CN201878479U - Cooling device for heating element - Google Patents
Cooling device for heating element Download PDFInfo
- Publication number
- CN201878479U CN201878479U CN2010205979881U CN201020597988U CN201878479U CN 201878479 U CN201878479 U CN 201878479U CN 2010205979881 U CN2010205979881 U CN 2010205979881U CN 201020597988 U CN201020597988 U CN 201020597988U CN 201878479 U CN201878479 U CN 201878479U
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- conducting base
- heat
- heater element
- heat dissipation
- auxiliary heat
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Abstract
The utility model discloses a cooling device for a heating element, which comprises a heat conducting base in direct contact with the heating element. The heat conducting base is provided with a cavity; a vertical projection is arranged in the cavity of the heat conducting base; an auxiliary heat radiation part with a cavity is arranged in the middle of the upper end surface of the heat conducting base; and the cavity of the heat conducting base is combined with the cavity of the auxiliary heat radiation part to form a liquid storage cavity; cooling liquid for absorbing heat of the heat conducting base is stored in the liquid storage cavity; an inflow pipe of the cooling liquid is arranged at one end of the auxiliary heat radiation part, and a return pipe of the cooling liquid is arranged at the other end of the auxiliary heat radiation part; and a cooling circulator is connected with the inflow pipe and the return pipe respectively; and a plurality of heat radiation fins are arranged on the left side and the right side of the auxiliary heat radiation part. Through primary heat radiation and auxiliary heat radiation, heat of the heating element can dissipate quickly.
Description
Technical field
The utility model relates to a kind of cooling device, is specifically related to a kind of cooling device and method that is used for heater element.
Background technology
In the information processor of existing PC etc., adopt fin is installed on CPU, and then cooling fan is installed on the top of fin, CPU is carried out the cooling means of forced air-cooling by air cooling.The CPU that in the information processor of PC etc., uses, along the road development of high speed, need carry out high speed processing to Various types of data, the arithmetic speed of CPU also just is forced to accelerate, also increase the cooling capacity deficiency of the forced air-cooling of taking in the prior art from the caloric value of CPU thereupon.In order to satisfy the cooling requirement to CPU, Water Cooling Technology has appearred in the prior art.
For existing Water Cooling Technology, dispelled the heat and the liquid refrigerant that is cooled flows in the stream that forms in its metal framework by radiator.Though can play corresponding thermolysis in the cooling device in the past, for the form of its heat radiation, it is long-pending promptly to enlarge liquid contact surface by wall portion, can not be effectively with heat from wall to the liquid refrigerant transmission, thermal resistance is big.Therefore, the cooling effectiveness of its generation is not high.
Summary of the invention
At above-mentioned technical problem, the purpose of this utility model provides a kind of cooling device that is used for heater element, and cooling device of the present utility model can make the heat of heater element be distributed fast by main body heat radiation and auxiliary heat dissipation.
The technical scheme that realizes above-mentioned purpose is as follows:
The cooling device that is used for heater element, comprise the heat-conducting base that directly contacts with heater element, described heat-conducting base is the heat-conducting base with cavity, be provided with vertical projection in the cavity of heat-conducting base, the middle part of this heat-conducting base upper surface is provided with the auxiliary heat dissipation parts with cavity, the cavity of heat-conducting base combines with the cavity of auxiliary heat dissipation parts and forms a liquid storage cylinder, store in this liquid storage cylinder and be used to absorb the cooling fluid that comes from the heat-conducting base heat, be provided with the inflow pipe of cooling fluid at an end of auxiliary heat dissipation parts, the other end of auxiliary heat dissipation parts is provided with the return duct of cooling fluid, return duct is provided with fin, a cool cycles device is connected respectively with the end of inflow pipe and return duct, is equipped with some radiating fins at the left surface and the right flank of auxiliary heat dissipation parts.
Adopted such scheme, can make the horizontal direction transmission of heat by heat-conducting base itself along heat-conducting base, be provided with vertical projection in the cavity of heat-conducting base, the heat that can make heater element by projection is to vertical direction transmission, therefore, all under the situation that heat is transmitted, help accelerating the transmission of heat on the heater element in level and vertical direction.The cavity of heat-conducting base combines with the cavity of auxiliary heat dissipation parts and forms a liquid storage cylinder, store in this liquid storage cylinder and be used to absorb the cooling fluid that comes from the heat-conducting base heat, can the heat that come from the heat-conducting base be absorbed apace by the cooling fluid in the liquid storage cylinder, heat-conducting base is lowered the temperature.Be provided with the inflow pipe of cooling fluid at an end of auxiliary heat dissipation parts, the other end of auxiliary heat dissipation parts is provided with the return duct of cooling fluid, return duct is provided with fin, a cool cycles device is connected respectively with the end of inflow pipe and return duct, mode by circulation makes coolant flow, helps cooling fluid and absorbs heat apace.Left surface and right flank at the auxiliary heat dissipation parts are equipped with some radiating fins, and radiating fin can be accelerated distributing of heat on the auxiliary heat dissipation parts equally.
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is that the A of Fig. 1 is to schematic diagram;
Fig. 3 is the first execution mode circuit structure diagram of the control device in the utility model;
Fig. 4 is the first execution mode circuit structure diagram of the control device in the utility model;
In the accompanying drawing, 1 is heat-conducting base, and 1a is a cavity, and 1b is a projection, 2 is thermal component, and 2a is a cavity, and 2b is a transition part, and 2c is a connector, 3 is cooling fluid, and 4 is inflow pipe, and 5 is return duct, and 6 is the cool cycles device, 7 is radiating fin, and 8 is microcontroller, and 9 is first temperature sensor, 10 is standby holder, and 11 is electromagnetically operated valve, and 12 is microcontroller, 13 is second temperature sensor, and 14 is fan, and 15 is heater element.
Embodiment
With reference to Fig. 1 and Fig. 2, the cooling device that is used for heater element of the present utility model comprises the heat-conducting base 1 that directly contacts with heater element 15 components and parts such as () CPU, and this heat-conducting base adopts the metal material of good heat conductivity to make, for example, and copper or aluminium.Heat-conducting base 1 is for having the heat-conducting base of cavity 1a, be provided with vertical protruding 1h in the cavity of heat-conducting base 1, this projection is positioned at the middle part of whole cavity 1a, when heat-conducting base absorbs heat, heat except meeting to horizontal direction diffusion, can also make heat carry out the diffusion of vertical direction by protruding 1h.The middle part of heat-conducting base 1 upper surface is provided with the auxiliary heat dissipation parts 2 with cavity 2a, in fact auxiliary heat dissipation parts 2 be with heat-conducting base 1 by casting integrated moulding, this forging type is the forging type of disappearance mould, promptly adopting foam is core rod, when foam is heated, can vaporize, thereby obtain required cavity.Auxiliary heat dissipation parts 2 are a roughly rectangular radiating block, and this radiating block is along vertical layout (shown in Fig. 1 direction) of heat-conducting base 1, and the lower end of radiating block is provided with the transition part 2b of arc.The cavity 1a of heat-conducting base 1 combines with the cavity 2a of auxiliary heat dissipation parts 2 and forms a liquid storage cylinder, store in this liquid storage cylinder and be used to absorb the cooling fluid 3 that comes from the heat-conducting base heat, cooling fluid can be taken away the heat on the heat-conducting base in time, and the cooling fluid in the liquid storage cylinder becomes main heat dissipation region.Be provided with the inflow pipe 4 of cooling fluid at an end of auxiliary heat dissipation parts 2, the other end of auxiliary heat dissipation parts 2 is provided with the return duct 5 of cooling fluid, and return duct is provided with fin 5a, by fin 5a, can provide very big help for distributing of heat in the cooling fluid.Auxiliary heat dissipation parts 2 are provided with the connector 2c of two flares, and described inflow pipe 4 is connected with a connector 2c respectively with return duct 5.Auxiliary heat dissipation parts 2 are provided with groove, and described return duct is embedded in this groove after bending.A cool cycles device 6 is connected respectively with the end of inflow pipe 4 with return duct 5, the cool cycles device comprises a pump and a liquid reserve tank, in liquid reserve tank, be provided with a plurality of cylinder heat absorbing sheets, these cylinder heat absorbing sheets are with the overlapped way setting, help institute's heat content in the cooling fluid is absorbed by this cylinder heat absorbing sheet, reduce coolant temperature.Cool cycles device 6 can make cooling fluid 3 flow circularly, is beneficial to make heat contained in the cooling fluid 3 to be distributed effectively.Left surface and right flank at auxiliary heat dissipation parts 2 are equipped with some radiating fins 7.
On above-mentioned cooling device basis, in conjunction with as shown in Figure 3,, except above-mentioned thermal component is arranged, also comprise a control device for cooling device of the present utility model, this control device mainly is auxiliary above-mentioned cooling device cooling.First temperature sensor, 9, the first temperature sensors 9 that control device comprises microcontroller 8 and is used to detect heater element 15 are connected with microcontroller, and cool cycles device 6 is connected with microcontroller.Microcontroller 8 is a single-chip microcomputer.For this kind mode, cool cycles device 6 mainly is the control that is subjected to microcontroller 8, to change the flowing velocity of cooling fluid into, when if heater element 15 temperature exceed preset value, then microcontroller can be controlled cool cycles device 6 and quicken operation, drive cooling fluid 3 from row and flow fast, help accelerating to reduce the heat of heater element 15 like this.For the control device in the present embodiment, also comprise the standby holder 10 that has cooling fluid, this standby holder is communicated with the cool cycles device by electromagnetically operated valve 11, and described electromagnetically operated valve 11 is connected with microcontroller.Cooling fluid stores for future use in standby holder 10, mainly be to prevent when the mode of heater element 15 by top quickening cooling fluid 3 all can't make the temperature of heater element 15 be reduced to desirable value, at this moment open by microcontroller 11 control electromagnetically operated valves, standby cooling fluid in the standby holder 10 is flowed in the cool cycles device 6, converge with cooling fluid 3, heat part in the cooling fluid 3 passes to standby cooling fluid by thermaltransmission mode, comparatively speaking, the temperature of cooling fluid integral body is lower than previous temperature, thereby helps reducing the temperature of heater element 15.
As Fig. 4, for control device, the utility model also is not limited to the foregoing description, i.e. control device second temperature sensor 13 that comprises microcontroller 12 and be used to detect heater element 15, and the fan 14 that also is provided with auxiliary heat dissipation in the upper end of auxiliary heat dissipation parts.Second temperature sensor 13 is connected with microcontroller 12, and fan 14 is connected with microcontroller 12.Similarly, microcontroller 12 also is a single-chip microcomputer, is preset with Control Software in the microcontroller 12, and it carries out work according to software program, about this point, has corresponding record below.For the control device of present embodiment, similarly also be auxiliary above-mentioned cooling device cooling.
Claims (7)
1. cooling device that is used for heater element, comprise the heat-conducting base that directly contacts with heater element, it is characterized in that: described heat-conducting base is the heat-conducting base with cavity, be provided with vertical projection in the cavity of heat-conducting base, the middle part of this heat-conducting base upper surface is provided with the auxiliary heat dissipation parts with cavity, the cavity of heat-conducting base combines with the cavity of auxiliary heat dissipation parts and forms a liquid storage cylinder, store in this liquid storage cylinder and be used to absorb the cooling fluid that comes from the heat-conducting base heat, be provided with the inflow pipe of cooling fluid at an end of auxiliary heat dissipation parts, the other end of auxiliary heat dissipation parts is provided with the return duct of cooling fluid, return duct is provided with fin, a cool cycles device is connected respectively with the end of inflow pipe and return duct, is equipped with some radiating fins at the left surface and the right flank of auxiliary heat dissipation parts.
2. the cooling device that is used for heater element according to claim 1, it is characterized in that: also comprise a control device, first temperature sensor that this control device comprises microcontroller and is used to detect heater element, first temperature sensor is connected with microcontroller, and the cool cycles device is connected with microcontroller.
3. the cooling device that is used for heater element according to claim 2 is characterized in that: also comprise the standby holder that has standby cooling fluid, this standby holder is communicated with the cool cycles device by electromagnetically operated valve, and described electromagnetically operated valve is connected with microcontroller.
4. the cooling device that is used for heater element according to claim 1, it is characterized in that: also comprise a control device, second temperature sensor that this control device comprises microcontroller and is used to detect heater element, and the fan that also is provided with auxiliary heat dissipation in the upper end of auxiliary heat dissipation parts, second temperature sensor is connected with microcontroller, and fan is connected with microcontroller.
5. according to claim 1 or the 4 described cooling devices that are used for heater element, it is characterized in that: described auxiliary heat dissipation parts are provided with groove, and described return duct is embedded in this groove after bending.
6. the cooling device that is used for heater element according to claim 1 is characterized in that: described auxiliary heat dissipation parts are a radiating block, and this radiating block is along vertical layout of heat-conducting base, and the lower end of radiating block is provided with the transition part of arc.
7. the cooling device that is used for heater element according to claim 1 is characterized in that: described auxiliary heat dissipation parts are provided with the connector of two flares, and described inflow pipe is connected with a connector respectively with return duct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205979881U CN201878479U (en) | 2010-11-09 | 2010-11-09 | Cooling device for heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205979881U CN201878479U (en) | 2010-11-09 | 2010-11-09 | Cooling device for heating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201878479U true CN201878479U (en) | 2011-06-22 |
Family
ID=44166383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205979881U Expired - Fee Related CN201878479U (en) | 2010-11-09 | 2010-11-09 | Cooling device for heating element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201878479U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101977489A (en) * | 2010-11-09 | 2011-02-16 | 廖维秀 | Cooling device and method for heating elements |
-
2010
- 2010-11-09 CN CN2010205979881U patent/CN201878479U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101977489A (en) * | 2010-11-09 | 2011-02-16 | 廖维秀 | Cooling device and method for heating elements |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 Termination date: 20111109 |