CN202067054U - Pixel array substrate - Google Patents
Pixel array substrate Download PDFInfo
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- CN202067054U CN202067054U CN2011201453674U CN201120145367U CN202067054U CN 202067054 U CN202067054 U CN 202067054U CN 2011201453674 U CN2011201453674 U CN 2011201453674U CN 201120145367 U CN201120145367 U CN 201120145367U CN 202067054 U CN202067054 U CN 202067054U
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- array substrates
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Abstract
A pixel array substrate comprises a substrate, a pixel array, at least one first repair line, a plurality of second repair lines parallel with one another, a first connecting line and a second connecting line, wherein the substrate is provided with a plane; the pixel array is arranged on the plane and comprises a pixel group, a plurality of scanning lines and a plurality of data lines, and the data lines and the scanning lines are electrically connected with the pixel group; the first repair line is arranged on the plane and intersects with the data lines; the second repair lines are arranged on the plane and intersect with the data lines; the first connecting line is arranged on the plane and connected with the first repair line; the second connecting line is arranged on the plane and connected with the second repair lines; and the first repair line, the second repair lines, the first connecting line, and the second connecting line are all electrically insulated with the scanning lines.
Description
Technical field
The utility model relates to a kind of assembly of display, and particularly relevant for a kind of image element array substrates (pixel array substrate) with a plurality of transistors (transistor).
Background technology
Image element array substrates is general LCD (Liquid Crystal Display, LCD) significant components in, and image element array substrates generally includes a pel array and many patch cords (repair line), wherein pel array comprises a pixel group (pixel group) and many data lines (data line) that electrically connect pixel group, and pixel group has the rotation that a plurality of transistors are controlled liquid crystal molecule, thereby allows the LCD can show image.
In detecting the process of image element array substrates, when find a certain image element array substrates wherein a data line opens circuit the time, the staff can carry out laser preparing (laser repair) to this image element array substrates.Specifically, the staff can be melted data line with burning at the overlapping place illuminating laser beam between data line that opens circuit and the patch cord, and connects data line and patch cord, allows the data line that opens circuit electrically connect patch cord, so that image element array substrates can normal operation.
Yet, sometimes because the flaw in the manufacture process, caused before the detection image element array substrates, patch cord electrically connects data line already, even to such an extent as to allow the data line and the patch cord that open circuit electrically connect, patch cord still is difficult to bring into play mending function, causes the image element array substrates can't normal operation.
The utility model content
The utility model provides a kind of image element array substrates, to solve the problem that above-mentioned patch cord is difficult to bring into play mending function.
The utility model proposes a kind of image element array substrates, comprise a substrate, a pel array, at least one first patch cord, many second patch cords arranged side by side each other, one first connecting line and one second connecting lines.Substrate has a plane, and pixel array configuration in the plane, and comprises a pixel group, many sweep traces arranged side by side each other and many data lines arranged side by side each other.These data lines and these sweep traces are staggered, and these data lines and these sweep traces electric connection pixel group.First patch cord disposes in the plane, and staggered with these data lines.These second patch cords dispose in the plane, and staggered with these data lines, and wherein the pixel group position is between first patch cord and these second patch cords.First connecting line disposes in the plane, and connects first patch cord.Second connecting line disposes in the plane, and the position is by pixel group.Second connecting line connects these second patch cords, and wherein first patch cord, these second patch cords, first connecting line and second connecting line all are electrically insulated with these sweep traces.
In the utility model one embodiment, above-mentioned image element array substrates also comprises a plurality of detecting pads.These detecting pads connect these data lines respectively, and the position is between these second patch cords.
In the utility model one embodiment, the quantity of above-mentioned first patch cord is a plurality of, and these first patch cords are arranged side by side each other.
In the utility model one embodiment, above-mentioned image element array substrates also comprises at least one connection strap.Connection strap disposes in the plane, and is connected between these first patch cords.
In the utility model one embodiment, above-mentioned image element array substrates also comprises another connection strap at least.This connection strap disposes in the plane, and is connected between these second patch cords.
In the utility model one embodiment, the quantity of above-mentioned connection strap is many, and these connection straps are connected between these second patch cords, and each bar data line bit is between adjacent two connection straps.
In the utility model one embodiment, above-mentioned image element array substrates also comprises a plurality of detecting pads.These detecting pads connect these data lines respectively, and the position between these second patch cords, wherein each detecting pad position is between adjacent two connection straps.
In the utility model one embodiment, above-mentioned first patch cord, these second patch cords, first connecting line, second connecting line and these sweep traces all the position between substrate and these data lines.
In the utility model one embodiment, above-mentioned image element array substrates also comprises an insulation course.Insulation course disposes in the plane, and comprehensive ground overlay planes, first patch cord, these second patch cords, first connecting line, second connecting line and these sweep traces, and these data lines are configured on the insulation course.
In the utility model one embodiment, above-mentioned image element array substrates also comprises a protective seam, and protective seam covers these data lines and insulation course.
In the utility model one embodiment, above-mentioned image element array substrates also comprises a driven unit.Driven unit electrically connects these data lines, and the first patch cord position is between driven unit and pixel group.
In the utility model one embodiment, above-mentioned image element array substrates comprises that also one repairs assembly, repairs assembly and electrically connects first connecting line and second connecting line.
In the utility model one embodiment, above-mentioned repairing assembly is an amplifier.
Based on above-mentioned,, thereby can provide many can supply the used patch cord (i.e. first patch cord and second patch cord) of laser preparing because image element array substrates of the present utility model comprises above-mentioned first patch cord and second patch cord.So, the utility model can not only allow the data line that opens circuit transmit picture element signal, thereby makes the image element array substrates normal operation, and can solve the problem that known patch cord is difficult to bring into play mending function.
For above-mentioned feature and advantage of the present utility model can be become apparent, embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A is the schematic top plan view of the image element array substrates of the utility model one embodiment.
Figure 1B is the local enlarged diagram of the image element array substrates among Figure 1A.
Fig. 1 C is the diagrammatic cross-section that I-I section along the line is illustrated among Figure 1B.
Fig. 1 D is the schematic top plan view of image element array substrates after repairing among Figure 1A.
Fig. 2 is the schematic top plan view of the image element array substrates of another embodiment of the utility model.
Embodiment
Figure 1A is the schematic top plan view of the image element array substrates of the utility model one embodiment.See also Figure 1A, the image element array substrates 100 of present embodiment comprises a substrate 110 and a pel array 120, and wherein substrate 110 has a plane 112, and pel array 120 is configured on the plane 112.Pel array 120 comprises many sweep traces arranged side by side each other (scan line) 122s, many data line 122d arranged side by side each other and a pixel group 124.These data lines 122d and these sweep traces 122s are staggered, so these data lines 122d and these sweep traces 122s can be netted arrangement, thereby form a plurality of grid L1.
These data lines 122d and these sweep traces 122s electrically connect pixel group 124.Specifically, pixel group 124 comprises a plurality of pixel cells (not illustrating), and these pixel cells are configured in respectively in these grids L1.Each pixel cell comprises a transistor (not illustrating) and a pixel electrode (pixel electrode, do not illustrate), and these transistors electrically connect these pixel electrodes, wherein pixel electrode can be by indium tin oxide (Indium Tin Oxide, ITO) or indium-zinc oxide (Indium Zinc Oxide IZO) waits transparent conductive material made.
These transistors configuration aspects can be thin film transistor (TFT) (Thin-film Transistor, TFT), aspect electrically can be imitate a transistor npn npn (Field-Effect Transistor, FET).Therefore, each transistor has a grid (gate), one source pole (source) and a drain electrode (drain), and wherein grid connects sweep trace 122s, and source electrode connects data line 122d, and drain electrode connects pixel electrode.Hence one can see that, and these transistors can be unlocked via these sweep traces 122s or close, so that these pixel electrodes can produce the electric field that the control liquid crystal molecule rotates, thereby allows LCD be able to show image.
Image element array substrates 100 also comprises many first patch cords 131 arranged side by side each other, many second patch cord 132, one first connecting line 141 and one second connecting lines 142 arranged side by side each other.These first patch cords 131, these second patch cords 132, first connecting line 141 and second connecting line 142 all are configured on the plane 112, wherein first connecting line 141 connects these first patch cords 131, and second connecting line 142 connects these second patch cords 132.In addition, 142 of second connecting lines are other at pixel group 124.
These first patch cords 131 are all staggered with these data lines 122d with these second patch cords 132, and 124 of pixel groups are between these first patch cords 131 and these second patch cords 132.Specifically, the two trend of first patch cord 131 and second patch cord 132 can be same as the trend of sweep trace 122s, and these first patch cords 131 can be arranged side by side with these sweep traces 122s with these second patch cords 132, and therefore first patch cord 131 all interlocks with these data lines 122d with second patch cord 132.
Must explanation be that though Figure 1A illustrates many first patch cords 131, in other embodiments, the quantity of first patch cord 131 that image element array substrates 100 is included can only be one.Therefore, the quantity of first patch cord 131 shown in Figure 1A only supplies to illustrate, and non-limiting the utility model.
Image element array substrates 100 can also comprise a connection strap (connection strip) 151 and one connection strap 152, and connection strap 151,152 all is configured on the plane 112, wherein connection strap 151 is connected between these first patch cords 131, and connection strap 152 is connected between these second patch cords 132.Therefore, these first patch cords 131 can be connected in parallel to each other via connection strap 151, and these second patch cords 132 can be connected in parallel to each other via connection strap 152.So, the all-in resistance of the all-in resistance of these first patch cords 131 and these second patch cords 132 is minimized.
What must illustrate is that connection strap 151,152 is all selectivity assembly of the present utility model and inessential assembly.That is to say that image element array substrates 100 not necessarily will comprise connection strap 151 or 152.Therefore, in other embodiments, image element array substrates 100 can not comprise any connection strap 151 and 152.So the connection strap 151 and 152 shown in Figure 1A only supplies to illustrate, and non-limiting the utility model.
In addition, image element array substrates 100 can also comprise a plurality of detecting pads (testing pad) 160.These detecting pads 160 connect these data lines 122d respectively, and the position is between these second patch cords 132.These detecting pads 160 can use for the machines platform.Specifically, when detecting image element array substrates 100, the many probes (probe) that detect board can contact these detecting pads 160, and export test signal to these data lines 122d via these probes and detecting pad 160, thereby check whether image element array substrates 100 can normal operation.
In addition, image element array substrates 100 can also comprise a driven unit 172 and a repairing assembly 174, and driven unit 172 can be source driving chip (source-driving integrated circuit, source driving IC).Driven unit 172 electrically connects these data lines 122d, and can the output pixel signal to these data lines 122d, and 131 of these first patch cords are between driven unit 172 and pixel group 124.
Hold above-mentioned, when wherein a sweep trace 122s outputs signal to a wherein row pixel cell of pixel group 124, the transistor of this row pixel cell can be unlocked, to such an extent as to picture element signal can be passed to the pixel electrode of this row pixel cell via these data lines 122d, thereby impel liquid crystal molecule to rotate, allow LCD be able to show image.
Figure 1B is the local enlarged diagram of the image element array substrates among Figure 1A, and Fig. 1 C is the diagrammatic cross-section that I-I section along the line is illustrated among Figure 1B, and wherein Figure 1B amplifies the position, lower right of image element array substrates 100 among Figure 1A and draws.See also Figure 1A, Figure 1B and Fig. 1 C, these first patch cords 131, these second patch cords 132, first connecting line 141, second connecting line 142 and these sweep traces 122s all can the position between substrate 110 and data line 122d.
Particularly, image element array substrates 100 can also comprise an insulation course 182, and insulation course 182 is configured on the plane 112, and comprehensive ground overlay planes 112, these first patch cords 131, these second patch cords 132, first connecting line 141, second connecting line 142 and these sweep traces 122s, wherein data line 122d and detecting pad 160 all are configured on the insulation course 182.
Hence one can see that, and insulation course 182 can separate first patch cord 131 and data line 122d, and separate second patch cord 132 and data line 122d.Therefore, carrying out before the laser preparing, in theory, first patch cord 131, second patch cord 132, first connecting line 141 and second connecting line 142 should all be electrically insulated with data line 122d.
Image element array substrates 100 can also comprise a protective seam 184, and protective seam 184 covers these data lines 122d and insulation course 182.Protective seam 184 is an insulation course; and can be inorganic film (inorganic film) or organic film (organic film); wherein the material of this inorganic film for example is monox or silicon nitride, and the material of this organic film for example is macromolecular material (polymer).
These first patch cords 131, these second patch cords 132, first connecting line 141 and second connecting line 142 all are electrically insulated with these sweep traces 122s, and all can be formed by the metallic diaphragm behind one deck patterning (patterning), wherein the method for patterning for example is little shadow (photolithography) and etching (etching).Therefore, first patch cord 131, second patch cord 132, first connecting line 141 and second connecting line 142 all can the position at grade, for example be on plane 112, and all can contact with substrate 110.
Fig. 1 D is the schematic top plan view of image element array substrates after repairing among Figure 1A.See also Fig. 1 D, understandable for technology contents of the present utility model can be known more, can represent to open circuit with the X symbol among Fig. 1 D.When data line 122d wherein opens circuit, for example among Fig. 1 D when the right number comes the 3rd data line 122d to open circuit, the staff can be in data line 122d that opens circuit and wherein overlapping place between one first patch cord 131, and data line 122d that opens circuit and the overlapping place illuminating laser beam between one second patch cord 132 wherein, melt data line 122d with burning.So, first patch cord 131 electrically connects with data line 122d, and second patch cord 132 electrically connects with data line 122d.
Before illuminating laser beam, whether the staff can check earlier has any first patch cord 131 and any second patch cord 132 to electrically connect any data line 122d, confirms particularly whether first patch cord 131 and second patch cord 132 of position between the data line 122d that opens circuit and second connecting line 142 has any data line 122d of electric connection.
In theory, each bar first patch cord 131 at this time should all be electrically insulated with all data line 122d with each bar second patch cord 132, but the flaw in the manufacture process might cause wherein one first patch cord 131 or wherein one second patch cord 132 electrically connected a certain data line 122d, cause this first patch cord 131 or second patch cord 132 to be difficult to bring into play mending function, so the staff can select first patch cord 131 and second patch cord 132 that still has mending function earlier.
See also Figure 1B and Fig. 1 D, in the process of carrying out laser preparing, the staff can be with the edge of laser-beam acquiring at data line 122d.With Figure 1B and Fig. 1 D is example, after article one second patch cord 132 has mending function above determining, the staff can be with corner (corner) C1 of laser-beam acquiring in data line 122d and second patch cord, 132 the two zone that overlap, melt segment data line 122d so that laser beam can be burnt, thereby the data line 122d and second patch cord 132 are electrically connected.In like manner, the staff also adopts identical method that data line 122d and top article one first patch cord 131 are electrically connected.
Please consult Fig. 1 D once more, after the data line 122d that opens circuit electrically connected first patch cord 131 and second patch cord 132, first patch cord 131 and second patch cord 132 that the staff can utilize laser beam will electrically connect data line 122d blew.With Fig. 1 D is example, in the middle of first patch cord 131 that electrically connects data line 122d and second patch cord 132, the part that is blown all the position in the data line 122d that opens circuit left side, shown in Fig. 1 D.
Secondly, the staff can also utilize laser beam that part first connecting line 141 is blown with part second connecting line 142.With Fig. 1 D is example, and the part position that first connecting line 141 is blown is between adjacent two first patch cords 131, and the part position that second connecting line 142 is blown is between adjacent two second patch cords 132.So, the data line 122d that opens circuit, first patch cord 131, second patch cord 132, first connecting line 141 and second connecting line 142 can form one by repairing the thick black line of conductive path P1(as shown in Fig. 1 D of assembly 174).
Hold above-mentionedly, after the laser preparing that finishes, when driven unit 172 output pixel signals during to these data lines 122d, picture element signal can transmit in the data line 122d that opens circuit along conductive path P1.So, a plurality of pixel cells that the data line 122d that opens circuit is connected are received picture element signal.When picture element signal when repairing assembly 174, repair assembly 174 and can amplify picture element signal, to reduce the picture element signal that transmits at conductive path P1 situation as far as possible because of the decay distortion.
Hence one can see that, even arbitrary first patch cord 131 or arbitrary second patch cord 132 electrically connected data line 122d in the past already at laser preparing, still have other first patch cord 131 or other second patch cord 132 can be for laser preparing, thereby allow the data line 122d that opens circuit to transmit picture element signal, impel image element array substrates 100 normal operations.
Fig. 2 is the schematic top plan view of the image element array substrates of another embodiment of the utility model.See also Fig. 2, the image element array substrates 200 of present embodiment is similar to aforementioned image element array substrates 100.For example, the two laser preparing mode of image element array substrates 100,200 is all identical, and the two comprises identical assembly.Therefore, image element array substrates 100,200 the two no longer repeat specification of identical technical characterictic.Yet image element array substrates 100,200 the two difference are: image element array substrates 200 comprises many connection straps 152 that connect second patch cord 132.
Specifically, these connection straps 152 are connected between these second patch cords 132, wherein each bar data line 122d and each detecting pad 160 all can be situated between adjacent two connection straps 152, as shown in Figure 2, because these connection straps 152 are connected between these second patch cords 132, to such an extent as to the interior resistance of these connection straps 152 is connected in parallel to each other.So, these second patch cords 132 are minimized with whole all-in resistance after these connection straps 152 combine.
In sum, image element array substrates of the present utility model comprises patch cord arranged side by side each other (i.e. first patch cord and second patch cord), even therefore wherein a patch cord electrically connected a certain data line in the past already at laser preparing, still have other patch cord can supply laser preparing, thereby allow the data line that opens circuit to transmit picture element signal, impel the image element array substrates normal operation.
Though the utility model with previous embodiment openly as above; right its is not in order to limiting the utility model, anyly has the knack of alike skill person, in not breaking away from spirit and scope of the present utility model; the equivalence of doing to change with retouching is replaced, and still is in the scope of patent protection of the present utility model.
Claims (13)
1. an image element array substrates is characterized in that, comprising:
One substrate has a plane;
One pel array is configured on this plane, and comprises a pixel group, many sweep traces arranged side by side each other and many data lines arranged side by side each other, and those data lines and those sweep traces are staggered, and those data lines and those sweep traces electrically connect this pixel group;
At least one first patch cord is configured on this plane, and staggered with those data lines;
Many second patch cords arranged side by side each other are configured on this plane, and staggered with those data lines, and wherein this pixel group position is between this first patch cord and those second patch cords;
One first connecting line is configured on this plane, and connects this first patch cord; And
One second connecting line, be configured on this plane, and the position by this pixel group, this second connecting line connects those second patch cords, wherein this first patch cord, those second patch cords, this first connecting line and this second connecting line all are electrically insulated with those sweep traces.
2. image element array substrates as claimed in claim 1 is characterized in that, also comprises a plurality of detecting pads, and those detecting pads connect those data lines respectively, and the position is between those second patch cords.
3. image element array substrates as claimed in claim 1 is characterized in that, the quantity of this first patch cord is a plurality of, and those first patch cords are arranged side by side each other.
4. image element array substrates as claimed in claim 3 is characterized in that, also comprises at least one connection strap, and this connection strap is configured on this plane, and is connected between those first patch cords.
5. image element array substrates as claimed in claim 1 is characterized in that, also comprises at least one connection strap, and this connection strap is configured on this plane, and is connected between those second patch cords.
6. image element array substrates as claimed in claim 5 is characterized in that the quantity of this connection strap is many, and those connection straps are connected between those second patch cords, and respectively this data line bit between adjacent two connection straps.
7. image element array substrates as claimed in claim 6 is characterized in that, also comprises a plurality of detecting pads, and those detecting pads connect those data lines respectively, and the position between those second patch cords, wherein respectively this detecting pad position between adjacent two connection straps.
8. image element array substrates as claimed in claim 1 is characterized in that, this first patch cord, those second patch cords, this first connecting line, this second connecting line and those sweep traces all the position between this substrate and those data lines.
9. image element array substrates as claimed in claim 1, it is characterized in that, also comprise an insulation course, this insulation course is configured on this plane, and cover this plane, this first patch cord, those second patch cords, this first connecting line, this second connecting line and those sweep traces, and those data lines are configured on this insulation course comprehensively.
10. image element array substrates as claimed in claim 9 is characterized in that, also comprises a protective seam, and this protective seam covers those data lines and this insulation course.
11. image element array substrates as claimed in claim 1 is characterized in that, also comprises a driven unit, this driven unit electrically connects those data lines, and this first patch cord position is between this driven unit and this pixel group.
12. image element array substrates as claimed in claim 1 is characterized in that, comprises that also one repairs assembly, this repairing assembly electrically connects this first connecting line and this second connecting line.
13. image element array substrates as claimed in claim 12 is characterized in that, this repairing assembly is an amplifier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201453674U CN202067054U (en) | 2011-05-10 | 2011-05-10 | Pixel array substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201453674U CN202067054U (en) | 2011-05-10 | 2011-05-10 | Pixel array substrate |
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| Publication Number | Publication Date |
|---|---|
| CN202067054U true CN202067054U (en) | 2011-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201453674U Expired - Fee Related CN202067054U (en) | 2011-05-10 | 2011-05-10 | Pixel array substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019051928A1 (en) * | 2017-09-14 | 2019-03-21 | 惠科股份有限公司 | Display device and repair method therefor |
-
2011
- 2011-05-10 CN CN2011201453674U patent/CN202067054U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019051928A1 (en) * | 2017-09-14 | 2019-03-21 | 惠科股份有限公司 | Display device and repair method therefor |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20190510 |
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| CF01 | Termination of patent right due to non-payment of annual fee |