CN201941045U - Flushing device used after wire breaking during cutting of silicon wafers - Google Patents

Flushing device used after wire breaking during cutting of silicon wafers Download PDF

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Publication number
CN201941045U
CN201941045U CN2010206451219U CN201020645121U CN201941045U CN 201941045 U CN201941045 U CN 201941045U CN 2010206451219 U CN2010206451219 U CN 2010206451219U CN 201020645121 U CN201020645121 U CN 201020645121U CN 201941045 U CN201941045 U CN 201941045U
Authority
CN
China
Prior art keywords
water
pipe
water tank
silicon chip
flushing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010206451219U
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Chinese (zh)
Inventor
张敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUZHOU JINGNENG ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
HUZHOU JINGNENG ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUZHOU JINGNENG ELECTRONIC TECHNOLOGY Co Ltd filed Critical HUZHOU JINGNENG ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN2010206451219U priority Critical patent/CN201941045U/en
Application granted granted Critical
Publication of CN201941045U publication Critical patent/CN201941045U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The utility model provides a flushing device used after wire breaking during cutting of silicon wafers, which comprises a water tank, a water pump and a water pipe, wherein the water pump, the water pipe and a water curtain spraying pipe connected with the water pipe are arranged on the water tank. The silicon wafers can be uniformly separated by the flushing device so as to facilitate repressing of wires, and accordingly the flushing device is high in success ration and acceptability ratio, simple in operation and high in work efficiency.

Description

A kind of flusher that is used for after the silicon chip cutting is broken
Technical field
The utility model relates to solar silicon wafers and makes the field, is specifically related to a kind of flusher that is used for after the silicon chip cutting is broken.
Background technology
Need use solar silicon wafers in the Application of Solar Energy field in the prior art, silicon chip utilizes steel wire cutting crystal bar to form.In the process of steel wire cutting, run into the situation of broken string through regular meeting; need line ball again,, just need flushing to make it scatter because the silicon chip of part moulding can stick together; but normally adopt the manual hydraulic pamp of taking to wash at present; current are inconsistent, and silicon chip is difficult to evenly scatter, and are unfavorable for line ball again; make that the success rate and the qualification rate of cutting are lower; and waste of manpower hand-manipulated, troublesome poeration, inefficiency.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of flusher that is used for after the silicon chip cutting is broken, and can make that silicon chip evenly scatters, and helps line ball again, the success rate and the qualification rate height that make cutting, and simple to operate, high efficiency.
For solving above-mentioned existing technical problem, the utility model adopts following scheme: a kind of flusher that is used for after the silicon chip cutting is broken, and comprise water tank, be located at water pump and water pipe on the water tank, described water tank is provided with the cascade jet pipe that is connected with water pipe.
As preferably, described water tank is provided with the induction lift cylinder, and described cascade jet pipe is located on the induction lift cylinder.The lifting of control cascade jet pipe makes silicon chip evenly scatter.
As preferably, described cascade jet pipe comprises the water inlet pipe that is connected with water pipe, the some sparge pipes that are connected isocon with water inlet pipe, are connected with isocon, and described sparge pipe is provided with some water jets.The current unanimity, it is more even to make silicon chip scatter.
As preferably, described water tank bottom is provided with pulley.Convenient transportation.
As preferably, described water tank is provided with pushing hands.Convenient transportation.
Beneficial effect:
The utility model adopts technique scheme that a kind of flusher that is used for after the silicon chip cutting is broken is provided, and can make that silicon chip evenly scatters, and helps line ball again, the success rate and the qualification rate height that make cutting, and simple to operate, high efficiency.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the structural representation of cascade jet pipe in the utility model.
The specific embodiment
As depicted in figs. 1 and 2, a kind of flusher that is used for after the silicon chip cutting is broken comprises water tank 1, is located at water pump 2 and water pipe 3 on the water tank 1, and described water tank 1 is provided with the cascade jet pipe 4 that is connected with water pipe 3.Described water tank 1 is provided with induction lift cylinder 5, and described cascade jet pipe 4 is located on the induction lift cylinder 5.Described cascade jet pipe 4 comprises the water inlet pipe 41 that is connected with water pipe 3, the some sparge pipes 43 that are connected isocon 42 with water inlet pipe 41, are connected with isocon 42, and described sparge pipe 43 is provided with some water jets 44.Described water tank 1 bottom is provided with pulley 6.Described water tank 1 is provided with pushing hands 7.During real work, the lifting of induction lift cylinder 5 control cascade jet pipes 4, cascade jet pipe 4 is by water jet 44 hydroblasting silicon chips, can make that silicon chip evenly scatters, help line ball again, the success rate and the qualification rate height that make cutting, and simple to operate, high efficiency.

Claims (5)

1. flusher that is used for behind the silicon chip cutting broken string, it is characterized in that: comprise water tank (1), be located at water pump (2) and water pipe (3) on the water tank (1), described water tank (1) is provided with the cascade jet pipe (4) that is connected with water pipe (3).
2. a kind of flusher that is used for after the silicon chip cutting is broken according to claim 1, it is characterized in that: described water tank (1) is provided with induction lift cylinder (5), and described cascade jet pipe (4) is located on the induction lift cylinder (5).
3. a kind of flusher that is used for after the silicon chip cutting is broken according to claim 1, it is characterized in that: described cascade jet pipe (4) comprises the water inlet pipe (41) that is connected with water pipe (3), the some sparge pipes (43) that are connected isocon (42) with water inlet pipe (41), are connected with isocon (42), and described sparge pipe (43) is provided with some water jets (44).
4. a kind of flusher that is used for after the silicon chip cutting is broken according to claim 1, it is characterized in that: described water tank (1) bottom is provided with pulley (6).
5. a kind of flusher that is used for after the silicon chip cutting is broken according to claim 1, it is characterized in that: described water tank (1) is provided with pushing hands (7).
CN2010206451219U 2010-12-03 2010-12-03 Flushing device used after wire breaking during cutting of silicon wafers Expired - Fee Related CN201941045U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206451219U CN201941045U (en) 2010-12-03 2010-12-03 Flushing device used after wire breaking during cutting of silicon wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206451219U CN201941045U (en) 2010-12-03 2010-12-03 Flushing device used after wire breaking during cutting of silicon wafers

Publications (1)

Publication Number Publication Date
CN201941045U true CN201941045U (en) 2011-08-24

Family

ID=44468396

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010206451219U Expired - Fee Related CN201941045U (en) 2010-12-03 2010-12-03 Flushing device used after wire breaking during cutting of silicon wafers

Country Status (1)

Country Link
CN (1) CN201941045U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102327879A (en) * 2011-10-09 2012-01-25 镇江大成新能源有限公司 Online flusher

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102327879A (en) * 2011-10-09 2012-01-25 镇江大成新能源有限公司 Online flusher

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110824

Termination date: 20121203