CN201903400U - Small-size infrared system - Google Patents
Small-size infrared system Download PDFInfo
- Publication number
- CN201903400U CN201903400U CN2010206309035U CN201020630903U CN201903400U CN 201903400 U CN201903400 U CN 201903400U CN 2010206309035 U CN2010206309035 U CN 2010206309035U CN 201020630903 U CN201020630903 U CN 201020630903U CN 201903400 U CN201903400 U CN 201903400U
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- Prior art keywords
- infrared
- small
- paraffin
- aluminium alloy
- type heat
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- Expired - Lifetime
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- 239000012188 paraffin wax Substances 0.000 claims abstract description 45
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 28
- 238000005495 investment casting Methods 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 4
- 239000012782 phase change material Substances 0.000 abstract description 8
- 238000010521 absorption reaction Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000009825 accumulation Methods 0.000 abstract description 3
- 238000003384 imaging method Methods 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 10
- 238000001931 thermography Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 5
- 230000009466 transformation Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000010412 perfusion Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- 238000007670 refining Methods 0.000 description 3
- 238000005338 heat storage Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004169 Hydrogenated Poly-1-Decene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 235000019383 crystalline wax Nutrition 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model discloses a small-size infrared system to eliminate the inside adverse effect that produces heat accumulation and environmental change and produce thermal infrared imager imaging quality of prior art intermediate infrared system. The small infrared system comprises an infrared lens, a thermal infrared imager, a circuit processing system and an aluminum alloy annular heat dissipation cavity filled with paraffin; the aluminum alloy annular heat dissipation cavity is in close contact and rigid connection with the infrared lens, the thermal infrared imager and the circuit processing system. The utility model discloses be in the same place infrared camera lens and thermal infrared imager built-up connection, designed two-stage cavity structure, ensure the temperature stability of the inside of system through phase change material to thermal absorption and release.
Description
Technical field
The utility model relates to a kind of small-sized infrared system, relates in particular to the temperature control design of infrared optical system and thermal imaging system.
Background technology
Along with Development of Infrared Technology, infrared equipment also progressively develops to directions such as miniaturization, wide temperature ranges, and is also more and more higher to the quality requirements of infrared optical system.Large-scale infrared optical system commonly used adopts the refrigeration-type thermal infrared imager usually, can guarantee that infrared system is than the reliable and secure work in the large-temperature range.But for small-sized infrared system, be subjected to the restriction of physical dimension and weight, generally adopt the non-refrigeration type thermal infrared imager.For the non-refrigeration type thermal imaging system, guarantee the reliably working in the large-temperature range, must design the corresponding temperature compensation link or the thermal design that disappears.
The thermal technology that disappears for infrared optical system mainly contains three major types at present: the first kind is mechanical passive type.It utilizes thermally sensitive mechanical material or memorial alloy, make one or one group of lens generation axial displacement, thereby compensation is because the image planes displacement that temperature variation causes.This mode is owing to increased more mechanical compensation parts, so make the volume of system become big, weight increases.
Second class is that electronics is active, and it utilizes temperature sensor to detect the variation of temperature amount, calculates the image planes displacement that temperature variation causes then, produces axial displacement by the motor-driven lens, to reach compensation effect.This mode needs electronic equipments such as power supply, electronic circuit, drive motor, causes the reliability decrease of system, and especially in mechanics such as Aeronautics and Astronautics, the more abominable field of temperature environment, application is not high.
The 3rd class is the PASSIVE OPTICAL formula, and it utilizes the difference between the optical material thermal characteristics, by the reasonable combination between the different qualities material eliminating Temperature Influence, thereby obtain to stablize the effect of image planes.The heat and then reach the stable purpose of image planes but the difference of utilizing infra-red material merely disappears has certain limitation, has also limited the optical design of wider different infrared optical lens.
Above-mentioned three classes disappear thermal technology just at infrared optical system itself, do not consider susceptibility and the adaptability of thermal infrared imager to temperature.The components and parts that the processing of circuit system adopts in the infrared system are more, and power consumption is bigger, innerly will produce bigger influence to the thermal infrared imager imaging after producing accumulation of heat, thus the absorption extraction of internal heat imaging is necessary to infrared system.
The utility model content
The utility model aims to provide a kind of small-sized infrared system, and infrared system in the prior art is inner to produce the adverse effect that accumulation of heat and environmental change produce the thermal infrared imager image quality to eliminate.
The technical solution of the utility model is:
A kind of small-sized infrared system comprises that infrared lens, thermal infrared imager, processing of circuit system and embedding have the aluminium alloy system ring-type heat-dissipating cavity of paraffin; Described aluminium alloy system ring-type heat-dissipating cavity all closely contacts with infrared lens, thermal infrared imager and processing of circuit system and is rigidly connected.
Above-mentioned paraffin only embedding in the exocoel of described aluminium alloy system ring-type heat-dissipating cavity; Certainly, should guarantee to leave in the heat-dissipating cavity enough spaces of expanding with heat and contract with cold during embedding paraffin.Inner chamber forms air naturally and fills or vacuum environment.
The front portion of above-mentioned infrared lens is fixed by the front end of the inner chamber of axial screw and described aluminium alloy system ring-type heat-dissipating cavity; In described inner chamber, corresponding described thermal infrared imager is set on the rear light path of infrared lens; Described processing of circuit system fixedlys connected with the rear end of described aluminium alloy system ring-type heat-dissipating cavity by heat-conducting plate.
Above-mentioned rigidly connected thermal infrared imager of aluminium alloy system ring-type heat-dissipating cavity and processing of circuit system adopt screw axial to fix.So both be convenient to install and fix, structural stability is also better simultaneously.
Above-mentioned exocoel is direct hot investment casting aluminum alloy formed cavity.Like this, the sealing behind the compactness of material and the perfusion paraffin wax is better, can avoid installing the pollution or other perils that leak and cause thermal imaging system of back paraffin wax liquid.
The exocoel correspondence position of above-mentioned aluminium alloy system ring-type heat-dissipating cavity front end face is provided with paraffin embedding reserved opening, and this reserved opening is by the shutoff of special screw thread blocking cap gluing.
Above-mentioned paraffin is selected specific heat capacity (2.14～2.9) J/gK, is dissolved latent heat (200～220) J/g, paraffin density (0.88～0.915) g/cm3) paraffin wax fully refined.
The utlity model has following advantage:
1, this device is connected infrared lens and thermal infrared imager and is in the same place, and has designed the two-stage cavity structure, by phase-change material to the absorption of heat with discharge the temperature stabilization of guaranteeing internal system.
2, the phase transformation cavity can make full use of the useful space and form bigger internal cavity structures in order to the storage paraffin wax.Be shaped because this cavity is hot investment casting, the sealing behind the compactness of material and the perfusion paraffin wax is better, can avoid installing the pollution or other perils that leak and cause thermal imaging system of back paraffin wax liquid.
3, consider the miniaturization demand of equipment, the strict demand of heat expansion characteristic and temperature control scope, the paraffin kind that the utility model is selected possesses the high effective heat-storage performance.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is a phase transformation cavity body structure schematic perspective view (preceding apparent direction);
Fig. 3 is a phase transformation cavity body structure cross-sectional schematic.
The drawing reference numeral explanation:
1-aluminium alloy system ring-type heat-dissipating cavity, 101-exocoel, 102-inner chamber, 103-paraffin phase change material, 2-infrared lens, 3-thermal infrared imager, 4-processing of circuit system, 5-paraffin embedding reserved opening.
Embodiment
It is a kind of in small-sized infrared system that in fact the utility model provides, and utilizes phase-change material that the heat that inner components and parts produce is absorbed, and infrared optical system and thermal infrared imager are carried out temperature controlled device.This device is connected infrared lens and thermal infrared imager and is in the same place, and by the temperature stabilization that phase-change material is guaranteed internal system to the absorption and the release of heat, its structural representation as shown in the figure.Thermal infrared imager is rigidly connected by screw and cavity, and the processing of circuit system also is connected with the cavity rear end face by screw simultaneously.Infrared lens is installed in the inside of cavity, is screwed after the image planes accent is clear by screw.Cavity all is that the rigidity contact is connected with infrared lens, thermal imaging system and processing of circuit system, and all its surface of contact all has good thermal conduction capability, and this helps the heat that absorption processing of circuit system rapidly and efficiently produces, and guarantees the temperature stability of built-in system.Because system's components and parts are generally more, the circuit printing plate size is relatively large, simultaneously since in the mini-system infrared lens and thermal imaging system size less, this phase transformation cavity can make full use of the useful space and form bigger internal cavity structures in order to the storage paraffin wax.Be shaped because this cavity is hot investment casting, the sealing behind the compactness of material and the perfusion paraffin wax is better, can avoid installing the pollution or other perils that leak and cause thermal imaging system of back paraffin wax liquid.
