CN201893927U

CN201893927U - Midget microphone module

Info

Publication number: CN201893927U
Application number: CN201020670000XU
Authority: CN
Inventors: 张胜坤; 杨道沧
Original assignee: Merry Electronics Shenzhen Co ltd
Current assignee: Merry Electronics Shenzhen Co ltd
Priority date: 2010-12-17
Filing date: 2010-12-17
Publication date: 2011-07-06
Anticipated expiration: 2020-12-17

Abstract

The utility model discloses a midget microphone module, which comprises a condenser microphone and a switch sleeve. One end of the condenser microphone is provided with sound holes for receiving outside sound sources, the other end of the condenser microphone is provided with a circuit board, the outer surface of the circuit board is provided with a first electrode and a second electrode, the switch sleeve is sleeved at the outer side of the circuit board and is provided with an electric conduction part, and the electric conduction part is selectively contacted with the first and the second electrodes for starting/stopping the pickup function of the condenser microphone. The midget microphone module does not need an additional circuit board and a switch assembly, so the integral member can be simplified, meanwhile, the volume and assembly cost can be reduced, and the reliability and the competitiveness of a product can be improved.

Description

The midget microphone module

[technical field]

The utility model belongs to the midget microphone technical field, and particularly a kind of conduction grain that utilizes is as the midget microphone module that opens and closes microphone pickup function.

[background technology]

Fast development along with wireless communication technology, portable telephone device has been an indispensable instrument of daily life, and be usually used in the Handless of portable telephone device, it mainly is provided with microphone by means of controller, as the pickup function, and this microphone is generally the Electret Condencer Microphone that uses microminiaturization.Figure 1 shows that the controller profile of existing handfree receiver unit: controller 10 includes a lid 11, push up in order to be pressed and to pull in a switch 12, and a switch 12 and an Electret Condencer Microphone 13 are arranged on the circuit board 14, are opened and closed the pickup function of Electret Condencer Microphone 13 by push switch 12.

Yet existing structure and imperfect mainly is to be that switch 12 and Electret Condencer Microphone 13 must be welded on the circuit board 14, and such structure setting not only occupies number space more than controller 10 inside, and the whole spare part cost that uses is increased; Moreover, because circuit board 14 is one of necessary formations, no matter how microminiaturized Electret Condencer Microphone 13 is, circuit board 14 still needs to keep 12 groups of zones of establishing of switch, and thus, controller 10 is except the space of reserving circuit board 14, it is to every assembly of inductive switch 12, also make the volume of controller 10 just can't effectively reduce, make corresponding electro-acoustic product be restricted in design, also do not meet the expectation of consumer for the electro-acoustic product microminiaturization.

[utility model content]

Because above-mentioned problem, the purpose of this utility model is to provide a kind of midget microphone module, utilizes a switch cover to have the conductive part of conduction grain, optionally is contacted with Electret Condencer Microphone, to reach the pickup function of control capacitance formula microphone, solve the defective that prior art exists.

For achieving the above object, midget microphone module described in the utility model includes an Electret Condencer Microphone, and an end has a sound hole and receives extraneous source of sound, and the other end has a circuit board, and the lateral surface of circuit board is provided with one first electrode and one second electrode; An and switch cover, be installed in the lateral surface of circuit board, and the switch cover has a conductive part, optionally be contacted with first electrode and second electrode, to open and close the pickup function of Electret Condencer Microphone, by this, the utility model need not use extra circuit board and switch module, just can simplify integrated member, can reduce volume and assembly cost simultaneously, help promoting the reliability and the competitiveness of product.

[description of drawings]

Fig. 1 is the controller cross-sectional view of existing handfree receiver unit.

Fig. 2 is the surface structure schematic diagram of midget microphone module described in the utility model.

Fig. 3 is the cross-sectional view of midget microphone module described in the utility model.

Fig. 4 is the action schematic diagram of midget microphone module described in the utility model.

Fig. 5 is the cross-sectional view that is implemented on the Handless described in the utility model.

[primary clustering symbol description]

[embodiment]

Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.

Fig. 2 is the schematic appearance of the described midget microphone module of present embodiment.The midget microphone module includes an Electret Condencer Microphone 100 and switch cover 200; Electret Condencer Microphone 100 1 ends are provided with a circuit board 101, it is provided with one first electrode 102 and one second electrode 103, and overlapping 200 inboards, switch is provided with a conductive part 201, so that switch cover 200 is sheathed on the end of the circuit board 101 of Electret Condencer Microphone 100, and by conductive part 201 selective exposures, first electrode 102 and second electrode 103 of switch cover 200, keying with control capacitance formula microphone 10 makes it to be in pickup state or closed condition.Wherein, switch cover 200 is made for the silica gel material, and conductive part 201 then adopts carbon or golden conduction grain, and switch overlaps 200 outsides and has a sleeved part 202, be provided with a suitable space between sleeved part 202 and the conductive part 201, so that switch cover 200 is placed on the outer rim of Electret Condencer Microphone 100.

Fig. 3 is the profile of the described midget microphone module of present embodiment.Electret Condencer Microphone 100 includes in addition: a shell 20, an electret 30, a vibration component 40, an insulating washer 50 and a dead ring 60.

Shell 20 is made for metal material, and shell 20 is provided with a sound hole 21, in order to receive extraneous source of sound.

Circuit board 101 is fixed in the open end of shell 20 with mechanical combination, the inner surface of circuit board 101 is provided with a field-effect transistor 104, and field-effect transistor 104 utilizes electrode and

first electrode

102 and 103 electric connections of second electrode of circuit board 101 inner surfaces respectively, this connected mode is a prior art, does not repeat them here.

Electret 30 is arranged at and is adjacent to sound hole 21 sides in the shell 20, and electret 30 has several pores 31 and be communicated with sound hole 21, in order to sound air communication mistake to be provided.

Vibration component 40 comprises the retainer ring 42 that a vibrating membrane 41 and a metal material are made, retainer ring 42 1 ends are in order to support vibrating membrane 41, end is connected to circuit board 101 in addition, 50 of insulating washers are arranged between vibrating membrane 41 and the electret 30, make vibrating membrane 41 and electret 30 middle positions keep a spacing.

Dead ring 60 is installed between shell 20 and the retainer ring 42, forms short circuit in order to prevent shell 20 with retainer ring 42 conductings.

When external sound source enters in the shell 20 via sound hole 21, pore 31, vibrating membrane 41 be subjected to the sound airstream vibration and and the distance between the electret 30 change, and then cause capacitance between the two to change, and the field-effect transistor 104 that is passed to circuit board 101 handles, and makes it to convert to corresponding electric signal.

Fig. 4 is the action schematic diagram of the described midget microphone module of present embodiment.Be sheathed on the Electret Condencer Microphone 100 by switch cover 200, and switch cover 200 is the event of silica gel material, when switch overlaps 200 stressed being pressed, switch cover 200 distortion slightly, make the conductive part 201 that has the conduction grain can be contacted with first electrode 102 and second electrode 103 of Electret Condencer Microphone 100, in order to control capacitance formula microphone 100 pickups whether, make when the described midget microphone module of present embodiment applies to the Handless of mobile phone, need not additionally increase by a circuit board, arrangement as Electret Condencer Microphone and switch, except the man-hour that can reduce processing procedure and assembling, also can avoid the increase of fraction defective.

Fig. 5 is implemented on profile on the Handless for present embodiment.Present embodiment is arranged at the midget microphone module in one housing 300, housing 300 is the Handless part of mobile phone, make Electret Condencer Microphone 100 be arranged in the housing 300, and switch cover 200 as spacing and sealing Electret Condencer Microphone 100 in housing 300, and the outer rim of switch cover 200 is connected to this housing 300 upper limbs.Wherein, the side of housing 300 has a through hole 301 and is communicated with the sound hole 21 of Electret Condencer Microphone 100, in order to receive the source of sound outside the housing 300, thus, Handless can reduce volume, and has more microminiaturized advantage compared to existing product, meets consumer's the expectation and the market demand.

Comprehensively above-mentioned, the described midget microphone module of present embodiment, directly be placed on the circuit board lateral surface of Electret Condencer Microphone by the switch cover, and the material behavior of utilizing silica gel material switch to overlap, contact with second electrode with first electrode of circuit board so that have the conductive part of conduction grain, opened the pickup function of Electret Condencer Microphone, so present embodiment is with respect to existing structure, need not Electret Condencer Microphone be assemblied in step and operation on another circuit board, reduced the fraction defective of making effectively, also reduced the cost of assembling, the feasible competitive advantage that the utlity model has on the industry; In addition, volume of the present utility model can be compacter more than existing structure, more can meet present electronic product and move towards microminiaturized trend.

The above only is an illustrative, but not is restricted.Anyly do not break away from spirit of the present utility model and category, and it is carried out equivalent modifications or change, all should be contained in the middle of the scope of this patent.

Claims

1. a midget microphone module is characterized in that, comprising:

One Electret Condencer Microphone, one end have a sound hole and receive extraneous source of sound, and the other end has a circuit board, and the lateral surface of this circuit board is provided with one first electrode and one second electrode; And

One switch cover is the lateral surface that is sheathed on this circuit board, and this switch cover has a conductive part, and it optionally is contacted with this first electrode and this second electrode, to open and close the pickup function of this Electret Condencer Microphone.

2. midget microphone module as claimed in claim 1 is characterized in that: described conductive part is the carbonaceous conductive grain.

3. midget microphone module as claimed in claim 1 is characterized in that: described conductive part is gold conduction grain.

4. midget microphone module as claimed in claim 1 is characterized in that: described switch cover is the silica gel switch cover.

5. midget microphone module as claimed in claim 1 is characterized in that: described switch cover has a sleeved part, in order to be sheathed on the outer rim of this Electret Condencer Microphone.

6. midget microphone module as claimed in claim 5 is characterized in that: be provided with a space that is fit between described sleeved part and this conductive part.

7. midget microphone module as claimed in claim 1 is characterized in that: described midget microphone module is arranged in the housing, and this housing has a through hole that is in communication with the outside, and this through hole is communicated with described sound hole.

8. midget microphone module as claimed in claim 7 is characterized in that: the outer rim of described switch cover is connected to described housing upper limb.

9. midget microphone module as claimed in claim 1 is characterized in that: the medial surface of described circuit board is provided with a field-effect transistor, and this field-effect transistor and this first electrode and this second electrode electrically connect.