CN202093286U

CN202093286U - Electrode structure, array substrate and display device

Info

Publication number: CN202093286U
Application number: CN2011201901416U
Authority: CN
Inventors: 王海生; 胡明
Original assignee: Beijing BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2011-06-08
Filing date: 2011-06-08
Publication date: 2011-12-28
Anticipated expiration: 2021-06-08

Abstract

The utility model discloses an electrode structure, an array substrate and a display device, which relate to the electronic technique. The electrode structure comprises a substrate, an insulating layer arranged on the substrate and an electrode layer arranged on the insulating layer. The electrode layer comprises at least two first direction electrodes which are connected with each other and at least two second direction electrodes which are not connected. The electrode structure further comprises a connecting bridge which is arranged in an adjacent circuit layer of the electrode layer, and the at least two second direction electrodes are respectively connected with the connecting bridge through via holes. The electrodes are connected with the connecting bridge through the via holes, so that a problem that the connecting bridge on the edge of the insulating layer is broken can be avoided, well contact between the electrodes needed to be connected is achieved, and passing rate of products is improved. Only the insulating layers on the via holes need to be removed, so that process is easy to achieve.

Description

A kind of electrode structure, array base palte and display device

Technical field

The utility model relates to electronic technology, relates in particular to a kind of electrode structure, array base palte and display device.

Background technology

At present, when making the condenser type contact electrode, because directions X and Y direction respectively comprise two rhombus electrodes, and two rhombus electrode mutual conduction of directions X, two rhombus electrode mutual conduction of Y direction for realizing the good conducting of electrode, have following two kinds of implementations:

A kind of implementation is that the electrode with the electrode of directions X and Y direction is produced in the different layers, shown in Fig. 1 a, Fig. 1 b and Fig. 1 c, is two rhombus electrodes of directions X among Fig. 1 a, in Fig. 1 b, cover a layer insulating, in Fig. 1 c, made two rhombus electrodes of Y direction.So both can guarantee two rhombus electrode mutual conduction of directions X, two rhombus electrode mutual conduction of Y direction can guarantee that also insulation is good between two rhombus electrodes of two rhombus electrodes of directions X and Y direction.But, when making electrode in this way, need be respectively the directions X electrode and Y direction electrode plates two-layer ITO, increased the complicacy of making and technology, cost of manufacture is also higher.

Another kind of implementation is to make the electrode of directions X and the electrode of Y direction in one deck, shown in Fig. 2 a, Fig. 2 b and Fig. 2 c, in Fig. 2 a, the electrode of directions X and the electrode of Y direction have been made, wherein the electrode of directions X mutual conduction, two electrodes of Y direction do not connect, in Fig. 2 b, deposit a layer insulating, in Fig. 2 c, make two electrodes that metal bridge connects the Y direction, insulate by insulation course between the electrode of metal bridge and directions X.Make electrode in this way, no longer need to be respectively the directions X electrode and Y direction electrode plates two-layer ITO, but, because insulation course has certain thickness, so because the cause of thickness offset, metal bridge in insulation course edge breaks easily, the electrode loose contact that causes the Y direction, simultaneously, in the insulation course of making between metal bridge and the directions X electrode, because the insulation course area that is kept is very little, so technology difficulty is also bigger.

The utility model content

The utility model embodiment provides a kind of electrode structure, array base palte and display device, to realize interelectrode connection, improves the yield of product.

The utility model embodiment provides a kind of electrode structure, comprise: substrate, be arranged on insulation course on the described substrate, be arranged on the electrode layer on the described insulation course, described electrode layer comprises the second direction electrode that at least two interconnective first direction electrodes are not connected with at least two; Wherein, described electrode structure also comprises:

Connect bridge, be arranged in the adjacent circuit layer of described electrode layer, described at least two second direction electrodes are connected bridging and connect with described by via respectively.

The utility model embodiment also provides a kind of array base palte, comprises the electrode structure that the utility model embodiment provides.

The utility model embodiment also provides a kind of display device, comprises the electrode structure that the utility model embodiment provides.

The utility model embodiment provides a kind of electrode structure, array base palte and display device, mode connection electrode by via be connected bridge, thereby avoid connecting the problem that broken string takes place bridge in insulation course edge, and then realization needs the interelectrode good contact of connection, improved the yield of product, owing to only need to remove the insulation course at via place, also be convenient to technology and realize simultaneously.

Description of drawings

Fig. 1 a-Fig. 1 c is one of electrode structure synoptic diagram in the prior art;

Fig. 2 a-Fig. 2 c be in the prior art electrode structure synoptic diagram two;

The electrode structure synoptic diagram that Fig. 3 a and Fig. 3 b provide for the utility model embodiment;

The another kind of electrode structure synoptic diagram that Fig. 4 provides for the utility model embodiment;

The method for making its electrode process flow diagram that Fig. 5 provides for the utility model embodiment;

View in the electrode manufacturing process that Fig. 6 a-Fig. 6 d provides for the utility model embodiment.

Embodiment

With reference to Fig. 3 a and Fig. 3 b, wherein, Fig. 3 b is the sectional view of Fig. 3 a in the AA direction, and the electrode structure that the utility model embodiment provides comprises:

Substrate 301 is arranged on insulation course 302 on the substrate 301, is arranged on the electrode layer on the insulation course 302, and electrode layer comprises the second direction electrode 304 that at least two interconnective first direction electrodes 303 are not connected with at least two;

This electrode structure also comprises:

Connect bridge 305, be arranged in the adjacent circuit layer of electrode layer, at least two second direction electrodes 304 pass through via 306 respectively and are connected bridge 305 connections.

When first direction electrode 303 and second direction electrode 304 are vertical, first direction electrode 303 can be called directions X electrode 303, second direction electrode 304 is called Y direction electrode 304, the utility model embodiment vertically is that example describes with the two, and the technical scheme that those skilled in the art can provide the utility model embodiment extends in the two off plumb situation and uses.

Because this connection bridge 305 is arranged in the adjacent circuit layer of electrode layer, and by via 306 connection Y direction electrodes 304, do not carry out bending and do not need to connect bridge 305, so both realized directions X electrode 303 and Y direction electrode 304 are arranged on in one deck, solved again and connected bridge 305 because the loose contact that the offset problem at insulation course edge causes, improved the yield of product.

Wherein, directions X electrode 303 among the utility model embodiment and Y direction electrode 304 can adopt indium-tin oxide electrode, and substrate 301 can adopt glass substrate.

The adjacent circuit layer of said electrode layer among the utility model embodiment, be meant with electrode layer from nearest circuit layer, this circuit layer generally insulate with electrode layer.

On this electrode structure, can also carry out further processing and fabricating according to actual needs, for example cover passivation layer 307.

During concrete enforcement, can after making electrode layer, make insulation course, on this insulation course, make connection bridge 305 again in the place that needs are put up a bridge, mode by via 306 will connect bridge 305 and Y direction electrode 304 couples together again, and its concrete structure as shown in Figure 4.

Further, in order to reduce process complexity, connecting bridge 305 can be arranged between insulation course and the substrate, promptly be arranged on the bottom of this electrode structure, because Metal Trace (metal wire) just is arranged on this one deck, so, connect bridge 305 as if using metal material to make, can when making Metal Trace, produce connection bridge 305.

Connect bridge 305 and can use metal to make, also can use tin indium oxide to make, in the utility model embodiment, the connection bridge 305 that metal is made is called metal bridge, and the connection bridge 305 that tin indium oxide is made is called the tin indium oxide bridge.

Good with the contact that is connected bridge 305 in order to guarantee Y direction electrode 304, the size of via 306 and connection bridge is under the prerequisite that does not influence the outward appearance visual effect, and that makes is bigger as far as possible, thereby guarantees that Y direction electrode 304 is good with the contact that is connected bridge 305.

Usually, when the connection bridge was metal bridge, the diameter of via can be set to 5um-15um, and was preferable when being set to the 10um left and right sides; When the connection bridge was the tin indium oxide bridge, the diameter of via was that 20um-100um is preferable.

Good for further guaranteeing Y direction electrode 304 with the contact that is connected bridge 305, can suitably choose the thickness of suitable electrode, promptly when making directions X electrode and Y direction electrode, make the thickness of directions X electrode and Y direction electrode more than or equal to 150 dusts, can guarantee Y direction electrode 304 and be connected bridge 305 and contact and electrode structure can be done very thin like this in good like this, also be beneficial to and be undersized Touch Sensor (touch sensor), and help by via 306 make Y direction electrode 304 be connected bridge 305 conductings.

In the utility model embodiment, insulation course can adopt monox, silicon nitride or resin to make, that is, insulation course is specially silicon oxide layer, silicon nitride layer or resin bed.

As shown in Figure 5, the implementation method of the electrode structure that provides of the utility model embodiment comprises the steps:

Step S501, in the substrate manufacture metal bridge, this metal bridge can be arranged on same one deck with Metal Trace, shown in Fig. 6 a;

Step S502, cover insulation course on substrate, shown in Fig. 6 b, the thickness of institute's covered dielectric layer can be set according to the size of required electric capacity;

Step S503, the relevant position on metal bridge make via, shown in Fig. 6 c;

Step S504, two Y direction electrodes that interconnective directions X electrode is not connected with two of making, Y direction electrode all connects metal bridge by via, shown in Fig. 6 d;

Step S505, covering passivation layer.

The utility model embodiment also provides a kind of array base palte, and this array base palte comprises the electrode structure that the utility model embodiment provides.

The utility model embodiment also provides a kind of display device, and this display device comprises the electrode structure that the utility model embodiment provides.

Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.

Claims

1. electrode structure comprises: substrate, and be arranged on insulation course on the described substrate, be arranged on the electrode layer on the described insulation course, described electrode layer comprises the second direction electrode that at least two interconnective first direction electrodes are not connected with at least two; It is characterized in that described electrode structure also comprises:

2. electrode structure as claimed in claim 1 is characterized in that, described connection bridge is arranged between described insulation course and the described substrate.

3. electrode structure as claimed in claim 1 is characterized in that, described connection bridge is specially:

Metal bridge or tin indium oxide bridge.

4. electrode structure as claimed in claim 3 is characterized in that, when described connection bridge was metal bridge, the diameter of described via was 5um-15um.

5. electrode structure as claimed in claim 3 is characterized in that, when described connection bridge was the tin indium oxide bridge, the diameter of described via was 20um-100um.

6. electrode structure as claimed in claim 1 is characterized in that, the thickness of described first direction electrode and described second direction electrode is more than or equal to 150 dusts.

7. electrode structure as claimed in claim 1 is characterized in that, described insulation course is silicon oxide layer, silicon nitride layer or resin bed.

8. electrode structure as claimed in claim 1 is characterized in that, described first direction electrode and described second direction electrode are indium-tin oxide electrode.

9. an array base palte is characterized in that, comprises arbitrary described electrode structure as claim 1-8.

10. a display device is characterized in that, comprises arbitrary described electrode structure as claim 1-8.