CN202068709U

CN202068709U - Heat radiator with parallel-type heat pipes

Info

Publication number: CN202068709U
Application number: CN2011201715179U
Authority: CN
Inventors: 林俊宏; 谢东阳; 邱彦翔; 李俊亿
Original assignee: Cooler Master Co Ltd
Current assignee: Cooler Master International Co Ltd
Priority date: 2011-05-26
Filing date: 2011-05-26
Publication date: 2011-12-07
Anticipated expiration: 2021-05-26

Abstract

The utility model relates to a heat radiator with parallel-type heat pipes, which comprises a base, a plurality of heat pipes and a pair of side bars. The base is provided with a surface; the surface is concavely provided with an opening groove and caulking grooves respectively arranged on two sides of the opening groove; each of the heat pipes is provided with each evaporation section; each of the evaporation sections is parallel to each other and is placed in the opening groove in a mutually-contacted and connected way; each of the evaporation section is provided with a flat surface; and the pair of side bars are fixed in the caulking grooves and are protruded on the surface of the base; and the flat surfaces of each evaporation section and the outer surfaces of side bars form a coplanar structure. Therefore, the heat contact area of each heat pipe and the electronic heating source can be increased so as to improve the heat radiation efficiency of the heat radiator.

Description

Radiator with parallel heat pipe

Technical field

The utility model relates to a kind of radiator, refers to a kind of radiator with parallel heat pipe especially.

Background technology

With the heat conducting module of heat pipe (heat pipe) in conjunction with the heat-conducting seat gained, or in conjunction with the heat-pipe radiator of radiating fin group gained, can overcome the leading of processor that heat raises day by day, heat dissipation problem effectively, be with these lead, radiator structure only progressively replaces in the past the radiator structure by fin was constituted; But how problem such as to make up then be to remain to be overcome and solve for opposite heat tube and heat-conducting seat.

Existing heat conducting module, mainly comprise a heat-conducting block and plural heat pipe, it is to offer the most bar grooves that are parallel to each other on heat-conducting block, and between any two adjacent grooves, be formed with a divider, each heat pipe is imbedded respectively in each groove, and with a pressing element each heat pipe is pressed processing, so that each heat pipe is formed with the plane with the end face of divider.

When yet aforesaid combining structure is applied in the heat radiation in electronic heating source, be to do thermo-contact with the electronic heating source with the plane of heat pipe and divider, because the coefficient of heat conduction of divider is to be subjected to sizable limitation with its whole heat conduction efficiency far below the coefficient of heat conduction of heat pipe.Because each heat pipe is separated bar and separates and do not contact mutually, when heat pipe generation failure conditions wherein, and can't assist to do quick conductive in addition, so all can cause the damage in electronic heating source or the harmful effect of burning by other heat pipe; Really demand urgently being improved.

Summary of the invention

A purpose of the present utility model is to provide a kind of radiator with parallel heat pipe, and it relies on pasting side by side and mutually of each heat pipe to touch connection, can increase the thermocontact area in each heat pipe and electronic heating source, and then improve the heat dissipation of this radiator.

For achieving the above object, the technical solution adopted in the utility model is:

A kind of radiator with parallel heat pipe is characterized in that, comprising:

One pedestal has a surface, is concaved with an open slot on this surface and lays respectively at a caulking groove of these open slot both sides;

The plural number heat pipe, each this heat pipe has an evaporation section, and described these evaporation sections are that being placed in this open slot of connection touched in subsides arranged side by side and mutual, and each this evaporation section has a plane surface; And

A pair of side slat, this surface that is fixed on this caulking groove and protrudes this pedestal, this plane surface of described these evaporation sections and the outer surface of this side slat are a coplane structure.

Wherein: this pedestal is an aluminum element.

Wherein: the mid portion of this pedestal has protruded out a boss, and the surface of this pedestal is formed on this boss.

Wherein: this open slot comprises two above conduits, and is formed with a divider between any two adjacent these conduits, and the free end end face of this divider is lower than this surface, thereby makes this divider and should be formed with a difference of height between the surface.

Wherein: the coefficient of heat conduction of this side slat is higher than the coefficient of heat conduction of this pedestal.

Wherein: this side slat is a copper product element.

Wherein: also comprise a radiating fin group, this radiating fin group is to be overlapped on this pedestal top.

Wherein: this radiating fin group offers most intercommunicating pores, and each this heat pipe has more from the extended condensation segment of this evaporation section, and this condensation segment is that cross-under respectively is in this intercommunicating pore.

One pedestal has a surface, is concaved with an open slot on this surface;

A pair of side slat is fixed on this pedestal and protrudes this surface, and this plane surface of described these evaporation sections and the outer surface of this side slat are a coplane structure.

Wherein: this pedestal is an aluminum element.

Wherein: the mid portion of this pedestal has protruded out a boss, and this surface is formed on this boss.

Wherein: this side slat is a copper product element.

The utility model is by means of helping the mutual subsides of each heat pipe side to touch interconnect function, when a heat pipe produces failure conditions therein, the diversion effect that can rely on other adjacent heat pipe to share heat jointly continues running so that the electronic heating source can remain under the lower working temperature.Rely on the boss design of pedestal, and be beneficial to each side slat and each heat pipe flattens and procedure such as grinding.

Description of drawings

Fig. 1 is the utility model radiator three-dimensional exploded view;

Fig. 2 is a combination schematic diagram before each heat pipe of the present utility model does not flatten;

Fig. 3, Fig. 3 A are cutaway view and the partial enlarged drawings thereof of Fig. 2;

Fig. 4 is each heat pipe leveling back combination schematic diagram of the present utility model;

Fig. 5, Fig. 5 A are cutaway view and the partial enlarged drawings thereof of Fig. 4;

Fig. 6, Fig. 6 A are that the utility model heat sink applications is in electronic heating source user mode figure and partial enlarged drawing thereof;

Fig. 7, Fig. 7 A are another embodiment assembled sectional view and partial enlarged drawings thereof of the present utility model.

Description of reference numerals: 10-pedestal; The 11-boss; The 111-surface; The 12-open slot; The 121-conduit; The 122-divider; The 13-caulking groove; The 20-heat pipe; The 21-evaporation section; The 211-plane surface; The 22-condensation segment; The 30-side slat; The 311-outer surface; 40-radiating fin group; The 41-intercommunicating pore; The 7-printed circuit board (PCB); 8-electronic heating source.

Embodiment

Relevant detailed description of the present utility model and technology contents cooperate graphic being described as follows, however appended graphic only provide with reference to and explanation usefulness, be not to be used for to the utility model limitr in addition.

See also shown in Fig. 1 to Fig. 3, Fig. 3 A, the utility model provides a kind of radiator with parallel heat pipe, and it mainly comprises a pedestal 10, plural heat pipe 20 and a pair of side slat 30.

Pedestal 10 is made with metal materials such as aluminium or its alloys, the pedestal 10 of present embodiment roughly is one " H " word shape plate body, but do not exceed with this kind shape, it also can be other various different geometric modelings, mid portion at pedestal 10 has protruded out a boss 11, this boss 11 has a surface 111, be provided with an open slot 12 on surface 111, these open slot 12 inside are formed with three conduits 121, but do not exceed with this kind shape, it is so long as the conduit 121 more than two is the utility model institute covering scope; Be formed with a divider 122 between any two adjacent conduits 121, the free end end face of this divider 122 is lower than surface 111, so that be formed with a difference of height between divider 122 and the surface 111.Other is respectively equipped with a caulking groove 13 on the surface 111 of the pedestal 10 of open slot 12 both sides, and this caulking groove 13 roughly is one " T " word shape, but does not exceed with this kind shape, and it also can be other various different geometric modelings.

The inside of heat pipe (Heat Pipe) 20 has capillary structure and working fluid, utilize the liquid-gas phase transitionization of working fluid and the liquid return mechanism that capillary structure is provided, produce the heat transferred of continuous circulation, the heat pipe 20 of present embodiment is three, each heat pipe 20 has or two condensation segments 22 that an evaporation section 21 and spontaneous evaporation section 21 are extended, and each evaporation section 21 is in the open slot that is placed in aforementioned boss 11 12 that is parallel to each other (consulting shown in Figure 3).

Side slat 30 is made with metal materials such as copper or its alloys, its coefficient of heat conduction is higher than the coefficient of heat conduction of pedestal 10, the side slat 30 of present embodiment roughly is one " T " word shape, these two side slats 30 are to be mounted in the aforementioned caulking groove 13, the subregion of side slat 30 is 111 outsides, surface of protruding pedestal 10, and has an outer surface 311 at side slat 30 away from an end of caulking groove 13.

In addition, the radiator that the utlity model has parallel heat pipe more comprises a radiating fin group 40, this radiating fin group 40 stacks winding mutually by the radiating fin of majority respectively and forms, and on each radiating fin, offer most intercommunicating pores 41 of mutual correspondence, the zone line of radiating fin group 40 is to be overlapped on pedestal 10 tops, and 22 of the condensation segments of aforementioned each heat pipe 20 are that cross-under respectively is in each intercommunicating pore 41.

See also shown in Fig. 4 and Fig. 5, Fig. 5 A, after finishing the assembly working of aforementioned each element, with a pressing element (scheming not shown) evaporation section 21 of each heat pipe 20 is flattened processing, these evaporation sections 21 are pressed back its dual-side and incite somebody to action closely connected combination each other and do not produce the slit, and being formed with a plane surface 211 away from a side of boss 11 at each evaporation section 21, the plane surface 211 of each evaporation section 21 is a coplane structure with the outer surface 31 of each side slat 30.

See also Fig. 6, shown in Fig. 6 A, radiator of the present utility model can be applied in it on electronic heating source 8 of a printed circuit board (PCB) 7, be that the plane surface 211 of each evaporation section 21 and outer surface 31 common subsides of each side slat 30 are touched on the surface that is connected electronic heating source 8 during assembling, the high heat that produced in 8 operation of electronic heating source this moment, direct heat is conducted to each side slat 30 and each evaporation section 21, each side slat 30 and each evaporation section 21 are after accepting these heats, the working fluid of military order heat pipe 20 inside produces evaporation and becomes a gas, this gas will be removed toward the low-temperature region of heat pipe 20 fast with a large amount of heat, these gases are when arriving condensation segment 22, will be because of each radiating fin of radiating fin group 40 and the heat exchange action of surrounding air, and the working fluid that makes condensation segment 22 inside is condensed into a liquid, and rely on the capillary absorption affinity effect that helps heat pipe 20 inner capillary structures, and this liquid conveying is back to aforesaid each evaporation section 21.

See also shown in Fig. 7, Fig. 7 A, radiator of the present utility model is except can be as the above-mentioned embodiment, also can via welding manner be fixed in the surface 111 of pedestal 10 on by tin cream each side slat 30, each side slat 30 is 111 outsides, surface that protrude from pedestal 10, the evaporation section 21 of each heat pipe 20 also is to be embedded in the open slot 12 of pedestal 10, via pressing element the evaporation section 21 of each heat pipe 20 is flattened processing, the plane surface 211 of each evaporation section 21 forms a coplane structure with the outer surface 31 of each side slat 30.

More than explanation is just illustrative for the utility model; and nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited; can make many modifications, variation or equivalence, but all will fall within the protection range of the present utility model.

Claims

1. the radiator with parallel heat pipe is characterized in that, comprising:

2. the radiator with parallel heat pipe according to claim 1 is characterized in that: this pedestal is an aluminum element.

3. the radiator with parallel heat pipe according to claim 2 is characterized in that: the mid portion of this pedestal has protruded out a boss, and the surface of this pedestal is formed on this boss.

4. the radiator with parallel heat pipe according to claim 3, it is characterized in that: this open slot comprises two above conduits, and between any two adjacent these conduits, be formed with a divider, the free end end face of this divider is lower than this surface, thereby makes this divider and should be formed with a difference of height between the surface.

5. the radiator with parallel heat pipe according to claim 1 is characterized in that: the coefficient of heat conduction of this side slat is higher than the coefficient of heat conduction of this pedestal.

6. the radiator with parallel heat pipe according to claim 1 is characterized in that: this side slat is a copper product element.

7. the radiator with parallel heat pipe according to claim 1 is characterized in that: also comprise a radiating fin group, this radiating fin group is to be overlapped on this pedestal top.

8. the radiator with parallel heat pipe according to claim 7, it is characterized in that: this radiating fin group offers most intercommunicating pores, each this heat pipe has more from the extended condensation segment of this evaporation section, and this condensation segment is that cross-under respectively is in this intercommunicating pore.

9. the radiator with parallel heat pipe is characterized in that, comprising:

One pedestal has a surface, is concaved with an open slot on this surface;

10. the radiator with parallel heat pipe according to claim 9 is characterized in that: this pedestal is an aluminum element.

11. the radiator with parallel heat pipe according to claim 10 is characterized in that: the mid portion of this pedestal has protruded out a boss, this surface is formed on this boss.

12. the radiator with parallel heat pipe according to claim 11, it is characterized in that: this open slot comprises two above conduits, and between any two adjacent these conduits, be formed with a divider, the free end end face of this divider is lower than this surface, thereby makes this divider and should be formed with a difference of height between the surface.

13. the radiator with parallel heat pipe according to claim 9 is characterized in that: the coefficient of heat conduction of this side slat is higher than the coefficient of heat conduction of this pedestal.

14. the radiator with parallel heat pipe according to claim 9 is characterized in that: this side slat is a copper product element.

15. the radiator with parallel heat pipe according to claim 9 is characterized in that: also comprise a radiating fin group, this radiating fin group is to be overlapped on this pedestal top.

16. the radiator with parallel heat pipe according to claim 15, it is characterized in that: this radiating fin group offers most intercommunicating pores, each this heat pipe has more from the extended condensation segment of this evaporation section, and this condensation segment is that cross-under respectively is in this intercommunicating pore.