CN104080311B - A kind of cooling electronic component device and method - Google Patents
A kind of cooling electronic component device and method Download PDFInfo
- Publication number
- CN104080311B CN104080311B CN201310105599.0A CN201310105599A CN104080311B CN 104080311 B CN104080311 B CN 104080311B CN 201310105599 A CN201310105599 A CN 201310105599A CN 104080311 B CN104080311 B CN 104080311B
- Authority
- CN
- China
- Prior art keywords
- electronic component
- phase
- metal
- change
- compression type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
Provide a kind of radiator for combining metal solid-liquid phase change and steam compression type refrigeration circulation, cooling applied to high heat flux density electronic component, it uses a small amount of low-melting-point metal, phase transformation can be occurred below at 60 DEG C, to take away amount of heat rapidly, to cope with the case where electronic component power increases suddenly, the starting time is provided for steam compression type refrigeration circulation.After electronic component power stability, heat can be transferred to evaporator from electronic component surface well by the liquid metal with high thermal conductivity, sent out by refrigerant liquid vapour phase infantile feverish perspiration and taken away heat.This radiator combines the passive cooling of metal phase change and the active cooling characteristic of steam compression type refrigeration circulation, meet that high-power electronic component changed power is big and high heat flux density cooling requirements simultaneously, it solves the problems, such as vapor-compression refrigerant cycle starting, start the hysteresis quality freezed relative to electronic component chugging, ensure that the operating temperature of electronic component smooth change in safe range always.
Description
Technical field
The present invention relates to a kind of cooling electronic component device and methods, and in particular to a kind of metal phase change and steam compression type
The cooling electronic component device and method that refrigeration cycle combines.
Background technique
With the fast development of micro-electronic mechanical skill, electronic component size is smaller and smaller, and the number of transistor thereon
Amount is more and more, according to Moore's Law: doubling within number of transistors every 18 months on electronic component.Bring therefrom
Heat dissipation problem is more severe, and the heat flow density on some electronic component surfaces has reached even more thanFor such
High heat flow density, traditional air cooling way has reached the limit, and then new heat dissipation technology is suggested one after another, such as water
Hot and cold Manifold technology, thermoelectric cooling, steam compression type refrigeration circulation etc..Among these, steam compression type refrigeration circulation is by environment temperature
Degree limitation is minimum, and has most excellent heat-sinking capability.For theoretically, as long as environment temperature is lower than electronic component temperature,
Steam compression type refrigeration circulation can disperse heat.And this condition is usually all satisfiable.
However, electronic component power it some times happens that mutation, and steam compression type refrigeration circulation this is difficult to make it is fast
The response of speed, rises rapidly to will lead to electronic component temperature, and work of the temperature abrupt change for electronic component
Performance is also unfavorable.Therefore, it is necessary to solve this problem.
Summary of the invention
Thermal control problem brought by may rising rapidly at any time as described previously for electronic component temperature, it is still necessary to want
It is solved.Present inventor considered that a feasible approach, is to play a buffering by other cooling means of auxiliary to make
With the cooling means of this auxiliary allows within a short period of time dispersing amount of heat, to make steam compression type refrigeration
Circulation can start to start using this section of buffer time, and when refrigeration cycle starting finishes normal operation, this householder method
Good conduction of heat must can also be played, and the heat-sinking capability for keeping refrigeration cycle excellent is unlikely is restricted；This can be reached
It requires a bit, is most preferably no more than low-melting-point metal phase transformation, big potential heat value and high thermal coefficient can satisfy temperature and rise sharply
When cooling requirements, and when refrigeration cycle even running, good heating conduction again can be well by heat from electronics member
Device surface reaches the evaporator in refrigeration cycle.When electronic component temperature is subsequently reduced to setting value following temperature, phase transformation
Metal solidifies completely, and refrigeration subsystem is out of service, and the evaporating temperature for avoiding refrigeration system is too low there may be condensed water, from
And guarantee the trouble free service of electronic equipment；The a small amount of heat production of electronic component is passed through the fin band of Metal Packaging box surrounding by air
It walks
In conclusion steam compression type refrigeration circulation can satisfy high heat flux density cooling requirements, rise sharply for power
Situation, only needs that a small amount of phase-change metal can play the role of refrigeration system starting buffering and can be subcooled to avoid low temperature can
Condensed water can be led to the problem of.Therefore, the scheme that the two combines is for the High power microelectronic component that quickly grows instantly
Heat dissipation problem has great meaning.
On the basis of above-mentioned design, the present invention provides a kind of efficient heat-radiating device of electric component, combine gold
Symbolic animal of the birth year becomes and steam compression type refrigeration circulation, solves electronic component temperature in smooth working, chugging and is maintained at conjunction
High heat flux density heat dissipation problem under a variety of requirements such as suitable range and evaporated condensation water generation.
