CN202095239U - Heat-conduction fixing device for heterotype element - Google Patents
Heat-conduction fixing device for heterotype element Download PDFInfo
- Publication number
- CN202095239U CN202095239U CN 201120176865 CN201120176865U CN202095239U CN 202095239 U CN202095239 U CN 202095239U CN 201120176865 CN201120176865 CN 201120176865 CN 201120176865 U CN201120176865 U CN 201120176865U CN 202095239 U CN202095239 U CN 202095239U
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- CN
- China
- Prior art keywords
- heat
- heat conduction
- conduction
- heterotype element
- special
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a heat-conduction fixing device for a heterotype element. The heat-conduction fixing device is a heat-conduction rubber body embedded on the periphery of a heterotype element. Screw holes are disposed on the heat-conduction rubber body. The heat-conduction fixing device is the heat-conduction rubber body embedded on the periphery of the heterotype element, and the heat-conduction rubber body is fixed on an electronic product via the screw holes. The heat-conduction rubber body is utilized to fix the heterotype element, and the mounting is firm and convenient. The heat-conduction rubber body exhibits a heat-conduction capability, so that the heterotype element has a fine heat radiation effect, thereby preventing the heterotype element from overheating to affect the service life and the reliability of the heterotype element. In addition, the heat-conduction rubber body is embedded on the periphery of the heterotype element and can be used as a solid insulating material, so that no large distance needs to be reserved for the insulation space. The heat-conduction fixing device occupies little space, enables the space of the electronic product to be saved, and enables the cost of the product to be reduced.
Description
[technical field]
The utility model relates to electronic product, relates in particular to a kind of special-shaped element heat conduction fixture.
[background technology]
In electronic product, abnormity element (profile is special can't normal mounting or the element of assembling) is because its profile all is irregular, or neither one not only insulate but also can be for the plane of installing, so installing and fixing, insulate and dispelling the heat of special-shaped element is relatively to be difficult to the problem that solves always, particularly under natural heat dissipation (no fan) condition, special-shaped element can not dispel the heat.
[summary of the invention]
The utility model provides a kind of special-shaped element heat conduction fixture, and it can fix special-shaped element, good heat dissipation effect, and it is little to take up room.
The technical solution of the utility model is:
A kind of special-shaped element heat conduction fixture, described heat conduction fixture is the heat conduction colloid that is potted in special-shaped element periphery, and is provided with screw hole on this heat conduction colloid.
Heat conduction fixture of the present utility model, for being potted in the heat conduction colloid of special-shaped element periphery, this heat conduction colloid is fixed on the electronic product by screw hole, thus utilize this heat conduction colloid can fix special-shaped element, easy to assembly firm; And this heat conduction colloid has the capacity of heat transmission, makes that the radiating effect of special-shaped element is relatively good, avoids special-shaped element over-temperature to influence the life-span and the reliability of special-shaped element; Because the heat conduction colloid just is potted in special-shaped element periphery, heat conduction colloid and also can then need to reserve very big distance as insulating space as solid insulating material, and it is smaller to take up room, save the electronic product space in addition, reduce product cost.
[description of drawings]
Fig. 1 is special-shaped element heat conduction fixture of the present utility model shape and structure figure in one embodiment;
Fig. 2 is the end view of the special-shaped element heat conduction fixture among Fig. 1.
[embodiment]
Below in conjunction with accompanying drawing specific embodiment of the utility model is done a detailed elaboration.
As Fig. 1,2, special-shaped element heat conduction fixture of the present utility model is the heat conduction colloid 2 that is potted in special-shaped element 1 periphery, and is provided with screw hole 3 on this heat conduction colloid 2.
Can utilize encapsulating die to seal special-shaped element 1, embedding heat conduction glue in this encapsulating die afterwards, behind the heat-conducting glue water cure, remove encapsulating die and promptly form heat conduction colloid 2, heat conduction this moment colloid 2 is positioned at special-shaped element 1 periphery, utilize screw hole 3 heat conduction colloid 2 can be fixed on the electronic product again, thus utilize this heat conduction colloid 2 can fix special-shaped element 1, easy to assembly firm; And this heat conduction colloid 2 has the capacity of heat transmission, makes that the radiating effect of special-shaped element 1 is relatively good, avoids special-shaped element 1 to cross the life-span and the reliability of thermal impact abnormity element 1; Because heat conduction colloid 2 just is potted in special-shaped element 1 periphery, heat conduction colloid 2 and also can then need to reserve very big distance as insulating space as solid insulating material, and it is smaller to take up room, save the electronic product space in addition, reduce product cost.
Fixing heat conduction colloid 2 for convenience, screw hole 3 is distributed in around the heat conduction colloid 2, and screw hole 3 as shown in Figure 1 has four, is distributed in around the heat conduction colloid 2.
Wherein, heat conduction colloid 2 can be epoxide-resin glue or the high strength bonded adhesivess such as polyurethane resin adhesive or acrylic size that solidify.The shape of heat conduction colloid 2 can be cuboid or other shapes.
Above-described the utility model execution mode does not constitute the qualification to the utility model protection range.Any modification of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the claim protection range of the present utility model.
Claims (4)
1. special-shaped element heat conduction fixture, it is characterized in that: described heat conduction fixture is the heat conduction colloid that is potted in special-shaped element periphery, and is provided with screw hole on this heat conduction colloid.
2. special-shaped element heat conduction fixture according to claim 1, it is characterized in that: described screw hole is distributed in around the described heat conduction colloid.
3. special-shaped element heat conduction fixture according to claim 1 and 2 is characterized in that: epoxide-resin glue or polyurethane resin adhesive or the acrylic size of described heat conduction colloid for solidifying.
4. special-shaped element heat conduction fixture according to claim 3, it is characterized in that: described heat-conducting glue shape is a cuboid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120176865 CN202095239U (en) | 2011-05-30 | 2011-05-30 | Heat-conduction fixing device for heterotype element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120176865 CN202095239U (en) | 2011-05-30 | 2011-05-30 | Heat-conduction fixing device for heterotype element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202095239U true CN202095239U (en) | 2011-12-28 |
Family
ID=45370276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120176865 Expired - Fee Related CN202095239U (en) | 2011-05-30 | 2011-05-30 | Heat-conduction fixing device for heterotype element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202095239U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714517A (en) * | 2016-12-30 | 2017-05-24 | 上海航天科工电器研究院有限公司 | Liquid-cooled board card module for multipoint temperature monitoring |
-
2011
- 2011-05-30 CN CN 201120176865 patent/CN202095239U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714517A (en) * | 2016-12-30 | 2017-05-24 | 上海航天科工电器研究院有限公司 | Liquid-cooled board card module for multipoint temperature monitoring |
| CN106714517B (en) * | 2016-12-30 | 2018-08-17 | 上海航天科工电器研究院有限公司 | A kind of liquid-cooled board card module of multipoint temperature monitoring |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111228 Termination date: 20200530 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |