CN202070455U - Adhesive dispensing device for LED (light-emitting diode) die bonder - Google Patents
Adhesive dispensing device for LED (light-emitting diode) die bonder Download PDFInfo
- Publication number
- CN202070455U CN202070455U CN2011200733216U CN201120073321U CN202070455U CN 202070455 U CN202070455 U CN 202070455U CN 2011200733216 U CN2011200733216 U CN 2011200733216U CN 201120073321 U CN201120073321 U CN 201120073321U CN 202070455 U CN202070455 U CN 202070455U
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- Prior art keywords
- glue
- lacquer disk
- power source
- dripping head
- conversion power
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Abstract
The embodiment of the utility model relates to an adhesive dispensing device for an LED (light-emitting diode) die bonder. The adhesive dispensing device comprises a fixed plate, an adhesive dispensing driving assembly, an adhesive dispensing head assembly, an adhesive disk assembly, an adhesive dispensing head switching mechanism, an adhesive disk switching mechanism and a controller, wherein the adhesive dispensing driving assembly is fixedly arranged on the fixed plate; the adhesive dispensing head switching mechanism is used for controlling the adhesive dispensing head assembly to dispense adhesive; and the adhesive disk switching mechanism is used for controlling the adhesive disk assembly to supply the adhesive. In the utility model, the automatically switched adhesive dispensing head assembly and an adhesive disk structure capable of automatically supplying the adhesive in the adhesive dispensing device are arranged, so that the adhesive dispensing device realizes the technical effects that the production efficiency is improved, the production quality is promoted, the structure is simple, the volume is small, and the cost is low are achieved.
Description
Technical field
The utility model relates to LED manufacturing technology field, relates in particular to a kind of LED dropping glue of die bonder device.
Background technology
Along with light emitting diode (LED) technical development, make light emitting diode be widely used on the daily life fields such as illumination, signal demonstration, and the LED manufacturing technology is as solid crystal technique also constantly development thereupon.
Yet the inventor find that the solid brilliant machine of LED often requires identical carrier to go up dissimilar crystal admittedly, and dissimilar crystal may correspondingly use different glue point (difformity size or different glue types) in implementing the utility model process.Traditional way be point out on the carrier a kind of glue point solid behind a kind of crystal, artificial change the lacquer disk(-sc) that different glue are housed and change or clean Glue dripping head after solid more different crystal, this way efficient is low, fraction defective is high; Another kind of way is that the complete some colloid system of two covers is installed on same solid brilliant machine, and this way complex structure, volume is big and cost is high.
The utility model content
The utility model embodiment technical problem to be solved is, a kind of quality of production height is provided, and the production efficiency height is simple in structure, the LED dropping glue of die bonder device that volume is little and cost is low.
For solving the problems of the technologies described above, a kind of LED dropping glue of die bonder device is provided, comprise fixed head; Be fixedly arranged on the some glue driven unit on the described fixed head; The Glue dripping head assembly comprises mount pad and is symmetrically set at least two Glue dripping heads on the described mount pad; The lacquer disk(-sc) assembly comprises at least two lacquer disk(-sc)s that are used for splendid attire glue; Glue dripping head switching mechanism, comprise and be fixedly arranged on first driving member that the described some Glue dripping head on the glue driven unit changed power source, is connected in described Glue dripping head conversion power source output, described mount pad is fixed in the described first driving member end, and described Glue dripping head assembly moves under the drive of described first driving member so that a Glue dripping head is positioned at a glue operating position; Lacquer disk(-sc) switching mechanism, comprise the lacquer disk(-sc) conversion power source that is fixedly arranged on the described fixed head, second driving member that is connected in described lacquer disk(-sc) conversion power source output, described lacquer disk(-sc) assembly is fixed on described second driving member and moves under described second driving member drives so that the lacquer disk(-sc) of the glue of current required use is housed is positioned at for the glue position; Controller connects and controls described some glue driven unit, Glue dripping head conversion power source and lacquer disk(-sc) conversion power source.
Further, described Glue dripping head switching mechanism also comprises: first holder, be fixedly arranged on the described some glue driven unit, described Glue dripping head conversion power source is fixed on described first holder, and the through hole that the output shaft of described Glue dripping head conversion power source passes on described first holder links to each other with described first driving member, is formed with the stopper section on the hole wall of described through hole; Limited block, it is placed in the described through hole and is fixed on the output shaft of described Glue dripping head conversion power source, and described limited block cooperates the rotation angle range of the output shaft that limits described Glue dripping head conversion power source with described stopper section.
Further, described stopper section also is provided with screw, screws togather one in the described screw and regulates the adjusting bolt of the stroke range of described limited block by adjusting its length of stretching out described screw.
Further, described first driving member comprises the shaft coupling that is connected in described Glue dripping head conversion power source output, the turning cylinder that is connected in described shaft coupling, and the mount pad of described Glue dripping head assembly is fixed in described rotation the tip of the axis.
Further, described Glue dripping head switching mechanism also comprises fixation kit, this fixation kit comprises that an end is fixedly arranged on the tubular link of described first holder, accommodates the bearing that is fixedly arranged on described link two ends respectively, and is sheathed on the described turning cylinder and the bearing locking spare between described Glue dripping head assembly and described link.
Further, described lacquer disk(-sc) switching mechanism also comprises second holder that is fixedly arranged on the described fixed head, and described lacquer disk(-sc) conversion power source is fixed on described second holder; Described second driving member comprises the floating junction that is connected in described lacquer disk(-sc) conversion power source output, it is outside and be fixed in connecting plate on the described floating junction to be sheathed on described lacquer disk(-sc) conversion power source output, and an end is fixedly arranged on the lacquer disk(-sc) unit installing board that is used to install described lacquer disk(-sc) assembly on the described connecting plate.
Further, described lacquer disk(-sc) assembly comprises two lacquer disk(-sc)s, and the distance of two described lacquer disk(-sc)s equals the stroke distances of described second driving member.
Further, described lacquer disk(-sc) switching mechanism also comprises slide assemblies, this slide assemblies comprises and is fixedly arranged on described fixed head lower limb and is connected with the first corresponding guide rail mount pad of described connecting plate one end position, is fixedly arranged on the guide rail on the described first guide rail mount pad with described lacquer disk(-sc) unit installing board, and is installed on the described guide rail and the second guide rail mount pad of fixedly connected described lacquer disk(-sc) unit installing board.
Further, described Glue dripping head conversion power source and lacquer disk(-sc) conversion power source are motor and/or hydraulic cylinder and/or cylinder.
Further, described some glue driven unit realized the three-dimensional three-D displacement mechanism that moves for driving described Glue dripping head assembly.
Technique scheme has following beneficial effect at least: because adopted Glue dripping head assembly that automaticallyes switch and the gluing disk structure that supplies glue automatically, so overcome that the efficient of prior art is low, fraction defective is high, complex structure, volume is big and cost is high technical problem, and then reached and enhanced productivity, promote the quality of production, technique effect simple in structure, that volume is little and cost is low.
Description of drawings
Fig. 1 is the LED dropping glue of die bonder device overall structure schematic diagram of the utility model embodiment.
Fig. 2 is the LED dropping glue of die bonder device decomposing schematic representation of the utility model embodiment.
Fig. 3 is the decomposing schematic representation of the Glue dripping head switching mechanism of LED dropping glue of die bonder device shown in Figure 1.
Fig. 4 is the decomposing schematic representation of the lacquer disk(-sc) switching mechanism of LED dropping glue of die bonder device shown in Figure 1.
The specific embodiment
Please refer to Fig. 1～Fig. 4, the LED dropping glue of die bonder device of the utility model embodiment comprises fixed head 10, is fixedly arranged on some glue driven unit 20, Glue dripping head assembly 30, lacquer disk(-sc) assembly 40, Glue dripping head switching mechanism 50, lacquer disk(-sc) switching mechanism 60 and controller on the fixed head 10.
Point glue driven unit 20 is realized the three-dimensional displacement mechanism that moves for driving Glue dripping head assembly 30.In the present embodiment, can be used for driving Glue dripping head switching mechanism 50 rotation and move up and down, make Glue dripping head assembly 30 realize the action of some glue.
Glue dripping head assembly 30 comprises mount pad 31 and is symmetrically set at least two Glue dripping heads on the mount pad 31.In the present embodiment, comprise symmetrically arranged first Glue dripping head 311 and second Glue dripping head 313, thereby carry out still keeping being stained with after the 180 degree rotations invariant position of glue point.
Lacquer disk(-sc) assembly 40 comprises at least two lacquer disk(-sc)s 401,403 that are used for splendid attire glue.
Glue dripping head switching mechanism 50 comprises Glue dripping head conversion power source 51, first driving member 52, first holder 53, limited block 54 and fixation kit 55.
Glue dripping head conversion power source 51 is fixedly arranged on the glue driven unit 20.
First driving member 52 is connected in Glue dripping head conversion power source 51 outputs, and wherein, mount pad 31 is fixed in first driving member, 52 ends, and Glue dripping head assembly 30 moves under the drive of first driving member 52 so that a Glue dripping head is positioned at a glue operating position.Further, first driving member 52 comprises shaft coupling 521 and turning cylinder 523.
Shaft coupling 521 is connected in Glue dripping head conversion power source 51 outputs; Turning cylinder 523 is connected in shaft coupling 521.The mount pad 31 of Glue dripping head assembly 30 is fixed in the end of turning cylinder 523.
First holder 53, be fixedly arranged on the glue driven unit 20, Glue dripping head conversion power source 51 is fixed on first holder 53, and the through hole that the output shaft of Glue dripping head conversion power source 51 passes on first holder 53 links to each other with first driving member 52, is formed with stopper section 531 on the hole wall of described through hole.First holder 53 has and installs and fixes Glue dripping head conversion power source 51 and fixation kit 55 and and put the effect that glue driven unit 20 is connected.Wherein, stopper section 531 also is provided with screw, screws togather one in the described screw and regulates the adjusting bolt 533 of the stroke range of limited block 54 by adjusting its length of stretching out described screw, with the anglec of rotation of fine setting Glue dripping head assembly 30 correspondences.
Limited block 54 is placed in the described through hole and is fixed on the output shaft of Glue dripping head conversion power source 51, and limited block 54 cooperates the rotation angle range that limits the output shaft that is Glue dripping head conversion power source 51 with stopper section 531.
Fixation kit 55 comprises link 551, bearing 553 and bearing locking spare 555.
Link 551 roughly is tubular, is fixedly arranged on first holder 53 corresponding to the end at the bottom of the tube by screw, is used for fixing first driving member 52; Bearing 553 has two, accommodates respectively to be fixedly arranged on link 551 two ends; Bearing locking spare 555 is sheathed on the turning cylinder 523 and between Glue dripping head assembly 30 and link 551, bearing locking spare 555 and bearing 553 play the effect of fixed support turning cylinder 523.
Lacquer disk(-sc) switching mechanism 60 comprises lacquer disk(-sc) conversion power source 61, second driving member 63, second holder 65 and slide assemblies 67.
Lacquer disk(-sc) conversion power source 61 is fixedly arranged on the fixed head 10, and wherein, Glue dripping head conversion power source 51 and lacquer disk(-sc) conversion power source 61 are motor and/or hydraulic cylinder and/or cylinder.For example, Glue dripping head conversion power source 51 adopts the oscillating cylinder that has gas-tpe fitting, and lacquer disk(-sc) conversion power source 61 adopts and has the cylinder that gas-tpe fitting can be done stretching motion.
Floating junction 631 is connected in lacquer disk(-sc) conversion power source 61 outputs; Connecting plate 633 is fixed on the floating junction 631; Lacquer disk(-sc) unit installing board 635 1 ends are fixedly arranged on the connecting plate 633, are used to install lacquer disk(-sc) assembly 40.In the present embodiment, lacquer disk(-sc) assembly 40 comprises two lacquer disk(-sc)s, and the distance of two described lacquer disk(-sc)s equals the stroke distances of second driving member 63, thereby is that Glue dripping head assembly 30 is accurately for glue.
Second holder 65 is fixedly arranged on the fixed head 10, and lacquer disk(-sc) conversion power source 61 is fixed on second holder 65.
Slide assemblies 67 comprises: the first guide rail mount pad 671, guide rail 673 and the second guide rail mount pad 675.
The first guide rail mount pad 671 is fixedly arranged on fixed head 10 lower limbs; Guide rail 673 is fixedly arranged in the groove of the first guide rail mount pad, 671 correspondences; The second guide rail mount pad 675 is installed on the guide rail 673 and fixedly connected lacquer disk(-sc) unit installing board 635.
The controller (not shown) connects and control point glue driven unit 20, Glue dripping head conversion power source 51 and lacquer disk(-sc) conversion power source 61.
In the present embodiment, the job step of described LED dropping glue of die bonder device is as follows:
1. the Glue dripping head conversion power source 51 output anglecs of rotation are in 0 degree position during original state, and first Glue dripping head 311 is in the operating position, and the glue position of setting up an office is P1, and lacquer disk(-sc) conversion power source 61 is in the state that makes second driving member 63 be in retracted position; Lacquer disk(-sc) 401 is in the operating position; Be stained with the glue point and be made as Q1 for first Glue dripping head 311 provides, at this moment, under a drive of glue driven unit 20, first Glue dripping head 311 can be put to P1 from the Q1 viscose glue, thereby points out first kind of glue point.
2. when needs are pointed out another kind of glue point, Glue dripping head conversion power source 51 rotates 180 degree by first driving member 52 under limited block 54 and stopper section 531 mating reactions, promptly guarantee that by limited block 54 and angle modulation screw 533 anglec of rotation is 180 degree, because the position of first Glue dripping head 311 and second Glue dripping head 313 is with respect to the center symmetry of turning cylinder 523, so this moment, second Glue dripping head 313 was in the operating position, the glue position of setting up an office is P2, and some P2 overlaps with P1; 61 work of the power source of lacquer disk(-sc) conversion simultaneously make second driving member 63 be in the state of extended position, second driving member 63 drives lacquer disk(-sc) assembly 40 motion forward, because lacquer disk(-sc) 401 equals the stroke distances that lacquer disk(-sc) is changed second driving member 63 of power source 61 with the distance of lacquer disk(-sc) 403, so this moment, lacquer disk(-sc) 403 was in the operating position, if the glue point of being stained with that provides is made as Q2, then lacquer disk(-sc) 403 overlaps with the original position of lacquer disk(-sc) 401; Point Q2 overlaps with Q1, and at this moment, under a drive of glue driven unit 20, second Glue dripping head 313 can be put to P2 from the Q2 viscose glue, thereby points out second kind of glue point, and the position overlaps with first kind of glue point position.
3. repeat 1 to 2 step cycle work, finish the switching of glue types and the action of some glue.
To sum up, described LED dropping glue of die bonder device has adopted Glue dripping head assembly that automaticallyes switch and the gluing disk structure that supplies glue automatically, so overcome that the efficient of prior art is low, fraction defective is high, complex structure, volume is big and cost is high technical problem, and then reached and enhanced productivity, promote the quality of production, technique effect simple in structure, that volume is little and cost is low.
The above is the specific embodiment of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection domain of the present utility model.
Claims (10)
1. a LED dropping glue of die bonder device is characterized in that, comprising:
Fixed head;
Be fixedly arranged on the some glue driven unit on the described fixed head;
The Glue dripping head assembly comprises mount pad and is symmetrically set at least two Glue dripping heads on the described mount pad;
The lacquer disk(-sc) assembly comprises at least two lacquer disk(-sc)s that are used for splendid attire glue;
Glue dripping head switching mechanism, comprise and be fixedly arranged on first driving member that the described some Glue dripping head on the glue driven unit changed power source, is connected in described Glue dripping head conversion power source output, described mount pad is fixed in the described first driving member end, and described Glue dripping head assembly moves under the drive of described first driving member so that a Glue dripping head is positioned at a glue operating position;
Lacquer disk(-sc) switching mechanism, comprise the lacquer disk(-sc) conversion power source that is fixedly arranged on the described fixed head, second driving member that is connected in described lacquer disk(-sc) conversion power source output, described lacquer disk(-sc) assembly is fixed on described second driving member and moves under described second driving member drives so that the lacquer disk(-sc) of the glue of current required use is housed is positioned at for the glue position;
Controller connects and controls described some glue driven unit, Glue dripping head conversion power source and lacquer disk(-sc) conversion power source.
