CN201928528U - Selective PCB (printed circuit board) wave soldering device - Google Patents
Selective PCB (printed circuit board) wave soldering device Download PDFInfo
- Publication number
- CN201928528U CN201928528U CN2010206435610U CN201020643561U CN201928528U CN 201928528 U CN201928528 U CN 201928528U CN 2010206435610 U CN2010206435610 U CN 2010206435610U CN 201020643561 U CN201020643561 U CN 201020643561U CN 201928528 U CN201928528 U CN 201928528U
- Authority
- CN
- China
- Prior art keywords
- scaling powder
- tin stove
- lifting
- guide rail
- chain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a selective PCB (printed circuit board) wave soldering device, which comprises a guide rail and an underframe. A chain claw is arranged on the guide rail, and a selective scaling powder coating component, a PCB preheating component, a selective wave soldering component and a PCB conveying component are mounted between the underframe and the guide rail. The selective PCB wave soldering device is capable of realizing continuous selective PCB wave soldering by the aid of intelligent control, and is simple in structure, convenient in use and convenient for popularization and application.
Description
Technical field
The utility model relates to a kind of welding equipment, particularly a kind of PCB selectivity wave soldering equipment.
Background technology
Along with the development of electronic product, because of the constraint of various functions and service condition, the element on the PCB presents diverse trends, whole through hole plug-in unit PCB are arranged, whole paster PCB are arranged, also have to insert to paste to load in mixture PCB, present technical process is that whole through hole plug-in unit PCB weld with crest welder; All paster PCB welds with reflow machine; Slotting subsides load in mixture PCB in two kinds of situation, and slotting subsides load in mixture element and weld mount components with the elder generation of one side with reflow machine at PCB, weld inserting element with crest welder again; Slotting subsides load in mixture element and do not weld mount components with the elder generation of one side with reflow machine at PCB, weld inserting element more by hand, because as welding inserting element with crest welder, can influence the mount components of welding.
The utility model content
The purpose of this utility model is to overcome above-mentioned deficiency of the prior art, and a kind of PCB selectivity wave soldering equipment is provided.A kind of PCB selectivity wave soldering equipment described in the utility model can be realized continuous PCB selectivity wave soldering by Based Intelligent Control.
For achieving the above object, the technical solution adopted in the utility model is: a kind of PCB selectivity wave soldering equipment, it is characterized in that: comprise guide rail and underframe, described guide rail is provided with the chain pawl, scaling powder selectivity applicator assembly is installed between described underframe and guide rail, the PCB preheating assembly, selectivity wave soldering assembly and PCB conveying assembly, described scaling powder selectivity applicator assembly comprises foam box, the foaming masterplate, the scaling powder case, the foaming pipe, the scaling powder elevating screw, scaling powder lifting screw, the scaling powder elevating chain, screw mandrel base one, scaling powder lifting sprocket wheel, the scaling powder lifting motor, motor sprocket one, scaling powder lifting crossbearer, described screw mandrel base one is installed on the underframe, described scaling powder elevating screw is installed on the underframe by screw mandrel base one, described scaling powder lifting screw is installed on the scaling powder elevating screw and with scaling powder lifting crossbearer and is fixed on the scaling powder elevating screw, described scaling powder case is installed on the scaling powder lifting crossbearer, described foam box is installed in the scaling powder case, described foaming pipe is installed on the foam box, described scaling powder lifting sprocket wheel is installed on the scaling powder elevating screw, described scaling powder elevating chain is installed on the scaling powder lifting sprocket wheel, described scaling powder lifting motor is arranged on the underframe and is positioned at the below of scaling powder elevating chain, and described motor sprocket one is connected with the scaling powder elevating chain; Described PCB preheating assembly comprises heating tube and preheating cabinet, and described preheating cabinet is installed on the underframe and is positioned at a side of foam box, and described heating tube is installed on the preheating cabinet; Described selectivity wave soldering assembly comprises the tin stove, electromagnetic pump, crest masterplate nozzle, screw mandrel base two, tin stove lifting screw, tin stove lifting motor, motor sprocket two, tin stove elevating chain, tin stove lifting crossbearer, tin stove lifting sprocket wheel, tin stove elevating screw and tin stove lifting motor, described screw mandrel base two is installed on the underframe, described tin stove elevating screw is installed on the underframe by screw mandrel base two, described tin stove lifting screw is installed on the tin stove elevating screw and with tin stove lifting crossbearer and is fixed on the tin stove elevating screw, described tin stove is installed on the tin stove lifting crossbearer, described crest masterplate nozzle is arranged on the tin stove, described electromagnetic pump is installed on the tin stove, described tin stove lifting sprocket wheel is installed on the tin stove elevating screw, described tin stove elevating chain is installed on the tin stove lifting sprocket wheel, described tin stove lifting motor is installed on the underframe and is positioned at the below of tin stove elevating chain, and described motor sprocket two is connected with tin stove elevating chain; The PCB conveying assembly comprises transducer one, the transportation motor, the transportation sprocket wheel, transducer two, delivery chain, rotating shaft, chain dog chain bar, guide rail transfers wide screw mandrel and guide rail to transfer wide chain, described transducer one is installed on the preheating cabinet and is positioned at the guide rail inboard, described transducer two is installed on the tin stove and is positioned at the guide rail inboard, described transportation motor is installed in the guide rail top, described rotating shaft is installed in the guide rail below, transportation sprocket wheel on the described transportation motor is connected with rotating shaft by delivery chain, described rotating shaft drives the chain pawl by chain dog chain bar and moves on guide rail, described guide rail is transferred wide screw mandrel to be two and to be movably arranged on the two ends of guide rail respectively, and described two guide rails transfer wide screw mandrel to transfer wide chain to connect by guide rail.
Above-mentioned a kind of PCB selectivity wave soldering equipment, described guide rail is transferred the end of wide screw mandrel to be provided with guide rail and is transferred wide handle.
Above-mentioned a kind of PCB selectivity wave soldering equipment, described rotating shaft is synchronous square axis.
Above-mentioned a kind of PCB selectivity wave soldering equipment, described heating tube is an infrared heating pipe.
The utility model compared with prior art has the following advantages: a kind of PCB selectivity wave soldering equipment described in the utility model can be realized continuous PCB selectivity wave soldering by Based Intelligent Control.Solve to insert to paste and load in mixture element not in the manual welding problem of PCB with one side.Earlier weld mount components, again with PCB selectivity wave soldering equipment welding inserting element with reflow machine.It is simple in structure, easy to use, and is easy to utilize.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Description of drawings
Fig. 1 is a main TV structure schematic diagram of the present utility model.
Fig. 2 is a plan structure schematic diagram of the present utility model.
Description of reference numerals:
1-chain pawl; The 2-guide rail; The 3-foam box;
The 4-masterplate that foams; 5-transducer one; The 6-heating tube;
The 7-preheating cabinet; 8-tin stove; The 9-electromagnetic pump;
10-crest masterplate nozzle; 11-transports motor; 12-transports sprocket wheel;
13-transducer two; The 14-delivery chain; The 15-rotating shaft;
16-scaling powder case; The 17-pipe that foams; 18-scaling powder elevating screw;
19-scaling powder lifting screw; 20-scaling powder elevating chain; 21-screw mandrel base one;
22-scaling powder lifting sprocket wheel; 23-scaling powder lifting motor; 24-motor sprocket one;
25-scaling powder lifting crossbearer; The 26-underframe; 27-screw mandrel base two;
28-tin stove lifting screw; 29-tin stove lifting motor; 30-motor sprocket two;
31-tin stove elevating chain; 32-tin stove lifting crossbearer; 33-tin stove lifting sprocket wheel;
34-tin stove elevating screw; The 35-guide rail is transferred wide screw mandrel; The 36-guide rail is transferred wide handle;
The 37-guide rail is transferred wide chain; 38-chain dog chain bar.
Embodiment
A kind of PCB selectivity wave soldering equipment as depicted in figs. 1 and 2, comprise guide rail 2 and underframe 26, described guide rail 2 is provided with chain pawl 1, scaling powder selectivity applicator assembly is installed between described underframe 26 and guide rail 2, the PCB preheating assembly, selectivity wave soldering assembly and PCB conveying assembly, described scaling powder selectivity applicator assembly comprises foam box 3, foaming masterplate 4, scaling powder case 16, foaming pipe 17, scaling powder elevating screw 18, scaling powder lifting screw 19, scaling powder elevating chain 20, screw mandrel base 1, scaling powder lifting sprocket wheel 22, scaling powder lifting motor 23, motor sprocket 1, scaling powder lifting crossbearer 25, described screw mandrel base 1 is installed on the underframe 26, described scaling powder elevating screw 18 is installed on the underframe 26 by screw mandrel base 1, described scaling powder lifting screw 19 is installed on the scaling powder elevating screw 18 and with scaling powder lifting crossbearer 25 and is fixed on the scaling powder elevating screw 18, described scaling powder case 16 is installed on the scaling powder lifting crossbearer 25, described foam box 3 is installed in the scaling powder case 16, described foaming pipe 17 is installed on the foam box 3, described scaling powder lifting sprocket wheel 22 is installed on the scaling powder elevating screw 18, described scaling powder elevating chain 20 is installed on the scaling powder lifting sprocket wheel 22, described scaling powder lifting motor 23 is arranged on the underframe 26 and is positioned at the below of scaling powder elevating chain 20, and described motor sprocket 1 is connected with scaling powder elevating chain 20; Described PCB preheating assembly comprises heating tube 6 and preheating cabinet 7, and described preheating cabinet 7 is installed in the side that underframe 26 is positioned at foam box 3, and described heating tube 6 is installed on the preheating cabinet 7; Described selectivity wave soldering assembly comprises tin stove 8, electromagnetic pump 9, crest masterplate nozzle 10, screw mandrel base 2 27, tin stove lifting screw 28, tin stove lifting motor 29, motor sprocket 2 30, tin stove elevating chain 31, tin stove lifting crossbearer 32, tin stove lifting sprocket wheel 33, tin stove elevating screw 34 and tin stove lifting motor 29, described screw mandrel base 2 27 is installed on the underframe 26, described tin stove elevating screw 34 is installed on the underframe 26 by screw mandrel base 2 27, described tin stove lifting screw 28 is installed on the tin stove elevating screw 34 and with tin stove lifting crossbearer 32 and is fixed on the tin stove elevating screw 34, described tin stove 8 is installed on the tin stove lifting crossbearer 32, described crest masterplate nozzle 10 is arranged on the tin stove 8, described electromagnetic pump 9 is installed on the tin stove 8, described tin stove lifting sprocket wheel 33 is installed on the tin stove elevating screw 34, described tin stove elevating chain 31 is installed on the tin stove lifting sprocket wheel 33, described tin stove lifting motor 29 is installed on the underframe 26 and is positioned at the below of tin stove elevating chain 31, and described motor sprocket 2 30 is connected with tin stove elevating chain 31; The PCB conveying assembly comprises transducer 1, transportation motor 11, transportation sprocket wheel 12, transducer 2 13, delivery chain 14, rotating shaft 15, chain dog chain bar 38, guide rail transfers wide screw mandrel 35 and guide rail to transfer wide chain 37, described transducer 1 is installed on the preheating cabinet 7 and is positioned at guide rail 2 inboards, described transducer 2 13 is installed on the tin stove 8 and is positioned at guide rail 2 inboards, described transportation motor 11 is installed in guide rail 2 tops, described rotating shaft 15 is installed in guide rail 2 belows, transportation sprocket wheel 12 on the described transportation motor 11 is connected with rotating shaft 15 by delivery chain 14, described rotating shaft 15 drives chain pawl 1 by chain dog chain bar 38 and moves on guide rail 2, described guide rail is transferred wide screw mandrel 35 to be two and to be movably arranged on the two ends of guide rail 2 respectively, and described two guide rails transfer wide screw mandrel 35 to transfer wide chain 37 to connect by guide rail.Described guide rail is transferred the end of wide screw mandrel 35 to be provided with guide rail and is transferred wide handle 36.Described rotating shaft 15 is synchronous square axis.Described heating tube 6 is an infrared heating pipe.
In the scaling powder selectivity applicator assembly, foam box 3, foaming masterplate 4, scaling powder case 16, foaming pipe 17 constitute scaling powder foaming selectivity coating functions; Scaling powder elevating screw 18, scaling powder lifting screw 19, scaling powder elevating chain 20, screw mandrel base 1, scaling powder lifting sprocket wheel 22, scaling powder lifting motor 23, motor sprocket A24, scaling powder lifting crossbearer 25 constitute the elevating function of scaling powder selectivity applicator assembly, and the lifting of scaling powder selectivity applicator assembly is driven by scaling powder lifting motor 23.
Tin stove 8 in the selectivity wave soldering assembly, electromagnetic pump 9, crest masterplate nozzle 10 constitute selectivity wave-soldering systematic function; Screw mandrel base 2 27, tin stove lifting screw 28, tin stove lifting motor 29, motor sprocket B 30, tin stove elevating chain 31, tin stove lifting crossbearer 32, tin stove lifting sprocket wheel 33, tin stove elevating screw 34 constitute the elevating function of selectivity wave soldering assembly, the lifting of selectivity wave soldering assembly is driven by tin stove lifting motor 29.
In the PCB conveying assembly, transducer 1, transportation motor 11, transportation sprocket wheel 12, transducer 2 13, delivery chain 14, rotating shaft 15, chain dog chain bar 38 constitute the PCB conveying function; Guide rail is transferred wide screw mandrel 35, guide rail to transfer wide handle 36, guide rail to transfer wide chain 37 to constitute guide rail and is transferred wide function.
A kind of PCB selectivity wave soldering equipment described in the utility model, it is corresponding needing the PCB element of welding and foaming masterplate 4, crest masterplate nozzle 10, different PCB, corresponding different foaming masterplate 4 and crest masterplate nozzle 10.
The above; it only is preferred embodiment of the present utility model; be not that the utility model is imposed any restrictions; every according to the utility model technical spirit to any simple modification, change and equivalent structure transformation that above embodiment did, all still belong in the protection range of technical solutions of the utility model.
Claims (4)
1. PCB selectivity wave soldering equipment, it is characterized in that: comprise guide rail (2) and underframe (26), described guide rail (2) is provided with chain pawl (1), between described underframe (26) and guide rail (2), scaling powder selectivity applicator assembly is installed, the PCB preheating assembly, selectivity wave soldering assembly and PCB conveying assembly, described scaling powder selectivity applicator assembly comprises foam box (3), foaming masterplate (4), scaling powder case (16), foaming pipe (17), scaling powder elevating screw (18), scaling powder lifting screw (19), scaling powder elevating chain (20), screw mandrel base one (21), scaling powder lifting sprocket wheel (22), scaling powder lifting motor (23), motor sprocket one (24), scaling powder lifting crossbearer (25), described screw mandrel base one (21) is installed on the underframe (26), described scaling powder elevating screw (18) is installed on the underframe (26) by screw mandrel base one (21), described scaling powder lifting screw (19) is installed in scaling powder elevating screw (18) and goes up and scaling powder lifting crossbearer (25) is fixed on the scaling powder elevating screw (18), described scaling powder case (16) is installed on the scaling powder lifting crossbearer (25), described foam box (3) is installed in the scaling powder case (16), described foaming pipe (17) is installed on the foam box (3), described scaling powder lifting sprocket wheel (22) is installed on the scaling powder elevating screw (18), described scaling powder elevating chain (20) is installed on the scaling powder lifting sprocket wheel (22), described scaling powder lifting motor (23) is arranged on the below that scaling powder elevating chain (20) were gone up and be positioned to underframe (26), and described motor sprocket one (24) is connected with scaling powder elevating chain (20); Described PCB preheating assembly comprises heating tube (6) and preheating cabinet (7), and described preheating cabinet (7) is installed in the side that foam box (3) was gone up and be positioned to underframe (26), and described heating tube (6) is installed on the preheating cabinet (7); Described selectivity wave soldering assembly comprises tin stove (8), electromagnetic pump (9), crest masterplate nozzle (10), screw mandrel base two (27), tin stove lifting screw (28), tin stove lifting motor (29), motor sprocket two (30), tin stove elevating chain (31), tin stove lifting crossbearer (32), tin stove lifting sprocket wheel (33), tin stove elevating screw (34) and tin stove lifting motor (29), described screw mandrel base two (27) is installed on the underframe (26), described tin stove elevating screw (34) is installed on the underframe (26) by screw mandrel base two (27), described tin stove lifting screw (28) is installed in tin stove elevating screw (34) and goes up and tin stove lifting crossbearer (32) is fixed on the tin stove elevating screw (34), described tin stove (8) is installed on the tin stove lifting crossbearer (32), described crest masterplate nozzle (10) is arranged on the tin stove (8), described electromagnetic pump (9) is installed on the tin stove (8), described tin stove lifting sprocket wheel (33) is installed on the tin stove elevating screw (34), described tin stove elevating chain (31) is installed on the tin stove lifting sprocket wheel (33), described tin stove lifting motor (29) is installed in the below that tin stove elevating chain (31) was gone up and be positioned to underframe (26), and described motor sprocket two (30) is connected with tin stove elevating chain (31); The PCB conveying assembly comprises transducer one (5), transportation motor (11), transportation sprocket wheel (12), transducer two (13), delivery chain (14), rotating shaft (15), chain dog chain bar (38), guide rail transfers wide screw mandrel (35) and guide rail to transfer wide chain (37), described transducer one (5) is installed on the preheating cabinet (7) and is positioned at guide rail (2) inboard, described transducer two (13) is installed on the tin stove (8) and is positioned at guide rail (2) inboard, described transportation motor (11) is installed in guide rail (2) top, described rotating shaft (15) is installed in guide rail (2) below, transportation sprocket wheel (12) on the described transportation motor (11) is connected with rotating shaft (15) by delivery chain (14), described rotating shaft (15) drives chain pawl (1) by chain dog chain bar (38) and goes up mobile at guide rail (2), described guide rail is transferred wide screw mandrel (35) to be two and to be movably arranged on the two ends of guide rail (2) respectively, and described two guide rails transfer wide screw mandrel (35) to transfer wide chain (37) to connect by guide rail.
2. a kind of PCB selectivity wave soldering equipment according to claim 1 is characterized in that: described guide rail is transferred the end of wide screw mandrel (35) to be provided with guide rail and is transferred wide handle (36).
3. a kind of PCB selectivity wave soldering equipment according to claim 1, it is characterized in that: described rotating shaft (15) is synchronous square axis.