According to an aspect of the invention, there is provided a kind of metal solid-liquid phase change and steam compression type refrigeration circulation combine
Cooling electronic component device, characterized by comprising:
Phase-change metal packaging cartridge, wherein it is packaged with low temperature solid-liquid phase change metal,
Steam compression type refrigeration subsystem,
Wherein, the phase-change metal packaging cartridge is thermally contacted with electronic component to be cooled.
According to another aspect of the present invention, it provides a kind of metal phase change and steam compression type refrigeration circulation combines
Cooling electronic component method, characterized by comprising:
It thermally contacts phase-change metal packaging cartridge with electronic component to be cooled, is packaged in the phase-change metal packaging cartridge
Phase-change metal,
When electronic component power jumps and heat dissipation capacity is made to increase sharply, phase-change metal is fused into liquid at this time, compared with
A large amount of heat is taken away in short time, while starting steam compression type refrigeration subsystem,
Wherein,
The refrigeration subsystem includes condensing unit and evaporator,
Evaporator is encapsulated in phase-change metal packaging cartridge and is immersed in phase-change metal.
Detailed description of the invention
Fig. 1 is to recycle the electronics combined according to the metal phase change and steam compression type refrigeration of one embodiment of the present of invention
Component radiator schematic illustration.
Fig. 2 is to recycle the electronics combined according to the metal phase change and steam compression type refrigeration of one embodiment of the present of invention
The phase-change metal packaging cartridge vertical view of component radiator cuts open figure.
Specific embodiment
Technical solution of the present invention is illustrated with reference to the accompanying drawings and detailed description.
As shown in Figure 1, metal phase change of the invention and steam compression type refrigeration recycle the cooling electronic component combined
Device includes two parts, that is, includes phase-change metal packaging cartridge 1 and steam compression type refrigeration subsystem 2.
A specific embodiment according to the present invention, the phase-change metal packaging cartridge 1 include phase-change metal 1-1 and fin 1-
2 (see Fig. 2).Wherein, phase-change metal 1-1 is encapsulated in phase-change metal packaging cartridge 1, and fin 1-2 is arranged in phase-change metal packaging cartridge 1
On outer wall.
As illustrated in fig. 1 and 2, the refrigeration subsystem 2 includes condensation unit 2-1 and evaporator 2-2.Wherein, evaporator 2-2
It is immersed in phase-change metal 1-1 and is encapsulated in phase-change metal packaging cartridge 1.Phase-change metal packaging cartridge 1 connects with electronic component heat
Touching, the contact generally pass through heat-conducting glue, as shown in Figure 1.
When electronic component low-power operation, heat is in thermally conductive form through solid phase-change metal 1-1 and phase transformation gold
Belong to 1 wall surface of packaging cartridge and reach the fin 1-2 being arranged on 1 outer wall of phase-change metal packaging cartridge, then with free convection or forced convection
Form be scattered in environment through fin 1-2.
When electronic component power increases, electronic component surface temperature reaches the setting close to phase-change metal 1-1 fusing point
When value, such as 60 DEG C, refrigeration subsystem 2 starts.With the lasting raising of electronic component temperature, such as 62 DEG C, phase-change metal 1-1 is molten
Change, refrigeration subsystem 2 has entered steady operational status at this time, and metal 1-1 fusing to be phased finishes, and heat is mainly by refrigeration subsystem
System 2 disperses.
When electronic component power declines, electronic component surface temperature is down to the fusing point of phase-change metal 1-1 hereinafter, such as 58
DEG C, phase-change metal 1-1 solidification, refrigeration subsystem 2 is out of service, is returned to radiating mould when electronic component low power run
Formula.
The enabling signal of refrigeration subsystem (2) is from the temperature sensor for being attached to electronic component surface.
According to one embodiment of present invention, phase-change metal is encapsulated in together with evaporator therein (2-2) is immersed in
In phase-change metal packaging cartridge (1), phase-change metal packaging cartridge (1) outer wall is disposed with fin (1-2).
According to one embodiment of present invention, the start and stop of refrigeration subsystem (2) are passed by the temperature on electronic component surface
The temperature signal control that sensor issues, start and stop the fusing point that temperature is slightly below phase-change metal (1-1).
In above-described embodiment, phase-change metal 1-1 can use Wood's metal, but be not limited to this kind of material.
The above is only a specific application examples of the invention, are not limited in any way to protection scope of the present invention.It is all
The technical solution formed using equivalents or equivalent transformation is all fallen within rights protection scope of the present invention.
