CN202009156U - LD pump green solid laser adopting two TECs - Google Patents

LD pump green solid laser adopting two TECs Download PDF

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Publication number
CN202009156U
CN202009156U CN 201120119681 CN201120119681U CN202009156U CN 202009156 U CN202009156 U CN 202009156U CN 201120119681 CN201120119681 CN 201120119681 CN 201120119681 U CN201120119681 U CN 201120119681U CN 202009156 U CN202009156 U CN 202009156U
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laser
control circuit
temperature
crystal
solid state
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Expired - Fee Related
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CN 201120119681
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吴中雄
王吉文
杨顺
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SHANGHAI SANXIN TECHNOLOGY DEVELOPMENT Co Ltd
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SHANGHAI SANXIN TECHNOLOGY DEVELOPMENT Co Ltd
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Abstract

The utility model provides an LD pump green solid laser adopting two TECs (thermal electrical coolers). The LD pump green solid laser is characterized in that two thermal electrical coolers (TECs) are adopted to lock the optimum operating temperatures of an IR (infra red laser) and a laser crystal, and the output of a green light intensity sensor is taken as the input to control the working current of the IR, so that the effects of high output efficiency, stable output power and high probability of batch production can be achieved; and the LD pump green solid laser can be used as a green light source module of a laser-based micro-projector, and the like.

