CN201868403U - Chip unloading device used in semiconductor encapsulating process - Google Patents
Chip unloading device used in semiconductor encapsulating process Download PDFInfo
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- CN201868403U CN201868403U CN2010206106045U CN201020610604U CN201868403U CN 201868403 U CN201868403 U CN 201868403U CN 2010206106045 U CN2010206106045 U CN 2010206106045U CN 201020610604 U CN201020610604 U CN 201020610604U CN 201868403 U CN201868403 U CN 201868403U
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Abstract
The utility model relates to a chip unloading device used in a semiconductor encapsulating process. The chip unloading device comprises a chip shedding cavity which consists of a box body for placing a thin iron ring and a funnel longitudinally penetrating through the box body, wherein the upper surface of the box body is an inclined surface, the center of the inclined surface is provided with an opening, an upper mouth of the funnel takes a shape the same as that of the opening and closely fixed on the opening, a lower mouth of the funnel penetrates through a bottom plate of the box body and is provided with a discharge hole in an extending way, air vents are arranged at a connecting position of the upper mouth of the funnel and the opening of the inclined surface, and the upper end positioned on the side wall at the rear part of the funnel, an ion fan is arranged in a containing space between the outer side of the funnel and the inner side of the box body, an air outlet of the ion fan is communicated with the air vents through air guide ducts, a clamping component for fixing the thin iron ring is arranged on the inclined surface around the opening, and a through hole is also arranged in the inclined surface around the opening. The chip unloading device can take down a large number of encapsulated chips from an adhesive tape in one time, and avoid damage to the chip quality caused by static electricity generated in operation.
Description
Technical field
The utility model is about semiconductor packaging process, relates in particular to a kind of chip discharge mechanism that is used for semiconductor packaging process.
Background technology
Semiconductor packaging has directly determined the development of semiconductor level as a requisite ring in the semiconductor manufacturing industry; The purpose of semiconductor packages is to finish the pin of bare chip internal circuit and the electric interconnection of outside matrix signal exit, protects bare chip simultaneously, avoids foreign object damage, makes it can carry certain external force.Development through decades, semiconductor packaging is advanced day by day, encapsulated type also presents omnifarious situation along with the difference of product application, from DIP, SOP, QFP, PGA, BGA to CSP again to SIP, a technical indicator generation is than generation advanced person, these all are to develop according at that time the packaging technology and the market demand, and the basic manufacturing process of some of these encapsulation technologies roughly comprises the steps: (1) wafer attenuate: need wafer is ground attenuate to reach suitable package thickness in encapsulation; (2) circuit is drawn: the weld pad on the chip is drawn out to the outside external pin that forms of packaging body, is convenient to and other device interconnections, according to the difference of circuit lead-out mode, packaged type is also different; (3) insulator coats: chip internal is protected, play physical support and protection, outer field shield, stress buffer, heat radiation, over-dimension and standardized effect; (4) chip separates: also claim chip cutting, the chip that links together on the wafer is separated into each chip unit; (5) seal sign: packaged chip is printed sign, to distinguish; (6) chip pickup: chip pickup is that packaged chip is put in the suitable packaging material, is convenient to transportation; (7) functional test: packaged chip is carried out functional test, the checking product percent of pass.
QFN (quad flat non-leaded package) quad flat non-pin package, it is advanced packaging technology in the semiconductor packages in recent years, the product of its encapsulation is square, pin also is square and apportion is arranged in around the matrix bottom, product size after the encapsulation is little, power path is short, electrical property is good, reliability is high, be subjected to the consistent of market and favor, its main technique has: (1) wafer attenuate; (2) wafer cuts into single chips; (3) chip and lead frame are bonding; (4) lead-in wire bonding; (5) plastic packaging; (6) lettering; (7) chip separates; (8) grasp (chip separates from lead frame); (9) test; (10) packing shipment.In above-mentioned technology, after chip was finished plastic packaging and lettering, product had arrived cutting (chip separation) step; As shown in Figure 5, the side that first lead frame 7 with carries chips is formed with mold compound before the cutting adheres on the UV adhesive tape 8, and UV adhesive tape 8 adheres on the thin iron hoop 9, will approach iron hoop 9 afterwards and be positioned in the automatic gas cutting machine, and lead frame is cut; After cutting was finished, each lead frame unit 71 was separated from one another, has promptly formed the good single chips of plastic packaging, and again through UV-irradiation, the adhesion of UV adhesive tape 8 reduces greatly, as long as one grab gently, single chips that plastic packaging is good just is removed like a cork.
At present, in the prior art, chip grasps technology and adopts dual mode usually: artificial manual picking or with picking up absorption of machine automatically is put in the packaging material of appointment again.Though adopt and to pick up machine automatically and improved greatly than the efficient of artificial picking, but still operation of needs, product for the Different Package requirement, can transport shipment as only installing to then in the can with bag packaging, as if need product that carries out functional test etc. after the cutting, the two is not best mode.
Moreover in the prior art, chip is easy to generate static during grab chips, and static can produce infringement to chip, influences product quality.
In view of this, the inventor relies on relevant design and manufacturing experience for many years, proposes a kind of chip discharge mechanism that is used for semiconductor packaging process, to overcome the defective of prior art.
The utility model content
The purpose of this utility model is to provide a kind of chip discharge mechanism that is used for semiconductor packaging process, can once a large amount of packaged chips be taken off from the UV adhesive tape, to enhance productivity, the demand that adapts to different clients, simultaneously, this chip discharge mechanism has static eliminating function, the infringement that the static that can avoid producing in the operation causes chip quality.
The purpose of this utility model is to realize like this, a kind of chip discharge mechanism that is used for semiconductor packaging process, this chip discharge mechanism comprises the chip cavity that comes off at least, and this chip cavity that comes off is made of the box body of placing thin iron hoop and the funnel that vertically runs through this box body; The upper surface of box body is an inclined-plane that tilts, and the central part on this inclined-plane is provided with an opening, and the shape of suitable for reading and this opening of described funnel is identical and closely be fixed on this opening, and base plate and extension that the end opening of described funnel passes box body are provided with a discharging opening; The connecting portion of and inclined-plane opening suitable for reading at described funnel and the upper end that is positioned at the rear sidewall of described funnel are provided with air vent hole; Be provided with the ion fan in the accommodation space of the described funnel outside and box body inboard, the air outlet of ion fan is communicated in described air vent hole by guide duct; On described inclined-plane and around described opening, be provided with the fixing fixing member that approaches iron hoop; On described inclined-plane and around described opening, also be provided with open-work.
In a better embodiment of the present utility model, below described discharging opening, be provided with a glove plate, this glove plate is fixedly connected on the base plate of box body.
In a better embodiment of the present utility model, described fixing member comprises the card article that is positioned at the opening left and right sides and downside and is positioned at the latch member of opening upside.
In a better embodiment of the present utility model, described latch member by one fixedly the chute body and be slidedly arranged on this fixedly the slide block in the chute body constitute; This slide block is provided with a handle, this slide block rear end and fixedly be provided with a stage clip between the chute body, and slip front is the tapered end of the thin iron hoop of a chucking.
In a better embodiment of the present utility model, the shape of cross section of described funnel is circular, and described opening shape also is circular, and the axial line of described circular funnel is the direction setting of leaning forward gradually from top to bottom.
In a better embodiment of the present utility model, the shape of cross section of described funnel is a rectangle, and described opening shape also is a rectangle; This funnel is made of front side wall, rear wall, left side wall and right side wall, and the front side wall edge on the described funnel end opening is positioned at the front side at the front side wall edge of described funnel on suitable for reading.
In a better embodiment of the present utility model, the described chip cavity that comes off is arranged on the centre position of a body desktop.
In a better embodiment of the present utility model, be higher than the come off position of cavity of chip on this body and be provided with rack, rack is provided with along the desktop rear end on this.
In a better embodiment of the present utility model, described table body bottom is provided with four rolling.
In a better embodiment of the present utility model, the table body bottom on described each roller next door is respectively equipped with a feet that can stretch up and down.
From the above mentioned, chip discharge mechanism of the present utility model, can once a large amount of packaged chips be taken off from the UV adhesive tape, improved production efficiency, simultaneously, owing to adopted the ion fan can produce a large amount of air-flows that has positive and negative charge, make this chip discharge mechanism have static eliminating function, the infringement that the static that can avoid producing in the operation causes chip quality.
Description of drawings
The following drawings only is intended to the utility model done and schematically illustrates and explain, does not limit scope of the present utility model.Wherein,
Fig. 1: be the structural representation of chip discharge mechanism of the present utility model.
Fig. 2: be the come off structural representation of cavity of the chip of chip discharge mechanism of the present utility model.
Fig. 3: for the A among Fig. 2 to part sectional structure schematic diagram.
Fig. 4: be the structural representation of latch member in the utility model.
Fig. 5: the structural representation that is stained with the thin iron hoop of lead frame and UV adhesive tape in the prior art.
Embodiment
Understand for technical characterictic of the present utility model, purpose and effect being had more clearly, now contrast description of drawings embodiment of the present utility model.
As Fig. 1, Fig. 2, shown in Figure 3, the utility model provides a kind of chip discharge mechanism 100 that is used for semiconductor packaging process, this chip discharge mechanism 100 comprises the chip cavity 1 that comes off, the described chip cavity 1 that comes off is arranged on the centre position of body 2 desktops, be provided with rack 21 being higher than the come off position of cavity 1 of chip on the desktop of this body, should go up rack 21 and be provided with along the desktop rear end, last rack has a loading plate, is used for carrying the material that operation is used.Described table body 2 bottoms are provided with four rolling 22; The table body bottom on described each roller 22 next door is respectively equipped with a feet 23 that can stretch up and down, and as described in Figure 1, this feet 23 can be the spiral stretching structure; Can change use as required mutually between feet 23 and the roller 22,, also can stably stop so that table body 2 can move.As shown in Figure 2, this chip cavity 1 that comes off is made of the box body 11 of placing thin iron hoop and the funnel 12 that vertically runs through this box body 11; The upper surface of box body 11 is an inclined-plane 111 that tilts, the central part on this inclined-plane 111 is provided with an opening 1111, the shape with this opening 1111 suitable for reading of described funnel 12 is identical and closely be fixed on this opening 1111, and the end opening of described funnel 12 passes the base plate 112 of box body and extends and is provided with a discharging opening 13; The connecting portion of and inclined-plane opening 1111 suitable for reading at described funnel 12 and the upper end that is positioned at the rear sidewall of described funnel are provided with air vent hole 14; Be provided with ion fan 15 (as shown in Figure 3) in the accommodation space of described funnel 12 outsides and box body 11 inboards, the air outlet 151 of ion fan 15 is communicated in described air vent hole 14 by guide duct 152, and the air inlet of ion fan 15 links to each other with giving the gas system; On described inclined-plane 111 and around described opening 1111, be provided with the fixing fixing member 16 that approaches iron hoop; On described inclined-plane 111 and also be provided with the open-work 17 of the thin iron hoop that is used to take around described opening 1111, described open-work 17 sizes can put in freely to stretch out with finger and be advisable, in the present embodiment, each design has two open-works 17 in the outside at the upper and lower edge of opening 111.
