CN201993794U

CN201993794U - Radio-frequency label

Info

Publication number: CN201993794U
Application number: CN2011201054301U
Authority: CN
Inventors: 管超; 玄正罡; 郑源
Original assignee: HUIZHOU EVERAY TECHNOLOGIES CO LTD
Priority date: 2011-04-12
Filing date: 2011-04-12
Publication date: 2011-09-28
Anticipated expiration: 2021-04-12

Abstract

The utility model belongs to the field of labels, in particular to a radio-frequency label, which comprises a base plate, a conducting layer and a chip and is characterized in that an inner groove is arranged on the upper surface of the base plate, the conducting layer is arranged on the surface of the inner groove, the chip is placed on the base plate and is connected with the conducting layer arranged on the surface of the inner groove, or the chip is directly pasted on the conducting layer arranged on the surface of the inner groove. Through the label structure, the mass production of the label can be easily realized, the performance is ensured, the processes such as printed circuit board (PCB) production, milling cutter cutting, corrosion and the like are not needed, the process flow is simplified, the large-scale mass production is convenient, the cost is also reduced, and the time is saved.

Description

A kind of radio-frequency (RF) tag

Technical field

The utility model belongs to the label field, particularly a kind of radio-frequency (RF) tag.

Background technology

RFID tag claims radio-frequency (RF) tag, electronic tag again, mainly is made of label chip that has cognizance code and antenna.Label chip is received and dispatched radiofrequency signal by label antenna.

Electronic tag can be soft, also can make hard.The mode of production comparative maturity of soft electronic tag: mainly be to adopt the method for serigraphy or metal etch on soft material, to form antenna pattern, with anisotropy conductiving glue label chip and antenna be pasted together again with metal.

Main in the market hard electronic label mainly is that soft Inlay secondary is encapsulated on the hard shell of given shape.This mode relates to the secondary encapsulation, and main shortcoming is that cost is high.

Another kind of mode is that label antenna directly adopts hard substrate.Mainly be on PCB, after the printed antenna, PCB to be sold specific label shape, again label chip added on the PCB with milling cutter.Its work flow is (wherein step 1,2, the 3rd, the production run of PCB circuit board) as shown in Figure 1:

1. produce the PCB substrate, composition is generally epoxy resin.

2. on the PCB substrate, cover copper, generally can use the way manufacturing of calendering and electrolysis.

3. remove unnecessary metal with etching method, only stay the metal of antenna pattern.

4. with milling cutter the monoblock pcb board is cut into the label of a plurality of given shapes.

5. label chip is added on the label substrate.

The major defect of this mode is: the production and the later stage that relate to pcb board need cut with milling cutter, and this all can produce high expense.

Also having a kind of mode is that the mode with serigraphy prints out antenna pattern with the silver slurry on hard floor.All there are shortcomings such as cost height, difficult batch process in the existing label and the label mode of production.For this reason, exigence those skilled in the art develop a kind of radio-frequency (RF) tag that can solve the prior art defective and preparation method thereof.

The utility model content

In order to overcome the defective of prior art, the purpose of this utility model is to propose a kind of radio-frequency (RF) tag of being convenient to large-scale production.

Radio-frequency (RF) tag of the present utility model is achieved through the following technical solutions:

A kind of radio-frequency (RF) tag, this label comprises substrate, conductive layer and chip, it is characterized in that: the upper surface of described substrate is provided with inner groovy, described inner groovy surface is provided with conductive layer, and described chip places on the substrate and is connected with the conductive layer on inner groovy surface or described chip directly is pasted on the conductive layer on inner groovy surface.

Wherein, described chip places on the substrate and is connected with the conductive layer on inner groovy surface or described chip directly is pasted on the conductive layer on inner groovy surface by conducting resinl by metal wire.

Wherein, described conductor layer aluminium film, silverskin or golden film.

The beneficial effects of the utility model are:

1. label construction of the present utility model is realized the batch process to label easily, and promptly guaranteed performance does not need technologies such as PCB production, milling cutter cutting and corrosion again, has promptly simplified technological process, is convenient to large-scale mass production, has reduced cost again, saves time.2. label of the present utility model adopts common plastics as label substrate, avoids using expensive pcb board material (mainly being epoxy resin), and does not need complicated PCB processing technology.3. the utility model is produced three-dimensional label substrate in batches in the mode of casting, avoids the later stage to cut into the technology of given shape with milling cutter.

Description of drawings

Fig. 1 is a work flow synoptic diagram of producing label in the prior art;

Fig. 2 is the work flow synoptic diagram of the utility model production radio-frequency (RF) tag;

Fig. 3 is the structural representation of the utility model radio-frequency (RF) tag;

Wherein, 1-substrate, 2-metal film, 3-chip, 4-inner groovy, 5-coupling part.

Embodiment

Below in conjunction with accompanying drawing radio-frequency (RF) tag of the present utility model and preparation method thereof is done further detailed description.

As shown in Figure 3, radio-frequency (RF) tag of the present utility model comprises substrate 1, conductive layer 2 and chip 3.Adopt the casting mode to prepare the substrate 1 that upper surface has inner groovy 4 in this example, in the shape of substrate 1 and the casting process in the mould shape of each substrate adapt, can be rectangle, trapezoidal, circular or other arbitrary shapes, this example is that example describes with the isosceles trapezoid.The shape of inner groovy is decided according to the design of concrete label antenna, can have any shape.The conductive layer 2 that inner groovy 4 surfaces are provided with is as this label antenna, chip 3 places on the substrate 1 and is connected with the conductive layer 2 on inner groovy surface or directly by conducting resinl chip 3 is pasted on the conductive layer 2 by fine wire, this conductive layer 2 adopts metal films, can the aluminium film, silverskin or golden film.

As shown in Figure 2, the utility model radio-frequency (RF) tag is produced in batches by following technology:

A) adopt the casting mode to produce each substrate 1 that upper surface has inner groovy 4 in batches, 1 all is connected by coupling part 5 between each substrate; The concrete technology of casting mode is: adopt injection machine that insulating material is heated to melt liquid, melt liquid is arrived in the airtight mould with high-pressure injection, through cooling and shaping, eject each substrate 1 that upper surface has inner groovy 4 after the die sinking;

The insulating material of using in the casting mode in this example (for example adopts plastics, materials such as PET, ABS, PMMA, HIPS) make substrate, can avoid using expensive pcb sheet material like this, and do not need metal etching process, not only reduced cost, the preparation method is also simpler, easily operation.The substrate shape that the upper surface that employed mold shape and the utility model need make in this example has inner groovy adapts, for the step that simplifies the operation, be reserved with a connection channel between the model of need each substrate in mould, like this when in mould, injecting melt liquid, interface channel also can be filled, be coupling part 5 recited above after the die sinking, its material also is plastics, can realize easily that so just disposable injection melt liquid can mass-produce a plurality of substrates 1 in mould, not only save time, increase work efficiency, each substrate of making also conveniently carries out subsequent operation.

B) in the inner groovy 4 of the upper surface of each substrate 1 and each substrate, be coated with conductive layer 2 (being metal film);

Plating conductive layer 2 (being metal-coated membrane) can adopt modes such as vacuum coating or plated film, wherein vacuum coating mode adopts the general vacuum coating equipment of prior art to plate conductive layer 2 (being metal film), the metal film that is plated can the aluminium film, silverskin, golden film etc., and the utility model is good with the aluminium film.

C) by modes such as polishing, cutting, etchings, the conductive layer 2 (being metal film) of each substrate 1 upper surface is removed, only stay the antenna of the conductive layer 2 (being metal film) on inner groovy 4 surfaces as label;

D) chip 3 is installed in respectively on each substrate 1 and is connected with the conductive layer 2 (being metal film) on inner groovy surface by fine wire and realizes and the binding of antenna, perhaps chip 3 is pasted on the conductive layer 2 (being metal film) on inner groovy surface by conducting resinl respectively.

E) cut off coupling part 5 between each substrate 1, each radio-frequency (RF) tag that is prepared from is separated, promptly finish the batch process of the utility model radio-frequency (RF) tag.

Should be noted that at last: above embodiment only is not intended to limit in order to the explanation the technical solution of the utility model; in conjunction with the foregoing description the utility model is had been described in detail; those of ordinary skill in the field are to be understood that: those skilled in the art still can make amendment or are equal to replacement embodiment of the present utility model, but these modifications or change are all among the claim protection domain that application is awaited the reply.

Claims

1. radio-frequency (RF) tag, this label comprises substrate (1), conductive layer (2) and chip (3), it is characterized in that: the upper surface of described substrate (1) is provided with inner groovy (4), described inner groovy (4) surface is provided with conductive layer (2), and described chip (3) places substrate (1) to go up and be connected with the conductive layer (2) on inner groovy surface or described chip (3) directly is pasted on the conductive layer (2) on inner groovy surface.

2. radio-frequency (RF) tag as claimed in claim 1 is characterized in that: described chip (3) places substrate (1) to go up and be connected with the conductive layer (2) on inner groovy surface or described chip (3) directly is pasted on the conductive layer on inner groovy surface by conducting resinl by metal wire.

3. radio-frequency (RF) tag as claimed in claim 1 is characterized in that: described conductor layer (2) aluminium film, silverskin or golden film.