Description

Adopt the LD pump green light solid state laser of double T EC
Technical field
The utility model relates to a kind of LD pump green light solid state laser, relates in particular to a kind of LD pump green light solid state laser that adopts double T EC.
Background technology
Laser is approximately point-source of light because of it, and dispersion angle is little, the light path efficiency height, and color representation power is strong, becomes more satisfactory micro projection light source gradually.
Development along with the LASER Light Source technology, red light semiconductor laser and blue-light semiconductor laser be comparative maturity all, but the development of green light semiconductor also needs technical important breakthrough just might realize industrialization, present stage green (light) laser mainly produce by diode pumped solid state laser.
LD pump green light solid state laser is mainly by forming as semiconductor pumped lasing light emitter and laser crystal with 808nm infrared laser (IR, infra red).Usually the laser crystal condition of work requires than higher: the working temperature that at first is laser crystal is strict, and secondly laser crystal is wide strict to IR centre wavelength and ripple.And IR centre wavelength dispersion is generally bigger at present, need control its centre wavelength by adjustment IR temperature and satisfy the requirement of laser crystal the IR absorbing wavelength, adopt single TEC to satisfy simultaneously, can't realize the industrialization of LD pump green light solid state laser IR wavelength adjustment and difficult to laser crystal working temperature control ratio.The utility model adopts double T EC structure, can make the industrialization of LD green glow light-pumped solid state laser become possibility.
Summary of the invention
The purpose of this utility model is to provide a kind of LD pump green light solid state laser that adopts double T EC, and the laser operating efficiency height of this structure, power output are stablized, and easily produce in batches, can be used as the green-light source of laser micro projector.
Adopt the LD pump green light solid state laser of double T EC, comprising:
Infrared laser IR, IR temperature sensor, IR temperature closed loop control circuit, the TEC1 that is used to adjust the IR wavelength, IR luminous power closed control circuit, laser crystal, laser crystal temperature sensor, laser crystal temperature closed loop control circuit, the TEC2 that is used to control the laser crystal temperature, green glow light intensity sensor, TEC1 and TEC2 are heat sink, and the heat conduction casing of placing described laser.Described laser crystal can be ND:YVO 4With PPLN or be the gummed crystal of KTP.
IR temperature closed loop control circuit is used to adjust the operating current of TEC1, with control IR working temperature.Non-phase-locked IR centre wavelength changes along with its temperature change, is about 0.3nm/ ℃ usually.The debugging calibration phase, with wavemeter monitoring IR wavelength, the operating current of adjusting TEC1 by the IR temperature-control circuit is to adjust the IR working temperature, satisfy the requirement of laser crystal to the IR absorbing wavelength until the IR output wavelength, record IR temperature sensor output valve at this moment is as the value of setting of IR temperature-control circuit.During real work, the operating current of adjusting TEC1 by IR temperature closed loop control circuit is to adjust the IR working temperature and to be locked in this value of setting, and this moment, the wavelength of IR was required wavelength.The IR temperature-control circuit, as input, the TEC1 operating current is the close loop control circuit of output with the output of IR temperature sensor, obtains locking the purpose of IR wavelength by the working temperature of locking IR.Perhaps, the debugging calibration phase, earlier locking laser crystal temperature is near the laser crystal nominal temperature and lock the IR operating current, adjust IR with the relative position of laser crystal and up to there being green glow to export, operating current by IR temperature closed loop control circuit adjustment TEC1 scans red laser IR working temperature then, as positive and negative 10 degree scope interscans at red laser IR temperature nominal value, monitor green glow power by green glow light intensity sensor or light power meter simultaneously and obtained the IR working temperature conduct value of setting when IR temperature closed loop control circuit is preserved green glow power maximum automatically by IR temperature closed loop control circuit; Real work Phase I R temperature-control circuit is adjusted the operating current of TEC1 to adjust red laser IR working temperature and to be locked in this value of setting.
Laser crystal temperature closed loop control circuit is used to adjust the operating current of TEC2, with the working temperature of control laser crystal.Usually same batch laser crystal optimum working temperature (the high light light conversion efficiency is arranged this moment) dispersion is little, test out the be provided with temperature of laser crystal optimum working temperature earlier as laser crystal temperature closed loop control circuit, operating current by laser crystal temperature closed loop control circuit adjustment TEC2 makes laser crystal be locked in the optimum working temperature state.In order to reduce to the requirement of laser crystal temperature closed loop control circuit and the influence of laser crystal optimum working temperature dispersion, on the basis of finishing to IR working temperature and operating current locking, the operating current of adjusting TEC2 by laser crystal temperature closed loop control circuit scans the laser crystal working temperature, as positive and negative 3 degree scope interscans at laser crystal working temperature nominal value, monitor green glow power by green glow light intensity sensor or light power meter simultaneously and obtained the laser crystal working temperature conduct value of setting when laser crystal temperature closed loop control circuit is preserved green glow power maximum automatically by laser crystal temperature closed loop control circuit; Real work stage laser crystal temperature-control circuit is adjusted the operating current of TEC2 to adjust the laser crystal working temperature and to be locked in this value of setting.
The output of green glow light intensity sensor is as the input of IR luminous power closed control circuit, and the power output of the operating current control IR by adjusting infrared laser IR obtains the green glow of light stable intensity.
Reduce volume in order to reduce cost, described IR temperature closed loop control circuit, laser crystal temperature closed loop control circuit and IR luminous power closed control circuit can merge with other circuit in the application system.
The relative position of infrared laser IR and laser crystal can be adjusted, and can lock the position of IR and laser crystal for the ease of being in course of adjustment, and adopts low thermal resistance technology that IR, laser crystal are separately fixed on the chill surface on TEC1, the TEC2.
The relative position of infrared laser IR and laser crystal is in course of adjustment, the heat delivery surface of TEC1, TEC2 can be not in one plane, be to guarantee TEC1, TEC2 and heat sink tight the contact, TEC1 or TEC2 contact with heat sink by heat-conducting glue, fix again after the adjustment heat sink on; Or " L " type of employing is heat sink, and TEC1, TEC2 are placed on respectively by heat-conducting glue on the face of " L " type, and it is fixing to adjust the back.
Description of drawings
Fig. 1 is the plan structure figure of the LD pump green light solid state laser of the employing double T EC that provides of the utility model;
Fig. 2 be the employing double T EC that provides of the utility model LD pump green light solid state laser face structure chart;
Fig. 3 is that another embodiment of the LD pump green light solid state laser of the employing double T EC that provides of the utility model faces structure chart.
Specific embodiments
For making the purpose of this utility model, technical scheme and technique effect clearer, content of the present utility model is described in further detail below in conjunction with accompanying drawing.
