CN201886709U - High-pixel-density light emitting diode (LED) display module group - Google Patents
High-pixel-density light emitting diode (LED) display module group Download PDFInfo
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- CN201886709U CN201886709U CN2010206388836U CN201020638883U CN201886709U CN 201886709 U CN201886709 U CN 201886709U CN 2010206388836 U CN2010206388836 U CN 2010206388836U CN 201020638883 U CN201020638883 U CN 201020638883U CN 201886709 U CN201886709 U CN 201886709U
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- pcb panel
- pixel density
- drain pan
- high pixel
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Abstract
The utility model discloses a high-pixel-density light emitting diode (LED) display module group, which comprises a face mask, a printed circuit board (PCB) panel, an insulation board and a bottom case and is characterized in that the PCB panel is the PCB panel integrating a lamp and a driver, LED lamps are regularly distributed on the PCB panel, one side of the bottom case right against the PCB panel is provided with a groove corresponding to a device arranged at the bottom surface of the PCB panel, and heat conductive silica gel is placed in the groove. The high-pixel-density LED display module group disclosed by the utility model has the beneficial effects that: according to the module group with the structure, the pixel density of the module group can be greatly increased, the resolution ratio of a display screen is improved, and in addition, the heat radiation problem of the module group is completely solved, so when the module group works, the brightness is high, the weakening is low, the consistency is good, and the reliability and the weatheability are high.
Description
Technical field
The utility model relates to the LED demonstration module that a kind of LED shows module, particularly a kind of high pixel density.
Background technology
At present, the dot spacing major part of full-color LED display screen all is not more than 6mm, the more common indoor LED display that p6, p8, p10, p12 and p16 spacing are arranged; And the development trend of display screen is that dot spacing is more and more littler at present, resolution is more and more higher, require closely to watch display image not have color lump, exquisiteness, soft, gorgeous, the display screen of this high display quality could satisfy the more and more higher requirement of consumer to terminal display.But the technological side of doing little spacing full-color LED display screen is to following problem:
First; Dot spacing is little, and the pixel point density height adds the mode of dynamic scan, must be in the face of the problem of complex circuit board wiring.
Second; The module heat radiation of high pixel point density is a big problem.At first, the unit area pixel is many, and it is big to produce heat; Secondly, the single chip power-consumption of dynamic scan is big.Add in the general module casing fan or directly template be well to solve little spacing module heat dissipation problem as for indoor device.
The utility model content
The technical problems to be solved in the utility model provides a kind of high pixel density, and the LED of module good heat dissipation effect shows module.
In order to solve the problems of the technologies described above, the technical scheme that its technical matters that solves the utility model adopts is: provide a kind of LED of high pixel density to show module, comprise face shield, PCB panel, insulcrete and drain pan, it is characterized in that, described PCB panel is the PCB panel that lamp drives unification, regular distribution LED lamp on the PCB panel, described drain pan simultaneously is provided with and PCB panel bottom surface device corresponding grooves over against the PCB panel, places heat conductive silica gel in the described groove.
Wherein, the pel spacing of described LED lamp is 3mm.
Wherein, described PCB panel is the multilayer circuit board structural design.
Wherein, described PCB panel bottom surface is fixed with and is used for the copper post that fixes with drain pan, and described copper post is provided with and is used for the screw thread that fixes with bolt.
Wherein, described face shield adopts silica gel to make, and cover is attached on the pcb board.
Wherein, described pad insulating film is between PCB panel and drain pan, and insulating trip is provided with the corresponding room that gets with PCB panel bottom surface device.
Wherein, also include the pipe standing groove that is used to hold the chip standing groove of chip for driving and is used to hold field effect transistor in the groove of described drain pan, place the heat conductive silica gel of respective shapes respectively at chip standing groove and pipe standing groove.
Wherein, the back side of described drain pan is schistose texture and is provided with radiating groove.
Wherein, the screw that power interface interts mouth, interspersed mouthful of signaling interface and can supply bolt to pass is also designed at the back side of described drain pan.
Wherein, the back side of described drain pan further is equipped with the pilot pin of positioning module, and described pilot pin is located by connecting with the packing casing.
The beneficial effects of the utility model are, the module of this structure can increase the picture element density of module greatly, improves the resolution of display screen, and has solved the heat dissipation problem of module fully, when making this module work, the high and low decay of brightness, high conformity, high reliability and high-weatherability.
Description of drawings
Below in conjunction with accompanying drawing embodiment of the present utility model is described in further detail.
Fig. 1 is that the LED of the high pixel density of utility model embodiment shows the local structure for amplifying synoptic diagram of module;
Fig. 2 is the drain pan Facad structure synoptic diagram that the LED of the high pixel density of utility model embodiment shows module;
Fig. 3 is the local structure for amplifying synoptic diagram of PCB panel that the LED of the high pixel density of utility model embodiment shows module;
Fig. 4 is the local structure for amplifying synoptic diagram of face shield that the LED of the high pixel density of utility model embodiment shows module;
Fig. 5 is the insulation fin construction synoptic diagram that the LED of the high pixel density of utility model embodiment shows module;
Fig. 6 is the drain pan structure signal that the LED of the high pixel density of utility model embodiment shows module.
Wherein, 1: face shield;
The 2:PCB panel; The 21:LED lamp; 22: the copper post;
3: insulcrete; 31: the room;
4: drain pan; 41: the chip standing groove; 42: the pipe standing groove; 43: radiating groove; 44: pilot pin; 45: interspersed mouthful of power interface; 46: interspersed mouthful of signaling interface; 47: screw.
Embodiment
By describing technology contents of the present utility model, structural attitude in detail, realized purpose and effect, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
See also Fig. 1 and Fig. 2, the LED of the utility model high pixel density shows module, comprise face shield 1, PCB panel 2, insulcrete 3 and drain pan 4, described PCB panel 2 drives the PCB panel 2 of unification for lamp, regular distribution LED lamp 21 on the PCB panel 2, described LED lamp 21 can be the three-in-one LED lamp of SMD minimum encapsulation, adopts this LED lamp can reduce spacing between the LED lamp, and the lamp base of described LED lamp 21 is weldingly fixed on the PCB panel;
Described drain pan 4 is provided with and PCB panel 2 bottom surface device corresponding grooves over against PCB panel 2 one sides, place heat conductive silica gel in the described groove, heat conductive silica gel is placed between device and the drain pan 4, can be faster the heat of device be dispersed, thereby makes display screen keep normal and stable operation.
The LED of the high pixel density of said structure shows that module can reduce the pixel of module greatly, improve the resolution of display screen, and solved the heat dissipation problem of module fully, when making this module work, the high and low decay of brightness, high conformity, high reliability and high-weatherability.
In the present embodiment, the pel spacing of described LED lamp 21 is 3mm, even can be lower than 3mm, and picture element density is up to 111100/m
2More than, being designed to the module that spacing is little, resolution is high, the display screen that this module is combined into can very clear, mildly demonstrate image, presents no graininess, even, soft, the gorgeous image of look better when showing, can compare favourably with the TV display effect.
In the present embodiment, as shown in Figure 3, described PCB panel 2 is the multilayer circuit board structural design, with the electric current uniform distribution, reduces power consumption, improves radiating rate, effectively prolongs the life-span of display screen, takes the reliability of multilayer circuit board structural design higher.
In the present embodiment, described PCB panel 2 bottom surfaces also are fixed with some and are used for the copper post 22 that fixes with drain pan 4, described copper post 22 be provided be used for bolt fix screw thread.
In the present embodiment, as shown in Figure 4, described face shield 1 adopts silica gel to make, and coats silica gel treatment and glue at the back side of face shield 1, and face shield 1 cover is attached on the PCB panel 2.
Adopt the module of the face shield 1 suitable extra small spacing of this material and fixed placement, in use be difficult for projection and disengaging PCB panel 2.Covered by some face shields 1 on the LED demonstration module of this high pixel density, this is because the pixel distribution of entire module is many and close, operates in this way than being easier to, and saves the production time.
In the present embodiment, as shown in Figure 5, described insulating trip 3 pads can effectively strengthen placing the effect of conducting between PCB panel 2 and drain pan 4.Described insulating trip 3 is the empty shape of thread, promptly is provided with corresponding with PCB panel 2 bottom surface devices room 31 on insulating trip 3, makes the device of PCB panel 2 bottom surfaces can pass these rooms 31, seals and influence device and dispel the heat thereby be unlikely to be insulated sheet 3.
In the present embodiment, as shown in Figure 2, be used to place electronic devices and components such as resistance, the electric capacity etc. of pcb board back in the groove of described drain pan,, accelerate radiating effect these heater elements by in groove, placing heat conductive silica gel.Described groove also includes the pipe standing groove 42 that is used to hold the chip standing groove 41 of chip for driving and is used to hold field effect transistor.Because the position of groove is the position that faces chip, resistance and electric capacity under the PCB panel 2, make drain pan 4 and PCB panel 2 fit tightr.
With before PCB panel 2 contacts, respectively place the heat conductive silica gel of respective shapes at standing groove 1 and standing groove 2 at drain pan 4, the heat that heat conductive silica gel distributes chip for driving and field effect transistor fast and effectively disperses.
In the present embodiment, as shown in Figure 6, the back side of described drain pan is schistose texture, can increase area, is provided with radiating groove 43 between lamella and the lamella, strengthens the radiating effect of module.
Interspersed mouthful 46 of interspersed mouthful of 45, two signaling interface of a power interface and several screws 47 that can supply bolt or screw to pass are also designed in the back side of drain pan, screw or bolt pass this hole, can couple together with the copper post 22 on the PCB panel 2, drain pan 4 and PCB panel 2 are fixed together, same screw or bolt can pass the screw 47 on casing and the drain pan 4, and module is fixing with above the casing.
The back side of described drain pan further is mounted to the pilot pin 44 of a rare positioning module, and described pilot pin 44 is located by connecting with the packing casing, promptly is fixed on the casing by the pilot pin positioning module.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model instructions and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (10)
1. the LED of a high pixel density shows module, comprise face shield, PCB panel, insulcrete and drain pan, it is characterized in that, described PCB panel is the PCB panel that lamp drives unification, regular distribution LED lamp on the PCB panel, described drain pan simultaneously is provided with and PCB panel bottom surface device corresponding grooves over against the PCB panel, places heat conductive silica gel in the described groove.
2. the LED of high pixel density according to claim 1 shows module, it is characterized in that the pel spacing of described LED lamp is 3mm.
3. the LED of high pixel density according to claim 1 shows module, it is characterized in that described PCB panel is the multilayer circuit board structural design.
4. the LED of high pixel density according to claim 3 shows and it is characterized in that module, and described PCB panel bottom surface is fixed with and is used for the copper post that fixes with drain pan, and described copper post is provided with and is used for the screw thread that fixes with bolt.
5. the LED of high pixel density according to claim 1 shows module, it is characterized in that, described face shield adopts silica gel to make, and cover is attached on the pcb board.
6. the LED of high pixel density according to claim 1 shows module, it is characterized in that, described pad insulating film is between PCB panel and drain pan, and insulating trip is provided with the corresponding room that gets with PCB panel bottom surface device.
7. the LED of high pixel density according to claim 1 shows module, it is characterized in that, also include the pipe standing groove that is used to hold the chip standing groove of chip for driving and is used to hold field effect transistor in the groove of described drain pan, place the heat conductive silica gel of respective shapes respectively at chip standing groove and pipe standing groove.
8. the LED of high pixel density according to claim 7 shows module, it is characterized in that the back side of described drain pan is schistose texture and is provided with radiating groove.
9. the LED of high pixel density according to claim 8 demonstration module is characterized in that, the screw that power interface interts mouth, interspersed mouthful of signaling interface and can supply bolt to pass is also designed at the back side of described drain pan.
10. the LED of high pixel density according to claim 9 shows module, it is characterized in that the back side of described drain pan further is equipped with the pilot pin of positioning module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206388836U CN201886709U (en) | 2010-12-02 | 2010-12-02 | High-pixel-density light emitting diode (LED) display module group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206388836U CN201886709U (en) | 2010-12-02 | 2010-12-02 | High-pixel-density light emitting diode (LED) display module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201886709U true CN201886709U (en) | 2011-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206388836U Expired - Fee Related CN201886709U (en) | 2010-12-02 | 2010-12-02 | High-pixel-density light emitting diode (LED) display module group |
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| CN (1) | CN201886709U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102881232A (en) * | 2012-09-26 | 2013-01-16 | 上海三思电子工程有限公司 | Dot spacing light-emitting diode (LED) display screen with face mask |
| CN103077666A (en) * | 2013-02-21 | 2013-05-01 | 吴小刚 | High-definition LED (Light-Emitting Diode) display screen |
| CN104252842A (en) * | 2014-09-18 | 2014-12-31 | 苏州合欣美电子科技有限公司 | LED (Light Emitting Diode) display screen module with separated lamp boards and driving boards |
| CN111968531A (en) * | 2020-08-14 | 2020-11-20 | 深圳市锐拓显示技术有限公司 | LED display module, manufacturing method and LED display screen |
| CN116092399A (en) * | 2022-09-01 | 2023-05-09 | 上海觊煊显示技术有限公司 | Display assembly and floor screen |
-
2010
- 2010-12-02 CN CN2010206388836U patent/CN201886709U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102881232A (en) * | 2012-09-26 | 2013-01-16 | 上海三思电子工程有限公司 | Dot spacing light-emitting diode (LED) display screen with face mask |
| CN103077666A (en) * | 2013-02-21 | 2013-05-01 | 吴小刚 | High-definition LED (Light-Emitting Diode) display screen |
| CN104252842A (en) * | 2014-09-18 | 2014-12-31 | 苏州合欣美电子科技有限公司 | LED (Light Emitting Diode) display screen module with separated lamp boards and driving boards |
| CN111968531A (en) * | 2020-08-14 | 2020-11-20 | 深圳市锐拓显示技术有限公司 | LED display module, manufacturing method and LED display screen |
| CN116092399A (en) * | 2022-09-01 | 2023-05-09 | 上海觊煊显示技术有限公司 | Display assembly and floor screen |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN RADIANT OPTO-ELEC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN UNILUMIN TECHNOLOGY CO., LTD. Effective date: 20120720 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20120720 Address after: 518000, Shenzhen, Guangdong province Baoan District Shiyan Town, Tong Tau Avenue, Ming Hai Jin Industrial Park, building 7 floor Patentee after: Radiant Opto-Elec Technology Co., Ltd. Address before: 518000, Guangdong, Shenzhen, Fuyong, Baoan District street, Ocean Development Zone, Fu'an industrial city, two, Fourteenth Patentee before: Shenzhen Zhouming Technology Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building seven, building 2-3 Patentee after: Radiant Opto-Elec Technology Co., Ltd. Address before: 518000, Shenzhen, Guangdong province Baoan District Shiyan Town, Tong Tau Avenue, Ming Hai Jin Industrial Park, building 7 floor Patentee before: Radiant Opto-Elec Technology Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building seven, building 2-3 Patentee after: SHENZHEN ROEVISUAL TECHNOLOGY CO., LTD. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building seven, building 2-3 Patentee before: Radiant Opto-Elec Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110629 Termination date: 20191202 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |