CN102383173A - Anode device used for electroplating - Google Patents
Anode device used for electroplating Download PDFInfo
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- CN102383173A CN102383173A CN2010102711940A CN201010271194A CN102383173A CN 102383173 A CN102383173 A CN 102383173A CN 2010102711940 A CN2010102711940 A CN 2010102711940A CN 201010271194 A CN201010271194 A CN 201010271194A CN 102383173 A CN102383173 A CN 102383173A
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- copper
- anode
- sulfuric acid
- ball
- liquid
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Abstract
The invention relates to an anode device used for electroplating, which comprises an anode frame, a copper ball and a platinum titanium net, wherein the copper ball is placed in the anode frame, and the platinum titanium net is arranged on the upper part of the anode frame. Compared with the prior art, the anode device used for electroplating has the advantages that the costs of three main materials, namely, the copper ball, sulfuric acid and additives, are lowered, the work load of maintaining liquid copper is reduced, and the anode device is environment-friendly, convenient to operate, low in cost and beneficial to popularization. A right amount of platinum titanium net is added on the basis of an original anode, thereby forming the anode without the copper ball. Copper ions of copper sulfate in the liquid copper are decomposed and deposited on a cylinder, thereby keeping the balance of the contents of the copper sulfate and sulfuric acid in the liquid copper. Under a chemical effect of current, the quantity of the decomposed copper ions of the copper sulfate in the liquid copper is exactly equal to the quantity of the copper ions of the copper sulfate generated from the reaction of the copper ball and the sulfuric acid.
Description
Technical field
The present invention relates to a kind of anode assembly, especially relate to a kind of galvanized anode assembly that is used for.
Background technology
Copper liquid major ingredient is copper sulfate, sulfuric acid, additive and pure water.Main salt copper sulfate is the source of cupric ion, the cupric ion that in water, dissociates out after the dissolving, and after the energising, cupric ion deposits on the version roller.Factors such as mother-in-law U.S. degree, sulfuric acid content, temperature, electric current, additive will directly have influence on sedimentation effect.
Cathodic reaction: Cu
2+2e → Cu
Anodic reaction: Cu → Cu
2+2e
In the plating process, copper ion concentration descends because of consumption, the influence deposition.Can adopt two kinds of methods to solve:
(1) anode is made with copper ball in interpolation copper sulfate, (2)
When adopting copper ball to solve the low problem of sedimentation effect as anode, mother-in-law U.S. degree can raise gradually, and sulfuric acid content can descend gradually.Be the balance bath element, must replenish pure water adjustment mother-in-law U.S.A degree, must additional an amount of sulfuric acid and additive, this practice causes finally that liquid level is too high to cause discharge opeing.The discharge opeing problem had both made copper ball, sulfuric acid, additive three big main material wastes, brought very big inconvenience for again the maintenance service of copper liquid.
Summary of the invention
The object of the invention is exactly to provide a kind of cost lower, the easy and simple to handle galvanized anode assembly that is used for that is beneficial to popularization for the defective that overcomes above-mentioned prior art existence.
The object of the invention can be realized through following technical scheme:
A kind ofly be used for galvanized anode assembly, this device is made up of anode frame and copper ball, and described copper ball places the inside of anode frame, it is characterized in that, the top of described anode frame is provided with platinum titanium net.
Described platinum titanium network interface card is located at the top of anode frame.
Compared with prior art, the present invention has the following advantages:
(1) reduces copper ball, sulfuric acid, additive three big main material costs, reduce copper liquid maintenance workload;
(2) have environmental protection, easy and simple to handle, cost is low, be beneficial to the advantage of popularization;
(3) according to the chemical effect of electric current; On former anode basis, increase an amount of platinum titanium net as no copper ball anode; The cupric ion that decomposes copper sulfate in the copper liquid deposits on edition roller; Copper sulfate and sulfuric acid content keep balance in the copper liquid thereby make, and through the chemical effect of electric current, the amount of decomposing the cupric ion of copper sulfate in the copper liquid equals the amount of the copper ball and the cupric ion of the copper sulfate of sulfuric acid reaction generation just.
Description of drawings
Fig. 1 is a structural representation of the present invention.
1 is that platinum titanium net, 2 is that anode frame, 3 is copper ball among the figure.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is elaborated.
Embodiment
A kind ofly be used for galvanized anode assembly, its structure is as shown in Figure 1, and this device is made up of platinum titanium net 1, anode frame 2 and copper ball 3, and platinum titanium net 1 is fastened on the top of anode frame 2, and copper ball 3 places the inside of anode frame 2.The old platinum titanium of intercepting chromium groove net 1, it is of a size of 600 (length) * 30 (wide) mm, conducts electricity, and does not corrode.During use, adopt following steps:
(1) in anode, under the situation of copper ball amount abundance and level stability, detects mother-in-law U.S. degree (the U.S. scale of plating bath mother-in-law is accurate between 20-21) every day.
1. rise to about 23 like mother-in-law U.S. degree, sulfuric acid content must descend, and needs an amount of platinum titanium web area that increases;
2. descend like mother-in-law U.S. degree, sulfuric acid content must rise, and needs an amount of platinum titanium web area that reduces;
3. after stablizing like mother-in-law U.S. degree, this copper groove just need not increase and decrease platinum titanium web area, guarantees constant the getting final product of platinum titanium net.
(2) old copper liquid utilizes method:
1. detect mother-in-law U.S. degree, when it is stable, find that liquid level descends, can replenish old copper liquid, generally replenish 50 liters.
2. the assay sulfuric acid content descends, and liquid level also descends, and also can replenish old copper liquid as the case may be.
(3) in the plating process, bubble can occur in the plating bath near the anode and belong to hydrogen evolution phenomenon, the not influence of cupric ion deposition.
Claims (2)
1. one kind is used for galvanized anode assembly, and this device is made up of anode frame and copper ball, and described copper ball places the inside of anode frame, it is characterized in that, the top of described anode frame is provided with platinum titanium net.
2. a kind of galvanized anode assembly that is used for according to claim 1 is characterized in that described platinum titanium network interface card is located at the top of anode frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102711940A CN102383173A (en) | 2010-08-31 | 2010-08-31 | Anode device used for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102711940A CN102383173A (en) | 2010-08-31 | 2010-08-31 | Anode device used for electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102383173A true CN102383173A (en) | 2012-03-21 |
Family
ID=45822987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102711940A Pending CN102383173A (en) | 2010-08-31 | 2010-08-31 | Anode device used for electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102383173A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3616277A (en) * | 1968-07-26 | 1971-10-26 | Kennecott Copper Corp | Method for the electrodeposition of copper powder |
| CN1166187A (en) * | 1994-11-15 | 1997-11-26 | 比利时西门子公司 | Electrolytic treating device for plate-like workpieces, in particular printed circuit boards |
| JP2002053998A (en) * | 2000-08-07 | 2002-02-19 | Kyoden:Kk | Protective cover for titanium case for copper electroplating, and copper electroplating method |
| CN201309976Y (en) * | 2008-12-16 | 2009-09-16 | 健鼎（无锡）电子有限公司 | Adjustable anode |
| CN201778138U (en) * | 2010-08-31 | 2011-03-30 | 上海运青制版有限公司 | Anode device containing copper ball |
-
2010
- 2010-08-31 CN CN2010102711940A patent/CN102383173A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3616277A (en) * | 1968-07-26 | 1971-10-26 | Kennecott Copper Corp | Method for the electrodeposition of copper powder |
| CN1166187A (en) * | 1994-11-15 | 1997-11-26 | 比利时西门子公司 | Electrolytic treating device for plate-like workpieces, in particular printed circuit boards |
| JP2002053998A (en) * | 2000-08-07 | 2002-02-19 | Kyoden:Kk | