CN201885615U

CN201885615U - Heat pipe

Info

Publication number: CN201885615U
Application number: CN2010202966659U
Authority: CN
Inventors: 蔡与哲
Original assignee: YAOJIA TECHNOLOGY Co Ltd
Current assignee: Kunshan Guangxing Electronics Co., Ltd.
Priority date: 2010-08-19
Filing date: 2010-08-19
Publication date: 2011-06-29
Anticipated expiration: 2020-08-19

Abstract

The utility model provides a heat pipe which is arranged on a heating source. The heat pipe comprises a shell body and a capillary structure, wherein the shell body is in closed state; and working fluid is filled in the shell body, while the capillary structure is formed on the inner side wall of the shell body. Along the surrounding direction of the shell body, the thickness of the capillary structure is distributed in a non-uniform manner, and the thicker part of the capillary structure is close to the heat source, while the thinner part of the capillary structure is far away from the heat source. The heat pipe provided by the utility model has higher radiating efficiency.

Description

Heat pipe

Technical field

The utility model relates to a kind of heat pipe, relates in particular to a kind of heat pipe with capillary structure of uneven gauge.

Background technology

Over the years, the progressive speed of Information technology can be described as quite quick, especially at the instruction cycle of central processing unit electronic building bricks such as (Central processing unit are called for short CPU) and the transistor size aspect of intension.Also owing to the instruction cycle of central processing unit is quite high, so the used heat of related generation is also quite big.In order to make central processing unit operate as normal under the temperature that is allowed, design good heat conduction and cooling system and just played the part of important role.

In early days, the used heat of central processing unit is to dispel the heat by fan.Afterwards, along with the used heat that central processing unit produced is more and more big, and electronic installation is more and more frivolous (for example: notebook computer), just have manufacturer to introduce heat pipe (heat pipe) and dispel the heat to assist central processing unit.Above-mentioned heat pipe is arranged between fin and the electronic building brick, the used heat that electronic building brick produced can be absorbed by the liquid in the side of heat pipe (that is: heat absorbing side), after the liquid heat absorption evaporation, the steam of evaporation can be because the opposite side (that is: heat radiation side) of the former thereby past heat pipe of pressure differential moves, and after condensing on the heat radiation side, be back to the heat absorbing side of heat pipe again.

At present, heat pipe commonly used on the market mainly can be divided into following three kinds of aspects:

(1) channel heat pipe: its tube wall inboard at heat pipe is provided with a plurality of grooves.

(2) sintered heat pipe: it is formed with a sinter layer on the tube wall inboard of heat pipe, and this sinter layer is to be formed by copper powder institute sintering.

(3) combined type heat pipe: its tube wall inboard at heat pipe is provided with outside a plurality of grooves, also is formed with a sinter layer.

At present, no matter be sintered heat pipe or combined type heat pipe, its sinter layer is to be formed by copper powder institute sintering, and along the direction that tube wall centered on, this sinter layer is the thickness that is keeping homogeneous.

Yet, though the existing pretty good heat radiation function of traditional heat pipe gradually becomes trend because the volume of electronic product is more and more frivolous, so the requirement of the heat dissipation of opposite heat tube relatively is also more and more high.Therefore, how to allow heat pipe have higher heat dissipation, be worth the person of ordinary skill in the field to go to consider.

Summary of the invention

The purpose of this utility model provides a kind of heat pipe, and this heat pipe has higher heat dissipation because of the thickness of its capillary structure is uneven distribution.

According to above-mentioned purpose and other purposes, the utility model provides a kind of heat pipe, and this heat pipe is to be arranged on the pyrotoxin.This heat pipe comprises a shell body and a capillary structure, and shell body is the state that is sealing, and shell body inside is filled with working fluid, and capillary structure is formed on the madial wall of this shell body.Along the direction that centers on of shell body, the thickness of capillary structure is to be uneven distribution, and the thicker close pyrotoxin of part of capillary structure, and the part that capillary structure approaches is then away from pyrotoxin.

In above-mentioned heat pipe, capillary structure is a sinter layer.Wherein, capillary structure is to be formed by metal dust institute sintering, and this metal dust for example is a copper powder.

In above-mentioned heat pipe, capillary structure is to be formed by many copper wire institute sintering.

In above-mentioned heat pipe, be formed with a plurality of grooves on the madial wall of shell body.

In above-mentioned heat pipe, the cylindrical or flat tube shape of shell body.

In above-mentioned heat pipe, on the madial wall of shell body, capillary structure is not formed on the side away from pyrotoxin.

Because it is thicker to be positioned at the madial wall below sinter layer partly of shell body, so its capillary force is stronger, can add the speed that working fluid behind the quick setting is back to heat absorbing end, and the sinter layer of madial wall upper section that is positioned at shell body is thinner, so its thermal resistance is lower, the workflow physical efficiency after the evaporation is condensed with fast speeds.In addition, the sinter layer of upper section also can be brought into play the function of the nuclei of condensation, the rate of set of the working fluid after can accelerating more to evaporate.

For above-mentioned purpose of the present utility model, feature and advantage more can be become apparent, hereinafter will and cooperate appended diagram with embodiment, elaborate.

Description of drawings

Fig. 1 shows the stereogram of the heat pipe of first embodiment of the present utility model.

Fig. 2 shows the generalized section of the heat pipe of first embodiment.

Fig. 3 shows the partial view of inside of the heat pipe of second embodiment.

Fig. 4 shows the stereogram of the heat pipe of the 3rd embodiment of the present utility model.

Fig. 5 shows the stereogram of the heat pipe of the 4th embodiment of the present utility model.

Fig. 6 shows the schematic diagram of copper mesh.

The specific embodiment

See also Fig. 1 and Fig. 2, Fig. 1 shows the stereogram of the heat pipe of first embodiment of the present utility model, and Fig. 2 shows the generalized section of the heat pipe of first embodiment.This heat pipe 100 is to do extension along a direction E wherein, its two ends are respectively radiating end 102 and heat absorbing end 104, and the heat absorbing end 104 of heat pipe 100 is to be arranged on the electronic chip 20, and radiating end 102 then is to combine with other heat abstractors (not illustrating, for example: fin, fan).Heat pipe 100 comprises a shell body 110 and a sinter layer 120, and this sinter layer 120 is formed on the madial wall of shell body 110.Wherein, shell body 110 is the states that are sealing, that is to say that the inside of shell body 110 and external environment are isolated, and the inside of shell body is filled with working fluid, and this working fluid is the hole that is arranged in sinter layer 120.In the present embodiment, working fluid is a water, but the person of ordinary skill in the field can replace with it working fluid of alcohol or other kinds.

As seen from Figure 2, in shell body 110 around direction S on, the thickness of sinter layer 120 is to be uneven distribution, sinter layer 120 than thickness portion 120b near electronic chip 20, the thin part 120a of sinter layer 120 is then away from electronic chip 20.In the present embodiment, the thickness of sinter layer 120 is attenuation gradually from lower to upper.When electronic chip 20 in when running, its liberated heat can see through shell body 110 and the working fluid that be positioned at sinter layer 120 inside absorbs.After absorbing heat, the working fluid evaporation enters in the flowing space 106, and moves from heat absorbing end 104 toward radiating end 102 because of the cause of pressure differential.Working fluid after the evaporation can be condensed into liquid and enters in the sinter layer 120 after radiating end 102 heat radiation, and the capillary force that the workflow after condensing is known from experience by sinter layer 120 is back to heat absorbing end 104.

In the present embodiment, the sinter layer 120 thicker reasons that are positioned at below part are to make capillary force to strengthen, to add the speed that working fluid behind the quick setting is back to heat absorbing end 104.And the thin reason of sinter layer 120 that is positioned at upper section is to lower thermal resistance, and the workflow physical efficiency after the evaporation is condensed with fast speeds.

In addition, the producer of heat pipe also can offer a plurality of grooves on the inwall of shell body, to increase the radiating efficiency of heat pipe.Please refer to Fig. 3, Fig. 3 shows the partial view of inside of the heat pipe of second embodiment.In the present embodiment, heat pipe 200 comprises a shell body 210 and a sinter layer 220, wherein is formed with a plurality of grooves 212 on the madial wall of shell body 210, and these grooves 212 also can provide capillary force, so can increase the back-flow velocity of coagulating liq.

In first embodiment, the shell body 110 of heat pipe 100 is to be the flat tube shape, the heat pipe 100 of this type is suitable for being applied in the more frivolous electronic installation of build, and (for example: notebook computer), but the person of ordinary skill in the field can change it shape that is designed to other.Please refer to Fig. 4, Fig. 4 shows the stereogram of the heat pipe of the 3rd embodiment of the present utility model.Wherein, the shell body 310 of heat pipe 300 presents the pipe shape.

In first embodiment and second embodiment, the upper section that is positioned at the inside of shell body is provided with sinter layer, but the person of ordinary skill in the field also can select only partly to be provided with in the below sinter layer.Please refer to Fig. 5, Fig. 5 shows the stereogram of the heat pipe of the 4th embodiment of the present utility model.Wherein, in this heat pipe 400, sinter layer 420 only is formed on the below part of the inside of shell body 410.

Please comparison diagram 2 and Fig. 5, though in Fig. 5, sinter layer 420 only is formed on the below part of the inside of shell body 410, so upper section has less thermal resistance.Yet though the thermal resistance of the upper section of the heat pipe 100 of Fig. 2 is bigger, the sinter layer 120 that is positioned at the madial wall upper section of shell body 110 can be brought into play the function of the nuclei of condensation, so the rate of set of the working fluid after the evaporation can't be also poorer than the heat pipe 400 of Fig. 5.According to the inventor's of this case result of study, keep some sinter layers at the madial wall upper section of shell body, the radiating effect that it reached is preferable on the contrary.

In first embodiment and second embodiment, capillary structure is all sinter layer, but the person of ordinary skill in the field can change it into the capillary structure of other kenels, for example: copper mesh, copper wire.Please refer to Fig. 6, Fig. 6 shows the schematic diagram of copper mesh, and this copper mesh 520 is to be formed by the many overlapped braidings of copper wire 520a, and capillary structure also can form by the copper mesh 520 of the multilayer that coincides, and then the capillary force of capillary structure integral body is increased.

The utility model illustrates as above that with embodiment so it is not in order to limit the claim that the utility model is advocated.Its scope of patent protection should with claims and etc. same domain and deciding.All persons of ordinary skill in the field, in not breaking away from this patent spirit or scope, change of being done or modification, the equivalence of finishing under the spirit that all belongs to the utility model and disclosed change or design, and should be included in claims the claim scope in.

Claims

1. a heat pipe is arranged on the pyrotoxin, it is characterized in that, this heat pipe comprises:

One shell body, this shell body are the states that is sealing, and this shell body inside is filled with working fluid; And

One capillary structure, this capillary structure are formed on the madial wall of this shell body;

Wherein, along the direction that centers on of this shell body, the thickness of this capillary structure is to be uneven distribution.

2. heat pipe according to claim 1 is characterized in that, close this pyrotoxin of the part that capillary structure is thicker, and the part that this capillary structure approaches is then away from this pyrotoxin.

3. heat pipe according to claim 1 and 2 is characterized in that this capillary structure comprises a sinter layer.

4. heat pipe according to claim 3 is characterized in that, this sinter layer is to be formed by metal dust institute sintering.

5. heat pipe according to claim 4 is characterized in that, this metal dust is a copper powder.

6. heat pipe according to claim 3 is characterized in that, this sinter layer is to be formed by many copper wire institute sintering.

7. heat pipe according to claim 1 and 2 is characterized in that, is formed with a plurality of grooves on the madial wall of this shell body.

8. heat pipe according to claim 1 and 2 is characterized in that this shell body is cylindrical.

9. heat pipe according to claim 1 and 2 is characterized in that this shell body is the flat tube shape.

10. heat pipe according to claim 1 and 2 is characterized in that, on the madial wall of this shell body, this capillary structure only forms below part within the outer shell.