CN201841612U - Wafer cutting device - Google Patents
Wafer cutting device Download PDFInfo
- Publication number
- CN201841612U CN201841612U CN2010205670825U CN201020567082U CN201841612U CN 201841612 U CN201841612 U CN 201841612U CN 2010205670825 U CN2010205670825 U CN 2010205670825U CN 201020567082 U CN201020567082 U CN 201020567082U CN 201841612 U CN201841612 U CN 201841612U
- Authority
- CN
- China
- Prior art keywords
- cutting
- column
- cross bar
- wafer
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model relates to a wafer cutting device, which comprises a cutting mechanism, a bottom plate and a support mechanism. The cutting mechanism includes at least one cutting wire saw. The support mechanism includes at least two vertical columns and one transverse rod, the vertical columns are fixed to the bottom plate, and two tail ends of the transverse rod are respectively detachably connected with one vertical column. The heights of the transverse rod and the vertical columns can be adjusted.
Description
Technical field
The utility model relates to the cutting equipment of semi-conducting material, relates more specifically to be used for the cutting equipment of wafer, especially ultra thin wafer.
Background technology
Wafer (for example silicon wafer and IIIA-VA compounds of group wafer, for example GaAs wafer etc.) is widely used in semicon industry.In the process of making wafer, at first utilize growing method to obtain crystal bar (being also referred to as crystal ingot), then crystal bar is cut into wafer.Cutting also need be experienced grinding, etching and cleaning after finishing, and the final acquisition of operation such as polishing can be for the wafer of making the semiconductor devices use.
Formula wafer multi-line cutting machine is from top to bottom used in the cutting of wafer usually.In the process of utilizing the cutting of this kind cutting machine, the bottom of crystal bar is adhesively fixed on the workbench, and the cutting of crystal bar begins from the top to finish to the bottom.(for example 4 cun wafer slice thickness are about 260 microns for the cutting of ultra thin wafer for such cutting method, or 6 cun wafers are about 300 microns), cutting proceeds to when bottom wafer tilts even lodging, occurs a large amount of bottom of wafer fracture (so-called " rotting at the end ") and causes damage.For example, adopt the multi-thread cutting of formula from top to bottom (" tangent ") method, the breakage rate of 6 cun wafers of cutting ultra thin (about about 300 microns of slice thickness) is more than 35%.
For reducing the loss, developed a kind of cutting method (" cutting ") of formula from top to bottom: crystal bar is suspended on the cutting machine after bonding by the top, begins to be cut to the top from the bottom and finishes.After cutting finished, all wafers all was suspended on the binding platform.Adopt this scheme of cutting to realize the cutting of ultra thin wafer effectively, and breakage rate generally is no more than 5%.But the price of the saw of falling the tangent line is generally 2 times more than that cut the scroll saw price from top to bottom.
Therefore, be starved of the wafer cutting equipment that a kind of cost is low, loss is little.
The utility model content
The purpose of this utility model is to solve the problems referred to above in the prior art.
According to an aspect of the present utility model, a kind of cutting equipment of wafer is provided, comprising:
A cutting mechanism comprises at least one cutting scroll saw;
A base plate; And
A supporting mechanism comprises at least two columns and a cross bar, and described column is fixed to base plate, and described cross bar releasably is connected to each column respectively in two end; The adjustable height of wherein said cross bar and each column tie point.
In a preferred embodiment of the present utility model, described column is provided with the hole that is used to put into cross bar, is provided with holding pin in the hole, and the height in hole (hole is in the distance of vertical direction to base plate) is equal to or less than boule diameter to be cut and press strip thickness sum.
In a preferred embodiment of the present utility model, described column is fixed to base plate movably, and the spacing between the column is adjustable.
In a preferred embodiment of the present utility model, described cutting mechanism comprises a plurality of cutting scroll saws (if each scroll saw be scroll saw independently) mutually or multiple cutting scroll saw (if scroll saw is to form through going up around the roller (roller) of cutting mechanism with single line).
In a preferred embodiment of the present utility model, comprise two columns and two cross bars, a column and corresponding cross bar and another column and corresponding cross bar are symmetrically distributed with respect to base plate.
Description of drawings
The utility model is described with reference to accompanying drawing by a non-restrictive example, in the accompanying drawings:
Fig. 1 is the schematic diagram of the wafer cutting equipment of prior art.
Fig. 2 is the schematic diagram of an embodiment of the present utility model.
Fig. 3 is the partial enlarged drawing of the wafer cutting equipment among Fig. 2.
The specific embodiment
In the utility model, " cutting scroll saw " is meant a line style thing that can be used to cut crystal bar, for example is with tooth or not toothed metal wire.
In the utility model, cutting mechanism can comprise a cutting scroll saw, also can comprise a plurality of cutting scroll saws that are assemblied in the same cutting mechanism, perhaps comprises by same line style thing through on the roller of cutting mechanism and the multiple scroll saw that forms.
Fig. 1 has schematically shown the wafer cutting equipment 1000 of prior art.This cutting equipment 1000 comprises cutting mechanism 120 and is used for fixing the base plate 130 of crystal bar.Cutting mechanism 120 comprises cutting scroll saw 122 and roller 121.There is press strip 111 at the top of crystal bar 110 to be cut in conjunction with (for example by bonding etc.), and the press strip of crystal bar 110 combination bottom it is fixed on the base plate 130.Press strip 111 is made by graphite usually, also can be made by other materials such as for example resin materials.
When cutting, the cutting scroll saw 122 of cutting mechanism 120 cuts crystal bar 110 from top to bottom.Because crystal bar is only fixing by the base plate 130 in its underpart, when being cut to the bottom of crystal bar, wafer tilts easily or lodges, thereby has caused a large amount of bottom of wafer fractures, forms the mashed end.The mashed end, make that the breakage rate of wafer is very serious, and for example when 6 cun wafers of cutting ultra thin, breakage rate will reach more than 35%.
Fig. 2 shows the schematic diagram of an embodiment 2000 of the present utility model.Should be appreciated that following explanation only is exemplary for the utility model, and should not be regarded as limiting the utility model.
The cutting equipment of a kind of wafer of the present utility model comprises: a cutting mechanism 220 comprises at least one cutting scroll saw; A base plate 230; And a supporting mechanism, comprising at least two columns 240 and a cross bar 250, described column 240 is fixed to base plate 230, and described cross bar 250 releasably is connected to each column 240 respectively in two end; The adjustable height of wherein said cross bar 250 and each column 240 tie point.
In a preferred embodiment of the present utility model, continuously around a steel wire, the spacing (corresponding to wafer thickness) by groove on the roller forms multiple scroll saw on the roller of with groove.Like this, in when cutting, the parallel steel wire after the coiling by means of abrasive material with disposable many wafers that cut into consistency of thickness of crystal bar.
In a preferred embodiment of the present utility model, described column 240 is provided with the hole that is used to put into cross bar 250, is provided with holding pin in the hole, and the height in hole (hole is in the distance of vertical direction to base plate) is equal to or less than boule diameter to be cut and press strip thickness sum.
In a preferred embodiment of the present utility model, described column 240 is fixed to base plate 230 movably, and the spacing between the column 240 is adjustable.
In a preferred embodiment of the present utility model, described cutting mechanism 220 comprises a plurality of cutting scroll saws.
In a preferred embodiment of the present utility model, two columns 240 and two cross bars 250 are arranged, they are symmetrically distributed with respect to base plate 230.
As shown in Figure 2, cutting mechanism 220 comprises cutting scroll saw 222 and roller 221.The crystal bar 210 that the top is combined with press strip 211 is fixed to base plate 230 by the press strip of its bottom combination, for example, is fixed to base plate 230 by method such as bonding.Cutting scroll saw 222 is positioned at crystal bar 210 tops, can cut crystal bar 210 from top to bottom.
Cutting equipment of the present utility model is with respect to the improvements of prior art: wafer cutting equipment 2000 also comprises the supporting mechanism that is used for crystal bar 210, and this supporting mechanism comprises at least two columns 240 and a cross bar 250.Column 240 by jockey for example bolt be fixed in base plate 230 movably.Cross bar 250 axis along crystal bar 210 to be cut above crystal bar extends, and be connected to column 240 respectively at two ends, and the groove 212 that is pressed against when cutting operation in crystal bar 210 press strips 211 supports crystal bar.Simultaneously, column 240 position each other is adjustable, and crystal bar 210 is supported between the column 240.
In embodiment shown in Figure 2, base plate 230 is a workbench form, crystal bar 210 by bonding press strip be fixed to this workbench 230 by bonding mode.Described supporting mechanism also is fixed to this workbench, and wherein two columns 240 are arranged in crystal bar 210 head and the tail both sides.After cross bar 250 was put into the correct position location, in cutting process subsequently, supporting mechanism and crystal bar 210 rose synchronously, thereby ensured that supporting mechanism can effectively play a role in whole cutting process.
In cutting process, cross bar 250 passes the groove 212 in the press strip 211, and owing to press strip 211 is pressed against on the crystal bar 210, so cross bar can be realized the support to crystal bar 210.As shown in Figure 3, groove 212 laterally runs through press strip 211, the groove opening that cross bar 250 can be positioned at press strip 211 upper surfaces enters press strip, moves to the mid portion of press strip downwards and towards the extension trend at press strip center along groove 212 then, thereby realizes the support to press strip and crystal bar.Though being shown in the upper surface of press strip 212 in the present embodiment, groove 212 has opening (as shown in Figure 3), but in other embodiments, the groove of press strip can be at vertical lateral opening of press strip, or one vertically run through the press strip end face and do not have the groove of opening in the side, and perhaps groove also can be a through hole that vertically runs through press strip.
In a preferred embodiment of the present utility model, two columns and two cross bars are arranged, a column and corresponding cross bar and another column and corresponding cross bar are symmetrically distributed with respect to base plate.Like this, the crystal bar top is provided with two press strips, and two cross bars respectively are pressed against on the longitudinal groove of each press strip.
In a specific embodiments of the present invention, cross bar 250 is stainless steel bars, and its diameter is preferably at the 3-8 millimeter.One of ordinary skill in the art will appreciate that, cross bar can be made by for example various metals of other any suitable materials, resin or carbon fibre material or the like, and can have other suitable size and cross sectional shapes, as long as the wafer cross bar can support crystal bar effectively and support cutting in the cutting process of crystal bar after.
Described column 240 can utilize known various bindiny mechanism for example bolt mechanism or snap device, is attached to base plate 230.Cross bar 250 can utilize various known modes to be attached on the column 240 equally.For example in a preferred embodiment, the connection between column 240 and the cross bar 250 is a quick-connect machanism.For example, in this quick-connect machanism, the last end of two root posts 240 is respectively equipped with the hole (not shown), is used to put into cross bar 250.To before the crystal bar cutting, earlier the hole of column is aimed at the groove of press strip, and the affirmation cross bar can effectively put into, in the hole on the top of column 240, be provided with holding pin at least one, so that cross bar can be fixed the stability of assurance system after putting into.Be understandable that the connection between cross bar and the column can be adopted other mechanism, and for example snap fastener or detent mechanism are realized.
Below, will briefly explain the course of work of wafer cutting equipment 2000 of the present utility model in conjunction with the accompanying drawings:
Prepare crystal bar 210 to be cut, wherein this crystal bar 210 is combined with the press strip 211 with groove 212, and crystal bar 210 is bonded with another press strip (no groove) in its bottom corresponding with press strip 211;
This crystal bar and press strip (by the bottom press strip) are bonded between two columns 240 of base plate 230, make the hole on the column 240 aim at (this moment, cross bar 250 also was not attached to column 240) with the groove 212 of press strip 211 simultaneously, can be placed into groove and column to guarantee cross bar 250;
Utilize 220 pairs of press strips 211 of cutting mechanism and crystal bar 210 to cut from top to bottom, after the cutting scroll saw 222 of cutting mechanism was cut the groove 212 of press strip 211, suspend cutting;
Continue to use 222 pairs of crystal bars of cutting scroll saw to cut, up to the cutting of finishing crystal bar.
After cutting was finished, though the press strip 211 of with groove 212 has been cut into the thin slice identical with wafer thickness, press strip still was connected as a single entity " hanging " on cross bar 250 with wafer, thereby had effectively avoided the inclination or the lodging of wafer.
Show that by the cutting test result who utilizes cutting equipment of the present utility model to carry out ultra thin wafer this utilizes equipment of the present utility model can be avoided the inclination or the lodging of wafer very effectively, thereby avoid the wafer loss effectively.
In addition, the utility model has effectively improved the yield rate of wafer cutting by to the existing cutting equipment transformation that utilizes the tangent scroll saw with lower cost.This compares with the saw of falling the tangent line system (its cost is the twice of tangent scroll saw) that needed originally to buy costliness, effectively reduces production cost.
Though the utility model specifically describes with reference to shown embodiment, this description is not intended to limit scope of the present utility model.Under the prerequisite that does not depart from the utility model purport and essential characteristic, the utility model can also be implemented with other concrete form.
For example, one of ordinary skill in the art will appreciate that, cutting mechanism 220 mentioned above can utilize other cutting mechanisms for example laser cutting mechanism substitute.Press strip can be made by graphite, resin and other suitable material.