Fig. 1 and Fig. 2 are respectively the structure vertical view and the front view of the LD pump green light solid state laser of employing double T EC provided by the invention, the laser that adopts double T EC is by infrared laser IR(131), laser crystal (141), be used to adjust the TEC1(111 of IR wavelength), be used to control the TEC2(112 of laser crystal temperature), IR temperature sensor (121), laser crystal temperature sensor (122), IR temperature closed loop control circuit (171), laser crystal temperature closed loop control circuit (181), green glow light intensity sensor (151), the heat sink formations such as (161) of IR luminous power closed control circuit (191) and TEC1 and TEC2, wherein heat sink (161) can be the bottom surfaces of placing described laser heat conduction casing.
In the present embodiment, infrared laser IR(131) be the infrared laser of 808nm, laser crystal (141) is the gummed crystal, this gummed crystal is by ND:YVO 4(141a) and two kinds of crystal of PPLN (141b) gummed form.The IR input of gummed crystal is ND:YVO 4(141a) crystal, input face (a) are coated with the anti-reflection film of 808nm infrared wavelength, the height reflection mould of 1064nm wavelength, the highly reflecting films of 532nm wavelength.The output of gummed crystal is PPLN (141b) crystal, and output face (b) is coated with the height reflection mould of 1064nm wavelength, the low-reflection film of 532nm wavelength.Infrared laser IR(131) infrared laser of launching 808nm impinges perpendicularly on gummed crystal input end face (a), through ND:YVO 4(141a) crystal absorbs the infrared laser that produces 1064nm, the infrared laser of 1064nm incides PPLN (141b) crystal double frequency through cemented surface, produce the green laser of 532nm, do not have the laser of absorbed 1064nm constantly between two end faces of gummed crystal, to come back reflective, up to being absorbed fully by PPLN (141b) crystal; PPLN (141b) crystal comes back reflective to the light beam of the 532nm of the laser freuqency doubling generation of 1064nm in the resonant cavity that two end faces of gummed crystal form, export the laser of 532nm at last from low reflection end face (b).
Infrared laser IR(131) be conventional infrared semiconductor laser, along with variation of temperature, its centre wavelength can be drifted about, but its temperature and centre wavelength have corresponding relation.Infrared laser IR(131), IR temperature sensor (121) adopts low thermal resistance technology to be fixed on TEC1(111) chill surface on.With IR temperature sensor (121) is input, IR temperature closed loop control circuit (171) is by control TEC1(111) operating current realize infrared laser IR(131) locking of working temperature, thereby realize locking to the best centre wavelength of infrared laser IR, its implementation is: the debugging calibration phase, with wavemeter monitoring IR wavelength, the operating current of adjusting TEC1 by the IR temperature-control circuit is to adjust the IR working temperature, satisfy the requirement of laser crystal to the IR absorbing wavelength until the IR output wavelength, record IR temperature sensor output valve at this moment is as the value of setting of IR temperature closed loop control circuit; In the real work stage, the operating current of adjusting TEC1 by the IR temperature-control circuit is to adjust the IR working temperature and to be locked in this value of setting, and this moment, the wavelength of IR was required wavelength.Or debugging calibration phase, earlier locking laser crystal (141) temperature near nominal temperature and lock IR(131) operating current, adjust IR(131) with the relative position of laser crystal (141) and up to green glow output is arranged, adjust the operating current of TEC1 (111) to IR(131 by IR temperature closed loop control circuit (171) then) working temperature scans, as at IR(131) the positive and negative 10 degree scope interscans of temperature nominal value, monitor green glow power by green glow light intensity sensor (151) or light power meter simultaneously and obtained the IR(131 when IR temperature closed loop control circuit (171) is preserved green glow power maximum automatically by serial ports by IR temperature closed loop control circuit (171)) the working temperature conduct value of setting; Real work Phase I R temperature-control circuit (171) is adjusted TEC1(111) operating current to adjust IR(131) working temperature and be locked in this value of setting.
Adopt low thermal resistance technology, laser crystal (141), laser crystal temperature sensor (122) and green glow light intensity inductor (151) be fixed on TEC2(112) chill surface on.With laser crystal temperature sensor (122) is input, laser crystal temperature closed loop control circuit (181) is by control TEC2(112) operating current realize locking to laser crystal (141) optimum working temperature, its implementation is: test out the be provided with temperature of laser crystal optimum working temperature as laser crystal temperature closed loop control circuit earlier, operating current by laser crystal temperature closed loop control circuit adjustment TEC2 makes laser crystal be locked in the optimum working temperature state.In order to reduce to the requirement of laser crystal temperature closed loop control circuit (181) and the influence of laser crystal (141) optimum working temperature dispersion, finish IR(131) on the basis of working temperature locking, adjust TEC2(112 by laser crystal temperature closed loop control circuit (181)) operating current laser crystalline substance (141) working temperature is scanned, as positive and negative 2 degree scope interscans at laser crystalline substance (141) working temperature nominal value, monitor green glow power by green glow light intensity sensor (151) or light power meter simultaneously and obtained laser crystalline substance (141) the working temperature conduct value of setting when laser crystal temperature closed loop control circuit (181) is preserved green glow power maximum automatically by serial ports by laser crystal temperature closed loop control circuit (181); Real work stage laser crystal temperature-control circuit (181) adjustment TEC2(112) operating current is to adjust laser crystalline substance (181) working temperature and to be locked in this value of setting.
Adjusting IR(131) with the relative position process of laser crystal (141) in, TEC1(111), heat delivery surface TEC2(112) may be not in one plane, in order to guarantee that TEC1, TEC2 closely contact with heat sink (161), TEC1 or TEC2 contact with heat sink by heat-conducting glue, after having adjusted again UV glue fixing heat sink on; Or employing structure as shown in Figure 3, adopting " L " type heat sink (261), TEC1, TEC2 are placed on respectively on the heat sink face of " L " type by heat-conducting glue, adjust the back and fix with UV glue.
Described laser module is placed in the heat conduction casing, bottom surface and two sides that heat sink (161) and " L " type heat sink (261) can be described heat conduction casings.
With the output of green glow light intensity inductor (151) input as IR luminous power closed control circuit (191), by adjusting infrared laser IR(131) operating current control infrared laser IR(131) power output, make described green (light) laser power output stable.
TEC1(111), hot side TEC2(112) is fixed on the heat dispersion heat sink (161) by low thermal resistance technology.As required, TEC1(111), TEC2(112) enthusiasm of independently dispelling the heat separately also can be arranged.
In order to reduce cost, the green module during non-working alone, described IR temperature closed loop control circuit (171), laser crystal temperature closed loop control circuit (181) and IR luminous power closed control circuit (191) can merge with other circuit in the application system.
The laser structure that provides by the utility model, can use the centre wavelength dispersion is bigger cheaply common infrared laser IR and the bigger laser crystal of optimum working temperature dispersion, can mass-produce high efficiency, type green (light) laser that power output is stable, this laser can be used as the green-light source module of laser micro projector etc.
Though with reference to preferred implementation of the present utility model; the utility model is illustrated and describes; but; the utility model is not subjected to the restriction of above embodiment; that describes in the foregoing description and the specification just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope, the thinkable various changes and modifications of those of ordinary skill in the art all fall in claimed the utility model scope.

Claims (9)

1. adopt the LD pump green light solid state laser of double T EC, it is characterized in that, comprising:
Infrared laser IR, IR temperature sensor, IR temperature closed loop control circuit, the TEC1 that is used to adjust the IR wavelength, IR luminous power closed control circuit, laser crystal, laser crystal temperature sensor, laser crystal temperature closed loop control circuit, the TEC2 that is used to control the laser crystal temperature, green glow light intensity sensor and TEC1 and TEC2 are heat sink.
2. the LD pump green light solid state laser of employing double T EC according to claim 1 is characterized in that, described IR temperature closed loop control circuit is adjusted the operating current of TEC1, control IR working temperature.
3. the LD pump green light solid state laser of employing double T EC according to claim 1 is characterized in that, described laser crystal temperature closed loop control circuit is adjusted the operating current of TEC2, the working temperature of control laser crystal.
4. the LD pump green light solid state laser of employing double T EC according to claim 1 is characterized in that the input of the output of green glow light intensity sensor as IR luminous power closed control circuit, controls the power output of IR by the operating current of adjusting IR.
5. the LD pump green light solid state laser of employing double T EC according to claim 1, it is characterized in that described IR temperature closed loop control circuit, laser crystal temperature closed loop control circuit and IR luminous power closed control circuit can merge with other circuit in the application system.
6. the LD pump green light solid state laser of employing double T EC according to claim 1 is characterized in that described laser crystal is ND:YVO 4With PPLN gummed crystal or ND:YVO 4With KTP gummed crystal.
7. the LD pump green light solid state laser of employing double T EC according to claim 1 is characterized in that described infrared laser IR, laser crystal are separately fixed on TEC1, the TEC2.
8. the LD pump green light solid state laser of employing double T EC according to claim 1 is characterized in that described laser can be positioned in the heat conduction casing, and the heat conduction casing has thermolysis simultaneously.
9. according to the LD pump green light solid state laser of claim 1 or 8 described employing double T EC, it is characterized in that, TEC1, TEC2 heat sink places on the plane or on " L " profile, described plane or " L " profile can be the bottom surface and the two sides of the heat conduction casing of described laser.
CN 201120119681 2011-04-21 2011-04-21 LD pump green solid laser adopting two TECs Expired - Fee Related CN202009156U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102751646A (en) * 2011-04-21 2012-10-24 上海三鑫科技发展有限公司 LD (Laser Diode) pumping green solid laser applying double TECs and temperature control method thereof
CN108448376A (en) * 2018-04-12 2018-08-24 中航华东光电有限公司 Small-Sized Pulsed green (light) laser
CN109893101A (en) * 2019-04-26 2019-06-18 中国科学院长春光学精密机械与物理研究所 A kind of caries diagnosis imaging device and hand-held caries diagnosis imager

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102751646A (en) * 2011-04-21 2012-10-24 上海三鑫科技发展有限公司 LD (Laser Diode) pumping green solid laser applying double TECs and temperature control method thereof
CN108448376A (en) * 2018-04-12 2018-08-24 中航华东光电有限公司 Small-Sized Pulsed green (light) laser
CN109893101A (en) * 2019-04-26 2019-06-18 中国科学院长春光学精密机械与物理研究所 A kind of caries diagnosis imaging device and hand-held caries diagnosis imager

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