CN201778138U - Anode device containing copper ball - Google Patents
Anode device containing copper ball Download PDFInfo
- Publication number
- CN201778138U CN201778138U CN2010205142951U CN201020514295U CN201778138U CN 201778138 U CN201778138 U CN 201778138U CN 2010205142951 U CN2010205142951 U CN 2010205142951U CN 201020514295 U CN201020514295 U CN 201020514295U CN 201778138 U CN201778138 U CN 201778138U
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- China
- Prior art keywords
- copper
- anode
- copper ball
- ball
- sulfuric acid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to an anode device containing a copper ball. The anode device comprises an anode frame, the copper ball and a platinum titanium mesh, wherein the copper ball is placed inside the anode frame, and the platinum titanium mesh is arranged at the upper part of the anode frame. Compared with the prior art, the anode device containing the copper ball reduces the costs of the three main materials including the copper ball, sulfuric acid and additives, reduces the maintenance workload of molten copper, and is environment-friendly, cost-efficient and easy to operate and promote. The platinum titanium mesh is adopted as a copper ball-free anode and added to the original anode, so as to decompose copper sulfate in molten copper, and the copper ions deposit on a print roller, thereby keeping the balance between copper sulfate content and sulfuric acid content in molten copper. Under the chemical effect of electric currents, the content of copper ions derived from copper sulfate in molten copper is just equal to the content of copper ions derived from copper sulfate generated by the reaction of the copper ball and sulfuric acid.
Description
Technical field
The utility model relates to a kind of anode assembly, especially relates to a kind of anode assembly that includes copper ball.
Background technology
Copper liquid major ingredient is copper sulfate, sulfuric acid, additive and pure water.Main salt copper sulfate is the source of cupric ion, the cupric ion that in water, dissociates out after the dissolving, and after the energising, cupric ion deposits on the version roller.Factors such as mother-in-law U.S. degree, sulfuric acid content, temperature, electric current, additive will directly have influence on sedimentation effect.
Cathodic reaction: Cu
2+2e → Cu
Anodic reaction: Cu → Cu
2+2e
In the plating process, copper ion concentration descends because of consumption, the influence deposition.Can adopt two kinds of methods to solve:
(1) anode is made with copper ball in interpolation copper sulfate, (2)
When adopting copper ball to solve the low problem of sedimentation effect as anode, mother-in-law U.S. degree can raise gradually, and sulfuric acid content can descend gradually.Be the balance bath element, must replenish pure water and adjust mother-in-law U.S. degree, must additional an amount of sulfuric acid and additive, this practice causes finally that liquid level is too high to cause discharge opeing.The discharge opeing problem had both made copper ball, sulfuric acid, additive three big main material wastes, brought very big inconvenience for again the maintenance service of copper liquid.
Summary of the invention
The purpose of this utility model is exactly to provide a kind of cost lower, the easy and simple to handle anode assembly that includes copper ball that is beneficial to popularization for the defective that overcomes above-mentioned prior art existence.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of anode assembly that includes copper ball, this device is made of anode frame and copper ball, and described copper ball places the inside of anode frame, it is characterized in that, and the top of described anode frame is provided with platinum titanium net.
Described platinum titanium network interface card is located at the top of anode frame.
Compared with prior art, the utlity model has following advantage:
(1) reduces copper ball, sulfuric acid, additive three big main material costs, reduce copper liquid maintenance workload;
(2) have environmental protection, easy and simple to handle, cost is low, be beneficial to the advantage of popularization;
(3) according to the chemical effect of electric current, on former anode basis, increase an amount of platinum titanium net as no copper ball anode, the cupric ion that decomposes copper sulfate in the copper liquid deposits on edition roller, thereby make copper sulfate and sulfuric acid content maintenance balance in the copper liquid, by the chemical effect of electric current, the amount of decomposing the cupric ion of copper sulfate in the copper liquid equals the amount of the cupric ion of the copper sulfate that copper ball and sulfuric acid reaction generate just.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
1 is that platinum titanium net, 2 is that anode frame, 3 is copper ball among the figure.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is elaborated.
Embodiment
A kind of anode assembly that includes copper ball, its structure as shown in Figure 1, this device is made of platinum titanium net 1, anode frame 2 and copper ball 3, platinum titanium net 1 is fastened on the top of anode frame 2, copper ball 3 places the inside of anode frame 2.
The old platinum titanium of intercepting chromium groove net 1, it is of a size of 600 (length) * 30 (wide) mm, conducts electricity, and does not corrode.
During use, adopt following steps:
(1) in anode, under the situation of copper ball amount abundance and level stability, detects mother-in-law U.S. degree (the U.S. scale standard of plating bath mother-in-law is between 20-21) every day.
1. rise to about 23 as mother-in-law U.S. degree, sulfuric acid content must descend, and needs an amount of platinum titanium web area that increases;
2. descend as mother-in-law U.S. degree, sulfuric acid content must rise, and needs an amount of platinum titanium web area that reduces;
3. after stablizing as mother-in-law U.S. degree, this copper groove just need not increase and decrease platinum titanium web area, guarantees constant the getting final product of platinum titanium net.
(2) old copper liquid utilizes method:
1. detect mother-in-law U.S. degree, when it is stable, find that liquid level descends, can replenish old copper liquid, generally replenish 50 liters.
2. the assay sulfuric acid content descends, and liquid level also descends, and also can replenish old copper liquid as the case may be.
(3) in the plating process, bubble can occur in the plating bath near the anode and belong to hydrogen evolution phenomenon, the not influence of cupric ion deposition.
Claims (2)
1. anode assembly that includes copper ball, this device is made of anode frame and copper ball, and described copper ball places the inside of anode frame, it is characterized in that, and the top of described anode frame is provided with platinum titanium net.
2. a kind of anode assembly that includes copper ball according to claim 1 is characterized in that described platinum titanium network interface card is located at the top of anode frame.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205142951U CN201778138U (en) | 2010-08-31 | 2010-08-31 | Anode device containing copper ball |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205142951U CN201778138U (en) | 2010-08-31 | 2010-08-31 | Anode device containing copper ball |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201778138U true CN201778138U (en) | 2011-03-30 |
Family
ID=43791357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010205142951U Expired - Fee Related CN201778138U (en) | 2010-08-31 | 2010-08-31 | Anode device containing copper ball |
Country Status (1)
Country | Link |
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CN (1) | CN201778138U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102383173A (en) * | 2010-08-31 | 2012-03-21 | 上海运青制版有限公司 | Anode device used for electroplating |
CN107523831A (en) * | 2017-09-30 | 2017-12-29 | 江阴康强电子有限公司 | It is roughened immersion plating pilot trench |
-
2010
- 2010-08-31 CN CN2010205142951U patent/CN201778138U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102383173A (en) * | 2010-08-31 | 2012-03-21 | 上海运青制版有限公司 | Anode device used for electroplating |
CN107523831A (en) * | 2017-09-30 | 2017-12-29 | 江阴康强电子有限公司 | It is roughened immersion plating pilot trench |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110330 Termination date: 20150831 |
|
EXPY | Termination of patent right or utility model |