferred embodiment comprises LED crystal particle 10, pedestal 20, lead 40, first guide block 50 and second guide block 60; And LED crystal particle 10, first guide block 50 and second guide block 60 electrically connect with lead 40 respectively; Lead 40 is except providing electric energy transmitting, more as the bridge that conducts heat energy to the second guide block 60.The wherein structure and the interconnected relationship of LED crystal particle 10, pedestal 20, lead 40; With roughly the same described in first preferred embodiment; Therefore repeat no more at this, only explain below with regard to second preferred embodiment and the first preferred embodiment difference.
See also Fig. 2 B, for the LED encapsulation unit shown in Fig. 2 A along the online generalized section of B-B.First, second guide block 50,60 is conduction and heat transfer material, and the one ejection formation be block, first, second guide block 50,60 copper materials such as employing brass, bronze or copper alloy of present embodiment.It promptly is to be transmitted by first, second guide block 50,60 that LED crystal particle 10 produces the needed electric energy of light, present embodiment with first guide block 50 as the P utmost point, and with second guide block 60 as the N utmost point.In addition the heat energy that produces of LED crystal particle 10 promptly is by first, second guide block 50,60 conduction, and that reduces LED crystal particle 10 by this connects surface temperature (Junction Temperature).
First, second guide block 50,60 has first side 51,61 and second side 52,62 and upper bottom surface 53,63 and bottom surface 54,64 respectively.The upper and lower bottom surface 53,54 of first guide block 50 and the upper and lower bottom surface 63,64 of second guide block 60 are inserted into first shrinkage pool, 21 belows from pedestal 20 2 sides respectively, and first side 51,61 of first, second guide block 50,60 is not at a distance of a spacing, connect each other mutually. Upper bottom surface 53,63 parts of first, second guide block 50,60 of this moment are coated by pedestal 20; In pedestal 20 was coated on first side 51,61 of first, second guide block 50,60, second side 52,62 and the bottom surface 54,64 of first, second guide block 50,60 exposed to outside the pedestal 20.
In addition, in the present embodiment, also second shrinkage pool 22 can further on pedestal 20, be set up, shown in Fig. 2 C and Fig. 2 D.Pedestal 20 includes second shrinkage pool 22 in addition, and second shrinkage pool 22 that runs through pedestal 20 provides electrostatic defending assembly E to be provided with, second shrinkage pool 22 arbitrary corner 23 that the position can be positioned at pedestal 20 is set.Present embodiment sees through electrostatic defending assembly E and promptly can be used to prevent and treat static discharge destruction LED encapsulation unit.And the light source that the LED crystal particle 10 that the electrostatic defending assembly E that places second shrinkage pool 22 can not stopped place first shrinkage pool 21 produces, and then promote the luminous efficiency of LED encapsulation unit.And more can be in the process of making LED encapsulation unit as the usefulness of vision localization.
Design shown in Fig. 2 C is to represent second shrinkage pool 22 of pedestal 20 to be arranged on first guide block, 50 places, makes the electrostatic defending assembly E that is arranged in second shrinkage pool 22 conflict the upper bottom surface 53 of first guide block 50 so that carry out electrostatic discharge protective.And the design shown in Fig. 2 D then is to represent second shrinkage pool 22 of pedestal 20 to be arranged at second guide block, 60 places, makes the electrostatic defending assembly E that is arranged in second shrinkage pool 22 upper bottom surface 63 of second guide block 60 of conflicting, so that carry out electrostatic discharge protective.
The present embodiment LED encapsulation unit is carried by heat-radiating substrate, is the best with the heat-radiating substrate that adopts copper material.First, second guide block the 50, the 60th is welded on the heat-radiating substrate, first, second guide block 50,60 is produced heat energy via heat-radiating substrate conduction LED encapsulation unit heat energy.
The above is merely the utility model preferred embodiment, is not in order to limit the protection range of the utility model claim; Simultaneously above description should be understood for those of ordinary skills and implement, so other does not break away from the equivalence of being accomplished under the spirit that the utility model discloses and change or modify, and all should be contained in the protection range of following claim.
Claims (10)
1. LED encapsulation unit; Comprise at least one LED crystal particle (10), a pedestal (20) and a supporting structure (30); Said pedestal (20) includes at least one first shrinkage pool (21); Said supporting structure (30) comprises one first support (31) and one second support (32); Said first support (31) and said second support (32) have one first end (311,321) and one second end (312,322) respectively; First end (311) of said first support (31) and first end (321) of said second support (32) stretch into said first shrinkage pool (21) of said pedestal (20); And said LED crystal particle (10) is arranged at first end (311) of said first support (31), and second end (312) of said first support (31) and second end (322) of said second support (32) turn down to said pedestal (20) bottom surface (24) from said pedestal (20) outside;
Multiple conducting wires (40) electrically connects said LED crystal particle (10) and said first support (31) and said second support (32); It is characterized in that,
Second end (312) of said first support (31) folds in the area (A2) of the area (A1) of said pedestal (20) bottom surface (24) greater than second end (322) turnover to said pedestal (20) bottom surface (24) of said second support (32).
2. LED encapsulation unit according to claim 1 is characterized in that, said pedestal (20) further has one second shrinkage pool (22), and is provided with an electrostatic defending assembly (E) in said second shrinkage pool (22).
3. LED encapsulation unit according to claim 2 is characterized in that, said electrostatic defending assembly (E) is arranged at first end (311) of said first support (31).
4. LED encapsulation unit according to claim 2 is characterized in that, said electrostatic defending assembly (E) is arranged at first end (321) of said second support (32).
5. LED encapsulation unit according to claim 1 is characterized in that, second end (312) turnover to said pedestal (20) bottom surface (24) area (A1) of said first support (31) is half the greater than said pedestal (20) bottom surface (24) area (At).
6. LED encapsulation unit according to claim 1; It is characterized in that; Respectively be formed with a kink (313,323) between first end (311) of said first support (31) and second end (312) and between first end (321) of said second support (32) and second end (322), said kink (313,323) offers a plurality of perforates (33).
7. LED encapsulation unit; Include at least one LED crystal particle (10), a pedestal (20), one first guide block (50) and one second guide block (60); Said pedestal (20) includes at least one first shrinkage pool (21); Said first guide block (50) and said second guide block (60) have a pair of side (51,52,61,62), a upper bottom surface (53,63) and a bottom surface (54,64) respectively; The upper bottom surface (53) of said first guide block (50) and the upper bottom surface (63) of said second guide block (60) extend into said first shrinkage pool (21); Said LED crystal particle (10) is arranged at the upper bottom surface (53) of said first guide block (50), and said first guide block (50) and said second guide block (60) part are coated in the said pedestal (20);
The leads (40) of following electrically connect said LED crystal particle (10) and said first guide block (50) and said second guide block (60) more; It is characterized in that,
One side (52) of said first guide block (50) exposes to said pedestal (20) with the bottom surface (54) of said first guide block (50); One side (62) of said second guide block (60) exposes to said pedestal (20) with the bottom surface (64) of said second guide block (60), and bottom surface (54) area (B1) of said first guide block (50) is greater than bottom surface (64) area (B2) of said second guide block (60).
8. LED encapsulation unit according to claim 7 is characterized in that, said pedestal (20) further has one second shrinkage pool (22), is provided with an electrostatic defending assembly (E) in said second shrinkage pool (22).
9. LED encapsulation unit according to claim 8 is characterized in that, said electrostatic defending assembly (E) is arranged at the upper surface (53) of said first guide block (50).
10. LED encapsulation unit according to claim 8 is characterized in that, said electrostatic defending assembly (E) is arranged at the upper surface (63) of said second guide block (60).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100205216U TWM416207U (en) | 2011-03-24 | 2011-03-24 | LED packaging unit |
| TW100205216 | 2011-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202120980U true CN202120980U (en) | 2012-01-18 |
Family
ID=45462021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120151872XU Expired - Fee Related CN202120980U (en) | 2011-03-24 | 2011-05-12 | Light emitting diode packaging unit |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202120980U (en) |
| TW (1) | TWM416207U (en) |
-
2011
- 2011-03-24 TW TW100205216U patent/TWM416207U/en not_active IP Right Cessation
- 2011-05-12 CN CN201120151872XU patent/CN202120980U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWM416207U (en) | 2011-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120118 Termination date: 20140512 |