CN201955313U - Device for measuring shrinkage rate and dielectric constant of LTCC - Google Patents
Device for measuring shrinkage rate and dielectric constant of LTCC Download PDFInfo
- Publication number
- CN201955313U CN201955313U CN2011200892138U CN201120089213U CN201955313U CN 201955313 U CN201955313 U CN 201955313U CN 2011200892138 U CN2011200892138 U CN 2011200892138U CN 201120089213 U CN201120089213 U CN 201120089213U CN 201955313 U CN201955313 U CN 201955313U
- Authority
- CN
- China
- Prior art keywords
- ltcc
- microwave
- ltcc substrate
- inductive capacity
- specific inductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
The utility model provides a device for measuring shrinkage rate and dielectric constant of low temperature co-fired ceramic (LTCC). The device comprises an LTCC substrate and a microwave circuit arranged on the LTCC substrate, wherein the microwave circuit comprises two microwave resonance circuits with the same structure and different sizes, and each microwave resonance circuit comprises a circular micro-strip ring resonator and a micro-strip transmission line matched with the circular micro-strip ring resonator. When the resonance frequency phase is measured and simulated, the dielectric constant and the circuit size parameter used in simulation are equal to the actual dielectric constant and the actual circuit size of the LTCC substrate material, and meanwhile, the shrinkage rate and the dielectric constant of the LTCC substrate material can be simultaneously measured.
Description
Technical field
The utility model relates to the measurement mechanism of a kind of LTCC, especially a kind of device of measuring LTCC shrinkage factor and specific inductive capacity.
Background technology
LTCC(Low Temperature Co-Fired Ceramic, LTCC) in sintering process, can produce shrinkage phenomenon.When LTCC is used as microwave base plate, in order to guarantee electric property, must know the shrinkage factor of LTCC, so that in design process, revised.When designing the microwave circuit based on ltcc substrate in addition, also need to know the specific inductive capacity of LTCC.Usually the method for measuring the LTCC shrinkage factor is to use the X-ray apparatus perspective to measure, and this method needs Special Equipment, apparatus expensive and requirement of shelter is arranged, and also effect neither be fine; Measuring the material dielectric constant method has Transmission line method, standing wave method or the like, and these methods have ask for something to the form of material sample, not necessarily are fit to the actual LTCC microwave base plate that uses.
Summary of the invention
Technical matters to be solved of the present utility model is the device that proposes a kind of LTCC of measurement shrinkage factor and specific inductive capacity, can measure shrinkage factor and the specific inductive capacity of LTCC simultaneously, also is particularly suitable for measuring the shrinkage factor and the specific inductive capacity of LTCC microwave base plate.
The utility model is for realizing that above-mentioned utility model purpose adopts following technical scheme:
A kind of device that is used to measure LTCC shrinkage factor and specific inductive capacity comprises ltcc substrate and is arranged on microwave circuit on the ltcc substrate; Wherein, described microwave circuit comprises two microwave resonator circuits that structure is identical, size is different, and described each microwave resonator circuits comprises circular microstrip ring resonator and the T type microstrip transmission line that matches with it.
Further, the device that is used to measure LTCC shrinkage factor and specific inductive capacity of the present utility model, one end of described T shaped microstrip transmission line is as the input/output port of pairing microwave resonator circuits, and the other end is parallel with the annulus limit of the circular microstrip ring resonator that is cooperated and leave the space.
Further, the device that is used to measure LTCC shrinkage factor and specific inductive capacity of the present utility model is respectively arranged with the disturbance mouth that its parity mode is effectively separated on each described circular microstrip ring resonator.
Further, the device that is used to measure LTCC shrinkage factor and specific inductive capacity of the present utility model, the resonance frequency difference of two microwave resonator circuits in the microwave circuit, this is for fear of the situation of separating that specific inductive capacity and shrinkage factor occur more.
The utility model adopts technique scheme to have following beneficial effect:
Can measure the shrinkage factor and the specific inductive capacity of ltcc substrate material simultaneously, introduce the electromagnetic distu theory, make that measurement is more accurate.
Description of drawings:
Fig. 1 is a structural representation of the present utility model.
Number in the figure: 1-LTCC substrate, 2,3-resonant circuit, 4, the circular microstrip ring resonator of 7-resonant circuit, 10, disturbance type breach on the 11-resonator, 5, the T shape input and output microstrip line of 8-resonant circuit, 6, the T shape input and output microstrip line of 9-resonant circuit and the coupling slit between the circular microstrip ring resonator.
Specific embodiments:
Be described in further detail below in conjunction with the enforcement of accompanying drawing technical scheme:
The embodiment that the utility model adopted is: ltcc substrate shrinkage factor and dielectric constant measuring apparatus comprise: the microwave circuit on ltcc substrate and the ltcc substrate, wherein: the one side of ltcc substrate is a metal ground plane, and microwave circuit in the another side etching of ltcc substrate; Microwave circuit comprises two microwave resonator circuits that version is similar, and these two resonant circuit each several part physical dimension differences, both resonance frequencies are also different; Each microwave resonator circuits is made up of circular microstrip ring resonator and two input and output microstrip transmission lines; Input and output microstrip transmission line shape is a T shape, one end of each T shape input and output microstrip transmission line is as the input/output port of resonant circuit, the other end is then parallel with a limit of circular microstrip ring resonator, and the electromagnetic energy coupling is carried out in the slit of passing through of T shape input and output microstrip transmission line and circular microstrip ring resonator.It is characterized in that on resonant ring, introducing the disturbance of particular design, the parity mode of circuited microstrip loop resonator is separated effectively, make T shape input and output microstrip transmission line 5 or 8 and circular microstrip ring resonator 4 or 7 between carry out the coupling of better electromagnetic energy by slit 6 or 9.
The principle that the measuring method of the utility model device is determined by circuit structure size and baseplate material specific inductive capacity and substrate thickness according to the resonance frequency of microwave resonator circuits.The physical dimension of the resonance frequency of the microwave resonator circuits on the ltcc substrate and circular microstrip ring resonator and input and output microstrip transmission line is relevant with the specific inductive capacity of ltcc substrate thickness and baseplate material, these parameters have been arranged, just can use the Electromagnetic Simulation computed in software to obtain the resonance frequency of this microwave resonator circuits; Also can directly obtain the resonance frequency of this resonant circuit on the other hand with the method for the actual ltcc substrate microwave resonator circuits behind the measurement sintering.If the resonance frequency that simulation software calculates is the same with the resonance frequency that measures, employed specific inductive capacity is exactly the specific inductive capacity of actual ltcc substrate material behind the sintering during simulation calculation resonance frequency so, and the dimensional parameters of employed resonant circuit each several part structure is exactly the dimensional parameters of the each several part structure of microwave resonator circuits correspondence on the actual ltcc substrate behind the sintering during same simulation calculation resonance frequency.Because the size of setting when the size of the microwave resonator circuits each several part before the sintering on the actual ltcc substrate is plate-making, these sizes all are known, we have just had before the microwave resonator circuits sintering on the actual ltcc substrate and the dimensional parameters of the each several part behind the sintering like this, the size numerical value of microwave resonator circuits structure division before sintering deducts the dimension difference that the size numerical value of relevant position behind the sintering must arrive this part structure on the ltcc substrate, this dimension difference divided by sintering before the size numerical value of this part-structure must arrive the shrinkage factor of this part-structure.
Structurally, the device of measurement LTCC shrinkage factor of the present utility model and specific inductive capacity comprises the microwave circuit on ltcc substrate and the ltcc substrate, and wherein: the one side of ltcc substrate is a metal ground plane, and microwave circuit is etched in the another side of ltcc substrate.Microwave circuit comprises two microwave resonator circuits that version is similar.Each microwave resonator circuits is made up of circular microstrip ring resonator and two input and output microstrip transmission line ports, and the circular microstrip ring resonator size of one of them resonant circuit is less than the circular microstrip ring resonator size of another resonant circuit.Each input and output microstrip transmission line shape all is a T shape, one end of each T shape input and output microstrip transmission line is as the input/output port of resonant circuit, the impedance of the microstrip line of this port is made as 50 ohm, and the T shape input and output microstrip transmission line other end is then parallel with a limit of circular microstrip ring resonator.And change the disturbance breach that is carved with particular design at each resonance.
On making, two microwave resonator circuits all are produced on the same substrate, and baseplate material is LTCC; Can adopt the metallic pattern on the common LTCC circuit board technology making substrate; For reducing loss, can be gold-plated on the metal of ltcc substrate; Can determine the overall circumference of two circular microstrip ring resonator annular conduction bands respectively according to needed frequency of operation, make the resonance frequency of a resonant circuit be higher than frequency of operation, and the resonance frequency of another resonant circuit be lower than frequency of operation.
When measuring, at first use the resonance frequency of two microwave resonator circuits on the ltcc substrate after vector network analyzer is measured sintering respectively; Use Electromagnetic Simulation software then, HFSS as Ansoft, the parameters such as specific inductive capacity that the parameters of structural dimension of the ltcc substrate microwave resonator circuits of setting with when plate-making before the sintering and ltcc substrate thickness and baseplate material are estimated are initial value, calculate the resonance frequency of two microwave resonator circuits respectively, then adjust specific inductive capacity and adjust these parameters of structural dimension, make the resonance frequency of these two microwave resonator circuits that simulation calculation obtains equal the measured value of these two microwave resonator circuits resonance frequencies with shrinkage factor; At this time the shrinkage factor of simulation calculation use is exactly the shrinkage factor of LTCC sintering, the specific inductive capacity that simulation calculation is used is exactly the specific inductive capacity of ltcc substrate material, and the microwave resonator circuits each several part parameters of structural dimension that simulation calculation is used is exactly the ltcc substrate microwave resonator circuits each several part parameters of structural dimension behind the sintering.
According to the above, just can realize the utility model.
Claims (4)
1. device that is used to measure LTCC shrinkage factor and specific inductive capacity is characterized in that: comprise ltcc substrate and be arranged on microwave circuit on the ltcc substrate; Wherein, described microwave circuit comprises two microwave resonator circuits that structure is identical, size is different, and described each microwave resonator circuits comprises circular microstrip ring resonator and the T type microstrip transmission line that matches with it.
2. the device that is used to measure LTCC shrinkage factor and specific inductive capacity according to claim 1, it is characterized in that: an end of described T shaped microstrip transmission line is as the input/output port of pairing microwave resonator circuits, and the other end is parallel with the annulus limit of the circular microstrip ring resonator that is cooperated and leave the space.
3. the device that is used to measure LTCC shrinkage factor and specific inductive capacity according to claim 1 is characterized in that: be respectively arranged with the disturbance mouth that its parity mode is effectively separated on each described circular microstrip ring resonator.
4. the device that is used to measure LTCC shrinkage factor and specific inductive capacity according to claim 1 is characterized in that: the resonance frequency difference of two microwave resonator circuits in the described microwave circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200892138U CN201955313U (en) | 2011-03-30 | 2011-03-30 | Device for measuring shrinkage rate and dielectric constant of LTCC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200892138U CN201955313U (en) | 2011-03-30 | 2011-03-30 | Device for measuring shrinkage rate and dielectric constant of LTCC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201955313U true CN201955313U (en) | 2011-08-31 |
Family
ID=44499421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200892138U Expired - Fee Related CN201955313U (en) | 2011-03-30 | 2011-03-30 | Device for measuring shrinkage rate and dielectric constant of LTCC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201955313U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102426299A (en) * | 2011-11-01 | 2012-04-25 | 电子科技大学 | Method for measuring effective dielectric constant of double-sided metal-foil-clad plate |
| CN102721707A (en) * | 2011-03-30 | 2012-10-10 | 南京邮电大学 | Device for measuring LTCC shrinkage and dielectric constant |
-
2011
- 2011-03-30 CN CN2011200892138U patent/CN201955313U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102721707A (en) * | 2011-03-30 | 2012-10-10 | 南京邮电大学 | Device for measuring LTCC shrinkage and dielectric constant |
| CN102426299A (en) * | 2011-11-01 | 2012-04-25 | 电子科技大学 | Method for measuring effective dielectric constant of double-sided metal-foil-clad plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102004121B (en) | Device and method for measuring ceramic contractibility rate and dielectric constant | |
| Li et al. | Full W-band waveguide-to-microstrip transition with new E-plane probe | |
| Letavin | Compact crossover based on low-pass filters | |
| CN202019043U (en) | Substrate integrated waveguide filter with steep sideband characteristic | |
| CN102721707B (en) | Device for measuring LTCC shrinkage and dielectric constant | |
| CN104865449A (en) | Dielectric substrate measurement apparatus based on multi-resonant waveguide substrate integration vibration cavity method and method thereof | |
| CN204289663U (en) | A kind of millimeter wave filter adopting frequency selectivity coupling to carry out Fundamental wave suppression | |
| CN104849680B (en) | The measuring method of the magnetic ferrite magnetic core wideband relative permeability of integrated inductor | |
| Letavin et al. | Investigation of the frequency influence on the miniaturization efficiency of microstrip devices using LPFs | |
| CN104466308A (en) | Balanced dielectric filter and manufacturing method thereof | |
| CN201955313U (en) | Device for measuring shrinkage rate and dielectric constant of LTCC | |
| CN104241743A (en) | Millimeter wave filter adopting frequency selectivity coupling for suppressing fundamental waves | |
| CN202101949U (en) | Device for measuring shrinkage rate and permittivity of low temperature co-fired ceramics (LTCC) | |
| Liu et al. | Equivalent circuit model of crosstalk reduction parallel transmission lines with defected microstrip structures | |
| CN106684520B (en) | Multi-mode substrate integrated waveguide resonator for measuring electrical characteristics of PCB substrate and measuring method thereof | |
| CN201974389U (en) | Measuring device for low temperature co-fired ceramics | |
| CN102721708B (en) | Low-temperature co-sintering ceramic measuring device | |
| CN109301415B (en) | Ferrite semi-filled SIW circulator based on high dielectric ceramics and processing method | |
| Hu et al. | Micromachined terahertz waveguide band-pass filters | |
| CN203895577U (en) | Band pass filter based on one third equilateral triangle substrate integration waveguide | |
| Chen et al. | Wireless charging to multiple electronic devices simultaneously in enclosed box | |
| Kordiboroujeni et al. | Efficient mode-matching design of substrate-integrated waveguide filters | |
| Kumar et al. | Formulation of size reduction technique in microstrip circuits by using DGS and DMS | |
| TWI496344B (en) | Multiband branch power splitter | |
| Chen et al. | Low cost octave directional coupler based on substrate integrated coaxial line (SICL) technique |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110831 Termination date: 20140330 |