CN201785493U - Etching equipment and chip box thereof - Google Patents
Etching equipment and chip box thereof Download PDFInfo
- Publication number
- CN201785493U CN201785493U CN2010202521068U CN201020252106U CN201785493U CN 201785493 U CN201785493 U CN 201785493U CN 2010202521068 U CN2010202521068 U CN 2010202521068U CN 201020252106 U CN201020252106 U CN 201020252106U CN 201785493 U CN201785493 U CN 201785493U
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- China
- Prior art keywords
- etching
- wafer holder
- spacing
- clamping
- chip
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Abstract
The utility model discloses etching equipment and a chip box thereof. The etching equipment is used for adopting etching liquid to etch a plurality of chips and comprises the chip box and a groove, the chip box comprises a plurality of chip holding portions, wherein the chips are respectively clamped by the chip holding portions, and a gap is reserved between each two adjacent chip holding portions. The groove comprises a groove body, a plurality of fluid outlets, at least one fluid inlet and a circulation pipe, wherein the etching liquid flows out from the fluid outlets, directly passes through the gaps to flow through the groove body, enters the circulation pipe via the fluid inlet, and flows out from the fluid outlets.
Description
Technical field
The utility model relates to a kind of etching machines, particularly relates to a kind of etching machines that can promote etching efficiency.
Background technology
In the etching machines of existing wet etching manufacture craft, a plurality of wafer storages by the wafer holder portion clamping in the chip casket, and are immersed in the interior etching solution of etching bath to carry out etching in the chip casket.In order to handle a large amount of wafers simultaneously, wafer spacing each other is minimum in the chip casket.Yet when wafer is soaked in the etching solution when carrying out etching, the Flow Field Distribution inequality of etching solution can cause the inconsistent of chip etching effect.Particularly the edge section etch effect of wafer is poor, causes the problem of peripheral etch residue (Under etch).
The utility model content
The purpose of this utility model is to provide a kind of etching machines and chip casket thereof, to solve above-mentioned prior art problems.
A kind of etching machines that promptly provides is provided the purpose of this utility model, in order to utilize an etching liquid a plurality of wafers is carried out etching.This etching machines comprises a chip casket and a cell body.The chip casket comprises a plurality of wafer holder portion, and wherein, these a plurality of wafers are respectively by this a plurality of wafer holder portion clamping, has all kept a spacing between a plurality of wafer holder of every adjacent this portion.Cell body comprises a cell body body, a plurality of fluid outlet, at least one fluid intake and a circulation line, wherein, this etching liquid flows out from this fluid outlet, directly by way of these a plurality of spacings this cell body body of flowing through, enter this circulation line through this fluid intake, flow out from these a plurality of fluid outlets again.
The utility model also provides a kind of chip casket, in order to a plurality of wafers of clamping to carry out etching.This chip casket comprises a plurality of wafer holder portion, and wherein, these a plurality of wafers are respectively by this a plurality of wafer holder portion clamping, has all kept a spacing between a plurality of wafer holder of every adjacent this portion, and wherein, this spacing is between 1.0～1.5 centimetres.
Advantage of the present utility model is, uses embodiment of the present utility model, and the flow field that can keep etching liquid in the cell body is stable, avoids eddy current to produce, and uniform etch effect is provided, and avoids peripheral etch residue (Under etch) to produce.
Description of drawings
Fig. 1 is the etching machines that shows the utility model first embodiment; And
Fig. 2 is the etching machines that shows the utility model second embodiment.
The main element nomenclature
10～etching liquid
20～wafer
100,100 '～etching machines
110,110 '～chip casket
111～wafer holder portion
120～cell body
121～cell body body
122～fluid outlet
123～fluid intake
124～circulation line
125 recycle pumps
Embodiment
With reference to Fig. 1, it is the etching machines 100 that shows the utility model first embodiment, carries out etching in order to utilize 10 pairs of a plurality of wafers 20 of an etching liquid.Etching machines 100 comprises a chip casket 110 and a cell body 120.Chip casket 110 comprises a plurality of wafer holder portion 111, and wherein, these a plurality of wafers 20 are respectively by these a plurality of wafer holder portion 111 clampings.Each wafer holder portion 111 has a clamping gap W, and wafer 20 is inserted among the W of clamping gap, and by circle clamping part 111 clampings.All kept a spacing G1 between a plurality of wafer holder of whenever adjacent this portion 111, spacing G1 is greater than clamping gap W.Cell body 120 comprises a cell body body 121, a plurality of fluid outlet 122, fluid intake 123, circulation line 124 and recycle pump 125.This etching liquid 10 flows out from this fluid outlet 122, directly by way of this a plurality of spacing G1 this cell body body 121 of flowing through, enters this circulation line 124 through this fluid intake 123, is driven by recycle pump 125, again from these a plurality of fluid outlets 122 outflows.
In the above-described embodiments, because each fluid outlet 122 is respectively over against this spacing G1, spacing G1 is greater than clamping gap W.Therefore etching liquid 10 is directly by way of these a plurality of spacing G1 this cell body body 12 of flowing through, thereby the flow field that can keep etching liquid 10 in the cell body 120 is stable, avoid eddy current to produce, and uniform etch effect is provided, avoid peripheral etch residue (Under etch) to produce.In this embodiment, this spacing G1 by adjusting spacing G1, can make etching liquid 10 flow between these a plurality of wafers smoothly between 1.0～1.5 centimetres, promotes etching efficiency.These a plurality of fluid outlets 122 are circular hole, and its aperture is between 1.0～1.5 centimetres.And this etching liquid 10 has an exit velocity when this fluid outlet 122 flows out, and this exit velocity is about 350ml/s (milliliters/second).
With reference to Fig. 2, it is the etching machines 100 ' that shows the utility model second embodiment, carries out etching in order to utilize 10 pairs of a plurality of wafers 20 of an etching liquid.This etching machines 100 ' comprises a chip casket 110 ' and a cell body 120.Chip casket 110 ' comprises a plurality of wafer holder portion 111, and wherein, these a plurality of wafers 20 are respectively by these a plurality of wafer holder portion 111 clampings.Each wafer holder portion 111 has a clamping gap W, and wafer 20 is inserted among the W of clamping gap, and by circle clamping part 111 clampings.All kept a spacing G2 between a plurality of wafer holder of whenever adjacent this portion 111, spacing G2 is greater than clamping gap W.Cell body 120 comprises a cell body body 121, a plurality of fluid outlet 122, fluid intake 123, circulation line 124 and recycle pump 125.This etching liquid 10 flows out from this fluid outlet 122, by way of this a plurality of spacing G2 this cell body body 121 of flowing through, enters this circulation line 124 through this fluid intake 123, is driven by recycle pump 125, again from these a plurality of fluid outlets 122 outflows.
In the utility model second embodiment, because each fluid outlet 122 is respectively over against this wafer holder portion 111.Therefore after this etching liquid 10 flowed out from this fluid outlet 122, these a plurality of spacing G2 can upwards flow through along the both sides of wafer.With first embodiment, it is stable that the utility model second embodiment can keep the flow field of etching liquid 10 in the cell body 120, avoids eddy current to produce, and uniform etch effect is provided, and avoids peripheral etch residue (Under etch) to produce.In this embodiment, this spacing G2 by adjusting spacing G2, can make etching liquid 10 flow between these a plurality of wafers smoothly between 1.0～1.5 centimetres, promotes etching efficiency.These a plurality of fluid outlets 122 are circular hole, and its aperture is between 1.0～1.5 centimetres.And this etching liquid 10 has an exit velocity when this fluid outlet 122 flows out, and in this embodiment, this exit velocity is about 350ml/s (milliliters/second).
In the above-described embodiments, fluid outlet is circular, and so it does not limit the utility model, and in a variation, fluid outlet also can be other shapes, and is for example square.
The utility model also discloses a kind of chip casket, to carry out etching, comprises a plurality of wafer holder portion in order to a plurality of wafers of clamping.Wherein, these a plurality of wafers are respectively by this a plurality of wafer holder portion clamping, have all kept a spacing between a plurality of wafer holder of every adjacent this portion, and wherein, this spacing is between 1.0～1.5 centimetres.Use chip casket of the present utility model, owing to all kept competent spacing between a plurality of wafer holder of whenever adjacent this portion, the flow field that therefore can keep etching liquid is stable, avoids eddy current to produce, and uniform etch effect is provided.
Claims (10)
1. etching machines, in order to utilize an etching liquid that a plurality of wafers are carried out etching, it is characterized in that, this etching machines comprises: chip casket and cell body, this chip casket comprises a plurality of wafer holder portion, wherein, these a plurality of wafers are respectively by this a plurality of wafer holder portion clamping, each wafer holder portion has a clamping gap, these a plurality of wafers are inserted in respectively among this clamping gap, and, all kept a spacing between a plurality of wafer holder of whenever adjacent this portion by this circle clamping part clamping, this spacing is greater than this clamping gap; This cell body comprises cell body body, a plurality of fluid outlet, at least one fluid intake and a circulation line, wherein, this etching liquid flows out from this fluid outlet, directly by way of these a plurality of spacings this cell body body of flowing through, enter this circulation line through this fluid intake, flow out from these a plurality of fluid outlets again.
2. etching machines as claimed in claim 1 is characterized in that, each fluid outlet is respectively over against this spacing.
3. etching machines as claimed in claim 2 is characterized in that this spacing is between 1.0～1.5 centimetres.
4. etching machines as claimed in claim 3 is characterized in that, these a plurality of fluid outlets are circular hole, and its aperture is between 1.0～1.5 centimetres.
5. etching machines as claimed in claim 4 is characterized in that, this etching liquid has an exit velocity when this fluid outlet flows out, and this exit velocity is 350 milliliters/second.
6. etching machines as claimed in claim 1 is characterized in that, each fluid outlet is respectively over against this wafer holder portion.
7. etching machines as claimed in claim 6 is characterized in that this spacing is between 1.0～1.5 centimetres.
8. etching machines as claimed in claim 7 is characterized in that, these a plurality of fluid outlets are circular hole, and its aperture is between 1.0～1.5 centimetres.
9. etching machines as claimed in claim 8 is characterized in that, this etching liquid has an exit velocity when this fluid outlet flows out, and this exit velocity is 350 milliliters/second.
10. chip casket, to carry out etching, it is characterized in that in order to a plurality of wafers of clamping this chip casket comprises: a plurality of wafer holder portion, wherein, by this a plurality of wafer holder portion clamping, each wafer holder portion has a clamping gap to these a plurality of wafers respectively, and these a plurality of wafers are inserted in respectively among this clamping gap, and by this circle clamping part clamping, all kept a spacing between a plurality of wafer holder of whenever adjacent this portion, wherein, this spacing is greater than this clamping gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202521068U CN201785493U (en) | 2010-06-30 | 2010-06-30 | Etching equipment and chip box thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202521068U CN201785493U (en) | 2010-06-30 | 2010-06-30 | Etching equipment and chip box thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201785493U true CN201785493U (en) | 2011-04-06 |
Family
ID=43817467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202521068U Expired - Fee Related CN201785493U (en) | 2010-06-30 | 2010-06-30 | Etching equipment and chip box thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201785493U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575796A (en) * | 2014-10-13 | 2016-05-11 | 友威科技股份有限公司 | Plasma etching device for printed circuit board |
| CN109300803A (en) * | 2017-07-25 | 2019-02-01 | 无尽电子有限公司 | Chip etching device |
-
2010
- 2010-06-30 CN CN2010202521068U patent/CN201785493U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575796A (en) * | 2014-10-13 | 2016-05-11 | 友威科技股份有限公司 | Plasma etching device for printed circuit board |
| CN109300803A (en) * | 2017-07-25 | 2019-02-01 | 无尽电子有限公司 | Chip etching device |
| CN109300803B (en) * | 2017-07-25 | 2022-04-22 | 无尽电子有限公司 | Wafer etching device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110406 Termination date: 20190630 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |