CN202010925U - Grinding device for high precision and ultra-thinned wafer - Google Patents
Grinding device for high precision and ultra-thinned wafer Download PDFInfo
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- CN202010925U CN202010925U CN2011200393498U CN201120039349U CN202010925U CN 202010925 U CN202010925 U CN 202010925U CN 2011200393498 U CN2011200393498 U CN 2011200393498U CN 201120039349 U CN201120039349 U CN 201120039349U CN 202010925 U CN202010925 U CN 202010925U
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Abstract
The utility model discloses a grinding device for high precision and ultra-thinned wafer comprising a bearing, a shell, a grinding wheel, an abrasive disc, a main shaft, a cooling jacket, a motor stator, a motor rotor and a seal ring, wherein the bearing is a gas bearing which is composed of an upper loop sheet, a middle loop sheet, a lower loop sheet and a hollow tube; the upper loop sheet and the lower loop sheet are respectively provided with an air intake through hole; a porous material layer is arranged in the air intake through hole; the hollow tube is provided with throttle through holes, each of the throttle through holes is provided with a throttler; an exhaust groove is arranged on the inner wall of the middle part of the hollow tube; a vent hole is arranged in the middle loop sheet; the shell is provided with an air vent; the exhaust groove is communicated with the outside via the vent hole and the air vent. The bearing in the grinding device has higher axial bearing capacity and rigidity, the friction loss of the bearing is low while the precision is high, thereby meeting the technical requirements on machining of high precision and ultra-thinned wafer.
Description
Technical field
The utility model belongs to semiconductor wafer manufacturing equipment field, specifically, relates to a kind of grinding attachment high-accuracy and ultra-thinization wafer that is used for.
Background technology
Semiconductor wafer belongs to typical hard brittle material, to its carry out high-accuracy, ultra-thinization grinding must adopt have high rigidity, high-precision grinding attachment.Main shaft in traditional device for grinding and cutting wafer adopts rolling bearing or the supporting of orifice restriction hydrostatic gas-lubricated bearing.Because the friction of rolling bearing belongs to the rolling friction between roller and outer ring and the inner ring, caloric value is big, and frictional dissipation is serious, so the rolling bearing precision is low, frictional dissipation is high.Orifice restriction hydrostatic gas-lubricated bearing axial rigidity is low.Compare with rolling bearing with oil bearing, because the compressibility of gas, so the rigidity of gas bearing is lower.Compare with other throttle style, the rigidity of the gas bearing of employing orifice restriction is lower.So, no matter be to adopt the rolling bearing supporting, still adopt the supporting of orifice restriction hydrostatic gas-lubricated bearing, all be unfavorable for the high-accuracy of semiconductor wafer and ultra-thinization processing.
Summary of the invention
Technical problem:Technical problem to be solved in the utility model is: a kind of grinding attachment high-accuracy and ultra-thinization wafer that is used for is provided, make the bearing in the device have very high axial bearing capacity and rigidity, and bearing friction loss is low, precision is high, satisfies the specification requirement of processing high-accuracy and ultra-thinization wafer.
Technical scheme:For solving the problems of the technologies described above, the technical solution adopted in the utility model is: of the present utility modelly be used for grinding attachment high-accuracy and ultra-thinization wafer, comprise bearing, shell, emery wheel, abrasive disc, main shaft, cooling jacket, motor stator and rotor, shell is the cylindrical body that top and bottom are provided with coaxial through-hole, be embedded with cooling jacket in the inwall of shell upper, be provided with cooling water inlet and coolant outlet in the shell, cooling water inlet and coolant outlet communicate with cooling jacket respectively, the week that cooling jacket is sleeved on motor stator laterally, rotor is fixedly connected on the top of main shaft, and rotor is corresponding mutually with motor stator, main shaft is supported by bearing, and bearing is fixedlyed connected with shell, the fixedly connected abrasive disc in the bottom of main shaft, the bottom of abrasive disc is provided with emery wheel, described bearing is a gas bearing, this gas bearing is by last ring plate, middle ring plate, following ring plate and hollow tube are formed, last ring plate is sleeved on the top of hollow tube, middle ring plate is sleeved on the middle part of hollow tube, following ring plate is sleeved on the bottom of hollow tube, be provided with annular groove between last ring plate and the middle ring plate, be provided with down annular groove between middle ring plate and the following ring plate, gas bearing is positioned at the inside of shell, fixedly connected with following ring plate in the bottom of shell, shell is provided with air inlet and following air inlet, and, last air inlet and last annular groove communicate, and following air inlet and following annular groove communicate; Described going up on ring plate and the following ring plate is respectively equipped with the air inlet through hole of even number number, and is provided with the porous material layer in the air inlet through hole; Evenly be provided with the throttling through hole of even rows number on the described hollow tube, every cribbing opening is provided with flow controller along circumferentially evenly even number setting in each throttling through hole; Hollow tube middle part inwall is provided with outgassing groove, is provided with radially a venthole in the middle ring plate, and shell also is provided with the gas outlet, and outgassing groove is by venthole and gas outlet and exterior.
Beneficial effect:Compared with prior art, adopt the beneficial effect of the technical program to be: bearing has very high axial bearing capacity and rigidity, and bearing friction loss is low, precision is high, satisfies the specification requirement of processing high-accuracy and ultra-thinization wafer.In the technical program, be respectively equipped with the air inlet through hole that has the porous material layer in the last ring plate of gas bearing and the following ring plate.The throttling of porous material layer can make bearing have higher axial bearing capacity and rigidity.Throttling through hole and flow controller are set in the hollow tube of gas bearing.The flow controller throttling can make bearing have certain radially bearing capacity.Therefore, the gas bearing in the technical program can be born bigger axial load and less radial load.Main shaft in the technical program adopts the gas bearing supporting, because the gap of gas bearing is little and have homogenization, so main shaft has very high rotating accuracy and axial precision.Simultaneously, the gas bearing frictional dissipation is low, precision is high.Therefore, the main shaft that gas bearing is set can satisfy the specification requirement of grinding high accuracy, ultra-thinization wafer.
Description of drawings
Fig. 1 is a structure cutaway view of the present utility model.
Fig. 2 is the half sectional view of the gas bearing in the utility model.
Have among the figure: shell 1, coolant outlet 2, porous material layer 3, gas bearing 4, last ring plate 41, middle ring plate 42, following ring plate 43, hollow tube 44, air inlet through hole 5, last air inlet 6, outgassing groove 7, following air inlet 8, first sealing ring 9, emery wheel 10, abrasive disc 11, throttling through hole 12, main shaft 13, following annular groove 14, venthole 15, lower seal 16, gas outlet 17, last sealing ring 18, flow controller 19, last annular groove 20, second sealing ring 21, cooling water inlet 22, cooling jacket 23, motor stator 24, rotor 25, upper end cover 26.
The specific embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in detail.
As depicted in figs. 1 and 2, a kind of grinding attachment high-accuracy and ultra-thinization wafer that is used for of the present utility model comprises bearing, shell 1, emery wheel 10, abrasive disc 11, main shaft 13, cooling jacket 23, motor stator 24 and rotor 25.Bearing, shell 1, abrasive disc 11, main shaft 13, cooling jacket 23, motor stator 24 and rotor 25 are coaxial.Shell 1 is the cylindrical body that top and bottom are provided with coaxial through-hole.Be provided with cooling water inlet 22 and coolant outlet 2 in the shell 1.Be embedded with cooling jacket 23 in the inwall on shell 1 top, cooling water inlet 22 and coolant outlet 2 communicate with cooling jacket 23 respectively.The week that cooling jacket 23 is sleeved on motor stator 24 laterally.Rotor 25 is fixedly connected on the top of main shaft 13, and rotor 25 is corresponding mutually with motor stator 24.Main shaft 13 is by bearing supporting, and bearing fixedlys connected with shell 1, the fixedly connected abrasive disc 11 in the bottom of main shaft 13, and the bottom of abrasive disc 11 is provided with emery wheel 10.Bearing is a gas bearing 4.This gas bearing 4 is made up of last ring plate 41, middle ring plate 42, following ring plate 43 and hollow tube 44.Gas bearing 4 preferred single piece promptly go up ring plate 41, middle ring plate 42, following ring plate 43 and hollow tube 44 and form with integral structure.Last ring plate 41 is sleeved on the top of hollow tube 44, and middle ring plate 42 is sleeved on the middle part of hollow tube 44, and following ring plate 43 is sleeved on the bottom of hollow tube 44.Be provided with annular groove 20 between last ring plate 41 and the middle ring plate 42, be provided with down annular groove 14 between middle ring plate 42 and the