CN201901704U - Special laser micro-cladding equipment - Google Patents
Special laser micro-cladding equipment Download PDFInfo
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- CN201901704U CN201901704U CN 201020628633 CN201020628633U CN201901704U CN 201901704 U CN201901704 U CN 201901704U CN 201020628633 CN201020628633 CN 201020628633 CN 201020628633 U CN201020628633 U CN 201020628633U CN 201901704 U CN201901704 U CN 201901704U
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Abstract
The utility model discloses special laser micro-cladding equipment, which comprises a worktable, a laser processing system and a control system. The special laser micro-cladding equipment is characterized by further comprising a CCD (charge coupled device) monitoring and positioning system and a write-through system. The CCD monitoring and positioning system comprises a coaxial CCD sensor, a paraxial CCD sensor, a zoom lens, an imaging eye lens, a zoom optical system, a paraxial imaging objective lens and an external monitor. The write-through system comprises a micro-pen write-through device and a micro-jet write-through device, the micro-pen write-through device comprises a support, a guide track, a cylinder, a slider, a piston rod, a dial indicator, a micro-distance adjusting nut and a micro-pen, and the micro-jet write-through device comprises a water bath, an air guide tube, a micro-pressure gauge and a micro-jet tool. The special laser micro-cladding equipment reasonably designs mounting stations and work modes of a laser path, a micro-jet and the micro-pen, integrates laser processing, a micro-pen write-through system and a micro-jet write-through system onto the same work platform, and realizes complementary advantages of various processing methods.
Description
Technical field
The utility model belongs to electronics/optoelectronic fabrication techniques field, be specifically related to the little cladding specific equipment of a kind of laser, this equipment can be applicable to the manufacturing of electronics/photoelectron element, comprises the manufacturing of conductor, resistance, electric capacity, inductance, transmitter, electrode and polymer optical wave guide.
Background technology
The generation development of large-scale integrated circuit, make electronic manufacturing technology constantly develop to the direction of integrated, miniaturization, effect, short run, many kinds and three-dimensional manufacturing in short-term, require conductor width and distance between centers of tracks more and more littler, and can realize multilayer wiring, the factor that restriction electronic product quality further improves changes chip chamber interconnection line spacing into by original chip size size.
2000, the contriver proposed the technology that the laser fine fusion covering electric slurry prepares lead, i.e. the flexible direct writing technology of the little cladding of laser, and develop the manufacturing system and the equipment of this technical backstopping voluntarily.This technology adopts the even glue method of rotation that the electric slurry of commercial electric slurry or preparation voluntarily is preset on the substrate, utilizes the CAD/CAM function of equipment, and need not mask is that may command laser is directly write the preparation plain conductor on the insulated substrate surface.But, adopt the even glue method of rotation to preset rete and have following several problem: the first, it is even to preset non-uniform film thickness; The second, need behind the laser direct-writing to remove redundant sizing agent, the slurry after the cleaning can not be recycled, and waste of material is serious; The 3rd, this method can't preset differing materials on same substrate.
At the problems referred to above, contriver's research and proposition micro-pen, little spray direct writing technology carry out presetting of electric slurry rete." a kind of micro-pen of directly writing electronics/photoelectron element reaches by its device that constitutes " (application number 200610019740.5) discloses a kind of micro-pen, and " a kind of electronic device for direct slurry atomization and deposition " (application number is 200610019527.4) discloses a kind of little spray direct-writing device.Wherein micro-pen is simple in structure, cost is low, control accuracy is high, applicable slurry viscosity scope is wide, not only can be used for making electronic devices and components, also can be used for making photoelectron element, as polymer optical wave guide.Include atomization chamber, release recycling cavity and deposition nozzle in the electronic device for direct slurry atomization and deposition.The material range of choice that this device can atomize is big, atomizing effect good, stable, simple in structure, easy to operate, practical.Micro-pen/little spray and laser recombining process flow process are as follows: adopt micro-pen or little spray direct-writing device that electric slurry is directly write earlier and be deposited on specified zone on the substrate, then with the slurry that LASER HEATING preset, obtain needed little cladding layer.After lasing, can also utilize micro-pen or little spray directly to write deposition apparatus and continue to add new material, prepare multiple material components and parts at grade or realize multilayer wiring.Micro-pen and little spray directly write the introducing of deposition apparatus, overcome the shortcoming that spin-coating method presets slurry coating technology, and industrial environment adaptability is good, and prospects for commercial application is also more wide.But existing workplatform can't satisfy the requirement of this recombining process, instrument distributes scattered, need the frequent direct-writing device of changing and clean when on same substrate, presetting multiple material, and reorientate the relative position of machining tool and substrate and adjust machined parameters, therefore add man-hour actual, the multiple action is more, operation steps is complicated, can't at utmost bring into play micro-pen, little spray and laser compound advantage, be difficult to satisfy the requirement of the quick compound manufacturing of industry, only be applicable to breadboard research work or small serial production.
