CN201993698U - Heat radiating structure of computer power source - Google Patents
Heat radiating structure of computer power source Download PDFInfo
- Publication number
- CN201993698U CN201993698U CN2011200201695U CN201120020169U CN201993698U CN 201993698 U CN201993698 U CN 201993698U CN 2011200201695 U CN2011200201695 U CN 2011200201695U CN 201120020169 U CN201120020169 U CN 201120020169U CN 201993698 U CN201993698 U CN 201993698U
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- China
- Prior art keywords
- radiator
- computer power
- heat
- integrated circuit
- heat pipe
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Abstract
The utility model discloses a heat radiating structure of a computer power source. The heat radiating structure comprises heat radiating fins, a heat guiding pipe and a heat radiator, wherein the heat radiating fins are connected with an integrated circuit board of the computer power source; the heat radiator is mounted on a frame of the computer power source; and the heat radiating fins are connected with the heat radiator through the heat guiding pipe. Compared with the prior art, the heat radiating structure of the computer power source, which is provided by the utility model, has the advantages that the heat radiator is far away from the integrated circuit board, so that the temperature surrounding the integrated circuit board is uniform, and the heat radiating efficiency is improved.
Description
Technical field
The utility model relates to the heat abstractor field of electronic component, exactly is meant a kind of radiator structure of computer power.
Background technology
A large amount of integrated circuit that use in the machine element.As everyone knows, high temperature is the formidable enemy of integrated circuit.High temperature not only can cause system's operation unstable, and shorten serviceable life, even some parts is burnt.The heat that causes high temperature is not from outside the computing machine, but computer-internal, or perhaps IC interior.Particularly the temperature that produces on the surface-mounted integrated circuit of computer power is higher.The effect of heating radiator is exactly with these heat absorption, diffuse in the cabinet then or cabinet outside, guarantee that the temperature of machine element is normal.At present, heating radiator generally by contacting with the heat generating components surface, absorbs heat, by the whole bag of tricks heat transferred is arrived at a distance again, and in the air in the cabinet, cabinet passes to these hot-airs outside the cabinet then, finishes the heat radiation of computing machine.But such radiator structure just conducts heat on the heating radiator, because heating radiator is close to surface-mounted integrated circuit, can make that still the local temperature of surface-mounted integrated circuit annex is higher, causes radiating efficiency not high thereby heat radiation is uneven.
The utility model content
At above-mentioned defective, the technical matters that the utility model solves is to provide a kind of radiator structure of computer power, and heating radiator away from surface-mounted integrated circuit, is made that the temperature on every side of surface-mounted integrated circuit is more even, improves radiating efficiency.
In order to solve above technical matters, the concrete technical scheme that the utility model provides is: the radiator structure of computer power, comprise heat radiator, heat pipe and heating radiator, described heat radiator is connected with the surface-mounted integrated circuit of computer power, described heating radiator is installed on the framework of computer power, is connected by described heat pipe between described heat radiator and the described heating radiator.
Preferably, described heat radiator is close to the described surface-mounted integrated circuit of described computer power and is connected.
Preferably, be connected with other heating radiator on the described surface-mounted integrated circuit of described computer power.
Preferably, described heat radiator comprises main body and loam cake, is provided with groove between described main body and the described loam cake, and described heat pipe is installed in the described groove.
Preferably, being connected between described heat pipe and the described heat radiator is filled with conduction material in the slit.
Preferably, described conduction material is a silicone grease.
Preferably, described main body and described loam cake are respectively arranged with connecting hole, are connected and fixed by web member between described main body and the described loam cake.
Preferably, described main body and described loam cake are respectively arranged with plural connecting hole, and described connecting hole evenly is arranged on the both sides of described heat pipe.
Preferably, described heating radiator is a fin radiator.
Preferably, the heat pipe between described heat radiator and the described heating radiator is a warp architecture.
The radiator structure of the computer power that the utility model provides, comprise heat radiator, heat pipe and heating radiator, heat radiator is connected with the surface-mounted integrated circuit of computer power, heating radiator is installed on the framework of computer power, be connected by heat pipe between heat radiator and the heating radiator, the heat of surface-mounted integrated circuit is transmitted on the heat radiator, conduct on the heating radiator rapidly by heat pipe again, heat is not concentrated on the heat radiator, and heat radiator is connected by heat pipe with heating radiator, make to be separated with a segment distance between heating radiator and surface-mounted integrated circuit, heat can not rest on the integrated circuit panel area; In addition, heat pipe itself can also increase the area of dissipation except heating radiator except heat conduction, accelerates distributing of heat.Compared with prior art, the radiator structure of the computer power that the utility model provides away from surface-mounted integrated circuit, makes that the temperature on every side of surface-mounted integrated circuit is more even with heating radiator, improves radiating efficiency.
Especially, the radiator structure of the computer power that the utility model provides, the heat pipe between heat radiator and the heating radiator is a warp architecture, except having aesthetic, can further increase area of dissipation, accelerates distributing of heat.
Description of drawings
Fig. 1 is the structural representation of the radiator structure of computer power in the utility model.
Respectively be denoted as among the figure:
The 1-heat radiator; The 2-heat pipe; The 3-fin radiator; The 4-connecting hole; The 5-surface-mounted integrated circuit; The 6-transformer; The 7-inductance; The other heating radiator of 8-.
Embodiment
For those skilled in the art can understand technical scheme provided by the utility model better, set forth below in conjunction with specific embodiment.
See also Fig. 1, this figure is the structural representation of the radiator structure of computer power in the utility model.
The radiator structure of the computer power that the utility model provides, comprise heat radiator 1, heat pipe 2 and fin radiator 3, heat radiator 1 is close to the surface-mounted integrated circuit 5 of computer power and is connected, fin radiator 3 is installed on the framework of computer power, be connected by heat pipe 2 between heat radiator 1 and the fin radiator 3, transformer 6 and inductance 7 are installed on the surface-mounted integrated circuit 5.
Be connected with other heating radiator 8 on the surface-mounted integrated circuit 5 of computer power, other heating radiator 8 is accelerated the radiating rate of surface-mounted integrated circuit.
The radiating principle of the radiator structure of the computer power that the utility model provides is as follows:
Be connected by heat pipe 2 between heat radiator 1 and the fin radiator, heat radiator 1 is connected with surface-mounted integrated circuit 5, the heat of sending out surface-mounted integrated circuit 5 is transmitted on the heat radiator 1, conduct to rapidly on the fin radiator 3 by heat pipe 2 again, heat is not concentrated on the heat radiator 1, and heat radiator 1 is connected by heat pipe 2 with fin radiator 3, makes 5 of fin radiator 3 and surface-mounted integrated circuits be separated with a segment distance, and heat can not rest on around the surface-mounted integrated circuit 5; In addition, heat pipe 2 itself can also increase the area of dissipation except fin radiator 3 except heat conduction, the distributing of quickening heat.
Of particular note, the radiator structure of the computer power that the utility model provides, its heat pipe can be more than one or two, can realize the purpose of this utility model equally, do not repeat them here.
Compared with prior art, the radiator structure of the computer power that the utility model provides away from surface-mounted integrated circuit 5, makes that the temperature on every side of surface-mounted integrated circuit 5 is more even with fin radiator 3, improves radiating efficiency.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from spirit or scope of the present utility model in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (10)
1. the radiator structure of a computer power, it is characterized in that, comprise heat radiator, heat pipe and heating radiator, described heat radiator is connected with the surface-mounted integrated circuit of computer power, described heating radiator is installed on the framework of computer power, is connected by described heat pipe between described heat radiator and the described heating radiator.
2. the radiator structure of computer power according to claim 1 is characterized in that, described heat radiator is close to the described surface-mounted integrated circuit of described computer power and is connected.
3. the radiator structure of computer power according to claim 1 is characterized in that, is connected with other heating radiator on the described surface-mounted integrated circuit of described computer power.
4. the radiator structure of computer power according to claim 1 is characterized in that, described heat radiator comprises main body and loam cake, is provided with groove between described main body and the described loam cake, and described heat pipe is installed in the described groove.
5. the radiator structure of computer power according to claim 4 is characterized in that, being connected between described heat pipe and the described heat radiator is filled with conduction material in the slit.
6. the radiator structure of computer power according to claim 5 is characterized in that, described conduction material is a silicone grease.
7. the radiator structure of computer power according to claim 4 is characterized in that, described main body and described loam cake are respectively arranged with connecting hole, is connected and fixed by web member between described main body and the described loam cake.
8. the radiator structure of computer power according to claim 7 is characterized in that, described main body and described loam cake are respectively arranged with plural connecting hole, and described connecting hole evenly is arranged on the both sides of described heat pipe.
9. the radiator structure of computer power according to claim 1 is characterized in that, described heating radiator is a fin radiator.
10. the radiator structure of computer power according to claim 1 is characterized in that, the heat pipe between described heat radiator and the described heating radiator is a warp architecture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200201695U CN201993698U (en) | 2011-01-21 | 2011-01-21 | Heat radiating structure of computer power source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200201695U CN201993698U (en) | 2011-01-21 | 2011-01-21 | Heat radiating structure of computer power source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201993698U true CN201993698U (en) | 2011-09-28 |
Family
ID=44670181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200201695U Expired - Fee Related CN201993698U (en) | 2011-01-21 | 2011-01-21 | Heat radiating structure of computer power source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201993698U (en) |
-
2011
- 2011-01-21 CN CN2011200201695U patent/CN201993698U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110928 Termination date: 20150121 |
|
| EXPY | Termination of patent right or utility model |