following ring plate 43.Gas bearing 4 is positioned at the inside of shell 1.Fixedly connected with following ring plate 43 in the bottom of shell 1, for example both can connect by screw.Shell 1 is provided with air inlet 6 and following air inlet 8, and last air inlet 6 and last annular groove 20 communicate, and following air inlet 8 and following annular groove 14 communicate.Be respectively equipped with the air inlet through hole 5 of even number number on last ring plate 41 and the following ring plate 43, and be provided with porous material layer 3 in the air inlet through hole 5.Even number in preferred four to 16 of the quantity of the air inlet through hole 5 in the quantity of the air inlet through hole 5 in the last ring plate 41 and the following ring plate 43 for example can be six, eight, ten or 12.Porous material layer 3 can play throttling action.If the top of air inlet through hole 5 is not provided with porous material layer 3, gas bearing 4 will not have axial bearing capacity so.Compare flow controller 19, the upper and lower that the gas bearing 4 of porous material layer 3 is set has bigger rigidity and axial bearing capacity.Evenly be provided with the throttling through hole 12 of even rows number on the hollow tube 44.Every cribbing opening 12 is along circumferentially evenly even number setting.One end of each throttling through hole 12 communicates with gap between gas bearing 4 and the main shaft 13, the other end of each throttling through hole 12 and last annular groove 20 or down annular groove 14 communicate.Be provided with flow controller 19 in each throttling through hole 12.The effect of flow controller 19 has been throttling actions.If flow controller 19 is not installed in the throttling through hole 12, gas bearing 5 will not have radially bearing capacity so.Hollow tube 44 middle part inwalls are provided with outgassing groove 7.Outgassing groove 7 is preferably along whole circumferential extension, and promptly outgassing groove 7 is the annular groove of a sealing.Like this, be convenient processing on the one hand, be to be convenient to get rid of gas on the other hand.In be provided with radially a venthole 15 in the ring plate 42.Shell 1 also is provided with gas outlet 17, and outgassing groove 7 is by venthole 15 and gas outlet 17 and exterior.
When the grinding attachment of said structure was worked, motor stator 24 and rotor 25 rotation at a high speed produced a large amount of heat.Cooling water enters the cooling jacket 23 from cooling water inlet 22.After cooling water absorbs the heat of motor stator 24, flow out from coolant outlet 2.The cooling water that heats up flows into cooling water inlet 22 again after supercooling.Cooling water so circulates, and motor stator 24 and rotor 25 are cooled off.By the last air inlet 6 and the following air inlet 8 of shell 1, to main shaft 13 input Compressed Gas.Usually, Compressed Gas is an air.Compressed Gas has two circulation branch roads after entering gas bearing 4, and article one circulation branch road is: Compressed Gas enters in annular groove 20 or the following annular groove 14, and the flow controller 19 in the throttling through hole 12 of flowing through again enters the radial clearance between main shaft 13 and the gas bearing 4; Second circulation branch road is: Compressed Gas enters in annular groove 20 or the following annular groove 14, and the porous material layer 3 of air inlet through hole 5 upper ends of flowing through enters the end play between main shaft 13 and the gas bearing 4.Article two, the compressed air in the circulation branch road all is from last air inlet 6 and 8 feedings of following air inlet, enters gap between gas bearing 4 and the main shaft 13 by flow controller 19 and porous matter material layers 3.Pressure air film in the gap between main shaft 13 and the gas bearing 4 provides radially bearing capacity and axial bearing capacity to main shaft 13.
When the grinding wafer, main shaft 13 bears bigger axial load and less radial load.Be provided with the air inlet through hole 5 that has porous material layer 3 in the last ring plate 41 of the gas bearing 4 in the technical program and the following ring plate 43.Compare other throttle style, 3 throttling of porous material layer have higher axial bearing capacity and rigidity.The hollow tube 44 of the gas bearing 4 in the technical program is provided with the radial gas bearing provided part that contains throttling through hole 12 and flow controller 19, provides certain radial load by flow controller 19.Therefore, the gas bearing in the technical program 4 can be born bigger axial load and less radial load.Main shaft 13 in the technical program adopts gas bearing 4 supportings, because the gap of gas bearing 4 is little and have homogenization, so main shaft 13 has very high rotating accuracy and axial precision.Simultaneously, gas bearing 4 frictional dissipations are low, precision is high.Therefore, the main shaft 13 that gas bearing 4 is set can satisfy the specification requirement of grinding high accuracy, ultra-thinization wafer.
Further, on the composition surface of described ring plate 43 down and shell 1 first sealing ring 9 is set, second sealing ring 21 is set on the composition surface of last ring plate 41 and shell 1, sealing ring 18 and lower seal 16 are set on the composition surface of middle ring plate 42 and shell 1.Set up sealing ring, can place gas leak.
Further, described throttling through hole 12 is four rows, and every cribbing opening 12 has 12 throttling through holes 12.The row's number of throttling through hole 12 and the number of every cribbing opening 12 all are even number.For example throttling through hole 12 can be two rows, four rows, six rows.Preferred four cribbing openings 12.Compare two cribbing openings, four cribbing openings 12 can improve rigidity and bearing capacity.Compare six cribbing openings, four cribbing openings 12 can reduce manufacture difficulty and reduce production costs.Every cribbing opening 12 generally is ten to 18 throttling through holes 12 along the throttling through hole 12 that circumferentially evenly is furnished with the even number number, for example can be ten, 12,14 or 18.
Further, the described grinding attachment that is used for high-accuracy and ultra-thinization wafer also comprises upper end cover 26, and upper end cover 26 is fixedly connected on shell 1 end face, and the through hole of covering shell 1 end face.Can avoid impurity to fall into grinding attachment like this, guarantee the operate as normal of grinding attachment.
Claims (6)
1. one kind is used for grinding attachment high-accuracy and ultra-thinization wafer, comprise bearing, shell (1), emery wheel (10), abrasive disc (11), main shaft (13), cooling jacket (23), motor stator (24) and rotor (25), shell (1) is the cylindrical body that top and bottom are provided with coaxial through-hole, be embedded with cooling jacket (23) in the inwall on shell (1) top, be provided with cooling water inlet (22) and coolant outlet (2) in the shell (1), cooling water inlet (22) and coolant outlet (2) communicate with cooling jacket (23) respectively, the week that cooling jacket (23) is sleeved on motor stator (24) laterally, rotor (25) is fixedly connected on the top of main shaft (13), and rotor (25) is corresponding mutually with motor stator (24), main shaft (13) is supported by bearing, and bearing is fixedlyed connected with shell (1), the fixedly connected abrasive disc in bottom (11) of main shaft (13), the bottom of abrasive disc (11) is provided with emery wheel (10), it is characterized in that, described bearing is gas bearing (4), this gas bearing (4) is by last ring plate (41), middle ring plate (42), following ring plate (43) and hollow tube (44) are formed, last ring plate (41) is sleeved on the top of hollow tube (44), middle ring plate (42) is sleeved on the middle part of hollow tube (44), following ring plate (43) is sleeved on the bottom of hollow tube (44), be provided with annular groove (20) between last ring plate (41) and the middle ring plate (42), be provided with down annular groove (14) between middle ring plate (42) and the following ring plate (43), gas bearing (4) is positioned at the inside of shell (1), fixedly connected with following ring plate (43) in the bottom of shell (1), shell (1) is provided with air inlet (6) and following air inlet (8), and, last air inlet (6) and last annular groove (20) communicate, and following air inlet (8) and following annular groove (14) communicate; Described going up on ring plate (41) and the following ring plate (43) is respectively equipped with the air inlet through hole (5) of even number number, and is provided with porous material layer (3) in the air inlet through hole (5); Evenly be provided with the throttling through hole (12) of even rows number on the described hollow tube (44), every cribbing opening (12) is provided with flow controller (19) along circumferentially evenly even number setting in each throttling through hole (12); Hollow tube (44) middle part inwall is provided with outgassing groove (7), in be provided with radially a venthole (15) in the ring plate (42), shell (1) also is provided with gas outlet (17), and outgassing groove (7) is by venthole (15) and gas outlet (17) and exterior.
2. be used for grinding attachment high-accuracy and ultra-thinization wafer according to claim 1 is described, it is characterized in that, on the composition surface of described ring plate (43) down and shell (1) first sealing ring (9) is set, second sealing ring (21) is set on the composition surface of last ring plate (41) and shell (1), sealing ring (18) and lower seal (16) are set on the composition surface of middle ring plate (42) and shell (1).
3. be used for grinding attachment high-accuracy and ultra-thinization wafer according to claim 1 is described, it is characterized in that described throttling through hole (12) is four rows, every cribbing opening (12) has ten to 18 throttling through holes (12).
4. describedly be used for grinding attachment high-accuracy and ultra-thinization wafer according to claim 1 or 3, it is characterized in that described going up in ring plate (41) and the following ring plate (43) is provided with eight air inlet through holes (5) respectively.
5. be used for grinding attachment high-accuracy and ultra-thinization wafer according to claim 1 is described, it is characterized in that, described shell (1) also is provided with upper end cover (26), and upper end cover (26) is fixedly connected on shell (1) end face, and the through hole of covering shell (1) end face.
6. be used for grinding attachment high-accuracy and ultra-thinization wafer according to claim 1 is described, it is characterized in that, describedly go up ring plate (41), middle ring plate (42), ring plate (43) and hollow tube (44) be with integral structure composition gas bearing (4) down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200393498U CN202010925U (en) | 2011-02-16 | 2011-02-16 | Grinding device for high precision and ultra-thinned wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200393498U CN202010925U (en) | 2011-02-16 | 2011-02-16 | Grinding device for high precision and ultra-thinned wafer |
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| Publication Number | Publication Date |
|---|---|
| CN202010925U true CN202010925U (en) | 2011-10-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011200393498U Expired - Lifetime CN202010925U (en) | 2011-02-16 | 2011-02-16 | Grinding device for high precision and ultra-thinned wafer |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172877A (en) * | 2011-02-16 | 2011-09-07 | 东南大学 | Grinding device for high-precision ultrathin wafer |
| CN104191356A (en) * | 2014-09-25 | 2014-12-10 | 桂林桂北机器有限责任公司 | Pressurized sealing water-proof and dust-proof anti-collision grinding head |
| CN104712656A (en) * | 2013-12-17 | 2015-06-17 | 株式会社安川电机 | Spindle motor |
| CN113021426A (en) * | 2021-01-28 | 2021-06-25 | 浙江金达电机电器有限公司 | Integrated rotary shaving unit |
-
2011
- 2011-02-16 CN CN2011200393498U patent/CN202010925U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172877A (en) * | 2011-02-16 | 2011-09-07 | 东南大学 | Grinding device for high-precision ultrathin wafer |
| CN102172877B (en) * | 2011-02-16 | 2012-12-19 | 东南大学 | Grinding device for high-precision ultrathin wafer |
| CN104712656A (en) * | 2013-12-17 | 2015-06-17 | 株式会社安川电机 | Spindle motor |
| CN104191356A (en) * | 2014-09-25 | 2014-12-10 | 桂林桂北机器有限责任公司 | Pressurized sealing water-proof and dust-proof anti-collision grinding head |
| CN113021426A (en) * | 2021-01-28 | 2021-06-25 | 浙江金达电机电器有限公司 | Integrated rotary shaving unit |
| CN113021426B (en) * | 2021-01-28 | 2023-03-07 | 浙江金达电机电器有限公司 | Integrated rotary shaving unit |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20111019 Effective date of abandoning: 20130227 |
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| RGAV | Abandon patent right to avoid regrant |