CN203446111U - 一种线路板补强贴合冶具 - Google Patents

一种线路板补强贴合冶具 Download PDF

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Publication number
CN203446111U
CN203446111U CN201320529186.0U CN201320529186U CN203446111U CN 203446111 U CN203446111 U CN 203446111U CN 201320529186 U CN201320529186 U CN 201320529186U CN 203446111 U CN203446111 U CN 203446111U
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plate
circuit board
cover plate
base plate
reinforcement
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Expired - Fee Related
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CN201320529186.0U
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English (en)
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仲伟荣
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Jiangsu High Tech Circuit Technology Co ltd
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JIANGSU UNIWELL ELECTRONIC Ltd
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Abstract

一种线路板补强贴合冶具,属于线路板制作领域。包括相互平行布置的取板、底板和盖板,取板和盖板设置在底板的正上方,取板设置在底板与盖板之间,所述底板上设置有竖直布置的用于实现柔性线路板和补强之间定位的定位销钉和用于限定补强位置的限位销钉,在取板和盖板上分别设置有与定位销钉和限位销钉配合的定位孔,所述定位销钉和限位销钉分别穿置于取板和盖板对应的定位孔内。本实用新型可有效提供补强贴合效率,并可解决手工贴合时贴偏不良问题。

Description

一种线路板补强贴合冶具
技术领域
本实用新型属于线路板制作领域,具体为一种线路板补强贴合冶具。
背景技术
目前很多柔性线路板产品的背面都需要贴合补强以提升其组装时的强度,现有技术中柔性线路板上的补强一般采用手工贴合,存在着明显的不足和局限:1、采用手工贴合补强,对员工的熟练程度要求较高,无法短时间、大范围普及;2、手工贴合补强其效率较低,且由于产品左右悬空,在贴合时无法保证柔性线路板与补强之间的相对位置。
实用新型内容
本实用新型提供一种线路板补强贴合冶具,目的在于克服现有技术中生产效率较低及补强容易贴偏等缺陷。
实现上述目的的技术方案是:一种线路板补强贴合冶具,其特征在于:包括相互平行布置的取板、底板和盖板,取板和盖板设置在底板的正上方,取板设置在底板与盖板之间,所述底板上设置有竖直布置的用于实现柔性线路板和补强之间定位的定位销钉和用于限定补强位置的限位销钉,在取板和盖板上分别设置有与定位销钉和限位销钉配合的定位孔,所述定位销钉和限位销钉分别穿置于取板和盖板对应的定位孔内。
本实用新型的底板为一定厚度的硬质板材,起支撑、固定作用,取板为薄的软质材料,起拿起产品的作用;使用时,先将取板通过定位销钉及限位销钉放置在底板上,然后将待贴合柔性线路板通过定位销钉固定在取板上,再将补强下表面的胶离型纸撕掉通过定位销钉放置在柔性线路板上,补强外周的锣槽穿过限位销钉,最后将盖板覆盖在补强上,并用烫斗在盖板上来回加温,让补强与柔性线路板粘成一体。
本实用新型可有效提供补强贴合效率,并可解决手工贴合时贴偏不良问题。
附图说明
图1为本实用新型的结构示意图。
具体实施方式
    如图1所示,本实用新型包括相互平行布置的取板1、底板2和盖板6,取板1和盖板6设置在底板2的正上方,取板1设置在底板2与盖板6之间,底板2上设置有竖直布置的用于实现柔性线路板和补强之间定位的定位销钉3和用于限定补强位置的限位销钉4,在取板1和盖板6上分别设置有与定位销钉3和限位销钉4配合的定位孔5,所述定位销钉3和限位销钉4分别穿置于取板1和盖板6对应的定位孔5内。

Claims (1)

1.一种线路板补强贴合冶具,其特征在于:包括相互平行布置的取板、底板和盖板,取板和盖板设置在底板的正上方,取板设置在底板与盖板之间,所述底板上设置有竖直布置的用于实现柔性线路板和补强之间定位的定位销钉和用于限定补强位置的限位销钉,在取板和盖板上分别设置有与定位销钉和限位销钉配合的定位孔,所述定位销钉和限位销钉分别穿置于取板和盖板对应的定位孔内。
CN201320529186.0U 2013-08-29 2013-08-29 一种线路板补强贴合冶具 Expired - Fee Related CN203446111U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107835591A (zh) * 2017-10-24 2018-03-23 高德(无锡)电子有限公司 一种能够提升软硬结合印刷线路板对位精准度的加工工艺

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107835591A (zh) * 2017-10-24 2018-03-23 高德(无锡)电子有限公司 一种能够提升软硬结合印刷线路板对位精准度的加工工艺

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Address after: 225215, Jiangsu Yangzhou District, Jiangdu Province town along the Yangtze River Development Zone, Hing Kong Road

Patentee after: Jiangsu high tech Circuit Technology Co.,Ltd.

Address before: 225215, Jiangsu Yangzhou District, Jiangdu Province town along the Yangtze River Development Zone, Hing Kong Road

Patentee before: Jiangsu Uniwell Electronic Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140219