4. a kind of PCB selectivity wave soldering equipment according to claim 1 is characterized in that: described heating tube (6) is an infrared heating pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206435610U CN201928528U (en) | 2011-01-03 | 2011-01-03 | Selective PCB (printed circuit board) wave soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206435610U CN201928528U (en) | 2011-01-03 | 2011-01-03 | Selective PCB (printed circuit board) wave soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201928528U true CN201928528U (en) | 2011-08-10 |
Family
ID=44432361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206435610U Expired - Fee Related CN201928528U (en) | 2011-01-03 | 2011-01-03 | Selective PCB (printed circuit board) wave soldering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201928528U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548241A (en) * | 2011-01-03 | 2012-07-04 | 西安中科麦特电子技术设备有限公司 | Selective wave soldering equipment of PCBs (printed circuit boards) |
| CN102689069A (en) * | 2012-06-01 | 2012-09-26 | 周秀兰 | Automatic soldering machine |
| CN104002007A (en) * | 2013-02-25 | 2014-08-27 | 谢玉强 | Full automatic dip soldering machine |
| CN106334852A (en) * | 2016-11-16 | 2017-01-18 | 东莞职业技术学院 | An Online Selective Wave Crest Welder |
| CN109732171A (en) * | 2019-03-20 | 2019-05-10 | 河南实拓实业有限公司 | A kind of Full-automatic tin-immersion machine |
| CN110869154A (en) * | 2017-07-11 | 2020-03-06 | 尔萨有限公司 | Welding system for selective wave soldering |
-
2011
- 2011-01-03 CN CN2010206435610U patent/CN201928528U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548241A (en) * | 2011-01-03 | 2012-07-04 | 西安中科麦特电子技术设备有限公司 | Selective wave soldering equipment of PCBs (printed circuit boards) |
| CN102689069A (en) * | 2012-06-01 | 2012-09-26 | 周秀兰 | Automatic soldering machine |
| CN102689069B (en) * | 2012-06-01 | 2016-06-29 | 周秀兰 | A kind of automatic tin welding machine |
| CN104002007A (en) * | 2013-02-25 | 2014-08-27 | 谢玉强 | Full automatic dip soldering machine |
| CN106334852A (en) * | 2016-11-16 | 2017-01-18 | 东莞职业技术学院 | An Online Selective Wave Crest Welder |
| CN110869154A (en) * | 2017-07-11 | 2020-03-06 | 尔萨有限公司 | Welding system for selective wave soldering |
| CN109732171A (en) * | 2019-03-20 | 2019-05-10 | 河南实拓实业有限公司 | A kind of Full-automatic tin-immersion machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201928528U (en) | Selective PCB (printed circuit board) wave soldering device | |
| CN204090331U (en) | A kind of PCBA board is separated and conveying device automatically with mistake stove fixture | |
| CN102548241A (en) | Selective wave soldering equipment of PCBs (printed circuit boards) | |
| CN102689065B (en) | A kind of welding method of circuit board element | |
| CN201552357U (en) | Selective atomizing machine | |
| CN202799417U (en) | Double-track Surface Mount Technology (SMT) production line feeding device | |
| CN102039465A (en) | Selective spraying machine | |
| CN105120602A (en) | Small and medium-sized PCB components mixed installing technology | |
| CN205196114U (en) | All revolving racks of SMT carrier | |
| CN104386508A (en) | Automatic plate feeding device of LED chip mounter | |
| CN202679812U (en) | Conveying return device of PCB (printed circuit board) wave soldering jig | |
| CN207658221U (en) | A kind of labelling machine for Beer Brewage | |
| CN105314384A (en) | Turning machine | |
| CN103111708A (en) | Reciprocating type printed circuit board (PCB) selective crest welder | |
| CN204442910U (en) | Adapter packs assembling production lines | |
| CN206005032U (en) | Bonding machine | |
| CN103111703A (en) | Reciprocating selectivity crest welder control system | |
| CN202143301U (en) | Novel flexible printed circuit board | |
| CN203368926U (en) | PCB board | |
| CN103111713A (en) | Crest width adjustable crest nozzle device used for crest injection machine | |
| CN202818778U (en) | X-Y motion mechanism for multifunctional heterotype chip mounter | |
| CN207141112U (en) | A kind of SMT feeder of plaster machine turnover bogie | |
| CN205151130U (en) | Corner machine | |
| CN203541791U (en) | Novel tin conveying device of tin soldering machine | |
| CN204934807U (en) | A kind of automatic some cream device for welding chip assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110810 Termination date: 20120103 |