CN201884975U - LED (light-emitting diode) - Google Patents
LED (light-emitting diode) Download PDFInfo
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- CN201884975U CN201884975U CN2010205363738U CN201020536373U CN201884975U CN 201884975 U CN201884975 U CN 201884975U CN 2010205363738 U CN2010205363738 U CN 2010205363738U CN 201020536373 U CN201020536373 U CN 201020536373U CN 201884975 U CN201884975 U CN 201884975U
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- Prior art keywords
- led
- heat
- heat conduction
- led wafer
- substrate
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- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 30
- 230000005540 biological transmission Effects 0.000 claims description 23
- 230000005855 radiation Effects 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 6
- 239000010445 mica Substances 0.000 claims description 6
- 229910052618 mica group Inorganic materials 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000005286 illumination Methods 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 241001025261 Neoraja caerulea Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
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- 230000009977 dual effect Effects 0.000 description 1
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- 230000007613 environmental effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses an LED, relates to the technical field of LEDs, and solves the problem that the temperature around an LED wafer is higher. In the embodiment of the utility model, the LED includes a substrate and an LED wafer fixed on the substrate, and the substrate is made of a heat conducting material. Or in the embodiment of the utility model, the LED includes a lead frame, an LED wafer fixed on the lead frame, and a transparent sheet used for encapsulating the LED wafer; and a heat dissipation layer made of a heat conducting material is arranged on the outer side surface of the LED. The embodiment of the utility model is mainly used for encapsulating various LEDs.
Description
Technical field
The utility model relates to LED (Light Emitting Diode, light emitting diode) technical field.
Background technology
LED can directly be converted into light to electricity, and the heart of LED is a semi-conductive LED wafer.As shown in Figure 1, LED wafer 13 is attached on the lead frame, and this lead frame comprises two parts, and wherein a part is extended the negative electrode 11 that connects power cathode, and another part extends the positive electrode 12 that connects positive source; The positive pole of LED wafer 13 is connected with positive electrode 12 by reflector 14 among Fig. 1, and the negative pole of LED wafer 13 then is connected with negative electrode 11 by lead 15 (generally adopting conductive gold wire).In order to protect the LED wafer, the light transmission piece 16 that adopts epoxy resin to make among Fig. 1 is got up the whole LED wafer package, only exposes positive electrode 12 and negative electrode 11.
There are the following problems at least to adopt existing LED encapsulation technology: because there is resistance in the LED wafer, produce certain heat at electric current by meeting in the process of LED wafer, these heats are collected in around the LED wafer for a long time, be closed in the epoxy resin of packaged LED and can't discharge, cause LED wafer environment temperature higher.If light LED for a long time, be subjected to the influence of higher temperature on every side of LED wafer, LED wafer and fluorescent material quicken loss, cause the LED life-span to be decayed, and brightness reduces, even can't satisfy normal illumination and optics needs.
The utility model content
Embodiment of the present utility model provides a kind of LED, can reduce LED wafer temperature on every side, to prolong the service life of LED.
For achieving the above object, embodiment of the present utility model adopts following technical scheme:
A kind of LED comprises substrate and is fixed on described on-chip LED wafer that described substrate is made by Heat Conduction Material.
A kind of LED, the light transmission piece that comprises lead frame, is fixed on the LED wafer on the lead frame and encapsulates described LED wafer; The lateral surface of described LED is provided with the heat dissipating layer that Heat Conduction Material is made.
The LED that the utility model embodiment provides, be fixed on the LED wafer on the substrate that heat sink material makes or around LED, be provided with the heat dissipating layer that Heat Conduction Material is made, can accelerate LED wafer radiating rate, raising radiating efficiency on every side, thereby reduce the temperature around the LED wafer.So, behind the LED that employing the utility model embodiment provides,, make LED wafer and fluorescent material loss rate slow down, and then prolonged the service life of LED because LED wafer environment temperature reduces relatively; And under the situation that the fluorescent material loss is slowed down, can improve the brightness of LED, make it satisfy normal illumination and optics needs better.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is a LED cutaway view in the prior art;
Fig. 2 is the cutaway view of LED among the utility model embodiment 1;
Fig. 3 is the LED front elevation of top illumination mode among the utility model embodiment 1;
Fig. 4 is the back view of illumination mode LED in top among the utility model embodiment 1;
Fig. 5 is the cutaway view of radiating component among the utility model embodiment 1;
Fig. 6 is the cutaway view of LED among the utility model embodiment 2.
The specific embodiment
Along with reaching its maturity of photoelectricity industry technology, for save electricity adapts to environmental protection demand and user's request, more and more electronic products adopt LED as backlight, and the brightness of LED and life-span directly influence the quality of entire product.The utility model embodiment makes LED wafer ambient heat shift rapidly by LED is improved, and reduces LED wafer temperature on every side, with the service life of prolongation LED, thereby promotes the LED overall quality.
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment 1:
The utility model embodiment provides a kind of LED, and as shown in Figure 2, this LED comprises the substrate 21 that Heat Conduction Material is made, and is fixed with LED wafer 22 on the described substrate 21, and a side of described substrate 21 is provided with described LED wafer 22 is encapsulated the light transmission piece 23 of getting up.In general, described light transmission piece 23 can adopt epoxy resin to make, and when the light that LED wafer 22 sends can appear by described light transmission piece 23, epoxy resin can guarantee that this LED has the function of antidetonation; The heat that the LED wafer produces then can conduct to light transmission piece 23 outsides by described substrate 21, thereby reduces the temperature around the LED wafer 22.
For the ease of in described LED wafer, inserting power supply, the described LED of the utility model embodiment also comprises the leg (not shown) that is used to connect feeder ear, and described leg comprises the part that is encapsulated in described light transmission piece inside and is exposed at the part in the described light transmission piece outside, and the positive pole of described LED wafer, negative pole link to each other by the part that is encapsulated in described light transmission piece inside on lead 25,26 and the described leg respectively.Lead in the utility model can adopt gold thread, silver-colored line or other conductive material, because lead is very thin, the basic difficulty of naked eyes is seen clearly, needs microscopic examination, so can not influence the light that the LED wafer sends.
Leg can be taked any one in the multiple packaged type in the prior art, at present, the luminous mode of LED mainly comprises top luminous (Top View) and side luminous (Side View) dual mode, below introduce in detail the luminous structure in top, Fig. 3 is the LED front elevation of top illumination mode, Figure 4 shows that the back view of top illumination mode LED.
As shown in Figure 3, Figure 4, be provided with leg 33 at the two ends of LED30 (only represented two peripheries of this LED among the figure, do not represented concrete shape), leg 33 can link to each other with the feeder ear in the packaged LED outside, exposes fully in the outside; Positive pole on the LED wafer 31, negative pole then link to each other with described leg by lead 34, because lead (this lead generally adopts gold thread) is thinner, the basic difficulty of naked eyes is seen clearly, needs microscopic examination, just macroscopical illustrating among Fig. 3, Fig. 4; And be coated with phosphor powder layer 32 on the described LED wafer 31.When LED is welded on the circuit board, the positive and negative electrode of feeder ear is connected with the positive and negative electrode of leg on the circuit board, and the some bright crystal wafer is luminous.Certainly also have the LED of side illumination mode, just some adjustment take place in the relative position of light-emitting area and leg, and the overall structure basically identical repeats no more herein.
When practice, described substrate 21 can be made into flat shape, also can be made into the boss shape among Fig. 2, so that described LED wafer 22 is fixed on the top of boss 211, and described boss 211 is encapsulated in described light transmission piece 23 inside.In fact, the boss 211 among the utility model embodiment can be a round boss, also can be other polygon boss, as: square boss, hexagon boss or the like.
The Heat Conduction Material that substrate 21 is adopted among the utility model embodiment includes but not limited to following material: heat-conducting silicone grease, heat conduction mica sheet or thermal conductive ceramic plate.
Adopt the LED among Fig. 2, because the LED wafer is fixed on the substrate that heat sink material makes, can accelerate LED wafer radiating rate, raising radiating efficiency on every side, thereby reduce the temperature around the LED wafer, make LED wafer and fluorescent material loss rate slow down, and then prolonged the service life of LED.And because the fluorescent material loss is slowed down, can improve the brightness of LED, make it satisfy normal illumination and optics needs better.
The LED that the foregoing description is described can reach the effect that reduces LED wafer environment temperature, and in order further to accelerate radiating rate, referring to Fig. 2, the LED of the utility model embodiment also comprises the radiating component 27 that Heat Conduction Material is made.Though the scheme among Fig. 2 has disclosed radiating component 27, in fact the utility model embodiment does not just draw does not separately have the accompanying drawing of radiating component 27, and using does not above-describedly have the scheme of radiating component 27 can realize corresponding effects yet.
As shown in Figure 5, described radiating component 27 comprises the inner ring body 271 that contacts and be encapsulated in described light transmission piece 23 inside with described boss 211 outer side edges, and described radiating component 27 also comprises outer ring body 272 that is exposed to described light transmission piece 23 outsides and the connector 273 that connects described inner ring body 271 and outer ring body 272.
Contact with described boss by described inner ring body, the heat that makes the LED wafer produce can be delivered to outer ring body 272 by described boss 211, inner ring body 271, connector 273 successively, because outer ring body 272 is positioned at light transmission piece 23 outsides, heat can be loose to the outside of light transmission piece, accelerate radiating rate.
The Heat Conduction Material that radiating component 27 is adopted among the utility model embodiment includes but not limited to following material: heat-conducting silicone grease, heat conduction mica sheet or thermal conductive ceramic plate.
After adopting radiating component 27 shown in Figure 5, as shown in Figure 2, the utility model embodiment can be arranged on described light transmission piece 23 on the connector 273 between described outer ring body 272 and the inner ring body 271, makes that the encapsulation of light transmission piece 23 is more firm.
For the ease of fixing described LED, as shown in Figure 2, the described outer ring body 272 of the utility model embodiment is provided with opening 274, and internally extend the fixing feet 28 that is used for fixing described LED from described opening 274, difference according to actual needs, described fixing feet 28 can be provided with two or more
LED wafer among the utility model embodiment can be any wafer, as: blue-ray LED wafer, yellow light LED wafer, green light LED wafer, white light LEDs wafer or the like.White light LEDs can adopt following illumination mode: the blue light single-chip adds that the YAG yellow fluorescent powder mixes the generation white light, behind the PN of LED wafer joint conduct positive voltage, and the normal blue light-emitting of LED blue light wafer, blue-light excited YAG yellow fluorescent powder mixes producing white light.
Embodiment 2:
The utility model embodiment provides a kind of LED, as shown in Figure 6, and the light transmission piece 43 that the utility model LED comprises lead frame 41, is fixed on the LED wafer 42 on the lead frame 41 and encapsulates described LED wafer 42; The lateral surface of described LED is provided with the heat dissipating layer 44 that Heat Conduction Material is made.Heat dissipating layer in the utility model can be arranged on the bottom (referring to Fig. 6) of LED, and also other parts of the LED that can be provided with are not shown.
The Heat Conduction Material that heat dissipating layer 44 is adopted among the utility model embodiment includes but not limited to following material: heat-conducting silicone grease, heat conduction mica sheet or thermal conductive ceramic plate.
Adopt the LED among Fig. 6, because the LED outside is provided with heat dissipating layer, can accelerates LED wafer radiating rate, raising radiating efficiency on every side, thereby reduce the temperature around the LED wafer, make LED wafer and fluorescent material loss rate slow down, and then prolonged the service life of LED.And because the fluorescent material loss is slowed down, can improve the brightness of LED, make it satisfy normal illumination and optics needs better.
In order to accelerate radiating rate, the utility model embodiment LED also comprises at least one heat radiation seal wire 45, inside, the other end that described heat radiation seal wire 45 1 ends are arranged at described LED are connected to described heat dissipating layer 44, make the heat of LED inside to be delivered to heat dissipating layer 44 by heat radiation seal wire 45, so that enlarge the area of dissipation of LED wafer, thereby accelerate radiating rate.Heat radiation seal wire among the utility model embodiment can adopt gold, and copper, also can adopt material such as heat-conducting resin at materials such as aluminium, and the bigger heat dissipating layer 44 of heat radiation seal wire and LED place area links to each other,
LED with heat radiation seal wire, heat radiation seal wire are as the water pipe of cistern, and heat transfers to the heat dissipating layer in the LED outside from each heat radiation seal wire as current.
After adopting the LED that describes among the utility model the foregoing description 1 and the embodiment 2, can obviously reduce LED wafer temperature on every side.LED among LED of the prior art and above-mentioned one of them embodiment is compared experiment, obtains following experimental result:
1, after LED of the prior art passed through lighting of long-time (about 240 hours), the temperature continuous high temperature was more than 50 degrees centigrade; The LED life-span descends simultaneously, and brightness is reduced to 245nits (nit).
2, the LED behind the increase LED heat sink conception, after lighted (about 240 hours) for a long time, temperature continued more than 43.7 degrees centigrade, and the LED display bulk temperature declines by a big margin, and approximately descends about 10 degrees centigrade; Simultaneously, the brightness of LED is reduced to about 260nits, and more the sample brightness of improvement does not promote more than 6%.
The utility model embodiment is mainly used in various LED encapsulation, as: encapsulation of backlight LED encapsulation, LED ornament lamp or the like.
The above; it only is the specific embodiment of the present utility model; but protection domain of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement all should be encompassed within the protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion by described protection domain with claim.
Claims (10)
1. a LED comprises substrate and is fixed on described on-chip LED wafer, it is characterized in that described substrate is made by Heat Conduction Material.
2. LED according to claim 1 is characterized in that, described LED comprises also and the contacted radiating component of described substrate that described radiating component is made by Heat Conduction Material.
3. LED according to claim 2 is characterized in that, a side that is fixed with described LED wafer on the described substrate is provided with light transmission piece that described LED wafer package is got up; Described substrate is a boss shape substrate, and described LED wafer is fixed on the top of boss, and described boss is encapsulated in described light transmission piece inside;
Described radiating component comprise with the contact of described boss outer side edges and be encapsulated in described light transmission piece inside inner ring body, be exposed to the outer ring body of described light transmission piece outside and the connector that is connected described inner ring body and outer ring body.
4. LED according to claim 3 is characterized in that, described light transmission piece is arranged on the connector between described outer ring body and the inner ring body.
5. according to any described LED in the claim 1 to 4, it is characterized in that the Heat Conduction Material of described substrate comprises: heat-conducting silicone grease, heat conduction mica sheet or thermal conductive ceramic plate.
6. according to any described LED in the claim 2 to 4, it is characterized in that the Heat Conduction Material of described radiating component comprises: heat-conducting silicone grease, heat conduction mica sheet or thermal conductive ceramic plate.
7. LED, the light transmission piece that comprises lead frame, is fixed on the LED wafer on the lead frame and encapsulates described LED wafer; It is characterized in that the lateral surface of described LED is provided with the heat dissipating layer that Heat Conduction Material is made.
8. LED according to claim 7 is characterized in that, also comprises at least one heat radiation seal wire, and inside, the other end that described heat radiation seal wire one end is arranged at described LED are connected to described heat dissipating layer.
9. LED according to claim 8 is characterized in that, the material of described heat radiation seal wire comprises: gold, copper, aluminium or heat-conducting resin.
10. according to claim 7 or 8 described LED, it is characterized in that the Heat Conduction Material of described heat dissipating layer comprises: heat-conducting silicone grease, heat conduction mica sheet or thermal conductive ceramic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205363738U CN201884975U (en) | 2010-09-17 | 2010-09-17 | LED (light-emitting diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205363738U CN201884975U (en) | 2010-09-17 | 2010-09-17 | LED (light-emitting diode) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201884975U true CN201884975U (en) | 2011-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205363738U Expired - Lifetime CN201884975U (en) | 2010-09-17 | 2010-09-17 | LED (light-emitting diode) |
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| Country | Link |
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| CN (1) | CN201884975U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104613346A (en) * | 2015-01-16 | 2015-05-13 | 新照明设计有限公司 | Manufacturing method of a three-dimensional LED packaged light bulb |
-
2010
- 2010-09-17 CN CN2010205363738U patent/CN201884975U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104613346A (en) * | 2015-01-16 | 2015-05-13 | 新照明设计有限公司 | Manufacturing method of a three-dimensional LED packaged light bulb |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150710 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150710 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150710 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 Beijing economic and Technological Development Zone, West Central Road, No. 8 Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110629 |