Claims (5)
1. a kind of metal solid-liquid phase change and steam compression type refrigeration recycle the cooling electronic component device combined, it is characterised in that
Include:
Phase-change metal packaging cartridge (1), wherein it is packaged with low temperature solid-liquid phase change metal (1-1),
Steam compression type refrigeration subsystem (2),
Wherein, the phase-change metal packaging cartridge (1) thermally contacts with electronic component to be cooled,
The refrigeration subsystem (2) includes condensing unit (2-1) and evaporator (2-2),
Wherein, evaporator (2-2) is encapsulated in phase-change metal packaging cartridge (1) and is immersed in phase-change metal (1-1),
When electronic component power jumps, heat dissipation capacity increases sharply, and phase-change metal (1-1) is fused into liquid, within a short period of time
A large amount of heat is taken away, refrigeration subsystem (2) starts at the same time；
When electronic component refrigeration subsystem (2) starting finishes and initially enters steady-working state, refrigerant is through condensing unit
(2-1) compression, condensation, throttling, evaporate into evaporator (2-2), take away the heat of the generation of electronic component, while taking away gold
Belong to the heat that liquid-solid-phase changeable generates, liquid metal is condensed into solid-state, and the refrigerant after evaporation returns to condensation unit in a gaseous form
(2-1) completes a steam compression type refrigeration circulation.
2. metal phase change according to claim 1 and steam compression type refrigeration recycle the cooling electronic component combined
Device, it is characterised in that:
Phase-change metal packaging cartridge (1) surrounding outer wall and top can be disposed with fin (1-2), and box body, fin are high thermal conductivity coefficient
Material.
3. metal phase change according to claim 1 and steam compression type refrigeration recycle the cooling electronic component combined
Device, it is characterised in that:
Evaporator pipeline enters packaging cartridge from the direction opposite with gravity.
4. metal phase change according to claim 1 and steam compression type refrigeration recycle the cooling electronic component combined
Device, it is characterised in that:
The enabling signal of refrigeration subsystem (2) from the temperature sensor for being attached to electronic component surface,
When electronic component temperature reaches close to the setting value of phase-change metal (1) fusing point, refrigeration subsystem (2) starting；
When electronic component temperature is subsequently reduced to some temperature of the setting value or less, phase-change metal (1-1) solidifies completely, system
Refrigeration subsystem (2) is out of service, and avoiding evaporating temperature too low, there may be condensed waters, guarantees the trouble free service of electronic equipment；Electricity
The a small amount of heat production of sub- component is taken away by air by the fin of Metal Packaging box surrounding.
5. a kind of metal phase change and steam compression type refrigeration recycle the cooling electronic component method combined, it is characterised in that packet
It includes:
Thermally contact phase-change metal packaging cartridge (1) with electronic component to be cooled, encapsulation in the phase-change metal packaging cartridge (1)
There is phase-change metal (1-1),
When electronic component power jumps and heat dissipation capacity is made to increase sharply, phase-change metal (1-1) is fused into liquid at this time, compared with
A large amount of heat is taken away in short time, while starting steam compression type refrigeration subsystem (2),
Wherein,
The refrigeration subsystem (2) includes condensing unit (2-1) and evaporator (2-2),
Evaporator (2-2) is encapsulated in phase-change metal packaging cartridge (1) and is immersed in phase-change metal (1-1),
When refrigeration subsystem (2) starting finish initially enter steady-working state when, refrigerant through condensation unit (2-1) compression,
Condensation, throttling, evaporate into evaporator (2-2), take away the heat of the generation of electronic component, while taking away metal liquid-solid-phase changeable
The heat of generation, liquid metal are condensed into solid-state, and the refrigerant after evaporation returns to condensation unit (2-1) in a gaseous form, complete
One steam compression type refrigeration circulation,
The enabling signal of refrigeration subsystem (2) from the temperature sensor for being attached to electronic component surface,
When electronic component temperature reaches close to the setting value of phase-change metal (1) fusing point, refrigeration subsystem (2) starting；
When electronic component temperature is subsequently reduced to some temperature of the setting value or less, refrigeration subsystem (2) is out of service, phase
Become metal (1-1) to solidify completely, refrigeration subsystem (2) is out of service, and avoiding evaporating temperature too low, there may be condensed waters, guarantees
The trouble free service of electronic equipment；The a small amount of heat production of electronic component is taken away by air by the fin of Metal Packaging box surrounding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310105599.0A CN104080311B (en) | 2013-03-28 | 2013-03-28 | A kind of cooling electronic component device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310105599.0A CN104080311B (en) | 2013-03-28 | 2013-03-28 | A kind of cooling electronic component device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104080311A CN104080311A (en) | 2014-10-01 |
| CN104080311B true CN104080311B (en) | 2019-10-18 |
Family
ID=51601288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310105599.0A Active CN104080311B (en) | 2013-03-28 | 2013-03-28 | A kind of cooling electronic component device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104080311B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108200749A (en) * | 2018-02-06 | 2018-06-22 | 联想(北京)有限公司 | A kind of radiator and electronic equipment |
| CN112696961B (en) * | 2019-10-23 | 2022-04-01 | 北京航空航天大学 | Three-stage phase change heat exchanger |
| CN111182767B (en) * | 2019-12-31 | 2022-03-04 | 季华实验室 | Heat radiator |
| CN112201637A (en) * | 2020-11-03 | 2021-01-08 | 深圳市森若新材科技有限公司 | Phase change liquid cooling heat abstractor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6205803B1 (en) * | 1996-04-26 | 2001-03-27 | Mainstream Engineering Corporation | Compact avionics-pod-cooling unit thermal control method and apparatus |
| CN2884543Y (en) * | 2006-03-22 | 2007-03-28 | 艾默生网络能源有限公司 | Battery pack |
| CN101101180A (en) * | 2007-07-17 | 2008-01-09 | 山东省科学院能源研究所 | Compound heat-exchanger |
| CN101242728A (en) * | 2007-02-08 | 2008-08-13 | 李建民 | Thermal controller for power part with compressor |
| CN102026527A (en) * | 2010-11-16 | 2011-04-20 | 深圳市航宇德升科技有限公司 | Miniature refrigerator for cooling electronic equipment |
| CN102664292A (en) * | 2012-05-22 | 2012-09-12 | 上海电力学院 | Radiating and cooling device for power battery |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6526768B2 (en) * | 2001-07-24 | 2003-03-04 | Kryotech, Inc. | Apparatus and method for controlling the temperature of an integrated circuit device |
-
2013
- 2013-03-28 CN CN201310105599.0A patent/CN104080311B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6205803B1 (en) * | 1996-04-26 | 2001-03-27 | Mainstream Engineering Corporation | Compact avionics-pod-cooling unit thermal control method and apparatus |
| CN2884543Y (en) * | 2006-03-22 | 2007-03-28 | 艾默生网络能源有限公司 | Battery pack |
| CN101242728A (en) * | 2007-02-08 | 2008-08-13 | 李建民 | Thermal controller for power part with compressor |
| CN101101180A (en) * | 2007-07-17 | 2008-01-09 | 山东省科学院能源研究所 | Compound heat-exchanger |
| CN102026527A (en) * | 2010-11-16 | 2011-04-20 | 深圳市航宇德升科技有限公司 | Miniature refrigerator for cooling electronic equipment |
| CN102664292A (en) * | 2012-05-22 | 2012-09-12 | 上海电力学院 | Radiating and cooling device for power battery |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104080311A (en) | 2014-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20190285356A1 (en) | Electronics Cooling with Multi-Phase Heat Exchange and Heat Spreader | |
| US8130497B2 (en) | Blade server | |
| CN104080311B (en) | A kind of cooling electronic component device and method | |
| US10231357B2 (en) | Two-phase cooling with ambient cooled condensor | |
| CN201226636Y (en) | Liquid cooling radiating device with evaporation cavity | |
| TWI483099B (en) | Phase change type heat dissipating device | |
| CA3043042A1 (en) | Systems, methods, and apparatus for passive cooling of uavs | |
| TW200301814A (en) | Optimised use of PCMS in cooling devices | |
| US20140158334A1 (en) | Thermal management system with variable-volume material | |
| US20110056650A1 (en) | Heat sink | |
| US20090109623A1 (en) | Heat-radiating module with composite phase-change heat-radiating efficiency | |
| CN104427825A (en) | Multigang frequency conversion type refrigeration system for fixed-point refrigeration of multiple heat dissipation sources of electronic device, and operation method thereof | |
| JP2007010211A (en) | Cooling device of electronics device | |
| CN105281198A (en) | Semiconductor laser device heat management device | |
| KR20170091620A (en) | Hybrid heat transfer system | |
| CN103263782A (en) | Condensation device based on semiconductor chilling plate | |
| US20040179338A1 (en) | Loop thermosyphon with wicking structure and semiconductor die as evaporator | |
| JP6070036B2 (en) | Loop thermosyphon and electronic equipment | |
| WO2015083256A1 (en) | Cooling device employing mixed working fluid, and cooling device of electronic device | |
| CN105845648A (en) | Microelectronic device tree-shaped radiator | |
| JP2005260237A (en) | Module for cooling semiconductor element | |
| JP2004319658A (en) | Electronic cooler | |
| CN102287962A (en) | Semiconductor condensed water device | |
| CN201903400U (en) | Small-sized infrared system | |
| CN206412867U (en) | A kind of compulsive-cooling motor casing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |