CN201829283U - High-precision thermistor chip - Google Patents
High-precision thermistor chip Download PDFInfo
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- CN201829283U CN201829283U CN2010205275597U CN201020527559U CN201829283U CN 201829283 U CN201829283 U CN 201829283U CN 2010205275597 U CN2010205275597 U CN 2010205275597U CN 201020527559 U CN201020527559 U CN 201020527559U CN 201829283 U CN201829283 U CN 201829283U
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- sintered bodies
- ceramic sintered
- high precision
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Abstract
The utility model relates to a high-precision thermistor chip, comprising a ceramic sintering body. The high-precision thermistor chip is characterized in that: a printing electrode layer is arranged at two end surfaces of the ceramic sintering body of the chip in an overlapping way. In the high-precision thermistor chip, the structural design is reasonable, the precision is high, the chipping quality and the thermosensitive precision of the chip are greatly improved, the using amount of electrode material is reduced and the finished product ratio of the chip in the preparation process is improved.
Description
Technical field
The utility model belongs to the core component of high precision thermosensitive resistor and transducer, is specifically related to a kind of high accuracy, high-quality thermistor chip.
Background technology
The NTC thermistor is a kind of semiconductive ceramic element of negative temperature coefficient, has the characteristic that resistance raises and descends with temperature.According to this specific character, the NTC element can be used for temperature-compensating, detected temperatures, inhibition surge etc.The NTC element has been widely used in various fields such as electronic thermometer, changes in temperature equipment, heated constant temperature electrical equipment, automotive electronics measurement and control of temperature, circuit temperature transducer, thermometric instrument, medical treatment electronic equipment, electronics toilet facility, battery of mobile phone and charging electrical equipment.According to its mounting means and purposes, it is accurate etc. to be divided into chip, insulation film type, glass envelope type, power-type, temperature sensor, pearl.Be subjected to obstacle exactly because the chip quality of high precision thermosensitive resistor of China and transducer development at present is low, particularly aspect the quality precision that improves thermistor chip, improving yields and repeatability and stability is the urgent task that the temperature-sensitive industry faces.Be in development at present always.To precision 1% with the industry the domestic screening method that generally adopts of product.And foreign corporation leans on the mode of artificial resistance trimming to solve the lower problem of precision.
The utility model content
The utility model provides a kind of reasonable in design, the thermistor chip that precision is high, and it can significantly improve the chipping qualities and the temperature-sensitive precision of chip, reduces the consumption of electrode material, improves the rate of finished products in this chip preparation process.
The technical scheme that the utility model adopted is as follows:
A kind of high precision thermosensitive resistor chip comprises ceramic sintered bodies, it is characterized in that the both ends of the surface stack of the ceramic sintered bodies of described chip is provided with the layer that prints electrode.
In one execution mode, described ceramic sintered bodies is a nano-powder compacting sintering molding structure.
In another execution mode, described printing electrode is fixed together with sintering structure between layer and described ceramic sintered bodies.
This high precision thermosensitive resistor chip adopts the two opposite end surface forming electrode layers of the form of the layer that prints electrode at ceramic sintered bodies, and this electrode layer is fixed with sintered form and ceramic sintered bodies, makes the cost of manufacture of this chip reduce, and the resistance value precision improves.The ceramic sintered bodies of this high precision thermosensitive resistor chip is a nanometer split compacting sintering molding structure in addition, the error of its nominal resistance after the high-temperature firing moulding≤± 1%, and B value error≤± 1%, precision improves greatly.
The beneficial effects of the utility model are, the reasonable in design of this high precision thermosensitive resistor chip, and the precision height, it can significantly improve the chipping qualities and the temperature-sensitive precision of chip, reduces the consumption of electrode material, improves the rate of finished products in this chip preparation process.
Below in conjunction with the drawings and specific embodiments embodiment of the present utility model is further elaborated.
Description of drawings
Fig. 1 is that the structure of the utility model embodiment is formed schematic diagram.
Embodiment
As shown in Figure 1, this high precision thermosensitive resistor chip is made up of the ceramic sintered bodies and the layer that prints electrode, and the both ends of the surface stack of ceramic sintered bodies 2 is provided with the layer 1 and 3 that prints electrode.Ceramic sintered bodies is a nano-powder compacting sintering molding structure, prints electrode to be fixed together with sintering structure between layer and ceramic sintered bodies.Can add SrO, Nb in the prescription of this ceramic sintered bodies
2O
5, AL
2O
5, ZnO, Cr
2O
5Wait other rare element oxide, this oxide can change the structure of thermo-sensitive material chip, and raw material grinds to form nano-powder through coprecipitation or the even batch mixing of solid phase method, again through mist projection granulating, and precompressed and isostatic compaction, high temperature sintering is made ceramic material, section.Printed silver palladium electrode and sintered electrode on the ceramic body after the section, and then, realize the production of production high accuracy NTC chip with the accurate scribing of scribing machine.
Claims (3)
1. a high precision thermosensitive resistor chip comprises ceramic sintered bodies, it is characterized in that the both ends of the surface stack of the ceramic sintered bodies of described chip is provided with the layer that prints electrode.
2. high precision thermosensitive resistor chip according to claim 1 is characterized in that described ceramic sintered bodies is a nano-powder compacting sintering molding structure.
3. high precision thermosensitive resistor chip according to claim 1 is characterized in that described printing electrode is fixed together with sintering structure between layer and described ceramic sintered bodies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205275597U CN201829283U (en) | 2010-09-14 | 2010-09-14 | High-precision thermistor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205275597U CN201829283U (en) | 2010-09-14 | 2010-09-14 | High-precision thermistor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201829283U true CN201829283U (en) | 2011-05-11 |
Family
ID=43967804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205275597U Expired - Fee Related CN201829283U (en) | 2010-09-14 | 2010-09-14 | High-precision thermistor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201829283U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108109790A (en) * | 2017-12-20 | 2018-06-01 | 广东爱晟电子科技有限公司 | A kind of multi-electrode thermistor and preparation method thereof |
-
2010
- 2010-09-14 CN CN2010205275597U patent/CN201829283U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108109790A (en) * | 2017-12-20 | 2018-06-01 | 广东爱晟电子科技有限公司 | A kind of multi-electrode thermistor and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20120914 |