2. LED dropping glue of die bonder device as claimed in claim 1 is characterized in that, described Glue dripping head switching mechanism also comprises:
First holder, be fixedly arranged on the described some glue driven unit, described Glue dripping head conversion power source is fixed on described first holder, and the through hole that the output shaft of described Glue dripping head conversion power source passes on described first holder links to each other with described first driving member, is formed with the stopper section on the hole wall of described through hole;
Limited block, it is placed in the described through hole and is fixed on the output shaft of described Glue dripping head conversion power source, and described limited block cooperates the rotation angle range of the output shaft that limits described Glue dripping head conversion power source with described stopper section.
3. LED dropping glue of die bonder device as claimed in claim 2 is characterized in that described stopper section also is provided with screw, screws togather one in the described screw and regulates the adjusting bolt of the stroke range of described limited block by adjusting its length of stretching out described screw.
4. LED dropping glue of die bonder device as claimed in claim 2, it is characterized in that, described first driving member comprises the shaft coupling that is connected in described Glue dripping head conversion power source output, the turning cylinder that is connected in described shaft coupling, and the mount pad of described Glue dripping head assembly is fixed in described rotation the tip of the axis.
5. LED dropping glue of die bonder device as claimed in claim 3, it is characterized in that, described Glue dripping head switching mechanism also comprises fixation kit, this fixation kit comprises that an end is fixedly arranged on the tubular link of described first holder, accommodates the bearing that is fixedly arranged on described link two ends respectively, and is sheathed on the described turning cylinder and the bearing locking spare between described Glue dripping head assembly and described link.
6. LED dropping glue of die bonder device as claimed in claim 1 is characterized in that described lacquer disk(-sc) switching mechanism also comprises second holder that is fixedly arranged on the described fixed head, and described lacquer disk(-sc) conversion power source is fixed on described second holder;
Described second driving member comprises the floating junction that is connected in described lacquer disk(-sc) conversion power source output, it is outside and be fixed in connecting plate on the described floating junction to be sheathed on described lacquer disk(-sc) conversion power source output, and an end is fixedly arranged on the lacquer disk(-sc) unit installing board that is used to install described lacquer disk(-sc) assembly on the described connecting plate.
7. LED dropping glue of die bonder device as claimed in claim 6 is characterized in that described lacquer disk(-sc) assembly comprises two lacquer disk(-sc)s, and the distance of two described lacquer disk(-sc)s equals the stroke distances of described second driving member.
8. LED dropping glue of die bonder device as claimed in claim 6, it is characterized in that, described lacquer disk(-sc) switching mechanism also comprises slide assemblies, this slide assemblies comprises and is fixedly arranged on described fixed head lower limb and is connected with the first corresponding guide rail mount pad of described connecting plate one end position, is fixedly arranged on the guide rail on the described first guide rail mount pad with described lacquer disk(-sc) unit installing board, and is installed on the described guide rail and the second guide rail mount pad of fixedly connected described lacquer disk(-sc) unit installing board.
9. LED dropping glue of die bonder device as claimed in claim 1 is characterized in that, described Glue dripping head conversion power source and lacquer disk(-sc) conversion power source are motor and/or hydraulic cylinder and/or cylinder.
10. LED dropping glue of die bonder device as claimed in claim 1 is characterized in that, described some glue driven unit realized the three-dimensional three-D displacement mechanism that moves for driving described Glue dripping head assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200733216U CN202070455U (en) | 2011-03-18 | 2011-03-18 | Adhesive dispensing device for LED (light-emitting diode) die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200733216U CN202070455U (en) | 2011-03-18 | 2011-03-18 | Adhesive dispensing device for LED (light-emitting diode) die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202070455U true CN202070455U (en) | 2011-12-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200733216U Expired - Lifetime CN202070455U (en) | 2011-03-18 | 2011-03-18 | Adhesive dispensing device for LED (light-emitting diode) die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202070455U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102509754A (en) * | 2011-12-16 | 2012-06-20 | 深圳翠涛自动化设备股份有限公司 | Dispensing arm structure for die bonder |
| CN103112266A (en) * | 2013-03-15 | 2013-05-22 | 吴静 | Adhesive dropping seat for adhesive binding |
| CN104282809A (en) * | 2014-11-03 | 2015-01-14 | 宁波海曙信满贸易有限公司 | LED glue dispensing and packaging equipment using left limiting sensor and right limiting sensor |
| CN104275274A (en) * | 2014-09-28 | 2015-01-14 | 吴长江 | Glue applicator for manufacturing LED sets and automatic assembling machine for LED sets |
| CN104465947A (en) * | 2014-11-03 | 2015-03-25 | 宁波海曙信满贸易有限公司 | LED adhesive dispensing packaging device good in damping effect |
| CN104874525A (en) * | 2015-05-29 | 2015-09-02 | 苏州市吴中区胥口广博模具加工厂 | Pneumatic dispensing device of servo-control type disc-rim dispensing machine |
| CN107326739A (en) * | 2017-06-15 | 2017-11-07 | 安徽金亿禾特种纸有限公司 | A kind of extraordinary paper processing equipment and technique |
| CN109746599A (en) * | 2019-01-30 | 2019-05-14 | 无锡奥特维科技股份有限公司 | A kind of cell piece processing equipment and method |
| CN115424947A (en) * | 2022-09-21 | 2022-12-02 | 深圳市三联盛科技股份有限公司 | Semiconductor chip mounting process and device |
-
2011
- 2011-03-18 CN CN2011200733216U patent/CN202070455U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102509754A (en) * | 2011-12-16 | 2012-06-20 | 深圳翠涛自动化设备股份有限公司 | Dispensing arm structure for die bonder |
| CN102509754B (en) * | 2011-12-16 | 2013-10-30 | 深圳翠涛自动化设备股份有限公司 | Dispensing arm structure for die bonder |
| CN103112266A (en) * | 2013-03-15 | 2013-05-22 | 吴静 | Adhesive dropping seat for adhesive binding |
| CN104275274A (en) * | 2014-09-28 | 2015-01-14 | 吴长江 | Glue applicator for manufacturing LED sets and automatic assembling machine for LED sets |
| CN104282809A (en) * | 2014-11-03 | 2015-01-14 | 宁波海曙信满贸易有限公司 | LED glue dispensing and packaging equipment using left limiting sensor and right limiting sensor |
| CN104465947A (en) * | 2014-11-03 | 2015-03-25 | 宁波海曙信满贸易有限公司 | LED adhesive dispensing packaging device good in damping effect |
| CN104874525A (en) * | 2015-05-29 | 2015-09-02 | 苏州市吴中区胥口广博模具加工厂 | Pneumatic dispensing device of servo-control type disc-rim dispensing machine |
| CN107326739A (en) * | 2017-06-15 | 2017-11-07 | 安徽金亿禾特种纸有限公司 | A kind of extraordinary paper processing equipment and technique |
| CN109746599A (en) * | 2019-01-30 | 2019-05-14 | 无锡奥特维科技股份有限公司 | A kind of cell piece processing equipment and method |
| CN109746599B (en) * | 2019-01-30 | 2023-11-17 | 无锡奥特维科技股份有限公司 | Battery piece processing equipment and method |
| CN115424947A (en) * | 2022-09-21 | 2022-12-02 | 深圳市三联盛科技股份有限公司 | Semiconductor chip mounting process and device |
| CN115424947B (en) * | 2022-09-21 | 2023-08-29 | 深圳市三联盛科技股份有限公司 | Semiconductor chip mounting technology and equipment |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Peace Village Fuyong town Shenzhen city Guangdong province 518000 Heping Road Ruiming Industrial Park building C8 Patentee after: Shenzhen Xinyichang Science and Technology Co., Ltd. Address before: Baoan District Peace Village Fuyong town Shenzhen city Guangdong province 518000 Heping Road Ruiming Industrial Park building C8 Patentee before: Shenzhen Xinyichang Automatic Equipment Co., Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111214 |