Summary of the invention
The utility model is at the shortcoming of the little cladding equipment of present laser, provide a kind of new pattern laser little cladding specific equipment, this equipment appropriate design the installation station and the mode of operation of laser optical path, little spray and micro-pen, laser processing and micro-pen, little spray straight-writing system are integrated on the same workplatform, realize the mutual supplement with each other's advantages of multiple processing means.
The little cladding specific equipment of a kind of laser that the utility model provides, this equipment comprises worktable, laser-processing system and Controlling System, it is characterized in that, this system also comprises CCD monitoring and positioning system and straight-writing system;
The CCD monitoring and positioning system comprises coaxial ccd sensor, paraxonic ccd sensor, zoom lens, imaging eyepiece, varifocal optical system, paraxonic image-forming objective lens and external connection monitors; Laser condensing lens, imaging eyepiece, zoom lens and coaxial ccd sensor are positioned on the same light path successively, this light path becomes 90 ° of angles with the horizontal optical path of laser-processing system, and laser condensing lens and imaging eyepiece lay respectively at the both sides of laser-processing system horizontal optical path, and laser condensing lens is as the image-forming objective lens with shaft monitoring; Coaxial ccd sensor links to each other with external connection monitors, is directly shown the image of observation by external connection monitors; Paraxonic ccd sensor, varifocal optical system and paraxonic image-forming objective lens are located on the same light path successively, and are fixed on the rear of straight writing tools; The light beam that workpiece reflects is adjusted the back through varifocal optical system and is received by the paraxonic ccd sensor, and transfer to computer by the paraxonic image-forming objective lens;
Straight-writing system comprises micro-pen direct-writing device and little spray direct-writing device;
The structure of micro-pen direct-writing device is: second support is fixed on the pedestal, and guide rail and cylinder lay respectively at the both sides of second support, and first support is installed on the guide rail by slide block, and micro-pen is rack-mount, moves up and down with support; Cylinder is provided with airway, and support is fixedlyed connected with piston rod, and dial indicator is fixed on cantilever tip, is bolted on the support, and first, second microspur setting nut is determined its position by the extending area of the 3rd support, and is enclosed within on the bolt;
Little spray direct-writing device comprises water-bath, airway, micromanometer and little spray instrument; Wherein little spray instrument comprises atomization chamber, release recycling cavity and deposition nozzle again; Inlet air flow links to each other with micromanometer by airway, and the other end of micromanometer links to each other with atomization chamber, and atomization chamber links to each other with the release recycling cavity by airway; Atomization chamber and release recycling cavity all place water-bath; The other end of release recycling cavity is linked to each other with deposition nozzle by airway, and deposition nozzle sprays slurry and is deposited on substrate surface.
The equipment that the utility model provides combines micro-pen, little spray direct writing technology with laser processing technology, both can finish presetting of figure, can finish the manufacturing of figure again, saves with dry Kiln seasoned process, has shortened the process period of electronics pattern greatly.Particularly, the utlity model has following technique effect:
(1) adopts many micro-pens, micro-spray device, can realize different electronic materials directly writing on same substrate, also can realize the processing of multilayer electronic pattern, do not need to dismantle micro-pen, little spray structure and substrate, guarantee the accuracy of substrate position and processing.
(2) adopt micro-pen-laser, little spray-laser compounding technology, can on same substrate, carry out timesharing processing, can obtain (light) electronic devices and components fast.
(3) be equipped with detachable rotating shaft system on the operator's console, can on this equipment, realize the three-dimension flexible wiring, no material shape restriction.
(4) adopt paraxonic CCD system to process the location, coaxial CCD Monitoring systems is monitored laser processing procedure, being used of two portions transmitter, can either monitor in real time the course of processing, can accurately locate again, thereby can guarantee the precision of the whole course of processing, improve the processing quality of electronics pattern.
(5) adopt the special-purpose software of making of the little cladding of self-control laser that machining tool is controlled, the level of automation height, simple to operate, can effectively control working accuracy.
(5) operator's console below is equipped with detachable hot-plate, can heat substrate when directly writing, and accelerates the curing of slurry, shortens slurry in substrate diffusion time, reduces the lead live width.
(6) be uniform-distribution with inner threaded small through hole on the table top of operator's console, when substrate area is big, can directly use screw that substrate is fixed on the operator's console, can prevent that substrate position in the course of processing from changing influences working accuracy; Work material is a flexible base, board or breadth is less, weight is light when sliding easily, can be by the perforated plate that links to each other with off-gas pump be installed below operator's console, substrate is fixed on the operating table surface, and this method also can prevent the variation of substrate position in the course of processing and cause the reduction of working accuracy.
(7) operator's console is controlled by High Precision Linear Motor and closed-loop control system, and adopts the shockproof vibro-damping mount of marble, greatly reduces in the course of processing worktable to the influence of working accuracy.
Adopt this equipment both can finish the work of directly writing of single instrument fast, can carry out the composition operation of multiplex's tool again, need not mask, be easy to revise, operation is few, the lead time is short, efficient is high, environmental pollution is little, flexibility degree height, and the electronic devices and components pattern precision height that obtains also can be made complex figure and three-dimensional electronic components and parts.
Description of drawings
Fig. 1 is the side structure synoptic diagram of the little cladding specific equipment of laser of the present utility model;
Fig. 2 is little straight write device structural representation of the present utility model;
Fig. 3 is little spray direct-writing device structural representation of the present utility model;
Fig. 4 is the special-purpose software technology realization flow figure that makes of the little cladding of laser.
Embodiment
The employed laser apparatus of the utility model can be semiconductor laser, solid statelaser, optical fiber laser or lamp light-pumped solid state laser.Above-mentioned laser apparatus can adopt the continuous or quasi-continuous way of output.
The utility model is applicable to directly writing of multiple material, electric slurry of different nature, fast obtained performance good electron components and parts.Electric slurry comprises conductor paste, resistance slurry, dielectric paste or other electric slurries, and substrate can be materials such as pottery, glass, silicon, Resins, epoxy, polyimide.
Below in conjunction with accompanying drawing the utility model is further specified.
The utility model equipment mainly comprises worktable, laser-processing system, CCD monitoring and positioning system, straight-writing system and Controlling System five major parts.
As shown in Figure 1, worktable comprises operator's console 17, XY two dimension linear electric motors 18 and pedestal 19; Pedestal 19 adopts the shockproof vibro-damping mount of marbles, can reduce in the course of processing worktable to the influence of working accuracy; XY two dimension linear electric motors 18 are fixed on the pedestal 19, and operator's console 17 is installed on the XY two dimension linear electric motors 18, and by the motion of XY two dimension linear electric motors 18 red-tape operati platforms 17.
Laser-processing system comprises laser apparatus 1, optical gate 2, beam shaping mirror 3, beam expanding lens 4, metallic-membrane plating reflector 5 and laser condensing lens 6.
Laser apparatus 1, optical gate 2, beam shaping mirror 3, beam expanding lens 4 and metallic-membrane plating reflector 5 are positioned on the same light path successively, and laser apparatus 1, optical gate 2, beam shaping mirror 3 and beam expanding lens 4 are fixed on the pedestal 19, the light beam angle at 45 of metallic-membrane plating reflector 5 and laser apparatus 1.Laser condensing lens 6 is positioned on the reflected light path of metallic-membrane plating reflector 5.
The CCD monitoring and positioning system comprises coaxial ccd sensor 7, paraxonic ccd sensor 20, zoom lens 8, imaging eyepiece 9, varifocal optical system 21, paraxonic image-forming objective lens 22 and external connection monitors 24.
Laser condensing lens 6, imaging eyepiece 9, zoom lens 8 and coaxial ccd sensor 7 are positioned on the same light path successively, this light path becomes 90 ° of angles with the horizontal optical path of laser-processing system, and laser condensing lens 6 and imaging eyepiece 9 lay respectively at the both sides of the horizontal optical path of laser-processing system, and laser condensing lens 6 is as the image-forming objective lens with shaft monitoring; Coaxial ccd sensor 7 links to each other with external connection monitors 24, is directly shown the image of observation by external connection monitors 24.
Paraxonic ccd sensor 20, varifocal optical system 21 and paraxonic image-forming objective lens 22 are located on the same light path successively, and are fixed on the rear of straight writing tools.The light beam that workpiece reflects is adjusted the back through varifocal optical system 21 and is received by paraxonic ccd sensor 20, and transfer to Controlling System by paraxonic image-forming objective lens 22, and Controlling System adopts the computer 23 that control card is housed, the demonstration of control chart picture.
Straight-writing system comprises micro-pen direct-writing device and little spray direct-writing device.The micro-pen direct-writing device as shown in Figure 2, support 25B is fixed on the pedestal 19, and guide rail 27 and cylinder 28 lay respectively at the both sides of support 25B, and support 25A is installed on the guide rail 27 by slide block 26, micro-pen 16 is installed on the support 25A, and 25A moves up and down with support.Gas enters cylinder 28 by airway 11, the motion of the piston rod 29 by Controlling System control cylinder 28.Support 25C is fixedlyed connected with piston rod 29, and dial indicator 13 is fixed on support 25C top, the end of the thief rod of dial indicator 13 be positioned at bolt 14 directly over, and contact with it.Bolt 14 is fixed on the support 25A by nut 15C, and microspur setting nut 15A and microspur setting nut 15B determine its position by the extending area of support 25C, and are enclosed within on the bolt 14.
When Controlling System control cylinder 28, piston rod 29 is moved downward and when carrying out screens, piston rod 29 drive support 25C and the dial indicator 13, microspur setting nut 15A, the microspur setting nut 15B that are fixed on the support 25C descend simultaneously, and this moment, the thief rod position of dial indicator 13 did not change.Bolt 14 is owing to the decline of microspur setting nut 15A and microspur setting nut 15B descends, thereby driving nut 15C, support 25A moves downward together, slide block 26 is followed 25A and is moved on guide rail 27, it is downward together that the micro-pen 16 that is fixed on support 25A is also followed 25A, the working order that enter little the pen or shape tool this moment.When Controlling System control cylinder 28, piston rod 19 is moved upward and when carrying out screens, all parts move upward thereupon, enter the micro-pen off working state this moment.
When piston rod 29 maintains static, only regulate microspur setting nut 15A and microspur setting nut 15B and when locking, have only screw rod 14 can drive nut 15C, support 25A, slide block 26 and micro-pen 16 and move up and down.Simultaneously, the thief rod of dial indicator 13 can move up and down, and the side-play amount of pointer provides the accurate distance that micro-pen 16 moves up and down.Be micro-pen 16 fine position states this moment.Be rotated counterclockwise microspur setting nut 15A and 15B, micro-pen descends; Turn clockwise microspur setting nut 15A and 15B, micro-pen rises.
Little spray direct-writing device comprises water-bath 10, airway 11, micromanometer 12 and little spray instrument as shown in Figure 3; Wherein little spray instrument comprises atomization chamber 31, release recycling cavity 32 and deposition nozzle 33 again.Inlet air flow links to each other with micromanometer 12 by airway 11, and the other end of micromanometer 12 links to each other with atomization chamber 31, and atomization chamber 31 links to each other with release recycling cavity 32 by airway 11.Regulate micromanometer 12 and can among a small circle, measure and regulate the flow of driving gas, control air-flow in the straight writing tools of little spray, and can accurately measure air-flow size in little spray instrument.Figure 3 shows that atomization chamber 31 and release recycling cavity 32 are all placed water-bath 10, certain quantity solution 30 is housed in the water-bath 10, can carry out the whole constant temperature heating to atomization chamber 31 and release recycling cavity 32, also can realize atomizing, deposition smoothly with the electric slurry and the responsive to temperature type electric slurry that guarantee big viscosity, and not be subjected to or be subjected to less the influence of envrionment temperature.The other end of release recycling cavity 32 is linked to each other with deposition nozzle 33 by airway 11, and deposition nozzle 33 sprays slurry and is deposited on substrate 34 surfaces.Operator's console 17 moves under the control of computer 23, and deposition is directly write out the pattern of graphic file regulation.
The operation of little pen device and micro-spray device drives by gas, gas is derived from external gas storage equipment, in the gas passage, insert micromanometer 12 with control and demonstration airway internal gas pressure size, link to each other with micro-spray device with little pen device respectively by airway 11 again, form complete processing path.
Controlling System can adopt the computer 23 that control card is housed to realize the integral body of the little cladding equipment of laser is controlled.The little cladding of laser in the computer 23 is special-purpose make software send instruction can be respectively or control opening the light or closing the motion of light, XY two dimension linear electric motors 18, the directly lifting, the demonstration of paraxonic ccd sensor 20 signal output interfaces of writing tools of laser apparatus 1 simultaneously.Shown in Figure 4 is the special-purpose technology realization flow figure that makes software of the little cladding of laser.
Concrete workflow is as follows:
The laser that emits from laser apparatus 1 is by the open and-shut mode of optical gate 2 control laser in the course of processing, carry out beam shaping by 3 pairs of laser of beam shaping mirror, enlarge conversion to reduce the angle of divergence via 4 pairs of light beams of beam expanding lens again, (laser is all-trans laser beam behind the expansion bundle by metallic-membrane plating reflector 5, visible light can be thoroughly) change the laser direct of travel, reflex to laser condensing lens 6 places, focus on by 6 pairs of laser beams of laser condensing lens, adjust the spot size on the workpiece surface that is fixed on operator's console 17 by the camera lens of adjustment laser condensing lens 6 and the distance (being the Z axle) of workpiece surface, choose the laser facula size that is fit to processing and process.
When processing graphic pattern is X-Y scheme, workpiece is positioned on the operator's console 17, according to actual processing request, adjust the distance between laser condensing lens 6 and the workpiece, operator's console 17 is followed XY two dimension linear electric motors 18 and is moved in the XY two dimensional surface and finish the processing of laser to workpiece; When graphics processing is three-dimensional, can on operator's console 17, rotating shaft be installed, it is four-axle linked to control XYZU by little claddings manufacturing special software of installing in the computer 23 again, finishes the 3 D stereo manufacturing.
The visible light of workpiece surface images on the target surface of coaxial ccd sensor 7 by laser condensing lens 6 (as the object lens of visual light imaging system), imaging eyepiece 9 and zoom lens 8, change into numerary signal behind the coaxial ccd sensor 7 collection optical signals and show, can monitor in real time workpiece surface processing situation in the laser processing procedure by external connection monitors 24.
In order to ensure working accuracy, need the position of pattern on machining tool and the workpiece be positioned.At first on test board, draw out positioning pattern by machining tool, by traverser the positioning pattern on the substrate is moved under the paraxonic image-forming objective lens 22, visible light on the workpiece is by paraxonic image-forming objective lens 22, process varifocal optical system 21 is carried out conversion and is imaged on the target surface of paraxonic ccd sensor 20, paraxonic ccd sensor 20 is gathered optical signalling and is changed into numerary signal and is sent in the computer 23, demonstrates the image that the paraxonic station-keeping system observes by computer 23.Go out the distance at machining tool center and paraxonic image-forming objective lens 22 centers by computed in software according to positioning pattern.
Processing work is repeated to add man-hour, and need carry out conversion to graphics processing according to the putting position of workpiece on operator's console 17 in the program of the little cladding specific equipment of laser control software, are directly processed by oriented machining tool to get final product again.
Can realize that except adopting laser the also available micro-pen of this device and little spray realize directly writing function the quick function of directly writing.
Three cover micro-pen direct-writing devices and the little spray direct-writing device of two covers are housed in this equipment, user's different electric slurry of can in micro-pen and atomization chamber, packing into, by determining of relative position, can carry out the continuous or alternation of multiplex's tool, workpiece need not be taken out and reorientate, shorten the manufacturing time of (light) electronic devices and components.In addition, for the homogeneity that guarantees to atomize, for general commercial slurry, the temperature in the water-bath is controlled between 30 ℃ to 80 ℃.
This equipment can also be realized the Compound Machining of micro-pen-laser, little spray-laser except realizing the Compound Machining of many micro-pens, many little spray instruments.After determining the absolute location of laser and other instruments by computer 23 and paraxonic station-keeping system, calculate the relative distance of tool room.By in the software of Controlling System, drawing out the figure of preprocessing, by the motion of Controlling System control machining tool, on substrate, preset rete again according to design requirements; The hot-plate that install the worktable below can make rete fast setting on substrate, need not place drying oven to dry, and shortens the rete preset time; Computer 23 is according to the relative position value of laser with straight writing tools then, directly will preset rete and move to the laser below and carry out laser scanning, substrate need not be taken off and reorientate, and finishes the Compound Machining of micro-pen-laser, little spray-laser.Adopt this method to carry out the processing of electronic devices and components, the working accuracy height, speed is fast, level of automation is high, shortened process period greatly.
The utility model not only is confined to above-mentioned embodiment; persons skilled in the art are according to the disclosed content of the utility model; can adopt other multiple embodiment to implement the utility model; therefore; every employing project organization of the present utility model and thinking; do some simple designs that change or change, all fall into the scope of the utility model protection.
Claims (3)
1. little cladding specific equipment of laser, this equipment comprises worktable, laser-processing system and Controlling System, it is characterized in that, this system also comprises CCD monitoring and positioning system and straight-writing system;
The CCD monitoring and positioning system comprises coaxial ccd sensor (7), paraxonic ccd sensor (20), zoom lens (8), imaging eyepiece (9), varifocal optical system (21), paraxonic image-forming objective lens (22) and external connection monitors (24); Laser condensing lens (6), imaging eyepiece (9), zoom lens (8) and coaxial ccd sensor (7) are positioned on the same light path successively, this light path becomes 90 ° of angles with the horizontal optical path of laser-processing system, and laser condensing lens (6) and imaging eyepiece (9) lay respectively at the both sides of laser-processing system horizontal optical path, and laser condensing lens (6) is as the image-forming objective lens with shaft monitoring; Coaxial ccd sensor (7) links to each other with external connection monitors (24), is directly shown the image of observation by external connection monitors (24); Paraxonic ccd sensor (20), varifocal optical system (21) and paraxonic image-forming objective lens (22) are located on the same light path successively, and are fixed on the rear of straight writing tools; The light beam that workpiece reflects is adjusted the back through varifocal optical system (21) and is received by paraxonic ccd sensor (20), and transfer to computer (23) by paraxonic image-forming objective lens (22);
Straight-writing system comprises micro-pen direct-writing device and little spray direct-writing device;
The structure of micro-pen direct-writing device is: second support (25B) is fixed on the pedestal (19), guide rail (27) and cylinder (28) lay respectively at the both sides of second support (25B), first support (25A) is installed on the guide rail (27) by slide block (26), micro-pen (16) is installed on the support (25A), and (25A) moves up and down with support; Cylinder (28) is provided with airway (11), support (25C) is fixedlyed connected with piston rod (29), dial indicator (13) is fixed on support (25C) top, bolt (14) is fixed on the support (25A), first, second microspur setting nut (15A, 15B) is determined its position by the extending area of the 3rd support (25C), and is enclosed within on the bolt (14);
Little spray direct-writing device comprises water-bath (10), airway (11), micromanometer (12) and little spray instrument; Wherein little spray instrument comprises atomization chamber (31), release recycling cavity (32) and deposition nozzle (33) again; Inlet air flow links to each other with micromanometer (12) by airway (11), and the other end of micromanometer (12) links to each other with atomization chamber (31), and atomization chamber (31) links to each other with release recycling cavity (32) by airway (11); Atomization chamber (31) all places water-bath (10) with release recycling cavity (32); The other end of release recycling cavity (32) is linked to each other with deposition nozzle (33) by airway (11), and deposition nozzle (33) sprays slurry and is deposited on substrate (34) surface.
2. the little cladding specific equipment of kind of laser according to claim 1 is characterized in that, worktable comprises operator's console (17), XY two dimension linear electric motors (18) and pedestal (19); XY two dimension linear electric motors (18) are fixed on the pedestal (19), and operator's console (17) is installed in the top of XY two dimension linear electric motors (18), and the motion of red-tape operati platform (17).
3. the little cladding specific equipment of kind of laser according to claim 1 is characterized in that, laser-processing system comprises laser apparatus (1), optical gate (2), beam shaping mirror (3), beam expanding lens (4), metallic-membrane plating reflector (5) and laser condensing lens (6);
Laser apparatus (1), optical gate (2), beam shaping mirror (3), beam expanding lens (4) and metallic-membrane plating reflector (5) are positioned on the same light path successively, laser apparatus (1), optical gate (2), beam shaping mirror (3) and beam expanding lens (4) are fixed on the pedestal of worktable, the light beam angle at 45 of metallic-membrane plating reflector (5) and laser apparatus (1); Laser condensing lens (6) is positioned on the reflected light path of metallic-membrane plating reflector (5).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020628633 CN201901704U (en) | 2010-11-26 | 2010-11-26 | Special laser micro-cladding equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020628633 CN201901704U (en) | 2010-11-26 | 2010-11-26 | Special laser micro-cladding equipment |
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| CN201901704U true CN201901704U (en) | 2011-07-20 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011123A (en) * | 2010-11-26 | 2011-04-13 | 华中科技大学 | Special equipment for laser micro-cladding |
| CN108746991A (en) * | 2018-05-21 | 2018-11-06 | 大连理工大学 | A kind of portable fixed point power spreading device and its application method |
| CN110431020A (en) * | 2017-03-15 | 2019-11-08 | 波尔多大学 | Device and method for the deposited particles in target |
| CN111516368A (en) * | 2020-05-25 | 2020-08-11 | 江苏盛矽电子科技有限公司 | Preparation method of polyimide solar screen printing plate |
-
2010
- 2010-11-26 CN CN 201020628633 patent/CN201901704U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011123A (en) * | 2010-11-26 | 2011-04-13 | 华中科技大学 | Special equipment for laser micro-cladding |
| CN102011123B (en) * | 2010-11-26 | 2012-07-04 | 华中科技大学 | Special equipment for laser micro-cladding |
| CN110431020A (en) * | 2017-03-15 | 2019-11-08 | 波尔多大学 | Device and method for the deposited particles in target |
| CN108746991A (en) * | 2018-05-21 | 2018-11-06 | 大连理工大学 | A kind of portable fixed point power spreading device and its application method |
| CN111516368A (en) * | 2020-05-25 | 2020-08-11 | 江苏盛矽电子科技有限公司 | Preparation method of polyimide solar screen printing plate |
| CN111516368B (en) * | 2020-05-25 | 2021-02-23 | 江苏盛矽电子科技有限公司 | Preparation method of polyimide solar screen printing plate |
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