CN202019500U - 一种pcb预叠合装置 - Google Patents
一种pcb预叠合装置 Download PDFInfo
- Publication number
- CN202019500U CN202019500U CN 201120147321 CN201120147321U CN202019500U CN 202019500 U CN202019500 U CN 202019500U CN 201120147321 CN201120147321 CN 201120147321 CN 201120147321 U CN201120147321 U CN 201120147321U CN 202019500 U CN202019500 U CN 202019500U
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- Prior art keywords
- pcb
- polyunit
- hot melt
- machine
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000010030 laminating Methods 0.000 title abstract 4
- 239000000463 material Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 8
- 239000010935 stainless steel Substances 0.000 claims abstract description 8
- 239000012943 hotmelt Substances 0.000 abstract 5
- 230000008018 melting Effects 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Images
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- Moulding By Coating Moulds (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201120147321 CN202019500U (zh) | 2011-05-09 | 2011-05-09 | 一种pcb预叠合装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201120147321 CN202019500U (zh) | 2011-05-09 | 2011-05-09 | 一种pcb预叠合装置 |
Publications (1)
Publication Number | Publication Date |
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CN202019500U true CN202019500U (zh) | 2011-10-26 |
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Family Applications (1)
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CN 201120147321 Expired - Lifetime CN202019500U (zh) | 2011-05-09 | 2011-05-09 | 一种pcb预叠合装置 |
Country Status (1)
Country | Link |
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CN (1) | CN202019500U (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103402330A (zh) * | 2013-07-31 | 2013-11-20 | 无锡市伟丰印刷机械厂 | 一种可调式电路板印刷底盘 |
CN104684262A (zh) * | 2015-03-25 | 2015-06-03 | 竞陆电子(昆山)有限公司 | 热熔机用铆合定位治具 |
CN104703455A (zh) * | 2015-03-25 | 2015-06-10 | 竞陆电子(昆山)有限公司 | 热熔机的组合载盘机构 |
CN107415484A (zh) * | 2017-06-09 | 2017-12-01 | 东莞市威力固电路板设备有限公司 | 一种预叠喷码机 |
CN108882563A (zh) * | 2018-07-02 | 2018-11-23 | 奥士康精密电路(惠州)有限公司 | 一种提升pcb铆合层间对准度的铆合治具 |
CN110602901A (zh) * | 2019-10-17 | 2019-12-20 | 昆山敏欣电子有限公司 | Pcb叠合专用治具及其使用方法 |
CN111885856A (zh) * | 2020-08-07 | 2020-11-03 | 博敏电子股份有限公司 | 一种提升多层电路板层间对准精度的熔合方法及治具 |
-
2011
- 2011-05-09 CN CN 201120147321 patent/CN202019500U/zh not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103402330A (zh) * | 2013-07-31 | 2013-11-20 | 无锡市伟丰印刷机械厂 | 一种可调式电路板印刷底盘 |
CN104684262A (zh) * | 2015-03-25 | 2015-06-03 | 竞陆电子(昆山)有限公司 | 热熔机用铆合定位治具 |
CN104703455A (zh) * | 2015-03-25 | 2015-06-10 | 竞陆电子(昆山)有限公司 | 热熔机的组合载盘机构 |
CN104684262B (zh) * | 2015-03-25 | 2017-11-03 | 竞陆电子(昆山)有限公司 | 热熔机用铆合定位治具 |
CN107415484A (zh) * | 2017-06-09 | 2017-12-01 | 东莞市威力固电路板设备有限公司 | 一种预叠喷码机 |
CN107415484B (zh) * | 2017-06-09 | 2023-09-01 | 东莞市威力固电路板设备有限公司 | 一种预叠喷码机 |
CN108882563A (zh) * | 2018-07-02 | 2018-11-23 | 奥士康精密电路(惠州)有限公司 | 一种提升pcb铆合层间对准度的铆合治具 |
CN110602901A (zh) * | 2019-10-17 | 2019-12-20 | 昆山敏欣电子有限公司 | Pcb叠合专用治具及其使用方法 |
CN111885856A (zh) * | 2020-08-07 | 2020-11-03 | 博敏电子股份有限公司 | 一种提升多层电路板层间对准精度的熔合方法及治具 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
DD01 | Delivery of document by public notice |
Addressee: Huang Xianquan Document name: Notification that Application Deemed not to be Proposed |
|
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN KINWONG ELECTRONIC CO., LTD. Free format text: FORMER NAME: KINGWONG ELECTRONICS (SHENZHEN) CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 518126, No. 166, Reservoir Road, iron Gang village, West Village, Shenzhen, Guangdong, Baoan District Patentee after: Shenzhen Kinwong Electronic Co., Ltd. Address before: 518126, No. 166, Reservoir Road, iron Gang village, West Village, Shenzhen, Guangdong, Baoan District Patentee before: Kinwong Electronic (Shenzhen) Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20111026 |
|
CX01 | Expiry of patent term |