CN201983768U - Small-sized slicing-type three-dimensional structure reconstruction system - Google Patents

Small-sized slicing-type three-dimensional structure reconstruction system Download PDF

Info

Publication number
CN201983768U
CN201983768U CN2011200269109U CN201120026910U CN201983768U CN 201983768 U CN201983768 U CN 201983768U CN 2011200269109 U CN2011200269109 U CN 2011200269109U CN 201120026910 U CN201120026910 U CN 201120026910U CN 201983768 U CN201983768 U CN 201983768U
Authority
CN
China
Prior art keywords
dimensional
image
lifting
horizontal
slice type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2011200269109U
Other languages
Chinese (zh)
Inventor
汪远银
马少鹏
马沁巍
刘力强
阳巍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INSTITUTE OF GEOLOGY CHINA EARTHQUAKE ADMINISTRATION
Beijing Institute of Technology BIT
Original Assignee
INSTITUTE OF GEOLOGY CHINA EARTHQUAKE ADMINISTRATION
Beijing Institute of Technology BIT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INSTITUTE OF GEOLOGY CHINA EARTHQUAKE ADMINISTRATION, Beijing Institute of Technology BIT filed Critical INSTITUTE OF GEOLOGY CHINA EARTHQUAKE ADMINISTRATION
Priority to CN2011200269109U priority Critical patent/CN201983768U/en
Application granted granted Critical
Publication of CN201983768U publication Critical patent/CN201983768U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Apparatus For Radiation Diagnosis (AREA)

Abstract

本实用新型涉及一种小型切片式三维结构重构系统,包括:控制器、机械操作单元和图像处理单元;其中,所述控制器分别与所述机械操作单元和图像处理单元相连;所述机械操作单元内设有由所述控制器控制的切片装置;所述控制器控制所述机械操作单元内的所述切片装置并对其进行操作,并控制所述图像处理单元进行图像采集、处理后生成三维内部结构模型。本实用新型与现有的常规CT三维重构技术相比,虽然存在对被测物体损坏的劣势,但其在三维重构的精度和分辨率上,以及设备小型化和低成本化方面具有常规CT无法比拟的优势。因此本实用新型适用于某些特殊的检测领域应用,并适于向小型科研和教学单位推广。

The utility model relates to a small slice type three-dimensional structure reconstruction system, comprising: a controller, a mechanical operation unit and an image processing unit; wherein, the controller is respectively connected with the mechanical operation unit and the image processing unit; the mechanical The operating unit is provided with a slicing device controlled by the controller; the controller controls and operates the slicing device in the mechanical operating unit, and controls the image processing unit to perform image acquisition and processing Generate a 3D internal structural model. Compared with the existing conventional CT three-dimensional reconstruction technology, the utility model has the disadvantage of damage to the measured object, but it has conventional advantages in the accuracy and resolution of the three-dimensional reconstruction, as well as in the miniaturization and cost reduction of equipment. CT incomparable advantages. Therefore, the utility model is suitable for application in some special detection fields, and is suitable for promotion to small scientific research and teaching units.

Description

小型切片式三维结构重构系统Small sliced 3D structure reconstruction system

技术领域technical field

本实用新型涉及三维内部结构测量领域,具体地说,本实用新型涉及一种小型切片式三维结构重构系统。The utility model relates to the field of three-dimensional internal structure measurement, in particular, the utility model relates to a small slice type three-dimensional structure reconstruction system.

背景技术Background technique

目前,在三维内部结构重构领域中,基于X射线扫描的成像系统是最常用的内部成像系统,各种型号的CT(Computed Tomography)机也是医学检查、工业检测等领域最常规的检测设备。At present, in the field of three-dimensional internal structure reconstruction, the imaging system based on X-ray scanning is the most commonly used internal imaging system, and various types of CT (Computed Tomography) machines are also the most conventional detection equipment in the fields of medical inspection and industrial inspection.

CT是“计算机X射线断层摄影机”或“计算机X射线断层摄影术”的英文简称,是从1895年伦琴发现X射线以来在X射线诊断方面的最大突破,是近代飞速发展的电子计算机控制技术和X射线检查摄影技术相结合的产物。CT is the English abbreviation of "Computed X-ray Tomography" or "Computed X-ray Tomography". It is the biggest breakthrough in X-ray diagnosis since Roentgen discovered X-ray in 1895. The product of the combination of X-ray inspection photography technology.

CT机主要由X射线发射管和不同数目的探测器组成。X射线发射管用来发X射线束,用其对所选择的层面进行扫描,由于X射线束会和不同密度的组织相互作用,穿透扫描层后其强度会发生相应的吸收和衰减。探测器用来探测被吸收和衰减后的X射线束。并将该信号转变为电信号,再经模/数转换器转换成数字信号后输入计算机储存。对不同方向探测的X射线束数据进行反演处理,可得到该扫描层的断层数字图像。A CT machine is mainly composed of an X-ray emitting tube and a different number of detectors. The X-ray emitting tube is used to emit X-ray beams to scan the selected layer. Since the X-ray beams will interact with tissues of different densities, their intensity will be absorbed and attenuated accordingly after penetrating the scanning layer. The detector is used to detect the absorbed and attenuated X-ray beam. And the signal is converted into an electrical signal, and then converted into a digital signal by an analog/digital converter and then input to a computer for storage. The tomographic digital image of the scanning layer can be obtained by inverting the X-ray beam data detected in different directions.

常规CT机可无损地获得材料或结构内部三维图像。但在小型科研和教学实验中,如想获得材料或构件内部精细的三维结构,而不在乎试件是否损伤时,常规的CT机并不一定是最理想的设备,这是因为:Conventional CT machines can obtain three-dimensional images of materials or structures without loss. However, in small-scale scientific research and teaching experiments, if you want to obtain the fine three-dimensional structure inside the material or component, regardless of whether the test piece is damaged, the conventional CT machine is not necessarily the most ideal equipment, because:

1)常规CT设备非常昂贵,且占地面积大,且还需要专业人员操作,此类设备非大型用户难以负担和维护。1) Conventional CT equipment is very expensive, occupies a large area, and requires professionals to operate it. Such equipment is difficult for non-large users to afford and maintain.

2)常规CT设备获取的图像是经反演呈现的是X射线吸收率,表现为黑白图像或伪彩色,信息量少,不适于探测结构较复杂的物体,也无法对X射线吸收率相同而结构或颜色不同的构件进行检测。2) The image obtained by conventional CT equipment is inverted to present the X-ray absorption rate, which is displayed as a black and white image or false color, with less information, and is not suitable for detecting objects with complex structures, nor can it be used for the same X-ray absorption rate. Components with different structures or colors are inspected.

3)常规CT设备所获取图像的空间分辨率较低,难以进行精细结构探测。3) The spatial resolution of images acquired by conventional CT equipment is low, making it difficult to detect fine structures.

以上几方面因素决定了常规的CT设备很难在某些特殊科研和教学领域中推广和应用。The above factors determine that conventional CT equipment is difficult to promote and apply in some special scientific research and teaching fields.

实用新型内容Utility model content

本实用新型涉及一种小型切片式三维结构重构系统,该系统解决了常规CT设备无法在某些科研领域中推广和应用的问题。The utility model relates to a small slice type three-dimensional structure reconstruction system, which solves the problem that conventional CT equipment cannot be popularized and applied in some scientific research fields.

为了解决上述问题,本实用新型提供了一种小型切片式三维结构重构系统,包括:控制器、机械操作单元和图像处理单元;其中,所述控制器分别与所述机械操作单元和图像处理单元相连;所述机械操作单元内设有由所述控制器控制的切片装置;所述控制器控制所述机械操作单元内的所述切片装置并对其进行操作,并控制所述图像处理单元进行图像采集、处理后生成三维内部结构模型。In order to solve the above problems, the utility model provides a small slice type three-dimensional structure reconstruction system, including: a controller, a mechanical operation unit and an image processing unit; The units are connected; the mechanical operation unit is provided with a slicing device controlled by the controller; the controller controls and operates the slicing device in the mechanical operation unit, and controls the image processing unit After image acquisition and processing, a three-dimensional internal structure model is generated.

其中,进一步地,所述机械操作单元包括:切片装置、水平传送装置、升降装置、清洗装置和烘干装置,其中:Wherein, further, the mechanical operation unit includes: a slicing device, a horizontal conveying device, a lifting device, a cleaning device and a drying device, wherein:

所述水平传送装置的一水平侧面设置有所述切片装置、升降装置、清洗装置和烘干装置;A horizontal side of the horizontal conveying device is provided with the slicing device, lifting device, cleaning device and drying device;

在所述水平传送装置的另外一水平侧面与所述切片装置、清洗装置、烘干装置和图像处理单元所对应的位置分别设置有接近传感器。Proximity sensors are respectively provided at positions corresponding to the slicing device, the cleaning device, the drying device and the image processing unit on the other horizontal side of the horizontal conveying device.

其中,进一步地,在所述水平传送装置的另外一水平侧面上分别对应所述切片装置、清洗装置、烘干装置的位置设置的接近传感器为电感式接近传感器。Wherein, further, the proximity sensors provided on the other horizontal side of the horizontal conveying device respectively corresponding to the positions of the slicing device, the cleaning device and the drying device are inductive proximity sensors.

其中,进一步地,在所述水平传送装置的另外一水平侧面上对应所述图像处理单元的位置设置的接近传感器为光电开关接近传感器。Wherein, further, the proximity sensor disposed on the other horizontal side of the horizontal transfer device corresponding to the position of the image processing unit is a photoelectric switch proximity sensor.

其中,进一步地,所述切片装置里还设置有检测切割厚度的位移传感器。Wherein, further, the slicing device is also provided with a displacement sensor for detecting the cutting thickness.

其中,进一步地,所述升降装置包括:支架、升降台、升降丝杠、升降驱动电机和夹具;其中,所述支架为长方框结构,长方框内部垂直设置有升降台。所述升降台通过支架内设置的所述升降丝杠进行升降。所述升降驱动电机设置在支架的垂直上方。所述夹具设置在所述升降台上,且所述支架、升降台、升降丝杠、升降驱动电机和夹具之间保持在一条垂直直线上。Wherein, further, the lifting device includes: a bracket, a lifting platform, a lifting screw, a lifting drive motor and a fixture; wherein, the bracket is a rectangular frame structure, and a lifting platform is vertically arranged inside the rectangular frame. The lifting platform is lifted and lowered by the lifting screw provided in the bracket. The lifting drive motor is arranged vertically above the support. The clamp is arranged on the lifting platform, and the bracket, the lifting platform, the lifting screw, the lifting drive motor and the clamp are kept on a vertical straight line.

其中,进一步地,所述支架包括:底座、上支撑板和竖直导轨;其中,所述支架内部在所述底座和上支撑板之间设置有两根竖直导轨,且所述升降台设置在两根竖直导轨之间,所述升降驱动电机设置在上支撑板的垂直上方。Wherein, further, the support includes: a base, an upper support plate and a vertical guide rail; wherein, two vertical guide rails are arranged inside the support between the base and the upper support plate, and the lifting platform is set Between the two vertical guide rails, the lifting drive motor is arranged vertically above the upper support plate.

其中,进一步地,所述夹具包括:夹具体、安装板、固定块、活动块、导向轴、直线轴承、调节螺钉、弹簧和弹簧压板;其中,所述导向轴一端固定在所述安装板上,另一端安装在所述固定块上;所述安装板与固定块之间的导向轴上安装有带有所述夹具体的活动块;所述活动块与导向轴通过所述直线轴承连接,所述导向轴上还套设有所述弹簧;所述弹簧与安装板之间设有所述弹簧压板,所述弹簧压板与安装板之间通过至少一个调节螺钉连接。Wherein, further, the clamp includes: a clamp body, a mounting plate, a fixed block, a movable block, a guide shaft, a linear bearing, an adjustment screw, a spring, and a spring pressure plate; wherein, one end of the guide shaft is fixed on the mounting plate , the other end is installed on the fixed block; a movable block with the clamp body is installed on the guide shaft between the mounting plate and the fixed block; the movable block is connected with the guide shaft through the linear bearing, The guide shaft is also sleeved with the spring; the spring pressing plate is arranged between the spring and the mounting plate, and the spring pressing plate and the mounting plate are connected by at least one adjusting screw.

其中,进一步地,所述水平传送装置包括:水平导轨和水平驱动丝杠;所述水平驱动丝杠和所述水平导轨形成所述水平传送装置。Wherein, further, the horizontal transfer device includes: a horizontal guide rail and a horizontal driving screw; the horizontal drive screw and the horizontal guide rail form the horizontal transfer device.

其中,进一步地,所述图像处理单元包括:图像采集模块、图像分割及提取模块、空间三维坐标获取模块和三维体重建模块,其中:Wherein, further, the image processing unit includes: an image acquisition module, an image segmentation and extraction module, a spatial three-dimensional coordinate acquisition module and a three-dimensional volume reconstruction module, wherein:

所述图像采集模块,与所述图像分割及提取模块相连,接收所述控制器发送的控制信号并进行图像采集,然后将采集的二维断层彩色图像发送给所述图像分割及提取模块;The image acquisition module is connected to the image segmentation and extraction module, receives the control signal sent by the controller and performs image acquisition, and then sends the collected two-dimensional tomographic color image to the image segmentation and extraction module;

所述图像分割及提取模块,与所述图像采集模块和空间三维坐标获取模块相连,接收所述图像采集模块发送的二维断层彩色图像,用相应算法对二维断层彩色图像中相关特征点和特征边界进行分割和提取,生成二维断层彩色图像并将分割和提取后的二维断层特征图像发送给所述空间三维坐标获取模块;The image segmentation and extraction module is connected to the image acquisition module and the spatial three-dimensional coordinate acquisition module, receives the two-dimensional tomographic color image sent by the image acquisition module, and uses a corresponding algorithm to analyze the relevant feature points in the two-dimensional tomographic color image and Segment and extract feature boundaries, generate a two-dimensional tomographic color image, and send the segmented and extracted two-dimensional tomographic feature image to the spatial three-dimensional coordinate acquisition module;

所述空间三维坐标获取模块,与所述图像分割及提取模块和三维体重建模块相连,生成二维断层特征图像中各点和边界的三维坐标,然后发送给所述三维体重建模块;The spatial three-dimensional coordinate acquisition module is connected to the image segmentation and extraction module and the three-dimensional volume reconstruction module to generate the three-dimensional coordinates of each point and boundary in the two-dimensional tomographic feature image, and then send it to the three-dimensional volume reconstruction module;

所述三维体重建模块,与所述空间三维坐标获取模块相连,将空间三维坐标获取模块计算获得的空间三维坐标(具体可以是三维坐标点云图)转换成为一个闭合的曲面模型,然后在此模型的基础上生成一个包含有被测物体三维内部结构的体模型,并转换成为与目前主流三维程序兼容的数据格式输出。The three-dimensional body reconstruction module is connected with the three-dimensional coordinate acquisition module, and converts the three-dimensional coordinates obtained by the three-dimensional coordinate acquisition module into a closed surface model, and then converts the obtained three-dimensional coordinates into a closed surface model in the model A volume model containing the three-dimensional internal structure of the measured object is generated on the basis of the measured object, and converted into a data format compatible with the current mainstream three-dimensional program for output.

与现有的常规CT三维重构技术相比,本实用新型所述的小型切片式三维结构重构系统,虽然存在对被测物体损坏的劣势,但其在三维重构的精度和分辨率上,以及设备小型化和低成本化方面具有常规CT无法比拟的优势。因此本实用新型适用于某些特殊的检测领域应用,并适于向小型科研和教学单位推厂。Compared with the existing conventional CT three-dimensional reconstruction technology, the small-scale sliced three-dimensional structure reconstruction system described in the utility model has the disadvantage of damaging the measured object, but its accuracy and resolution of the three-dimensional reconstruction , as well as equipment miniaturization and cost reduction have advantages that conventional CT cannot match. Therefore, the utility model is suitable for some special detection field applications, and is suitable for promoting to small scientific research and teaching units.

附图说明Description of drawings

图1为本实用新型实施例所述小型切片式三维结构重构系统的整体结构框图。Fig. 1 is a block diagram of the overall structure of the small slice type three-dimensional structure reconstruction system described in the embodiment of the present invention.

图2为本实用新型实施例所述的小型切片式三维结构重构系统的具体结构图。Fig. 2 is a specific structural diagram of the small slice type three-dimensional structure reconstruction system described in the embodiment of the present invention.

图3为图2所示的本实用新型实施例所述系统的机械操作单元上升降装置结构图。Fig. 3 is a structural diagram of the lifting device on the mechanical operation unit of the system according to the embodiment of the utility model shown in Fig. 2 .

图4为图3所示的本实用新型实施例所述的升降装置中夹具结构正视图。Fig. 4 is a front view of the fixture structure in the lifting device according to the embodiment of the utility model shown in Fig. 3 .

图5为图3所示的本实用新型实施例所述的升降装置中夹具结构立体图。Fig. 5 is a perspective view of the fixture structure in the lifting device according to the embodiment of the utility model shown in Fig. 3 .

图6为图2所示的本实用新型实施例所述系统的图像处理单元的结构框图。FIG. 6 is a structural block diagram of the image processing unit of the system according to the embodiment of the present invention shown in FIG. 2 .

图7为本实用新型实施例被测试物体处理效果流程图。Fig. 7 is a flow chart of the processing effect of the object under test according to the embodiment of the present invention.

图8为本实用新型实施例被测试物体为苹果的处理后生成的三维结构图。Fig. 8 is a three-dimensional structure diagram generated after the processing of an apple as the tested object according to the embodiment of the utility model.

具体实施方式Detailed ways

以下结合附图对本实用新型作进一步详细说明,但不作为对本实用新型的限定。The utility model will be described in further detail below in conjunction with the accompanying drawings, but not as a limitation to the utility model.

图1所示为本实用新型实施例所述的小型切片式三维结构重构系统整体结构框图,该系统用于生成被测物体的三维内部结构模型,系统包括:控制器1、机械操作单元2和图像处理单元3;其中,所述控制器1分别与所述机械操作单元2和图像处理单元3相连;所述机械操作单元2内设有由所述控制器1控制的切片装置21;所述控制器1控制所述机械操作单元2内的所述切片装置21对试件进行切片操作,并控制所述图像处理单元3进行图像采集、处理及生成三维内部结构模型。Figure 1 is a block diagram of the overall structure of the small-scale sliced three-dimensional structure reconstruction system described in the embodiment of the present invention. The system is used to generate a three-dimensional internal structure model of the measured object. The system includes: a controller 1, a mechanical operation unit 2 and an image processing unit 3; wherein the controller 1 is connected to the mechanical operation unit 2 and the image processing unit 3 respectively; the mechanical operation unit 2 is provided with a slicing device 21 controlled by the controller 1; The controller 1 controls the slicing device 21 in the mechanical operation unit 2 to slice the specimen, and controls the image processing unit 3 to collect, process and generate a three-dimensional internal structure model.

具体地,所述控制器1控制所述机械操作单元2对被测物体进行切片、清洗和烘干,然后控制所述图像处理单元3对切片、清洗和烘干后的被测物体表面进行图像采集,并将采集后的每幅二维断层彩色图像进行处理,生成被测物体的三维内部结构模型;Specifically, the controller 1 controls the mechanical operation unit 2 to slice, clean and dry the measured object, and then controls the image processing unit 3 to image the surface of the measured object after slicing, cleaning and drying. Collect and process each two-dimensional tomographic color image after collection to generate a three-dimensional internal structure model of the measured object;

所述机械操作单元2接收所述控制器1发送的控制信号对被测物体进行切片、清洗和烘干,并将切片、清洗和烘干后的被测物体移动至所述图像处理单元3的图像采集处;The mechanical operation unit 2 receives the control signal sent by the controller 1 to slice, clean and dry the measured object, and moves the sliced, cleaned and dried measured object to the image processing unit 3 Image collection office;

所述图像处理单元3根据所述控制器1发送的控制信号对经过所述机械操作单元2切片、清洗和烘干后的所述被测物体表面进行图像采集,并将采集后的每幅二维断层彩色图像进行处理,生成被测物体的三维内部结构模型。The image processing unit 3 collects images of the surface of the object under test after being sliced, cleaned and dried by the mechanical operation unit 2 according to the control signal sent by the controller 1, and collects two images of each collected image. The three-dimensional tomographic color image is processed to generate a three-dimensional internal structure model of the measured object.

具体地,如图2所示,机械操作单元2包括:切片装置21、水平传送装置22、升降装置23、清洗装置24和烘干装置25;其中,所述水平传送装置22的一水平侧面分别与所述切片装置21、升降装置23、清洗装置24和烘干装置25相连。Specifically, as shown in Figure 2, the mechanical operation unit 2 includes: a slicing device 21, a horizontal transfer device 22, a lifting device 23, a cleaning device 24, and a drying device 25; wherein, a horizontal side of the horizontal transfer device 22 is respectively It is connected with the slicing device 21 , the lifting device 23 , the cleaning device 24 and the drying device 25 .

具体地,所述切片装置21用于切割被测物体;Specifically, the slicing device 21 is used for cutting the measured object;

所述水平传送装置22用于与升降装置23配合将被测物体传送到切片装置21、清洗装置24和烘干装置25;The horizontal transfer device 22 is used to cooperate with the lifting device 23 to transfer the measured object to the slicing device 21, the cleaning device 24 and the drying device 25;

所述升降装置23用于与水平传送装置22配合将被测物体传送到切片装置21、清洗装置24和烘干装置25;The lifting device 23 is used to cooperate with the horizontal transfer device 22 to transfer the measured object to the slicing device 21, the cleaning device 24 and the drying device 25;

所述清洗装置24用于对切片后的被测物进行清洗;The cleaning device 24 is used for cleaning the sliced test object;

所述烘干装置25用于对清洗后的切片被测物体进行烘干;The drying device 25 is used to dry the sliced object to be measured after cleaning;

上述提及的切片装置21、水平传送装置22、升降装置23、清洗装置24和烘干装置25,在本实施例中均为现有技术中所采用的装置,例如切片装置21为具有圆形刀片切割物体的装置,当然这里也可以采取其他不同结构的切片装置;所以,在本实用新型中不对所述切片装置、水平传送装置、升降装置、清洗装置和烘干装置的结构做具体的限定。The slicing device 21 mentioned above, the horizontal conveying device 22, the lifting device 23, the cleaning device 24 and the drying device 25 are all devices adopted in the prior art in this embodiment, for example, the slicing device 21 has a circular The device of blade cutting object, of course also can take the slicing device of other different structures here; Therefore, in the utility model, the structure of described slicing device, horizontal conveying device, lifting device, cleaning device and drying device is not specifically limited .

另外,在所述水平传送装置22的另外一水平侧面上与切片装置21、清洗装置24、烘干装置25和图像处理单元3的相对应的位置分别设置有接近传感器26,该接近传感器26用于在升降装置23从水平传送装置22上移动到切片装置21、清洗装置24、烘干装置25和图像处理单元3所对应的位置时发出一个相应的开关信号,系统通过分析此开关信号便可知道升降装置23所处的工作位置。In addition, on the other horizontal side of the horizontal transfer device 22, a proximity sensor 26 is respectively provided at the positions corresponding to the slicing device 21, the cleaning device 24, the drying device 25 and the image processing unit 3, and the proximity sensor 26 is used for When the lifting device 23 moves from the horizontal conveying device 22 to the corresponding positions of the slicing device 21, the cleaning device 24, the drying device 25 and the image processing unit 3, a corresponding switch signal is sent out, and the system can analyze the switch signal. Know the working position where the lifting device 23 is located.

上述提及的接近传感器26在本实用新型中用到了两种,分别是电感式接近传感器和光电接近传感器;具体地,在水平传送装置的另外一水平侧面上对应切片装置、清洗装置和烘干装置的位置设置的接近传感器为电感式接近传感器;在水平传送装置的另外一水平侧面上对应图像采集单元的位置设置的接近传感器为光电接近传感器。另外,在切片装置21里还设置有检测切割厚度的位移传感器211,用于实时监测被测物体的切割厚度。The proximity sensor 26 mentioned above has used two kinds in the utility model, is respectively the inductive type proximity sensor and the photoelectric proximity sensor; The proximity sensor set at the position of the device is an inductive proximity sensor; the proximity sensor set at the position corresponding to the image acquisition unit on the other horizontal side of the horizontal transmission device is a photoelectric proximity sensor. In addition, a displacement sensor 211 for detecting the cutting thickness is also provided in the slicing device 21 for real-time monitoring of the cutting thickness of the measured object.

具体地,如图3所示,所述升降装置23包括:支架231、升降台232、升降丝杠233、升降驱动电机234和夹具235;其中,所述支架231为长方框结构,长方框框体内部垂直设置有升降台232,所述升降台232通过支架231内设置的升降丝杠233进行升降,所述升降驱动电机234设置在支架的垂直上方,所述夹具235设置在所述升降台232上,且所述支架231、升降台232、升降丝杠233、升降驱动电机234和夹具235之间保持在一条垂直直线上。Specifically, as shown in Figure 3, the lifting device 23 includes: a bracket 231, a lifting platform 232, a lifting screw 233, a lifting drive motor 234, and a clamp 235; wherein, the bracket 231 is a rectangular frame structure, and the The inside of the frame body is vertically provided with a lifting platform 232, and the lifting platform 232 is lifted by the lifting screw 233 provided in the bracket 231, the lifting drive motor 234 is arranged on the vertical top of the bracket, and the clamp 235 is arranged on the lifting platform. on the platform 232, and the support 231, the lifting platform 232, the lifting screw 233, the lifting drive motor 234 and the clamp 235 are kept on a vertical straight line.

进一步地,所述支架231包括底座2311、上支撑板2312和竖直导轨2313;其中,长方框结构的所述支架231内部设置有两条竖直导轨2313,具体地是所述底座2311和上支撑板2312之间设置有两条竖直导轨2313,且所述升降台设置在两条竖直导轨2313之间,所述升降驱动电机234设置在上支撑板2312的垂直上方。所述上支撑板231与升降丝杠233的连接处设置有限位挡板2314。Further, the support 231 includes a base 2311, an upper support plate 2312 and a vertical guide rail 2313; wherein, two vertical guide rails 2313 are arranged inside the support 231 of the rectangular frame structure, specifically the base 2311 and the vertical guide rail 2313. Two vertical guide rails 2313 are arranged between the upper support plates 2312 , and the lifting platform is arranged between the two vertical guide rails 2313 , and the lifting drive motor 234 is arranged vertically above the upper support plate 2312 . A limiting baffle 2314 is provided at the joint between the upper support plate 231 and the lifting screw 233 .

这里限位挡板2314的作用是起到保护作用。在正常情况下,升降台232是不能运动到限位挡板2314所在的位置的,如果操作不当,升降台232到达限位挡板2314的位置时,装在限位挡板2314上的接近传感器会发出一个开关信号,那么控制器1接收到此开关信号后会做出相应的处理,以保护小型切片式三维结构重构系统不至于因为误操作而损坏。The function of the limit baffle 2314 here is to play a protective role. Under normal circumstances, the lifting platform 232 cannot move to the position where the limit baffle 2314 is located. If the operation is improper, when the lifting platform 232 reaches the position of the limit baffle 2314, the proximity sensor installed on the limit baffle 2314 will A switch signal will be sent out, and the controller 1 will make corresponding processing after receiving the switch signal, so as to protect the small slice type 3D structure reconstruction system from being damaged due to misoperation.

具体地,如图4和5所示,所述夹具235,包括夹具体2351、安装板2352、固定块2353、活动块2354、导向轴2355、直线轴承2356、调节螺钉2357、弹簧2358和弹簧压板2359;在本实施例中弹簧2358为两根,所述导向轴2355一端固定在所述安装板2352上,所述导向轴2355另一端安装在所述固定块2353上;所述安装板2352与固定块2353之间的导向轴2355上安装有带有所述夹具体2351的活动块2353,所述活动块2353与所述导向轴2355通过所述直线轴承2356连接;所述导向轴2355上还套设有所述弹簧2358,所述弹簧2358与安装板2352之间设有所述弹簧压板2359,使弹簧2358不直接去接触到安装板2352,所述弹簧压板2359与安装板2352之间通过两个调节螺钉2357连接。Specifically, as shown in Figures 4 and 5, the clamp 235 includes a clamp body 2351, a mounting plate 2352, a fixed block 2353, a movable block 2354, a guide shaft 2355, a linear bearing 2356, an adjusting screw 2357, a spring 2358 and a spring pressure plate 2359; in this embodiment, there are two springs 2358, one end of the guide shaft 2355 is fixed on the installation plate 2352, and the other end of the guide shaft 2355 is installed on the fixed block 2353; the installation plate 2352 and A movable block 2353 with the clamp body 2351 is installed on the guide shaft 2355 between the fixed blocks 2353, and the movable block 2353 is connected with the guide shaft 2355 through the linear bearing 2356; The spring 2358 is sleeved, and the spring pressing plate 2359 is arranged between the spring 2358 and the mounting plate 2352, so that the spring 2358 does not directly touch the mounting plate 2352, and the spring pressing plate 2359 and the mounting plate 2352 pass through Two adjustment screws 2357 are connected.

其中,所述水平传送装置22包括水平导轨221和水平驱动丝杠222;在所述水平驱动丝杠222上设置所述水平导轨221形成所述水平传送装置22。Wherein, the horizontal transmission device 22 includes a horizontal guide rail 221 and a horizontal driving screw 222 ; the horizontal guide rail 221 is set on the horizontal driving screw 222 to form the horizontal transmission device 22 .

其中,所述图像处理单元3在实用新型的具体实施例一中可以采用高分辨率彩色CCD相机和一台计算机,所述切片装置21在具体实施例一中可以采用精密磨抛机。Wherein, the image processing unit 3 can use a high-resolution color CCD camera and a computer in the first embodiment of the utility model, and the slicer 21 can use a precision grinding and polishing machine in the first embodiment.

这里,再结合具体实施例进一步说明检测切割厚度的位移传感器211的作用.当被测物体未接触到切片装置21的切割面时,位移传感器211的读数为零。当被测物体碰到切片装置21的切割面时,并且升降台232继续向下移动,被测物体沿着两根带弹簧2358的竖直导轨2313做伸缩运动,带动检测切割厚度的位移传感器211的顶针运动,使检测切割厚度的位移传感器211产生读数。比如,需要切片的厚度为1mm,可以通过控制器1控制升降台232往下移动,只要当检测切割厚度的位移传感器211的读数为1V(此电压值对应传感器的位移是1mm)时停止,然后启动切片装置21对被测物体进行切割;在切割的过程中,由于被测物体自重和旁边两根弹簧2358会逐渐伸张,整个活动块2353部分随着切割的进行会渐渐下落,检测切割厚度的位移传感器211的读数会逐渐减小,直至读数为零,此时可认为一次切片结束。Here, the function of the displacement sensor 211 for detecting the cutting thickness will be further described in conjunction with specific embodiments. When the measured object does not touch the cutting surface of the slicing device 21, the reading of the displacement sensor 211 is zero. When the object to be measured touches the cutting surface of the slicing device 21 and the elevating table 232 continues to move downward, the object to be measured performs telescopic movement along the two vertical guide rails 2313 with springs 2358 to drive the displacement sensor 211 for detecting the cutting thickness The movement of the thimble makes the displacement sensor 211 that detects the cutting thickness generate readings. Such as, the thickness that needs to slice is 1mm, can control lifting table 232 to move down by controller 1, as long as the reading of displacement sensor 211 when detecting cutting thickness is 1V (the displacement of this voltage value corresponding sensor is 1mm) stop, then Start the slicing device 21 to cut the measured object; during the cutting process, due to the self-weight of the measured object and the two springs 2358 next to it will gradually stretch, the entire movable block 2353 will gradually fall along with the cutting, and the thickness of the cut is detected. The reading of the displacement sensor 211 will gradually decrease until the reading is zero, at which point one slice can be considered as finished.

另外,在切割过程中,控制器1通过检测切割厚度的位移传感器211的电压读数来监测被测物体的切割状态,两根弹簧2358可以起到柔性加载的作用,弹簧压板2359上方的调节螺钉2357可以调节两根弹簧2358在被测物体被切割时对被测物体的作用力。对被测物体的作用力可以根据被测物体的材料和切割需要进行调节。在检测切割厚度的位移传感器211的旁边设有接近传感器26,即对应切片装置21在水平传送装置上设置的接近传感器26,该接近传感器26起到安全保护作用,防止设置切片厚度过大而对检测切割厚度的位移传感器211造成损坏。In addition, during the cutting process, the controller 1 monitors the cutting state of the measured object by detecting the voltage reading of the displacement sensor 211 of the cutting thickness. The two springs 2358 can play the role of flexible loading, and the adjustment screw 2357 above the spring pressing plate 2359 The force exerted by the two springs 2358 on the measured object when the measured object is cut can be adjusted. The force on the measured object can be adjusted according to the material and cutting needs of the measured object. Next to the displacement sensor 211 that detects the cutting thickness is provided with a proximity sensor 26, that is, the proximity sensor 26 that corresponds to the slicing device 21 on the horizontal conveying device. The displacement sensor 211 that detects the cutting thickness is damaged.

具体地,如图6所示,系统中的图像处理单元3包括:图像采集模块31、图像分割及提取模块32、空间三维坐标获取模块33和三维体重建模块34;其中,Specifically, as shown in Figure 6, the image processing unit 3 in the system includes: an image acquisition module 31, an image segmentation and extraction module 32, a spatial three-dimensional coordinate acquisition module 33 and a three-dimensional volume reconstruction module 34; wherein,

所述图像采集模块31,与所述图像分割及提取模块32相连,用于采集经过所述机械操作单元2进行切片、清洗和烘干后的被测物体表面的二维断层彩色图像,并将采集得到的图像数据发送给所述图像分割及提取模块32;The image acquisition module 31 is connected to the image segmentation and extraction module 32, and is used to acquire the two-dimensional tomographic color image of the surface of the measured object after being sliced, cleaned and dried by the mechanical operation unit 2, and The collected image data is sent to the image segmentation and extraction module 32;

所述图像分割及提取模块32,与图像采集模块31和空间三维坐标获取模块33相连,具体是所述控制器1控制图像采集模块31对被烘干后的被测物体进行图像采集,并将图像采集后的每幅二维断层彩色图像输入给图像分割及提取模块32,图像分割及提取模块32通过相关数字图像算法对每幅二维断层彩色图像中各种不同颜色、特征点及边界进行分割和提取,并将分割和提取后的每幅二维断层特征图像发送给空间三维坐标获取模块33;其中,数字图像算法技术可以是现有的普遍采用的技术,对于本领域技术人员来说,这里并不对其做具体限定。The image segmentation and extraction module 32 is connected to the image acquisition module 31 and the spatial three-dimensional coordinate acquisition module 33, specifically, the controller 1 controls the image acquisition module 31 to perform image acquisition on the dried measured object, and Each two-dimensional tomographic color image after image acquisition is input to the image segmentation and extraction module 32, and the image segmentation and extraction module 32 performs various color, feature points and boundaries in each two-dimensional tomographic color image through a relevant digital image algorithm. Segment and extract, and send each two-dimensional tomographic feature image after segmentation and extraction to the spatial three-dimensional coordinate acquisition module 33; wherein, the digital image algorithm technology can be an existing commonly used technology, and for those skilled in the art , which is not specifically limited here.

所述空间三维坐标获取模块33,与图像分割及提取模块32和三维体重建模块34相连;其中,上面所述的图像分割及提取模块32仅仅是对每幅二维断层彩色图像中的相关特征点进行分割和提取,下面需要对分割和提取后的二维断层彩色图像生成与之对应的三维坐标,然后将生成的三维坐标发送给三维体重建模块34。因此,在本实施例一中,具体是:空间三维坐标获取模块33对每幅二维断层特征图像中的每个点生成三维坐标,空间三维坐标获取模块33可以根据每个点的三维坐标生成被测物的空间三维坐标。上述组成了被测物的空间三位坐标的点云图。具体地,每个点生成三维坐标,而每个点上x,y坐标单位是像素,z坐标单位是层数,因此必须全部转化为国际单位制才可以生成后面的被测物的空间三维坐标。所以z坐标的真实值可以通过层数与切割时每层实际距离的乘积来得到,而x,y坐标的真实值需要通过图像采集设备的靶面分辨率标定试验来得到。The spatial three-dimensional coordinate acquisition module 33 is connected with the image segmentation and extraction module 32 and the three-dimensional volume reconstruction module 34; wherein, the above-mentioned image segmentation and extraction module 32 is only for the relevant features in each two-dimensional tomographic color image Points are segmented and extracted. Next, it is necessary to generate corresponding three-dimensional coordinates for the segmented and extracted two-dimensional tomographic color images, and then send the generated three-dimensional coordinates to the three-dimensional volume reconstruction module 34 . Therefore, in the first embodiment, specifically: the spatial three-dimensional coordinate acquisition module 33 generates three-dimensional coordinates for each point in each two-dimensional tomographic feature image, and the spatial three-dimensional coordinate acquisition module 33 can generate the three-dimensional coordinates according to the three-dimensional coordinates of each point The three-dimensional coordinates of the measured object in space. The above constitutes the point cloud image of the three-dimensional coordinates of the measured object. Specifically, each point generates three-dimensional coordinates, and the x and y coordinate units of each point are pixels, and the z coordinate unit is the number of layers, so all must be converted into the international system of units before the three-dimensional coordinates of the measured object can be generated. . Therefore, the true value of the z coordinate can be obtained by multiplying the number of layers and the actual distance of each layer during cutting, while the true value of the x and y coordinates needs to be obtained through the target surface resolution calibration test of the image acquisition device.

所述三维体重建模块34,与空间三维坐标获取模块33相连;三维体重建模块34将空间三维坐标获取模块33形成的空间三维坐标的点云图中,每个点临近的三个点相连,组成一个三角面(或称小平面),将这些三角面组合,形成一个闭合的区域面模型,然后将该区域面模型转换成包含有被测物体的三维内部结构体模型并生成与目前主流三维程序兼容的数据格式。The three-dimensional body reconstruction module 34 is connected with the three-dimensional space coordinate acquisition module 33; the three-dimensional body reconstruction module 34 connects three points adjacent to each point in the point cloud diagram of the space three-dimensional coordinates formed by the space three-dimensional coordinate acquisition module 33, forming A triangular surface (or small plane), these triangular surfaces are combined to form a closed area surface model, and then the area surface model is converted into a 3D internal structure model containing the measured object and generated with the current mainstream 3D program Compatible data formats.

上述实施例中包括安装步骤仅仅作为参考,对于本领域技术人员来说,其实施的先后逻辑关系可以根据实际需要进行变化,这里不再一一列举。The installation steps included in the above-mentioned embodiments are only for reference. For those skilled in the art, the logical relationship of the implementation may be changed according to actual needs, and will not be listed here.

以下,用具体操作的实施例对本实用新型的小型切片式三维结构重构系统进行详细说明。Hereinafter, the small-scale sliced three-dimensional structure reconstruction system of the present invention will be described in detail with specific operation examples.

如图7所示,以花岗岩材料为例,当研究其细观结构对材料力学性能影响时,常常需要知道其内部矿物及细观缺陷的三维结构图。为得到其内部三维结构图,可将所研究的花岗岩材料加工成直径在2~6cm的圆柱试件,然后将该花岗岩圆柱试件装入本实用新型所述的小型切片式三维结构重构系统中升降台232的夹具235中。假如切片的厚度为1mm,切片100片,可通过控制器1设置所需切片的厚度d为1mm,切片的总数设置为100,并通过控制器1设置图像处理单元3所采集的图像的采集模式为触发采集;结合图1所示,具体实施步骤如下:As shown in Figure 7, taking the granite material as an example, when studying the influence of its mesostructure on the mechanical properties of the material, it is often necessary to know the three-dimensional structure diagram of its internal minerals and mesoscopic defects. In order to obtain its internal three-dimensional structure diagram, the studied granite material can be processed into a cylindrical specimen with a diameter of 2 to 6 cm, and then the granite cylindrical specimen is loaded into the small slice type three-dimensional structure reconstruction system described in the present invention In the clamp 235 of the middle lifting platform 232. If the thickness of the slice is 1 mm and there are 100 slices, the thickness d of the required slice can be set to 1 mm by the controller 1, the total number of slices can be set to 100, and the acquisition mode of the image collected by the image processing unit 3 can be set by the controller 1 In order to trigger the acquisition; combined with that shown in Figure 1, the specific implementation steps are as follows:

一、将被测试的花岗岩圆柱试件安装在本实用新型的机械操作单元2中升降装置23上的夹具235内,升降装置23中的升降台232带动花岗岩圆柱试件向下移动,切片装置21对应的检测切割厚度的位移传感器211实时检测该花岗岩圆柱试件所需要切片的厚度是否达到1mm,如达到则指示切片装置21进行切割;One, the tested granite cylinder test piece is installed in the fixture 235 on the lifting device 23 in the mechanical operation unit 2 of the present utility model, and the lifting platform 232 in the lifting device 23 drives the granite cylindrical test piece to move downward, and the slicing device 21 The corresponding displacement sensor 211 for detecting the cutting thickness detects in real time whether the required slice thickness of the granite cylindrical specimen reaches 1 mm, and if so, instructs the slicing device 21 to cut;

二、控制器1实时监测切割厚度的位移传感器211的读数,如监测到读数为零,则认为该轮切片结束,关闭切片装置并将升降装置23上升一定的距离;Two, the controller 1 monitors the reading of the displacement sensor 211 of the cutting thickness in real time. If the reading is zero, it is considered that the round of slicing is over, and the slicing device is closed and the lifting device 23 is raised by a certain distance;

三、所述升降装置23中的夹具235夹持切割后的花岗岩,通过水平传送装置22将该切割后的花岗岩传送到水槽(这里将清洗装置24设置为水槽)。与水槽对应位置上的接近传感器26监测到升降装置23到达时,发出一开关信号,控制器1收到此信号后将水槽打开,升降装置23将该切割后的花岗岩放入水槽中进行清洗;3. The clamp 235 in the lifting device 23 clamps the cut granite, and the cut granite is conveyed to the water tank through the horizontal conveying device 22 (here the cleaning device 24 is set as a water tank). When the proximity sensor 26 on the position corresponding to the water tank detects that the lifting device 23 arrives, it sends a switch signal, and the controller 1 opens the water tank after receiving this signal, and the lifting device 23 puts the cut granite into the water tank for cleaning;

四、清洗完成后,根据控制器1的指示,升降装置23携带清洗后的花岗岩移至烘干装置25,烘干装置25对该切割后的花岗岩进行烘干处理;4. After the cleaning is completed, according to the instructions of the controller 1, the lifting device 23 carries the cleaned granite and moves to the drying device 25, and the drying device 25 performs drying treatment on the cut granite;

五、烘干完成后,升降装置23携带烘干后的花岗岩移至图像处理单元3,图像处理单元3对该切割后的花岗岩表面进行图像采集,并将采集后的彩色图像数据进行处理并储存。5. After the drying is completed, the lifting device 23 carries the dried granite to the image processing unit 3, and the image processing unit 3 collects images of the cut granite surface, processes and stores the collected color image data .

六、升降装置23通过水平传送装置22回复到切片装置21处并开始下一轮的切割。如此循环,直至切片的总数为100。切片结束。切片结束后,图像处理单元3将之前采集的100幅二维断层图像进行三维重构,可获得所研究花岗岩的三维内部结构模型。三维内部结构模型获取后,研究人员就可进行后续的力学分析。当然,还可以,以附图8所示的苹果为例,对其进行切片处理,得到其内部相关组织的三维结构图,基于此三维结构图可进行大量深入的生物学分析。6. The lifting device 23 returns to the slicing device 21 through the horizontal conveying device 22 and starts the next round of cutting. This loops until the total number of slices reaches 100. Slicing is over. After slicing, the image processing unit 3 performs three-dimensional reconstruction on the 100 previously collected two-dimensional tomographic images to obtain a three-dimensional internal structure model of the studied granite. After the three-dimensional internal structure model is obtained, researchers can carry out subsequent mechanical analysis. Of course, it is also possible to take the apple shown in Figure 8 as an example, and slice it to obtain a three-dimensional structure diagram of relevant internal tissues. Based on this three-dimensional structure diagram, a large number of in-depth biological analyzes can be performed.

本实用新型还可以引入改进型的控制算法和高精度的实时监控系统,具体就是采用闭环改进型PID控制方法,此方法主要控制两个驱动电机的精密运转,来确保小型切片式三维结构重构系统的每一次操作都快速而精准。The utility model can also introduce an improved control algorithm and a high-precision real-time monitoring system. Specifically, it adopts a closed-loop improved PID control method. This method mainly controls the precise operation of the two driving motors to ensure the reconstruction of the small sliced three-dimensional structure. Every operation of the system is fast and precise.

与现有的常规CT三维重构技术相比,本实用新型所述的小型切片式三维结构重构系统,除了有对被测物体损坏的劣势,但其在三维重构的精度和分辨率上,以及设备小型化和低成本化方面具有常规CT无法比拟的优势。本实用新型可在一个普通的小工作台上运行,切片的精度可高达0.02mm,三维建模x,y方向的精度与所选图像采集设备的分辨率有关,所选图像采集设备的分辨率越高,则所建立三维模型的精度越高。本实用新型制作成本可控制在5万元以内。因此本实用新型适用于某些特殊的检测领域应用,并适于向小型科研教学单位推广。Compared with the existing conventional CT three-dimensional reconstruction technology, the small slice type three-dimensional structure reconstruction system described in the utility model has the disadvantage of damage to the measured object, but its accuracy and resolution of the three-dimensional reconstruction , as well as equipment miniaturization and cost reduction have advantages that conventional CT cannot match. The utility model can run on an ordinary small workbench, and the precision of slicing can be as high as 0.02mm. The higher the value, the higher the accuracy of the established 3D model. The manufacturing cost of the utility model can be controlled within 50,000 yuan. Therefore, the utility model is suitable for application in some special detection fields, and is suitable for promotion to small scientific research and teaching units.

当然,本实用新型还可有其他多种实施例,在不背离本实用新型精神及其实质的情况下,熟悉本领域的技术人员可根据本实用新型做出各种相应的改变和变形,但这些相应的改变和变形都应属于本实用新型所附的权利要求的保护范围。Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.

Claims (10)

1.一种小型切片式三维结构重构系统,其特征在于:1. A small slice type three-dimensional structure reconstruction system, characterized in that: 该系统包括:控制器、机械操作单元和图像处理单元;The system includes: a controller, a mechanical operation unit and an image processing unit; 其中,所述控制器分别与所述机械操作单元和图像处理单元相连;所述机械操作单元内设有由所述控制器控制的切片装置;所述控制器控制所述机械操作单元内的所述切片装置并对其进行操作,并控制所述图像处理单元进行图像采集、处理后生成三维内部结构模型。Wherein, the controller is respectively connected with the mechanical operation unit and the image processing unit; the mechanical operation unit is provided with a slicing device controlled by the controller; the controller controls all the mechanical operation units in the mechanical operation unit. and operate the slicing device, and control the image processing unit to collect and process images to generate a three-dimensional internal structure model. 2.如权利要求1所述的小型切片式三维结构重构系统,其特征在于:2. The small slice type three-dimensional structure reconstruction system as claimed in claim 1, characterized in that: 所述机械操作单元包括:切片装置、水平传送装置、升降装置、清洗装置和烘干装置,其中:The mechanical operation unit includes: a slicing device, a horizontal conveying device, a lifting device, a cleaning device and a drying device, wherein: 所述水平传送装置的一水平侧面设置有所述切片装置、升降装置、清洗装置和烘干装置;A horizontal side of the horizontal conveying device is provided with the slicing device, lifting device, cleaning device and drying device; 在所述水平传送装置的另外一水平侧面与所述切片装置、清洗装置、烘干装置和图像处理单元所对应的位置分别设置有接近传感器。Proximity sensors are respectively provided at positions corresponding to the slicing device, the cleaning device, the drying device and the image processing unit on the other horizontal side of the horizontal conveying device. 3.如权利要求2所述的小型切片式三维结构重构系统,其特征在于:3. The small slice type three-dimensional structure reconstruction system as claimed in claim 2, characterized in that: 在所述水平传送装置的另外一水平侧面上分别对应所述切片装置、清洗装置、烘干装置的位置设置的接近传感器为电感式接近传感器。The proximity sensors provided on the other horizontal side of the horizontal conveying device respectively corresponding to the positions of the slicing device, the cleaning device and the drying device are inductive proximity sensors. 4.如权利要求2所述的小型切片式三维结构重构系统,其特征在于:4. The small slice type three-dimensional structure reconstruction system as claimed in claim 2, characterized in that: 在所述水平传送装置的另外一水平侧面上对应所述图像处理单元的位置设置的接近传感器为光电开关接近传感器。The proximity sensor disposed corresponding to the position of the image processing unit on the other horizontal side of the horizontal transfer device is a photoelectric switch proximity sensor. 5.如权利要求2所述的小型切片式三维结构重构系统,其特征在于:5. The small slice type three-dimensional structure reconstruction system as claimed in claim 2, characterized in that: 所述切片装置里还设置有检测切割厚度的位移传感器。A displacement sensor for detecting cutting thickness is also arranged in the slicing device. 6.如权利要求2所述的小型切片式三维结构重构系统,其特征在于:6. The small slice type three-dimensional structure reconstruction system as claimed in claim 2, characterized in that: 所述升降装置包括:支架、升降台、升降丝杠、升降驱动电机和夹具;其中,The lifting device includes: a bracket, a lifting platform, a lifting screw, a lifting drive motor and a fixture; wherein, 所述支架为长方框结构,长方框内部垂直设置有升降台;所述升降台通过支架内设置的所述升降丝杠进行升降;所述升降驱动电机设置在支架的垂直上方;所述夹具设置在所述升降台上,且所述支架、升降台、升降丝杠、升降驱动电机和夹具之间保持在一条垂直直线上。The support is a rectangular frame structure, and a lifting platform is vertically arranged inside the rectangular frame; the lifting platform is lifted and lowered by the lifting screw provided in the support; the lifting drive motor is arranged vertically above the support; The clamp is arranged on the lifting platform, and the support, the lifting platform, the lifting screw, the lifting drive motor and the clamp are kept on a vertical straight line. 7.如权利要求6所述的小型切片式三维结构重构系统,其特征在于:7. The small slice type three-dimensional structure reconstruction system as claimed in claim 6, characterized in that: 所述支架包括:底座、上支撑板和竖直导轨;其中,The support includes: a base, an upper support plate and a vertical guide rail; wherein, 所述支架内部在所述底座和上支撑板之间设置有两根竖直导轨,且所述升降台设置在两根竖直导轨之间,所述升降驱动电机设置在上支撑板的垂直上方。Two vertical guide rails are arranged inside the bracket between the base and the upper support plate, and the lifting platform is arranged between the two vertical guide rails, and the lifting drive motor is arranged vertically above the upper support plate . 8.如权利要求7所述的小型切片式三维结构重构系统,其特征在于:8. The small slice type three-dimensional structure reconstruction system as claimed in claim 7, characterized in that: 所述夹具,包括夹具体、安装板、固定块、活动块、导向轴、直线轴承、调节螺钉、弹簧和弹簧压板;其中,The clamp includes a clamp body, a mounting plate, a fixed block, a movable block, a guide shaft, a linear bearing, an adjusting screw, a spring, and a spring pressure plate; wherein, 所述导向轴一端固定在所述安装板上,另一端安装在所述固定块上;所述安装板与固定块之间的导向轴上安装有带有所述夹具体的活动块;所述活动块与导向轴通过所述直线轴承连接,所述导向轴上还套设有所述弹簧;所述弹簧与安装板之间设有所述弹簧压板,所述弹簧压板与安装板之间通过至少一个调节螺钉连接。One end of the guide shaft is fixed on the mounting plate, and the other end is mounted on the fixed block; a movable block with the clamp body is installed on the guide shaft between the mounting plate and the fixed block; The movable block is connected with the guide shaft through the linear bearing, and the spring is also sleeved on the guide shaft; the spring pressing plate is arranged between the spring and the mounting plate, and the spring pressing plate and the mounting plate are passed through At least one adjusting screw connection. 9.如权利要求2所述的小型切片式三维结构重构系统,其特征在于:9. The small slice type three-dimensional structure reconstruction system as claimed in claim 2, characterized in that: 所述水平传送装置包括:水平导轨和水平驱动丝杠;所述水平驱动丝杠和所述水平导轨形成所述水平传送装置。The horizontal transmission device includes: a horizontal guide rail and a horizontal driving screw; the horizontal driving screw and the horizontal guide rail form the horizontal transmission device. 10.如权利要求1至9中任一所述的小型切片式三维结构重构系统,其特征在于:10. The small slice type three-dimensional structure reconstruction system according to any one of claims 1 to 9, characterized in that: 所述图像处理单元包括:图像采集模块、图像分割及提取模块、空间三维坐标获取模块和三维体重建模块,其中:The image processing unit includes: an image acquisition module, an image segmentation and extraction module, a spatial three-dimensional coordinate acquisition module and a three-dimensional volume reconstruction module, wherein: 所述图像采集模块,与所述图像分割及提取模块相连,接收所述控制器发送的控制信号并进行图像采集,然后将采集的二维断层彩色图像发送给所述图像分割及提取模块;The image acquisition module is connected to the image segmentation and extraction module, receives the control signal sent by the controller and performs image acquisition, and then sends the acquired two-dimensional tomographic color image to the image segmentation and extraction module; 所述图像分割及提取模块,与所述图像采集模块和空间三维坐标获取模块相连,接收所述图像采集模块发送的二维断层彩色图像,对每幅二维断层彩色图像中各种不同颜色进行分割和提取,并将分割和提取后的每幅二维断层彩色图像发送给所述空间三维坐标获取模块;The image segmentation and extraction module is connected to the image acquisition module and the spatial three-dimensional coordinate acquisition module, receives the two-dimensional tomographic color image sent by the image acquisition module, and performs various color corrections on each two-dimensional tomographic color image. segmenting and extracting, and sending each segmented and extracted two-dimensional tomographic color image to the spatial three-dimensional coordinate acquisition module; 所述空间三维坐标获取模块,与所述图像分割及提取模块和三维体重建模块相连,生成每幅二维断层彩色图像中各点和边界的三维坐标,然后发送给所述三维体重建模块;The spatial three-dimensional coordinate acquisition module is connected to the image segmentation and extraction module and the three-dimensional volume reconstruction module to generate the three-dimensional coordinates of each point and boundary in each two-dimensional tomographic color image, and then send it to the three-dimensional volume reconstruction module; 所述三维体重建模块,与所述空间三维坐标获取模块相连,将三维坐标转换成为一个闭合的曲面模型,在该曲面模型上生成一个三维内部结构的体模型,然后转换成数据格式输出。The 3D body reconstruction module is connected with the space 3D coordinate acquisition module, converts the 3D coordinates into a closed surface model, generates a 3D internal structure volume model on the surface model, and then converts it into a data format for output.
CN2011200269109U 2011-01-26 2011-01-26 Small-sized slicing-type three-dimensional structure reconstruction system Expired - Lifetime CN201983768U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200269109U CN201983768U (en) 2011-01-26 2011-01-26 Small-sized slicing-type three-dimensional structure reconstruction system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200269109U CN201983768U (en) 2011-01-26 2011-01-26 Small-sized slicing-type three-dimensional structure reconstruction system

Publications (1)

Publication Number Publication Date
CN201983768U true CN201983768U (en) 2011-09-21

Family

ID=44611227

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011200269109U Expired - Lifetime CN201983768U (en) 2011-01-26 2011-01-26 Small-sized slicing-type three-dimensional structure reconstruction system

Country Status (1)

Country Link
CN (1) CN201983768U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102175175A (en) * 2011-01-26 2011-09-07 中国地震局地质研究所 Small slice type three-dimensional structure reconstruction system
CN107063106A (en) * 2017-03-29 2017-08-18 嘉善永金金属制品有限公司 A kind of material detection device
CN110487789A (en) * 2019-08-12 2019-11-22 中国矿业大学(北京) Rock mesostructure three-dimensional reconstruction system and method based on grinding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102175175A (en) * 2011-01-26 2011-09-07 中国地震局地质研究所 Small slice type three-dimensional structure reconstruction system
CN107063106A (en) * 2017-03-29 2017-08-18 嘉善永金金属制品有限公司 A kind of material detection device
CN110487789A (en) * 2019-08-12 2019-11-22 中国矿业大学(北京) Rock mesostructure three-dimensional reconstruction system and method based on grinding device

Similar Documents

Publication Publication Date Title
CN102175175B (en) Small slice type three-dimensional structure reconstruction system
CN104111260B (en) Ceramic Tiles non-destructive detecting device and detection method
WO2018049818A1 (en) Three-dimensional measurement technology-based system and method for measuring surface area of object
CN213239979U (en) Industry CT check out test set
CN205720055U (en) The internal carrying out flaw detection device of a kind of concrete ray
CN202614710U (en) Energized conductor flaw detection device based on three-dimensional micrometric displacement mobile platform
CN106017325A (en) Improved non-contact optical measurement method for complex surface and irregular object volume
CN108917597A (en) Mobile phone center detection device based on 3D vision
CN110230981B (en) Size detection system and size detection method for large-size parts
CN106052586A (en) Stone big board surface contour dimension obtaining system and method based on machine vision
CN201983768U (en) Small-sized slicing-type three-dimensional structure reconstruction system
CN209640237U (en) Optical detection apparatus
CN105910553A (en) A detector for detecting a plane and a method for detecting the same
CN108489394A (en) A kind of large-scale sheet metal works almost T-stable automatic detection device and method
CN207952024U (en) A kind of axial workpiece detection screening installation
CN202994091U (en) A Calibration Plate Accuracy Detector
CN104061881B (en) Optical device and optical measuring method for observing and analyzing actual contact area of contact points
CN210572137U (en) Manual-automatic integrated air coupling ultrasonic scanning device
CN211426334U (en) Medical radiological image die body measurement standard device
CN111578850B (en) A measuring method for visually measuring the thickness of pile fabrics
CN214660775U (en) Water pump appearance detection system
CN213580627U (en) Semi-automatic detection device for rubber sealing ring
CN110487789B (en) Rock microscopic structure three-dimensional reconstruction system and method based on grinding sheet device
CN211825732U (en) Non-contact film pressing backlight panel detection device and backlight panel automatic detection line
CN207123260U (en) A kind of secondary element image measures tool

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20110921

Effective date of abandoning: 20130227

RGAV Abandon patent right to avoid regrant