CN202037502U - Clamping device used on grinding machine for solar wafer production - Google Patents
Clamping device used on grinding machine for solar wafer production Download PDFInfo
- Publication number
- CN202037502U CN202037502U CN2011201241257U CN201120124125U CN202037502U CN 202037502 U CN202037502 U CN 202037502U CN 2011201241257 U CN2011201241257 U CN 2011201241257U CN 201120124125 U CN201120124125 U CN 201120124125U CN 202037502 U CN202037502 U CN 202037502U
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- CN
- China
- Prior art keywords
- grinding machine
- clamping device
- baffle plate
- silicon ingot
- support arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a clamping device used on a grinding machine for solar wafer production. The clamping device comprises a base fixed on a grinding machine frame, a balancing rod arranged on the base, and a right angle type baffle plate fixed on the grinding machine frame and arranged on the circumference of the base, wherein, clamping devices are respectively arranged at two ends of the right angle type baffle plate. The clamping device provided by the utility model has the benefits as follows: the structural design is reasonable, the clamping device is applicable to a wide range of silicon ingot sizes, a polycrystalline silicon ingot can be conveniently placed on a surface grinding machine to be finished so as to remove sags and crests on the surface of the silicon ingot, the distances between the same surface to an opposite lower surface are enabled to be consistent, the normal polishing of the polycrystalline silicon ingot is ensured, the polishing yield is improved, and cost waste is avoided.
Description
Technical field
The utility model relates to produces solar silicon wafers grinding machine technical field, relates in particular to a kind of grinding machine clamping device.
Background technology
In the solar silicon wafers process of manufacture, need through steps such as polishing, chamfering, cutting, cleaning, detections.When polycrystal silicon ingot is polished, surface smoothness and dimensional requirement strictness to polycrystal silicon ingot, but, in the process of polysilicon block evolution, the excessive bad phenomenon of size difference up and down of surface irregularity, the relative lower surface of same surface distance can appear in polycrystal silicon ingot, cause polycrystal silicon ingot normally not polish or residual trace can appear in surface of polished, influence polishing yield causes the cost waste.
Summary of the invention
Technical problem to be solved in the utility model is: a kind of production solar silicon wafers grinding machine clamping device is provided, its reasonable in design, can easily polycrystal silicon ingot be positioned in the surface grinding machine and repair, remove the uneven of silicon ingot surface, and make the consistent size up and down of the relative lower surface of same surface distance, guarantee that polycrystal silicon ingot normally polishes, improve the polishing yield, avoid the cost waste.
For solving the problems of the technologies described above, the technical solution of the utility model is: produce solar silicon wafers grinding machine clamping device, it comprises:
Be fixed in the base on the grinding machine frame;
Be arranged at the haltere on the described base;
Be fixed on the grinding machine frame and, be respectively arranged with clamping device at the two ends of described square baffle plate around the square baffle plate that described base is provided with.
As a kind of optimized technical scheme, described clamping device comprises: the support arm that is arranged at described square baffle plate end; The flexible push rod that is arranged on the described support arm is provided with contact plate in the end of described push rod.
As a kind of optimized technical scheme, the hinged end that is arranged at described square baffle plate of described support arm also is provided with the spacer pin that is used to keep described support arm level in the end of described square baffle plate.
As a kind of optimized technical scheme, described support arm is provided with and the corresponding draw-in groove in described spacer pin position.
As a kind of optimized technical scheme, be provided with protective layer on the surface of described contact plate.
As a kind of optimized technical scheme, described push rod is the screw rod that is threadedly connected on the described support arm.
After having adopted technique scheme, the beneficial effects of the utility model are: in use, the surface that polycrystal silicon ingot behind the evolution need be ground up, the top of silicon ingot or bottom abut against on square baffle plate one side, adjust the level of polycrystal silicon ingot by the haltere on the base, two faces corresponding with square baffle plate both sides are all fitted tightly with the square baffle plate, with the clamping device on the support arm silicon ingot is clamped then, promptly finish the gripping of polycrystal silicon ingot, carry out refacing with care implements such as emery wheels at last and get final product.The utility model reasonable in design, applied widely to the silicon ingot size, can easily polycrystal silicon ingot be positioned in the surface grinding machine and repair, remove the uneven of silicon ingot surface, and make the consistent size up and down of the relative lower surface of same surface distance, guarantee that polycrystal silicon ingot normally polishes, improve the polishing yield, avoid the cost waste.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the side view of the utility model embodiment;
Among the figure: 1. grinding machine frame, 2. base, 3. haltere, 4. square baffle plate, 5. support arm, 6. spacer pin, 7. push rod, 8. contact plate.
The specific embodiment
As depicted in figs. 1 and 2, a kind of production solar silicon wafers grinding machine clamping device, it comprises: be fixed in the base 2 on the grinding machine frame 1; Be arranged at the haltere 3 on the base 2; Be fixed on the grinding machine frame 1 and, be respectively arranged with clamping device at the two ends of square baffle plate 4 around the square baffle plate 4 that base 2 is provided with.
Clamping device comprises support arm 5 and the flexible push rod 7 that is arranged on the support arm 5 that is arranged at square baffle plate 4 ends, wherein, the support arm 5 hinged ends that are arranged at square baffle plate 4, also be provided with the spacer pin 6 that is used to keep support arm 5 levels in the end of square baffle plate 4, support arm 5 is provided with and the corresponding draw-in groove in this spacer pin 6 positions, and support arm is turned to horizontal level around hinge, and spacer pin 6 is sticked in this draw-in groove spacing to support arm 5.
In use, the surface that polycrystal silicon ingot behind the evolution need be ground up, the top of silicon ingot or bottom abut against on square baffle plate 4 one side, adjust the level of polycrystal silicon ingot by the haltere on the base 23, two faces corresponding with square baffle plate 4 both sides are all fitted tightly with square baffle plate 4, with the clamping device on the support arm 5 silicon ingot is clamped then, promptly finish, carry out refacing with care implements such as emery wheels at last and get final product the gripping of polycrystal silicon ingot.
The utility model reasonable in design, applied widely to the silicon ingot size, can easily polycrystal silicon ingot be positioned in the surface grinding machine and repair, remove the uneven of silicon ingot surface, and make the consistent size up and down of the relative lower surface of same surface distance, guarantee that polycrystal silicon ingot normally polishes, improve the polishing yield, avoid the cost waste.
Claims (6)
1. produce solar silicon wafers grinding machine clamping device, it is characterized in that, comprising:
Be fixed in the base on the grinding machine frame;
Be arranged at the haltere on the described base;
Be fixed on the grinding machine frame and, be respectively arranged with clamping device at the two ends of described square baffle plate around the square baffle plate that described base is provided with.
2. production solar silicon wafers grinding machine clamping device as claimed in claim 1, it is characterized in that: described clamping device comprises:
Be arranged at the support arm of described square baffle plate end;
The flexible push rod that is arranged on the described support arm is provided with contact plate in the end of described push rod.
3. production solar silicon wafers grinding machine clamping device as claimed in claim 2, it is characterized in that: the hinged end that is arranged at described square baffle plate of described support arm also is provided with the spacer pin that is used to keep described support arm level in the end of described square baffle plate.
4. production solar silicon wafers grinding machine clamping device as claimed in claim 3 is characterized in that: described support arm is provided with and the corresponding draw-in groove in described spacer pin position.
5. production solar silicon wafers grinding machine clamping device as claimed in claim 2, it is characterized in that: the surface at described contact plate is provided with protective layer.
6. as the described production solar silicon wafers grinding machine clamping device of the arbitrary claim of claim 2 to 5, it is characterized in that: described push rod is the screw rod that is threadedly connected on the described support arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201241257U CN202037502U (en) | 2011-04-25 | 2011-04-25 | Clamping device used on grinding machine for solar wafer production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201241257U CN202037502U (en) | 2011-04-25 | 2011-04-25 | Clamping device used on grinding machine for solar wafer production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202037502U true CN202037502U (en) | 2011-11-16 |
Family
ID=44964967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201241257U Expired - Fee Related CN202037502U (en) | 2011-04-25 | 2011-04-25 | Clamping device used on grinding machine for solar wafer production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202037502U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102896906A (en) * | 2012-09-29 | 2013-01-30 | 武汉市金麦克工业技术有限公司 | Pneumatic industrial marking machine |
| CN102962743A (en) * | 2012-11-28 | 2013-03-13 | 天津市环欧半导体材料技术有限公司 | Chamfering machine capable of processing non-standard silicon wafer |
| CN104210041A (en) * | 2014-08-21 | 2014-12-17 | 浙江辉弘光电能源有限公司 | Silicon rod clamp for sawing machine |
| CN111013950A (en) * | 2019-12-02 | 2020-04-17 | 西安奕斯伟硅片技术有限公司 | Silicon wafer passivation device and method |
-
2011
- 2011-04-25 CN CN2011201241257U patent/CN202037502U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102896906A (en) * | 2012-09-29 | 2013-01-30 | 武汉市金麦克工业技术有限公司 | Pneumatic industrial marking machine |
| CN102896906B (en) * | 2012-09-29 | 2015-11-25 | 武汉市金麦克工业技术有限公司 | A kind of pneumatic industrial marking machine |
| CN102962743A (en) * | 2012-11-28 | 2013-03-13 | 天津市环欧半导体材料技术有限公司 | Chamfering machine capable of processing non-standard silicon wafer |
| CN102962743B (en) * | 2012-11-28 | 2015-06-24 | 天津市环欧半导体材料技术有限公司 | Chamfering machine capable of processing non-standard silicon wafer |
| CN104210041A (en) * | 2014-08-21 | 2014-12-17 | 浙江辉弘光电能源有限公司 | Silicon rod clamp for sawing machine |
| CN111013950A (en) * | 2019-12-02 | 2020-04-17 | 西安奕斯伟硅片技术有限公司 | Silicon wafer passivation device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 Termination date: 20180425 |