CN201892593U - Backpressure sensor - Google Patents
Backpressure sensor Download PDFInfo
- Publication number
- CN201892593U CN201892593U CN2010205464565U CN201020546456U CN201892593U CN 201892593 U CN201892593 U CN 201892593U CN 2010205464565 U CN2010205464565 U CN 2010205464565U CN 201020546456 U CN201020546456 U CN 201020546456U CN 201892593 U CN201892593 U CN 201892593U
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- chip
- substrate
- base plate
- tubular body
- sensor
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Abstract
The utility model relates to a backpressure sensor, which comprises a chip, a base plate, an O-shaped seal ring and an outer casing. The outer casing is the shape of an integral round tube composed of round tubes of different diameter. The backpressure sensor is characterized in that the sensor is in a backpressure packaging structure, the base plate is embedded in the large-diameter round tube, the O-shaped seal ring is arranged between the lower surface of the base plate and a circular plane of a joint of the round tubes, the chip is adhered on the base plate, the base plate is provided with a small hole, an inner bore of the outer casing is communicated with the small hole on the base plate, and the small hole is communicated to the lower surface of a sensitive diaphragm on the chip. The backpressure sensor has the advantages of simplicity in structure and packaging process, low cost, high reliability, long service life and the like, and is applicable to pressure measurement of most non-corrosiveness gas and liquid media on severe environmental conditions.
Description
Technical field
The utility model relates to a kind of pressure transducer, particularly a kind of pressure transducer of back pressure type.
Background technology
Pressure transducer is at metrological service, auto industry, Aero-Space navigation, petrochemical complex, commercial unit, water conservancy, medical treatment, electric power, air-conditioning, tire pressure monitoring system, MAP fields such as (manifold absolutepressure sensor) has a wide range of applications.In different fields, the applied environment difference of sensor, the performance of sensor and encapsulation are required also different, but identical be all require packaging technology as far as possible simply, cost is cheap as far as possible.And the pressure transducer great majority that can provide at present are made up of the conditioning amplifying circuit that the sensitive element of insulation package adds the rear end, thereby manufacturing process more complicated, cost is higher, and the characteristic of chip also can be subjected to complicated potting process influence, and market wishes to have better product to provide.
Summary of the invention
The purpose of this utility model is at the defective that exists in the prior art, a kind of back pressure type pressure transducer is provided, promptly by certain packaged type, allow the back pressurized of sensor chip, thereby abandoned complicated oil-filled insulation package mode, this sensor is applicable to the pressure survey of most of non-corrosiveness gases and liquid under the severe environmental conditions.The utility model comprises: chip, substrate, O-ring seals, shell, the round tubular body of the integral body that shell is combined by the round tubular body of different-diameter, the joint portion of the round tubular body of different-diameter is a disk, it is characterized in that described sensor is the back pressure type encapsulating structure, substrate is inlaid in the major diameter circle tubular body, be provided with an O-ring seals between the disk of the lower surface of substrate and circle tubular body joint portion, the top of shell minor diameter is the test port of pressure transducer, chip attach is on substrate, substrate is provided with an aperture, the position of sensitive diaphragm is corresponding on the position of aperture and the chip, the endoporus of shell minor diameter circle tubular body communicates with the aperture on the substrate, and aperture communicates with sensitive diaphragm lower surface on the chip.Chip is the MEMS chip of micro mechanical structure or the conglomerate of MEMS chip and asic chip.
The utility model has the advantages that structure and packaging technology are simple, with low cost, the reliability height, advantages such as long service life are applicable to the pressure survey of most of non-corrosiveness gases and liquid medium under the severe environmental conditions.
Description of drawings
Fig. 1 structural representation of the present utility model.
Among the figure: 1 chip, 2 substrates, 3O shape O-ring seal, 4 shells.
Embodiment
Further specify embodiment of the present utility model below in conjunction with accompanying drawing:
Utility model is by chip 1, substrate 2, O-ring seals 3, shell 4 is formed, the utility model is the back pressure type encapsulating structure, promptly allow the back pressurized of sensor chip, abandoned complicated oil-filled insulation package mode, the round tubular body of the integral body that shell 4 is formed by the round tubular body stack combinations of different-diameter, the joint portion of the round tubular body of different-diameter is a disk, the similar T type of the xsect of shell 4, substrate 2 is inlaid in the major diameter circle tubular body, be provided with an O-ring seals 3 between the disk of the lower surface of substrate 2 and circle tubular body joint portion, the top of shell 4 minor diameters is the test port of pressure transducer, chip 1 sticks on substrate 2, substrate 2 is provided with an aperture, the position of the sensitive diaphragm on the position of aperture and the chip 1 is corresponding, the endoporus of shell 4 minor diameters circles tubular body communicates with the aperture on the substrate 2, and aperture communicates with sensitive diaphragm lower surface on the chip 1.Outside gas or liquid medium enter the endoporus that minor diameter is justified tubular body through the test port of pressure transducer, are delivered on the sensitive diaphragm of chip 1 through the aperture on the substrate 2 again.Chip is the MEMS chip of micro mechanical structure or the integrated pressure body of MEMS chip and asic chip.Substrate 2 and O-ring seals 3 cooperate realizes sealing, shell 4 protection whole sensor inner structures.The pressure transducer of back pressure type in the pressure limit that can bear, the linear ratio of the electric signal of output and pressure.
Claims (2)
1. back pressure type pressure transducer, comprise: chip, substrate, O-ring seals, shell, the round tubular body of the integral body that shell is combined by the round tubular body of different-diameter, the joint portion of the round tubular body of different-diameter is a disk, it is characterized in that described sensor is the back pressure type encapsulating structure, substrate is inlaid in the major diameter circle tubular body, be provided with an O-ring seals between the disk of the lower surface of substrate and circle tubular body joint portion, the top of shell minor diameter is the test port of pressure transducer, chip attach is on substrate, substrate is provided with an aperture, the position of sensitive diaphragm is corresponding on the position of aperture and the chip, the endoporus of shell minor diameter circle tubular body communicates with the aperture on the substrate, and aperture communicates with sensitive diaphragm lower surface on the chip.
2. back pressure type pressure transducer according to claim 1 is characterized in that described chip is the MEMS chip of micro mechanical structure or the conglomerate of MEMS chip and asic chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205464565U CN201892593U (en) | 2010-09-28 | 2010-09-28 | Backpressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205464565U CN201892593U (en) | 2010-09-28 | 2010-09-28 | Backpressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201892593U true CN201892593U (en) | 2011-07-06 |
Family
ID=44222067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205464565U Expired - Fee Related CN201892593U (en) | 2010-09-28 | 2010-09-28 | Backpressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201892593U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980717A (en) * | 2012-11-16 | 2013-03-20 | 江苏科技大学 | Back pressure type mechanical seal structure of pressure sensor without power wire plugging |
| CN103674397A (en) * | 2013-12-03 | 2014-03-26 | 新会康宇测控仪器仪表工程有限公司 | High-overload back pressure type absolute-pressure sensor module and manufacturing technology thereof |
-
2010
- 2010-09-28 CN CN2010205464565U patent/CN201892593U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980717A (en) * | 2012-11-16 | 2013-03-20 | 江苏科技大学 | Back pressure type mechanical seal structure of pressure sensor without power wire plugging |
| CN102980717B (en) * | 2012-11-16 | 2014-11-05 | 江苏科技大学 | Back pressure type mechanical seal structure of pressure sensor without power wire plugging |
| CN103674397A (en) * | 2013-12-03 | 2014-03-26 | 新会康宇测控仪器仪表工程有限公司 | High-overload back pressure type absolute-pressure sensor module and manufacturing technology thereof |
| CN103674397B (en) * | 2013-12-03 | 2016-04-20 | 新会康宇测控仪器仪表工程有限公司 | High overload back pressure type absolute pressure sensor module and manufacturing process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110706 Termination date: 20110928 |