CN201881054U

CN201881054U - Laser liftoff equipment for crystal silicon wafers

Info

Publication number: CN201881054U
Application number: CN2010206267920U
Authority: CN
Inventors: 罗新红; 余辉; 付三望
Original assignee: WUHAN GOSUN PHOTOELECTRIC TECHNOLOGY Co Ltd
Current assignee: JIANGSU KEYLAND LASER TECHNOLOGY CO., LTD.
Priority date: 2010-11-26
Filing date: 2010-11-26
Publication date: 2011-06-29
Anticipated expiration: 2020-11-26

Abstract

The utility model discloses laser liftoff equipment for crystal silicon wafers. The laser liftoff equipment comprises a main control unit, a laser generator, laser output system and a workpiece moving platform, wherein the main control unit controls the laser generator to generate a laser beam, the laser beam is emitted to the surface of the workpiece moving platform through a laser output system, an output end of the laser generator is connected with an input end of the laser output system through a rotating shaft, and the laser beam penetrates through the rotating shaft which is in hollow structure. The laser liftoff equipment for crystal silicon wafers has the advantages that laser output angle can be controlled electrically, moving mode of a silicon ingot is controlled through special program software, residual silicon wafers are cut off from the silicon ingot and can be machined into products in small specification, and accordingly waste is reduced and materials which serving as wastes originally can be utilized to the utmost extent.

Description

Crystal silicon chip laser lift-off equipment

Technical field

The utility model relates to technical field of laser processing, and a kind of crystal silicon chip laser lift-off equipment specifically is provided.

Background technology

In the existing crystal silicon solar cell sheet production technology, it is to cut into the silicon chip of corresponding specification through the raw material silicon ingot (more than 99.9999% purity) of purifying that a very crucial operation is arranged.At present isolation of crystalline silicon cell technology all is to adopt the mode of high accuracy line cutting, yet in this process, occurs in process of production cutting for some reason sometimes and end and cause producing waste material, as the chopping fracture etc.Generally speaking, waste material can only be taked to concentrate and melts down the mode that processing again refines and handle, but this kind purifying technique complexity and energy consumption are big, and simultaneously, global silicon materials are at full stretch and in continuous rise in price, causes the raw material silicon ingot price of purifying very expensive.

The utility model content

In order to overcome above problem, effectively the crystalline silicon waste material is utilized again, the utility model provides the residual crystal silicon chip laser lift-off of a kind of solar cell equipment, output angle that can electronic control and regulation laser, and pass through the motion mode that special program software is controlled silicon ingot, and residual silicon chip is cut down from silicon ingot, be processed into the product of small dimension again, cut the waste, this part former material that is used as waste product is utilized.

The technical scheme that its technical problem that solves the utility model adopts is: a kind of crystal silicon chip laser lift-off equipment, it comprises main control system, laser generator, laser output system and workpiece motion s platform, main control system control laser generator produces laser beam, this laser beam is incident upon the surface of workpiece motion s platform through the laser output system, the output of laser generator is connected by rotating shaft with the input of laser output system, rotating shaft is a hollow structure, and laser beam passes in this rotating shaft.

Further, this equipment also comprises electric device, and this electric device is connected with rotating shaft, the rotation of control rotating shaft.

Further, electric device comprises motor and driving gear, this Electric Machine Control driving gear rotation, and the periphery of rotating shaft is provided with driven gear, and driving gear is connected by belt with driven gear.

Further, driven gear, driving gear mesh by tooth with belt respectively.

Further, this equipment also comprises the machining control device, and machining control device control workpiece motion s platform is made two dimensional motion.

Further, the laser output system comprises outer light path device and is arranged on the amasthenic lens of outer light path device below that the laser beam that laser generator produces passes rotating shaft and is incident upon outer light path device, exports after the last line focus lens focus.

The beneficial effects of the utility model are: the laser output system of the utility model crystal silicon chip laser lift-off equipment is connected by rotating shaft with laser generator, make the laser output angle of laser output system to regulate, thereby make the laser output of equipment and crystal silicon chip rapidoprint at an angle, adjust angle, can make the laser beam of line focus mirror focus on silicon chip surface to be cut, have influence on laser focusing head in the time of can not making residual silicon ingot motion again, simultaneously, silicon ingot to be processed is fixed on the motion workbench of special two dimension, control the relative motion of silicon ingot and laser beam by special-purpose machining control device, can realize the purpose that silicon chip is stripped down from the waste product material.Utilize the special working ability of laser equipment, the former condemned MAT'L that is used as is utilized again, produce considerable economic thereby cut the waste.

Description of drawings

Fig. 1 is the structural representation of the utility model crystal silicon chip laser lift-off equipment;

Fig. 2 is the partial schematic diagram of this use novel crystal silicon chip laser lift-off equipment;

Fig. 3 is the utility model crystal silicon chip laser lift-off equipment working state schematic diagram;

In the accompanying drawing, the list of parts of each label representative is as follows:

1 main control system, 2 laser generators, 3 workpiece motion s platforms, 4 outer light path devices, 5 amasthenic lens, 6 rotating shafts, 7 electric devices, 8 machining control devices, 61 driven gears, 71 driving gears, 72 belts, 73 motors.

The specific embodiment

Below in conjunction with accompanying drawing principle of the present utility model and feature are described, institute gives an actual example and only is used to explain the utility model, is not to be used to limit scope of the present utility model.

As depicted in figs. 1 and 2, a kind of crystal silicon chip laser lift-off equipment, it comprises main control system 1, laser generator 2, the laser output system, workpiece motion s platform 3, electric device 7 and machining control device 8, main control system 1 control laser generator 2 produces laser beam, the output of laser generator 1 is connected by rotating shaft 6 with the input of laser output system, the laser output system comprises outer light path device 4 and is arranged on the amasthenic lens 5 of outer light path device 4 belows, rotating shaft 6 is a hollow structure, laser beam passes in rotating shaft 6, through outer light path device 4 reflections, after focusing on, last line focus camera lens 5 is incident upon the surface of workpiece motion s platform 3, machining control device 8 control workpiece motion s platforms 3 are made two dimensional motion, electric device 7 comprises motor 73 and driving gear 71, the periphery of rotating shaft 6 is provided with driven gear 61, driving gear 71 is connected by belt 72 with driven gear 61, and driven gear 61, be respectively equipped with tooth on driving gear 71 and the belt 72, driven gear 61, driving gear 71 meshes by tooth with belt 72 respectively, 73 rotations of motor 73 control driving gears, drive driven gear 61 rotations, thereby realize the step-less adjustment of laser output system laser output angle.

As shown in Figure 3, during this crystal silicon chip laser lift-off equipment work, at first silicon ingot waste material to be cut is positioned on the material frock clamp of workpiece motion s platform 3 fixing, rotate to an angle by electric device 8 control laser output systems, and adjust its laser beam line focus camera lens 5 that is produced by laser generator 2 is focused on after, focus just in time is in the root surface of silicon ingot waste material, workpiece motion s platform 3 is driven by machining control device 8 and does accurate two dimensional motion at directions X and Y direction, be provided with special program software in the machining control device 8, this special-purpose program software carries out following crystal silicon chip strip step by the key control of pressing of machining control device 8:

Step 1. is by the beginning button, controls two-dimentional workpiece motion s platform 3 and moves reciprocatingly in Y direction, makes laser beam can cut silicon ingot scraped surface ground floor silicon chip.

Step 2. is if above-mentioned steps 1 laser fails better to cut silicon ingot scraped surface ground floor silicon chip, and the process of repeating step 1 again is until with the cutting of ground floor silicon chip and separate.

Step 3. continues button, can control two-dimentional workpiece motion s platform and do the fine motion step motion in X-direction earlier, move distance is single silicon chip thickness and two layers of silicon chip spacing sum, make laser beam foucing after the laser condensing lens head focuses on still can be in the second layer silicon chip root surface of silicon ingot waste material, move reciprocatingly once in Y direction then, make laser beam can cut surperficial second layer silicon chip relic.

Step 4. repeats above process, the whole cutting and separating of residual silicon chip on the silicon ingot waste material can be got off.

The above only is preferred embodiment of the present utility model, and is in order to restriction the utility model, not all within spirit of the present utility model and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within the protection domain of the present utility model.

Claims

1. crystal silicon chip laser lift-off equipment, it comprises main control system, laser generator, laser output system and workpiece motion s platform, main control system control laser generator produces laser beam, this laser beam is incident upon the surface of workpiece motion s platform through the laser output system, it is characterized in that: the output of described laser generator is connected by rotating shaft with the input of laser output system, described rotating shaft is a hollow structure, and laser beam passes in this rotating shaft.

2. a kind of crystal silicon chip laser lift-off equipment according to claim 1, it is characterized in that: this equipment also comprises electric device, this electric device is connected with rotating shaft, the rotation of control rotating shaft.

3. a kind of crystal silicon chip laser lift-off equipment according to claim 2, it is characterized in that: described electric device comprises motor and driving gear, this Electric Machine Control driving gear rotation, the periphery of described rotating shaft is provided with driven gear, and described driving gear is connected by belt with driven gear.

4. a kind of crystal silicon chip laser lift-off equipment according to claim 3, it is characterized in that: described driven gear, driving gear mesh by tooth with belt respectively.

5. a kind of crystal silicon chip laser lift-off equipment according to claim 1, it is characterized in that: this equipment also comprises the machining control device, described machining control device control workpiece motion s platform is made two dimensional motion.

6. according to each described a kind of crystal silicon chip laser lift-off equipment of claim 1 to 5, it is characterized in that: described laser output system comprises outer light path device and is arranged on the amasthenic lens of outer light path device below, the laser beam that laser generator produces passes rotating shaft and is incident upon outer light path device, exports after the last line focus lens focus.