CN202119945U - Parallel light transceiving assembly for broadband high-speed transmission - Google Patents
Parallel light transceiving assembly for broadband high-speed transmission Download PDFInfo
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- CN202119945U CN202119945U CN2011201584172U CN201120158417U CN202119945U CN 202119945 U CN202119945 U CN 202119945U CN 2011201584172 U CN2011201584172 U CN 2011201584172U CN 201120158417 U CN201120158417 U CN 201120158417U CN 202119945 U CN202119945 U CN 202119945U
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Abstract
The utility model relates to a parallel light transceiving assembly for broadband high-speed transmission, which comprises a printed circuit board, an integrated circuit chip and a photoelectric element array, wherein the integrated circuit chip and the photoelectric element array are arranged on the printed circuit board, one end of the printed circuit board is provided with electric signal input and output ports, and the other end of the printed circuit board is provided with a side-face electrode. The photoelectric element array comprises a vertical cavity surface emitting laser (VCSEL) array and a potential difference (PD) photoelectric detector array which are assembled on the side face of the printed circuit board and respectively in routing connection with the side-face electrode of the printed circuit board. The integrated circuit chip comprises a laser driving chip and a detector TIA chip which are arranged on an electrode arranged on the surface of the printed circuit board. An optical fiber array is arranged in an optical fiber fixing member which is fixed on an optical fiber supporting member. The optical fiber array aligns with the photoelectric element array in one-to-one mode. The parallel light transceiving assembly for the broadband high-speed transmission adopts the unique circuit board technology and the photoelectric element side-face adhering technology, is simpler and easier to implement in manufacturing process, reduces the number of assembly components, and is lower in cost. Besides, the photoelectric property and structure stability of the assembly are remarkably improved.
Description
Technical field
The utility model relates to a kind of parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission.
Background technology
Along with the quick growth of the mankind to communication bandwidth requirements, the existing communication systems face capacity and energy consumption two is challenged greatly.Because can be in littler space, lower energy consumption takies down that bigger bandwidth is provided, and is increasing about the research and development of parallel optical module.The parallel optical module is a plurality of optical fiber of a plurality of laser alignment in an independent module---for example be fit to the 4 passage short distance transceiver modules that the short distance high bandwidth is calculated and exchange is used; Integrated four are independently sent and receiving cable, and are connected to one 12 passage multimode ribbon fiber.Because integrated high bandwidth density and the low-power consumption that is brought with miniaturization of device makes the transmission bandwidth of parallel optical module and use power consumption be superior to a plurality of discrete devices greatly, thereby improved the system transmissions performance.
The parallel optical module is higher to the desired precision of the aligning of sub-element, and patient rigging error is littler, to guarantee high as far as possible coupling efficiency.Prior art is when realizing these alignment functions, and very complicacy is very time-consuming, needs a cover complicated and parallel keeper, like V-type groove, MT type optical conenctor etc., and chip attachment process and optical coupled technology accurately accurately; In addition, photovoltaic array parts and printed circuit board (PCB) are electrically connected, and like gold thread connections, soft board connection etc., its distribution range is big, and length is longer, for the emission of high-frequency signal with detect can the bad noise of introducing, make the signal variation, the device performance deterioration; And it is, very high like the processing technology requirement of lens, photoconductive tube to optical module; The increase of optical module parts simultaneously also makes cost increase accordingly.
The utility model content
The purpose of the utility model is to overcome the deficiency that prior art exists, and a kind of parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission is provided.
The purpose of the utility model realizes through following technical scheme:
The parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission; Comprise printed circuit board (PCB) and position IC chip and optoelectronic component array on it; Characteristics are: an end of said printed circuit board (PCB) is provided with the electric signal IO port, and the other end of printed circuit board (PCB) is provided with side electrode; Said optoelectronic component array comprises VCSEL laser array and PD photodetector array, and VCSEL laser array and PD photodetector array are assembled on the side of printed circuit board (PCB), and is connected with printed circuit board (PCB) side electrode routing respectively; Said IC chip comprises laser driving chip and detector TIA chip, and laser driving chip and detector TIA chipset are loaded on the electrode of printed circuit board surface; Fiber array places in the optical fiber fixture, and the optical fiber fixture is fixed on the fiber support part, and fiber array is aimed at optoelectronic component array with man-to-man mode.
Further, the above-mentioned parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission is characterized in that: said VCSEL laser array and PD photodetector array are assembled on the side of printed circuit board (PCB) through conducting resinl with line spread mode side by side.
Further, the above-mentioned parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission, it is characterized in that: said laser driving chip and detector TIA chip are assembled on the electrode of printed circuit board surface through the upside-down mounting welding manner.
Further, the above-mentioned parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission, it is characterized in that: said signal input output end mouth is gold-plated plate structure.
Further, the above-mentioned parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission, it is characterized in that: said fiber array comprises complex root optical fiber, every optical fiber has a coupling end face.
Again further; The above-mentioned parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission; It is characterized in that: the center, effective coverage of said optoelectronic component array is aimed at man-to-man mode with the coupling surface of fiber array, is equipped with refractive index match glue between the center, effective coverage of optoelectronic component array and the coupling surface of fiber array.
Again further; The above-mentioned parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission; It is characterized in that: said fiber array has two groups; The coupling surface of first group of fiber array is aimed at the active center zone of VCSEL laser array with man-to-man mode; Be equipped with refractive index match glue between the active center zone of VCSEL laser array and the coupling surface of first group of fiber array, the coupling surface of second group of fiber array is aimed at the center, effective coverage of PD photodetector array with man-to-man mode, is equipped with refractive index match glue between the active center zone of PD photodetector array and the coupling surface of second group of fiber array.
Substantive distinguishing features and obvious improvement that the utility model technical scheme is outstanding are mainly reflected in:
The utility model adopts unique circuit plate manufacturing technology and photovalve side mounting technology, and through flip-chip technology, makes the electrical connection of photovalve more reasonable, the photoelectric properties of lifting subassembly; Respectively the employing active alignment technology of VCSEL laser array and PD photodetector array is carried out optical coupled, reduced the optoelectronic component array placement accuracy and significantly reduced the technology difficulty that photovalve is connected with optical fiber and promoted assembled error tolerance; Through reducing the quantity of component members, reduce the assembly cost, be more suitable for mass production applications.
Description of drawings
Below in conjunction with accompanying drawing the utility model technical scheme is described further:
Fig. 1: the assembling synoptic diagram that is used for the parallel light transmitting-receiving subassembly of broadband high-speed transmission;
Fig. 2: the parallel light transmitting-receiving subassembly optical coupled synoptic diagram that is used for the broadband high-speed transmission;
Fig. 3 a: light is coupled to the light path synoptic diagram of PD photodetector through refractive index match glue from optical fiber;
Fig. 3 b: the light path synoptic diagram that passes through refractive index match glue to optical fiber by the light of VCSEL laser instrument emission;
Fig. 4: joint place, uncut printed circuit board (PCB) side schematic top plan view;
Fig. 5: joint place, the printed circuit board (PCB) side schematic top plan view that cutting is accomplished;
Fig. 6: the main synoptic diagram of looking in joint place, printed circuit board (PCB) side that cutting is accomplished.
The implication of each Reference numeral sees the following form among the figure:
Embodiment
As shown in Figure 1; The parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission; Comprise printed circuit board (PCB) 01 and position IC chip 03 and optoelectronic component array 04 on it; One end of printed circuit board (PCB) 01 is provided with electric signal IO port 11, and signal input port 11 is gold-plated plate structure, and the other end of printed circuit board (PCB) 01 is provided with side electrode 02; IC chip 03 comprises laser driving chip 31 and detector TIA chip 32, and laser driving chip 31 is assembled on the electrode on printed circuit board (PCB) 01 surface with detector TIA chip 32 through the flip chip bonding mode; Optoelectronic component array 04 comprises VCSEL laser array 41 and PD photodetector array 42; VCSEL laser array 41 and PD photodetector array 42 are assembled on the side of printed circuit board (PCB) 01 through conducting resinl with line spread mode side by side, and VCSEL laser array 41 is connected with side electrode 02 routing of printed circuit board (PCB) respectively with PD photodetector array 42.Fiber array 07 is aimed at optoelectronic component array 04 with man-to-man mode, places in the optical fiber fixture 06, again by fiber support part 05 support fixation.
IC chip 03 is assembled on the electrode on printed circuit board (PCB) 01 surface through the flip chip bonding mode; Saved the conduction gold thread; Make between IC chip 03 and the printed circuit board (PCB) 01 be electrically connected more reasonable; Help promoting the high speed transmission of signals performance, also help promoting the reliability of the parallel light transmitting-receiving subassembly of broadband high-speed transmission.
The parallel light transmitting-receiving subassembly optical coupled of broadband high-speed transmission is as shown in Figure 2, and fiber array 07 comprises complex root optical fiber, is divided into two groups and place in the optical fiber fixture 06, and every optical fiber has a coupling end face; The coupling surface of first group of fiber array is aimed at the active center zone of VCSEL laser array 41 with man-to-man mode; The coupling surface of second group of fiber array is aimed at the center, effective coverage of PD photodetector array 42 with man-to-man mode; Be equipped with refractive index match glue 09 between the active center zone of VCSEL laser array 41 and the coupling surface of first group of fiber array, be equipped with refractive index match glue 09 between the active center zone of PD photodetector array 42 and the coupling surface of second group of fiber array.
The optical coupled light path of fiber array 07 and PD photodetector array 42 is shown in Fig. 3 a; When assembling; Earlier PD photodetector array 42 is assembled on the side of printed circuit board (PCB) 01 through conducting resinl, with conduction gold thread 08 PD photodetector array 42 is connected with the side electrode 02 of circuit board 01 again; When the incident light that is loaded with signal is incident to PD photodetector array 42 through refractive index match glue 09; Locus through adjustment fiber array 07; Feasible signal amplitude the best that is detected by PD photodetector array 42 is accomplished the assembling of fiber array 07 and PD photodetector array 42 through solidifying refractive index match glue 09.
The optical coupled light path of fiber array 07 and VCSEL laser array 41 is shown in Fig. 3 b; When assembling; Earlier VCSEL laser array 41 is assembled on the side of printed circuit board (PCB) 01 through conducting resinl, with conduction gold thread 08 VCSEL laser array 41 is connected with the side electrode 02 of circuit board 01 again; When the electric signal that is loaded with signal is incident to fiber array 07 by VCSEL laser array 41 through refractive index match glue 09; Locus through adjustment fiber array 07; The optical signal magnitude that makes fiber array 07 obtain is best, accomplishes the assembling of fiber array 07 and VCSEL laser array 41 through solidifying refractive index match glue 09.
The utility model carries out optical coupled through the optoelectronic component array 04 side mounting technology of uniqueness, has significantly promoted assembled error tolerance, has reduced the quantity of component members; Through using refractive index match glue 09; Promoted optical coupling efficiency, improved assembly property, reduced optics requirement simultaneously the coupling surface of fiber array 07; Reduce the assembly cost, be more suitable for producing in batches and use.
Adopt unique circuit plate manufacturing technology, make optoelectronic component array 04 can be fitted on the side of printed circuit board (PCB) 01.Like Fig. 4; Joint place, uncut printed circuit board (PCB) 01 side through increase some blind holes 21 in printed circuit board (PCB) 01, and is coated with conducting metal in blind hole; Make the electric signal on top layer to be delivered to internal layer through blind hole 21; Again through to printed circuit board (PCB) 01 along blind hole 21 the axle carry out cut, like Fig. 5, Fig. 6, make the side electrode 02 of printed circuit board (PCB) 01 to link to each other with the electric signal on top layer; And make optoelectronic component array 04 can be fitted on the side of printed circuit board (PCB) 01, through conduction gold thread 08 optoelectronic component array 04 is connected on the side electrode 02 of printed circuit board (PCB) 01 at last.
In sum; The parallel light transmitting-receiving subassembly that the utility model provides a kind of simple broadband high-speed to transmit; Adopt unique circuit plate manufacturing technology and photovalve side mounting technology; And, make the electrical connection of photovalve more reasonable, the photoelectric properties of lifting subassembly through flip-chip technology; Respectively the employing active alignment technology of VCSEL laser array and PD photodetector array is carried out optical coupled; Reduced the optoelectronic component array placement accuracy, reduced the technology difficulty that photovalve is connected with optical fiber and promoted assembled error tolerance; Through reducing the quantity of component members, reduce the assembly cost, be more suitable for mass production applications.
What need understand is: the above only is the preferred implementation of the utility model; For those skilled in the art; Under the prerequisite that does not break away from the utility model principle; Can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection domain of the utility model.
Claims (7)
1. the parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission; Comprise printed circuit board (PCB) (01) and position IC chip (03) and optoelectronic component array (04) on it; It is characterized in that: an end of said printed circuit board (PCB) (01) is provided with electric signal IO port (11), and the other end of printed circuit board (PCB) (01) is provided with side electrode (02); Said optoelectronic component array (04) comprises VCSEL laser array (41) and PD photodetector array (42); VCSEL laser array (41) and PD photodetector array (42) are assembled on the side of printed circuit board (PCB) (01), and are connected with printed circuit board (PCB) side electrode (02) routing respectively; Said IC chip (03) comprises laser driving chip (31) and detector TIA chip (32), and laser driving chip (31) and detector TIA chip (32) are assembled on the electrode on printed circuit board (PCB) (01) surface; Fiber array (07) places in the optical fiber fixture (06), and optical fiber fixture (06) is fixed on the fiber support part (05), and fiber array (07) is aimed at optoelectronic component array (04) with man-to-man mode.
2. the parallel light transmitting-receiving subassembly that is used for broadband high-speed transmission according to claim 1 is characterized in that: said VCSEL laser array (41) and PD photodetector array (42) are assembled on the side of printed circuit board (PCB) (01) through conducting resinl with line spread mode side by side.
3. the parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission according to claim 1 is characterized in that: said laser driving chip (31) and detector TIA chip (32) are assembled on the electrode on printed circuit board (PCB) (01) surface through the upside-down mounting welding manner.
4. the parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission according to claim 1 is characterized in that: said signal input output end mouth (11) is gold-plated plate structure.
5. the parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission according to claim 1, it is characterized in that: said fiber array (07) comprises complex root optical fiber, every optical fiber has a coupling end face.
6. the parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission according to claim 1; It is characterized in that: the center, effective coverage of said optoelectronic component array (04) is aimed at man-to-man mode with the coupling surface of fiber array (07), is equipped with refractive index match glue (09) between the coupling surface of the center, effective coverage of optoelectronic component array (04) and fiber array (07).
7. the parallel light transmitting-receiving subassembly that is used for the broadband high-speed transmission according to claim 1; It is characterized in that: said fiber array (07) has two groups; The coupling surface of first group of fiber array is aimed at the active center zone of VCSEL laser array (41) with man-to-man mode; Be equipped with refractive index match glue between the active center zone of VCSEL laser array (41) and the coupling surface of first group of fiber array; The coupling surface of second group of fiber array is aimed at the center, effective coverage of PD photodetector array (42) with man-to-man mode, is equipped with refractive index match glue between the active center zone of PD photodetector array (42) and the coupling surface of second group of fiber array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201584172U CN202119945U (en) | 2011-05-18 | 2011-05-18 | Parallel light transceiving assembly for broadband high-speed transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201584172U CN202119945U (en) | 2011-05-18 | 2011-05-18 | Parallel light transceiving assembly for broadband high-speed transmission |
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| Publication Number | Publication Date |
|---|---|
| CN202119945U true CN202119945U (en) | 2012-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201584172U Expired - Lifetime CN202119945U (en) | 2011-05-18 | 2011-05-18 | Parallel light transceiving assembly for broadband high-speed transmission |
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| Country | Link |
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| CN (1) | CN202119945U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169216A (en) * | 2011-05-18 | 2011-08-31 | 苏州旭创科技有限公司 | Parallel light transceiver component for broadband high-speed transmission |
-
2011
- 2011-05-18 CN CN2011201584172U patent/CN202119945U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169216A (en) * | 2011-05-18 | 2011-08-31 | 苏州旭创科技有限公司 | Parallel light transceiver component for broadband high-speed transmission |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120118 |
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| CX01 | Expiry of patent term |