CN201804845U - Device for removing residual tin on chip - Google Patents
Device for removing residual tin on chip Download PDFInfo
- Publication number
- CN201804845U CN201804845U CN2010202875503U CN201020287550U CN201804845U CN 201804845 U CN201804845 U CN 201804845U CN 2010202875503 U CN2010202875503 U CN 2010202875503U CN 201020287550 U CN201020287550 U CN 201020287550U CN 201804845 U CN201804845 U CN 201804845U
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- Prior art keywords
- tin
- chip
- control module
- residual
- soldering tin
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Abstract
The utility model discloses a device for removing residual tin on a chip. The device comprises a power control module, a temperature detection and control module, and a soldering tin melting device, which are connecting sequentially; and a heating pipe connected with the temperature detection and control module is arranged on the soldering tin melting device. The device for removing the residual tin on the chip comprises the power control module, the temperature detection and control module and the soldering tin melting device, wherein the soldering tin melting device is utilized for heating the chip after electrified and melting the residual tin on the pins of the chip, and the melting speed of the solder tin is high, therefore the work efficiency is improved, and the device for removing the residual tin on the chip has the characteristics of simple structure, low cost, and the like.
Description
Technical field
The utility model relates to a kind of maintenance unit of chip, is specifically related to a kind of device that is used to remove the residual tin of chip.
Background technology
Along with electronic product to miniaturization, multifunction development, the chip size that electronic product adopts is more and more littler.In manufacturing process, especially in the technology of paster, generally all can there be the bad product of some pasters, therefore need keep in repair these defective productss.
Chip is taken off from circuit board, the hot blast that the general using heat gun blows out is given chip and the heating of PCB (Printed Circuit Board, printed circuit board) plate, after the temperature that reaches melts soldering tin, make the tin fusing on the chip pin, then chip is taken off from pcb board.
And the chip of taking off must remove the residual tin on the pin before planting tin, otherwise can't utilize once more.At present, residual scolding tin on the chip generally adopts flatiron to drag the mode of tin to handle, make the operating efficiency of maintenance very low, and can't handle the chip of aQFN (Advanced quad flat non-leaded package modified model four sides do not have the pin flat packaging) encapsulation.In the middle of the chip of aQFN encapsulation a big grounding pin is arranged, can't handle, and if, then be easy to the pad of chip pin is sopped up with inhaling the tin tape handling with normal flatiron.
Therefore, be badly in need of a kind of device of removing the residual scolding tin of chip of research.
The utility model content
In view of above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of device that is used to remove the residual tin of chip, can melt the scolding tin on the chip fast.
In order to achieve the above object, the utility model has been taked following technical scheme:
A kind of device that is used to remove the residual tin of chip wherein, comprises energy supply control module, temperature detection and the control module and the melts soldering tin device that connect successively; Described melts soldering tin device is provided with the heating tube that is connected with temperature detection and control module.
The described device that is used to remove the residual tin of chip, wherein, described temperature detection and control module comprise temperature detecting unit, this temperature detecting unit is arranged on the described melts soldering tin device.
The described device that is used to remove the residual tin of chip, wherein, described energy supply control module comprises switch, fuse and the residual current protective unit that connects successively.
The described device that is used to remove the residual tin of chip, wherein, the melts soldering tin device is an aluminium block.
The described device that is used to remove the residual tin of chip, wherein, temperature detecting unit is a temperature sensor.
The device that is used to remove the residual tin of chip of the present utility model comprises energy supply control module, temperature detection and control module and melts soldering tin device, heated to chip by hot mode by the melts soldering tin device body, make the residual melts soldering tin on the chip pin, and the burn-off rate of scolding tin is fast, improved the maintenance efficiency of chip, simultaneously the device of the residual tin of this removal chip have simple in structure, characteristics such as cost is low.
Description of drawings
Fig. 1 removes the structured flowchart of the residual tin device of chip for the utility model;
Fig. 2 removes the structure principle chart of the residual tin device of chip for the utility model.
Embodiment
The device that is used to remove the residual tin of chip that the utility model provides, after the heating of melts soldering tin device body, heating makes the residual melts soldering tin on the chip pin to chip.After the residual melts soldering tin on the chip pin, promptly available rag or paper are directly wiped clean residual scolding tin, thereby reach the purpose of removing residual scolding tin on the chip pin.
For making the purpose of this utility model, technical scheme and effect clearer, clear and definite, below with reference to accompanying drawing and give an actual example the utility model is further described.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
See also Fig. 1 and Fig. 2, the device that is used to remove the residual tin of chip of the present utility model comprises energy supply control module 110, temperature detection and control module 120 and melts soldering tin device 130.Described energy supply control module 110 electrically connects with temperature detection and control module 120, and temperature detection and control module 120 electrically connect with melts soldering tin device 130.
Wherein, described melts soldering tin device 130 bodies are provided with a heating tube 131, this heating tube 131 is connected with temperature detection and control module 120, is used to convert electrical energy into heat energy to 130 heating of melts soldering tin device, makes the temperature of melts soldering tin device 130 be increased to solder melting temperature.
Described energy supply control module 110 is used for providing power supply to temperature detection and control module 120 and melts soldering tin device 130, temperature detection and control module 120 are used to detect the temperature of melts soldering tin device 130 bodies, thereby control energy supply control module 110 switches on or off the power supply of heating tube 131 in the melts soldering tin device 130.
When the temperature on temperature detection and control module 120 detection melts soldering tin devices 130 bodies is lower than the temperature of setting, connect the power supply of described heating tube 131, make heating tube 131 heatings; When the temperature that detects melts soldering tin device 130 bodies when temperature detection and control module 120 was higher than the temperature of setting, the power supply or the lower voltage of control energy supply control module 110 outputs that disconnect heating tube 131 did not generate heat heating tube.
Please continue to consult Fig. 2, described energy supply control module 110 is mainly used in provides supply voltage and earth leakage protective, and it comprises switch 111, fuse 112 and residual current protective unit 113.This switch 111, fuse 112 and residual current protective unit 113 are connected successively, and the device of removing the residual tin of chip is in overcurrent, overvoltage, even during electric leakage, thereby this energy supply control module 110 cuts off general supplies protection human body safety rapidly.
Described temperature detection and control module 120 comprise temperature detecting unit 121, this temperature detecting unit 121 is connected with its control circuit (not marking among the figure), and temperature detecting unit 121 is arranged on the melts soldering tin device 130, be used for detecting in real time the temperature of melts soldering tin device 130, the temperature that its control circuit detects by this temperature detecting unit 121, the size of control supply voltage, thus suitable voltage is provided for heating tube 131.Control circuit based on temperature detection and control module 120 is a prior art, does not repeat them here.
In the present embodiment, described temperature detecting unit 121 adopts temperature sensor, because the detection and the control technology comparative maturity thereof of present temperature sensor, and its cost is lower, therefore repeats no more.
Melts soldering tin device 130 adopts heat conduction and the good aluminium block of thermal storage performance, and heating tube 131 can be provided with a plurality of in aluminium block, also can adopt in the whole bottom surface of aluminium block to be covered with heating tube 131, and aluminium block is heated evenly.In the present embodiment, described heating tube 131 is a resistance wire.
Below the utility model is used to remove the device of the residual tin of chip occupation mode be described in detail:
Earlier the melts soldering tin device is placed on the resistant to elevated temperatures plank, energy supply control module is inserted the civil power of 220V, set the required temperature of fusing scolding tin then, heating tube is heated to the melts soldering tin device, when the temperature of aluminium block on the melts soldering tin device reaches the temperature of melts soldering tin, the chip of need maintenance is placed directly on the aluminium block, chip is placed on the temperature that only needs just to reach in 2 to 3 seconds melts soldering tin on the aluminium block, make the residual melts soldering tin on the pin, with rag or paper the residual scolding tin on the chip pin is wiped afterwards, remove residual scolding tin on the chip pin, chip can be utilized once more.
In sum, the device that is used to remove the residual tin of chip of the present utility model comprises energy supply control module, temperature detection and control module and melts soldering tin device, heated to chip by hot mode by the melts soldering tin device body, make the residual tin fusing on the chip pin, and the burn-off rate of scolding tin is fast, improved operating efficiency, simultaneously the device of the residual tin of this removal chip have simple in structure, characteristics such as cost is low.
More than the utility model is described in detail, for a person skilled in the art, can be improved according to the above description or conversion, and all these improve and conversion all should belong to the protection range of the utility model claims.
Claims (5)
1. a device that is used to remove the residual tin of chip is characterized in that, comprises energy supply control module, temperature detection and the control module and the melts soldering tin device that connect successively; Described melts soldering tin device is provided with the heating tube that is connected with temperature detection and control module.
2. the device that is used to remove the residual tin of chip according to claim 1 is characterized in that described temperature detection and control module comprise temperature detecting unit, and this temperature detecting unit is arranged on the described melts soldering tin device.
3. the device that is used to remove the residual tin of chip according to claim 1 is characterized in that, described energy supply control module comprises switch, fuse and the residual current protective unit that connects successively.
4. the device that is used to remove the residual tin of chip according to claim 1 and 2 is characterized in that, the melts soldering tin device is an aluminium block.
5. the device that is used to remove the residual tin of chip according to claim 2 is characterized in that, temperature detecting unit is a temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202875503U CN201804845U (en) | 2010-08-05 | 2010-08-05 | Device for removing residual tin on chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202875503U CN201804845U (en) | 2010-08-05 | 2010-08-05 | Device for removing residual tin on chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201804845U true CN201804845U (en) | 2011-04-20 |
Family
ID=43874348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202875503U Expired - Fee Related CN201804845U (en) | 2010-08-05 | 2010-08-05 | Device for removing residual tin on chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201804845U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686044A (en) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip |
-
2010
- 2010-08-05 CN CN2010202875503U patent/CN201804845U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686044A (en) * | 2012-05-14 | 2012-09-19 | 江苏中科梦兰电子科技有限公司 | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110420 Termination date: 20130805 |