The chip discharge mechanism 100 that is used for semiconductor packaging process of the present utility model is applicable to chip unloading and pick-up process, is particularly useful for the structure of chip attach on the thin iron hoop that posts adhesive tape of array arrangement.During use, will approach iron hoop and be fastened between the described fixing member 16 with fixing thin iron hoop, the side that thin iron hoop is stained with chip down; Open ion fan 15, the air-flow that the ion fan produces is transferred to described air vent hole 14 by guide duct 152; Instrument (as: bottle cap or other do not have the instrument of corner angle) with circle, the adhesive tape that manually scratches back and forth, because the UV adhesive tape is after being subjected to UV-irradiation, adhesive tape viscosity reduces greatly, the stressed back of chip breaks away from from adhesive tape thus, enters into the packing appliance of below along funnel 12.Then can directly pack shipment as required or carry out functional test again from the chip that adhesive tape takes off.
From the above mentioned, chip discharge mechanism of the present utility model, can once a large amount of packaged chips be taken off from the UV adhesive tape, improved production efficiency, simultaneously, owing to adopted the ion fan can produce a large amount of air-flows that has positive and negative charge, make this chip discharge mechanism have static eliminating function, the static that can avoid producing in the operation causes damage to chip quality.
In the present embodiment, described ion fan 15 can be provided with two; Air vent hole 14 is a row or multi-row being spaced, and described air vent hole 14 also can be vent openings, promptly directly opens an elongated opening in the rear sidewall upper end of described funnel and is used for the air-flow transmission.Described ion fan can produce a large amount of air-flows that has positive and negative charge, can with on the object with charging neutrality fall.When body surface institute is electrically charged when be negative electrical charge, it can absorb the positive charge in the air-flow, and when body surface institute is electrically charged when being positive charge, it can absorb the negative electrical charge in the air-flow, thereby the static on the body surface is neutralized, and reaches the effect of elimination static.The air-flow that ion fan 15 produces is transferred to described air vent hole 14 by guide duct 152, and air-flow constantly blows to the anterior sidewall of funnel through air vent hole 14, the static that produces in the time of can eliminating the funnel chips and drop.
In the present embodiment, as Fig. 1, Fig. 2, shown in Figure 3, be provided with a glove plate 18 below described discharging opening 13, this glove plate 18 is fixedly connected on base plate 112 belows of box body; Described packing appliance can be placed on this glove plate 18, the chip that falls from funnel in order to splendid attire.
Further, in the present embodiment, described fixing member 16 comprises card article 161 that is positioned at opening 1111 and arranged on left and right sides and downside and the latch member 162 that is positioned at the opening upside.The structure of described three card articles 161 is identical, with screw it is tightened on upper surface; As shown in Figure 4, described latch member 162 by one fixedly chute body 1621 and be slidedly arranged on this fixedly the slide block 1622 in the chute body constitute, this slide block 1622 is provided with a handle 1623, this slide block 1622 rear ends and fixedly be provided with a stage clip 1624 between the chute body 1621, slide block 1622 front ends are one can tighten the tapered end 1625 of described thin iron hoop.
As shown in Figure 2, the shape of described opening 1111 can be square or circle according to the needs of encapsulating products.In the present embodiment, the shape of cross section of described funnel 12 is a rectangle, and described opening 1111 shapes also are rectangle; This funnel 12 is made of front side wall 121, rear wall 122, left side wall 123 and right side wall 124.
Another kind of embodiment as present embodiment, the shape of cross section of described funnel 12 also can be circular (not shown), described opening 1111 shapes also are circular, the axial line of described circular funnel is the direction setting of leaning forward gradually from top to bottom, thus, in the time of can avoiding the ion fan running, the chip that drops adheres on the sidewall.
The above only is the schematic embodiment of the utility model, is not in order to limit scope of the present utility model.Any those skilled in the art, equivalent variations of having done under the prerequisite that does not break away from design of the present utility model and principle and modification all should belong to the scope that the utility model is protected.
Claims (10)
1. chip discharge mechanism that is used for semiconductor packaging process is characterized in that: this chip discharge mechanism comprises the chip cavity that comes off at least, and this chip cavity that comes off is made of the box body of placing thin iron hoop and the funnel that vertically runs through this box body; The upper surface of box body is an inclined-plane that tilts, and the central part on this inclined-plane is provided with an opening, and the shape of suitable for reading and this opening of described funnel is identical and closely be fixed on this opening, and base plate and extension that the end opening of described funnel passes box body are provided with a discharging opening; The connecting portion of and inclined-plane opening suitable for reading at described funnel and the upper end that is positioned at the rear sidewall of described funnel are provided with air vent hole; Be provided with the ion fan in the accommodation space of the described funnel outside and box body inboard, the air outlet of ion fan is communicated in described air vent hole by guide duct; On described inclined-plane and around described opening, be provided with the fixing fixing member that approaches iron hoop; On described inclined-plane and around described opening, also be provided with open-work.
2. the chip discharge mechanism that is used for semiconductor packaging process as claimed in claim 1 is characterized in that: be provided with a glove plate below described discharging opening, this glove plate is fixedly connected on the base plate of box body.
3. the chip discharge mechanism that is used for semiconductor packaging process as claimed in claim 1 is characterized in that: described fixing member comprises the card article that is positioned at the opening left and right sides and downside and is positioned at the latch member of opening upside.
4. the chip discharge mechanism that is used for semiconductor packaging process as claimed in claim 3 is characterized in that: described latch member by one fixedly the chute body and be slidedly arranged on this fixedly the slide block in the chute body constitute; This slide block is provided with a handle, this slide block rear end and fixedly be provided with a stage clip between the chute body, and slip front is the tapered end of the thin iron hoop of a chucking.
5. the chip discharge mechanism that is used for semiconductor packaging process as claimed in claim 1, it is characterized in that: the shape of cross section of described funnel is for circular, described opening shape also is circular, and the axial line of described circular funnel is the direction setting of leaning forward gradually from top to bottom.
6. the chip discharge mechanism that is used for semiconductor packaging process as claimed in claim 1 is characterized in that: the shape of cross section of described funnel is a rectangle, and described opening shape also is a rectangle; This funnel is made of front side wall, rear wall, left side wall and right side wall, and the front side wall edge on the described funnel end opening is positioned at the front side at the front side wall edge of described funnel on suitable for reading.
7. the chip discharge mechanism that is used for semiconductor packaging process as claimed in claim 1 is characterized in that: the described chip cavity that comes off is arranged on the centre position of a body desktop.
8. the chip discharge mechanism that is used for semiconductor packaging process as claimed in claim 7 is characterized in that: be higher than the come off position of cavity of chip on this body and be provided with rack, rack is provided with along the desktop rear end on this.
9. the chip discharge mechanism that is used for semiconductor packaging process as claimed in claim 7 is characterized in that: described table body bottom is provided with four rolling.
10. the chip discharge mechanism that is used for semiconductor packaging process as claimed in claim 9 is characterized in that: the table body bottom on described each roller next door is respectively equipped with a feet that can stretch up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206106045U CN201868403U (en) | 2010-11-16 | 2010-11-16 | Chip unloading device used in semiconductor encapsulating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206106045U CN201868403U (en) | 2010-11-16 | 2010-11-16 | Chip unloading device used in semiconductor encapsulating process |
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| Publication Number | Publication Date |
|---|---|
| CN201868403U true CN201868403U (en) | 2011-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206106045U Expired - Lifetime CN201868403U (en) | 2010-11-16 | 2010-11-16 | Chip unloading device used in semiconductor encapsulating process |
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| CN (1) | CN201868403U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102097349A (en) * | 2010-11-16 | 2011-06-15 | 嘉盛半导体(苏州)有限公司 | Chip unloading device for semiconductor package process |
-
2010
- 2010-11-16 CN CN2010206106045U patent/CN201868403U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102097349A (en) * | 2010-11-16 | 2011-06-15 | 嘉盛半导体(苏州)有限公司 | Chip unloading device for semiconductor package process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110615 Effective date of abandoning: 20120627 |