Described embodiment only should be regarded as exemplary and non-limiting.All all will comprise within the scope of the claims in the implication of the equivalent of claim and the variation scheme in the scope.
Claims (5)
1. the cutting equipment of a wafer comprises:
A cutting mechanism comprises at least one cutting scroll saw;
A base plate; And
A supporting mechanism comprises at least two columns and a cross bar, and described column is fixed to base plate, and described cross bar releasably is connected to each column respectively in two end; The adjustable height of wherein said cross bar and each column tie point.
2. the cutting equipment of wafer according to claim 1 is characterized in that, described column is provided with the hole that is used to put into cross bar, is provided with holding pin in the hole, and the hole is equal to or less than boule diameter to be cut and press strip thickness sum in vertical direction to the distance of base plate.
3. the cutting equipment of wafer according to claim 1 is characterized in that, described column is fixed to base plate movably, and the spacing between the column is adjustable.
4. the cutting equipment of wafer according to claim 1 is characterized in that, described cutting mechanism comprises a plurality of cutting scroll saws or multiple cutting scroll saw.
5. the cutting equipment of wafer according to claim 1 is characterized in that, comprises two columns and two cross bars, and a column and corresponding cross bar and another column and corresponding cross bar are symmetrically distributed with respect to base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205670825U CN201841612U (en) | 2010-10-19 | 2010-10-19 | Wafer cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205670825U CN201841612U (en) | 2010-10-19 | 2010-10-19 | Wafer cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201841612U true CN201841612U (en) | 2011-05-25 |
Family
ID=44036516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205670825U Expired - Lifetime CN201841612U (en) | 2010-10-19 | 2010-10-19 | Wafer cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201841612U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106626108A (en) * | 2016-12-12 | 2017-05-10 | 广东富源科技股份有限公司 | Sapphire crystal ingot C-direction bar digging free-cementing fixture |
| CN107415066A (en) * | 2017-05-25 | 2017-12-01 | 广东先导先进材料股份有限公司 | Cutting semiconductor materials method |
-
2010
- 2010-10-19 CN CN2010205670825U patent/CN201841612U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106626108A (en) * | 2016-12-12 | 2017-05-10 | 广东富源科技股份有限公司 | Sapphire crystal ingot C-direction bar digging free-cementing fixture |
| CN106626108B (en) * | 2016-12-12 | 2019-08-09 | 广东富源科技股份有限公司 | A kind of sapphire crystal ingot C is to drawing stick without cementing clamp |
| CN107415066A (en) * | 2017-05-25 | 2017-12-01 | 广东先导先进材料股份有限公司 | Cutting semiconductor materials method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20160070738A (en) | Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece | |
| CN206561324U (en) | A kind of sapphire ingot sanding apparatus | |
| CN201841612U (en) | Wafer cutting device | |
| CN108214952A (en) | A kind of full-automatic distributed polysilicon excavation machine and evolution method | |
| JP4510473B2 (en) | Wire sawing device | |
| CN201609861U (en) | Diamond wire cutting machine | |
| CN107053502B (en) | A kind of sapphire processing accurate positioning cutter device | |
| CN205463828U (en) | Novel stamping die device | |
| CN101249697B (en) | Novel edge-collapse proof unfilled corner proof gripper for silicon crystal-bar slicer | |
| CN202213067U (en) | Multi-wire wafer cutting tooling | |
| DE102010007459B4 (en) | A method of separating a plurality of slices from a crystal of semiconductor material | |
| CN207772136U (en) | Slicing single crystal silicon machine slicing mechanism | |
| CN208375626U (en) | A kind of multi-knife-head automatically moves positioning diamond wire cutting machine | |
| CN207857987U (en) | A kind of thread machining device for threaded fastener | |
| CN110340999A (en) | A kind of intelligent environmentally friendly manufacturing process of lightweight marble furniture | |
| CN204640570U (en) | A kind of diamond cutting line slicing machine | |
| CN201760976U (en) | Machine seat for four-roller guide wheel | |
| CN201833493U (en) | Silicon block wire cutting machine with baffle plate device | |
| CN201746450U (en) | Guide structure of work platform of shaped glass cutting machine | |
| CN104842462B (en) | Framework formula saw guiding mechanism | |
| CN102729348A (en) | Multi-wire cutting machine | |
| CN202702424U (en) | Multi-wire cutting machine | |
| CN102398315B (en) | Cutting method applied to slicing machine | |
| CN207874600U (en) | A kind of G8 diamond wire extracting machines | |
| CN216329265U (en) | Wafer slitting tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110525 |