CN202059672U - PCB (printed circuit board) structure - Google Patents
PCB (printed circuit board) structure Download PDFInfo
- Publication number
- CN202059672U CN202059672U CN2011201185365U CN201120118536U CN202059672U CN 202059672 U CN202059672 U CN 202059672U CN 2011201185365 U CN2011201185365 U CN 2011201185365U CN 201120118536 U CN201120118536 U CN 201120118536U CN 202059672 U CN202059672 U CN 202059672U
- Authority
- CN
- China
- Prior art keywords
- pcb
- pcb board
- model
- stress hole
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 230000035882 stress Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004080 punching Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000005553 drilling Methods 0.000 abstract 1
- 230000008642 heat stress Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000011188 CEM-1 Substances 0.000 description 1
- 239000011190 CEM-3 Substances 0.000 description 1
- 101100257127 Caenorhabditis elegans sma-2 gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model provides a PCB (printed circuit model) structure, which comprises a PCB body and LED lamps, wherein the LED lamps are arrayed on the PCB, and a plurality of stress holes are correspondingly arranged along diagonal lines of the PCB. Compared with the prior art, the PCB structure has the advantages that heat stress generated in reflow soldering is released by the aid of the holes on the PCB so that warping degree of the PCB is reduced and smooth of the PCB is controlled. Simultaneously, the holes are punched during the punching process of the PCB so that no extra manufacturing cost is increased, and hole drilling is flexible in operation to achieve due effect.
Description
Technical field
The utility model relates to the pcb board field, relates in particular to a kind of pcb board structure, can prevent the pcb board warpage that weldering refluxes and causes.
Background technology
At present, market more and more presents fast development situation for energy-conserving and environment-protective, image quality is superior, outward appearance is frivolous LED LCD TV demand, and therefore, exploitation also becomes the research emphasis of all big enterprises to the LED liquid crystal module.
Existing, straight-down negative LED liquid crystal module generally has two kinds of design LED lamp bar modes:
First kind is used the optical lens that adds expansion light source visual angle in the LED encapsulation, and this kind uses the LED lamp of lesser amt, and LED arranges the PCB design of adopting strip, and the while, PCB crossed the problem that lamp bar warpage can not appear in Reflow Soldering because the pcb board material adopts the FR4 material.This LED encapsulation needs the LED lamp of use less, sheet material need be chosen reflux-resisting welded, the material of on-deformable glass plate FR4, but can improve entire module thickness, while optical lens cost height on LED, the problem of existence supply of material producer's patent aspect mandate and exclusive supply.
Second kind is used normal visual angle and is not added any optics encapsulated LED lamp, and lamp is arranged in the entire module bottom surface with a determining deviation, whole pcb board need be partitioned into a few bulk PCB, has increased PCB and has crossed the technological requirement of Reflow Soldering.Adopt the arrangement mode that general LED lamp can the flexible design lamp, and obtain the liquid crystal module of different frivolous thickness; But the big consumption of PCB size is big, needs to use cheap CEM-1 and CEM-3 sheet material on reduction module cost, and causes the thermal stress deformation warpage issues of being heated and producing easily.
The utility model content
The purpose of this utility model is to provide a kind of pcb board structure, can prevent the pcb board warpage that weldering refluxes and causes.
The purpose of this utility model is achieved through the following technical solutions.
A kind of pcb board structure comprises: the pcb board main body, and on pcb board LED lamp arranged into an array, be provided with a plurality of stress hole along pcb board diagonal positions correspondence.
Preferably, described stress hole punch position is located at LED lamp each row and column and covers the copper place, and the center, hole is positioned on the pcb board diagonal.
Preferably, the corresponding PCB overall dimension of described stress hole dimension is proportional.
Preferably, the size in described stress hole satisfy its lateral separation and fore-and-aft distance than and the long and wide ratio of the size of pcb board equate.
Preferably, described stress hole is shaped as rectangle, rhombus, ellipse or regular polygon.
The utility model embodiment compared with prior art, beneficial effect is: the utility model is by punching on pcb board, the effect of the thermal stress that produces in the Reflow Soldering being passed through hole discharges thermal stress, thereby reduces the degree of warpage, the planarization of control pcb board.Pcb board punching is simultaneously finished when pcb board is die-cut by producer, can not increase manufacturing cost, and can apply in a flexible way, and makes it reach due effect.
Description of drawings
Fig. 1 is the utility model pcb board structural representation;
Fig. 2 is the utility model first example structure schematic diagram;
Fig. 3 is the utility model second example structure schematic diagram.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
See also shown in Figure 1, comprise on the pcb board: LED lamp 02 arranged into an array, be provided with a plurality of stress hole 01 along pcb board diagonal positions correspondence, stress hole 01 punch position is located at LED lamp each row and column and covers the copper place, the center, hole is positioned on the pcb board diagonal, and the size in stress hole 01 satisfies its lateral separation C and equates with the ratio of wide B than with the long A of size of pcb board with fore-and-aft distance D, that is A: B=C: D.
Fig. 2,3 is two other embodiment of the utility model, and its difference is that the stress hole on the pcb board is rhombus and ellipse, certainly, satisfies under the above-mentioned condition again, and the shape in stress hole also can be geometries such as regular polygon.
The utility model is by punching on pcb board, and the effect of the thermal stress that produces in the Reflow Soldering being passed through hole discharges thermal stress, thereby reduces the degree of warpage, the planarization of control pcb board.Pcb board punching is simultaneously finished when pcb board is die-cut by producer, can not increase manufacturing cost, and can apply in a flexible way, and makes it reach due effect.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (5)
1. pcb board structure comprises: the pcb board main body, and on pcb board LED lamp arranged into an array, it is characterized in that, be provided with a plurality of stress hole along pcb board diagonal positions correspondence.
2. pcb board structure as claimed in claim 1 is characterized in that, described stress hole punch position is located at LED lamp each row and column and covers the copper place, and the center, hole is positioned on the pcb board diagonal.
3. pcb board structure as claimed in claim 2 is characterized in that, the corresponding PCB overall dimension of described stress hole dimension is proportional.
4. pcb board structure as claimed in claim 3 is characterized in that, the size in described stress hole satisfies its lateral separation and equates with the size length of fore-and-aft distance ratio and pcb board and wide ratio.
5. as each described pcb board structure of claim 1 to 4, it is characterized in that, described stress hole be shaped as rectangle, rhombus, ellipse or regular polygon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201185365U CN202059672U (en) | 2011-04-19 | 2011-04-19 | PCB (printed circuit board) structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201185365U CN202059672U (en) | 2011-04-19 | 2011-04-19 | PCB (printed circuit board) structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202059672U true CN202059672U (en) | 2011-11-30 |
Family
ID=45019635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201185365U Expired - Fee Related CN202059672U (en) | 2011-04-19 | 2011-04-19 | PCB (printed circuit board) structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202059672U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050310A (en) * | 2014-04-25 | 2015-11-11 | 株式会社京浜 | Electronic circuit substrate |
| CN106211551A (en) * | 2016-07-27 | 2016-12-07 | 京东方科技集团股份有限公司 | A kind of flexible PCB and preparation method thereof, display module |
| CN112435998A (en) * | 2020-12-15 | 2021-03-02 | 南京工业职业技术大学 | Thermal stress management engine of GaN HEMT device |
-
2011
- 2011-04-19 CN CN2011201185365U patent/CN202059672U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050310A (en) * | 2014-04-25 | 2015-11-11 | 株式会社京浜 | Electronic circuit substrate |
| CN105050310B (en) * | 2014-04-25 | 2018-02-27 | 株式会社京浜 | Electronic circuit board |
| CN106211551A (en) * | 2016-07-27 | 2016-12-07 | 京东方科技集团股份有限公司 | A kind of flexible PCB and preparation method thereof, display module |
| CN112435998A (en) * | 2020-12-15 | 2021-03-02 | 南京工业职业技术大学 | Thermal stress management engine of GaN HEMT device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111130 Termination date: 20160419 |