This small-sized infrared system comprises that infrared lens, thermal infrared imager, processing of circuit system and embedding have the aluminium alloy system ring-type heat-dissipating cavity of paraffin; Aluminium alloy system ring-type heat-dissipating cavity all closely contacts with infrared lens, thermal infrared imager and processing of circuit system and is rigidly connected.Paraffin only embedding in the exocoel of described aluminium alloy system ring-type heat-dissipating cavity; Certainly, should guarantee to leave in the heat-dissipating cavity enough spaces of expanding with heat and contract with cold during embedding paraffin.Inner chamber forms air naturally and fills or vacuum environment.The front portion of infrared lens is fixed by the front end of the inner chamber of axial screw and described aluminium alloy system ring-type heat-dissipating cavity; In described inner chamber, corresponding described thermal infrared imager is set on the rear light path of infrared lens; Described processing of circuit system fixedlys connected with the rear end of described aluminium alloy system ring-type heat-dissipating cavity by heat-conducting plate.Rigidly connected thermal infrared imager of aluminium alloy system ring-type heat-dissipating cavity and processing of circuit system adopt screw axial to fix.So both be convenient to install and fix, structural stability is also better simultaneously.
Above-mentioned exocoel is direct hot investment casting aluminum alloy formed cavity.Like this, the sealing behind the compactness of material and the perfusion paraffin wax is better, can avoid installing the pollution or other perils that leak and cause thermal imaging system of back paraffin wax liquid.The exocoel correspondence position of above-mentioned aluminium alloy system ring-type heat-dissipating cavity front end face is provided with paraffin embedding reserved opening, and this reserved opening is by the shutoff of special screw thread blocking cap gluing.
This infrared system attemperating unit adopts the precision aluminium-alloy cavity structure, and the direct hot investment casting of the cavity of storage inside phase-change material is shaped.After the paraffin wax fusing, by being poured in inside cavity, with special screw thread blocking cap gluing perfusing hole to be shut when liquid side reaches three reserved opening when keeping flat in the reserved opening position, phase transformation cavity body structure stereographic map is as shown in Figure 2.
Consider the miniaturization demand of equipment, the strict demand of heat expansion characteristic and temperature control scope, phase-change material is selected paraffin in this device, and its melting temperature is at 50 ℃～60 ℃.
Paraffin: Main Ingredients and Appearance is that the material of C, two kinds of elements of H mixes, its chemical formula CxHy, claim crystalline wax again, carbon number is about 18～30 hydrocarbon mixture, key component is straight-chain paraffin (being about 80%～95%), also has on a small quantity with the alkane of indivedual side chains and the monocyclic naphthenes of belt length side chain (both add up to content below 20%).Paraffin be from crude distillation and lube cut make slack wax through solvent refining, solvent dewaxing or through wax freezing and crystallizing, squeezing dewaxing, again through de-oiling, and the post-refining sheet or the acicular crystal that make.Paraffin density rises with fusing point and increases, and is generally (0.88～0.915) g/cm3,50 ℃～70 ℃ of fusing points, and 300 ℃～550 ℃ of boiling points are water insoluble.Paraffin refined wax is good insulator, and is all higher than the most of materials except that some plastics (especially Teflon), is about thousand times of metal material.In addition, paraffin also is good heat accumulating, and its specific heat capacity is (2.14～2.9) J/gK, and melting heat is (200～220) J/g.The main quality index of paraffin is fusing point and oleaginousness, and the former represents temperature resistant capability, and the latter represents purity.Every class wax is pressed fusing point again, generally every 2 ℃, is divided into different kinds, as 52,54, and 56,58 trades mark such as grade.According to processing and refining degree difference, can be divided into 3 kinds of paraffin wax fully refined, semi-refined paraffin wax and scale waxs.Consider to be mainly surface-mounted integrated circuit in the controller and to possess the high effective heat-storage performance, therefore, select for use paraffin wax fully refined and semi-refined paraffin wax as heat accumulating (phase-change material).
The hot rerum natura variation range of the olefin material of selecting for use in this device is:
Specific heat capacity: (2.14～2.9) J/gK;
Dissolve latent heat: (200～220) J/g;
Paraffin density: (0.88～0.915) g/cm3).
Claims (7)
1. a small-sized infrared system comprises infrared lens, thermal infrared imager and processing of circuit system, it is characterized in that: described small-sized infrared system comprises that also embedding has the aluminium alloy system ring-type heat-dissipating cavity of paraffin; Described aluminium alloy system ring-type heat-dissipating cavity all closely contacts with infrared lens, thermal infrared imager and processing of circuit system and is rigidly connected.
2. small-sized infrared system according to claim 1 is characterized in that: described paraffin only embedding in the exocoel of described aluminium alloy system ring-type heat-dissipating cavity.
3. small-sized infrared system according to claim 2 is characterized in that: the front portion of described infrared lens is fixed by the front end of the inner chamber of axial screw and described aluminium alloy system ring-type heat-dissipating cavity; In described inner chamber, corresponding described thermal infrared imager is set on the rear light path of infrared lens; Described processing of circuit system fixedlys connected with the rear end of described aluminium alloy system ring-type heat-dissipating cavity by heat-conducting plate.
4. small-sized infrared system according to claim 3 is characterized in that: with described rigidly connected thermal infrared imager of aluminium alloy system ring-type heat-dissipating cavity and processing of circuit system all is to adopt screw axial to fix.
5. small-sized infrared system according to claim 4 is characterized in that: described exocoel is direct hot investment casting aluminum alloy formed cavity.
6. small-sized infrared system according to claim 5 is characterized in that: the exocoel correspondence position of described aluminium alloy system ring-type heat-dissipating cavity front end face is provided with paraffin embedding reserved opening, and this reserved opening is by the shutoff of special screw thread blocking cap gluing.
7. small-sized infrared system according to claim 6 is characterized in that: described paraffin is selected specific heat capacity 2.14～2.9J/gK, is dissolved latent heat 200～220J/g, paraffin density 0.88～0.915g/cm
3Paraffin wax fully refined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206309035U CN201903400U (en) | 2010-11-29 | 2010-11-29 | Small-size infrared system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206309035U CN201903400U (en) | 2010-11-29 | 2010-11-29 | Small-size infrared system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201903400U true CN201903400U (en) | 2011-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206309035U Expired - Lifetime CN201903400U (en) | 2010-11-29 | 2010-11-29 | Small-size infrared system |
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| Country | Link |
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| CN (1) | CN201903400U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2558723A (en) * | 2016-10-31 | 2018-07-18 | Commissariat Energie Atomique | Protective shield for an electronic device |
| CN111025630A (en) * | 2019-12-17 | 2020-04-17 | 天津津航技术物理研究所 | Phase-change-based manufacturing method of athermal infrared optical lens barrel |
| CN111351581A (en) * | 2020-03-17 | 2020-06-30 | 南京理工大学 | Temperature-controlled infrared thermal imager and temperature control method thereof |
| US11193820B2 (en) | 2017-01-09 | 2021-12-07 | General Electric Company | System and method for disposable infrared imaging system |
| US11397112B2 (en) | 2017-01-09 | 2022-07-26 | General Electric Company | System and method for monitoring of gas turbine components with infrared system |
-
2010
- 2010-11-29 CN CN2010206309035U patent/CN201903400U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2558723A (en) * | 2016-10-31 | 2018-07-18 | Commissariat Energie Atomique | Protective shield for an electronic device |
| GB2558723B (en) * | 2016-10-31 | 2021-11-03 | Commissariat Energie Atomique | Protective shield for an electronic device |
| US11193820B2 (en) | 2017-01-09 | 2021-12-07 | General Electric Company | System and method for disposable infrared imaging system |
| US11397112B2 (en) | 2017-01-09 | 2022-07-26 | General Electric Company | System and method for monitoring of gas turbine components with infrared system |
| US11692871B2 (en) | 2017-01-09 | 2023-07-04 | General Electric Company | System and method for disposable imaging system |
| CN111025630A (en) * | 2019-12-17 | 2020-04-17 | 天津津航技术物理研究所 | Phase-change-based manufacturing method of athermal infrared optical lens barrel |
| CN111351581A (en) * | 2020-03-17 | 2020-06-30 | 南京理工大学 | Temperature-controlled infrared thermal imager and temperature control method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110720 |
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| CX01 | Expiry of patent term |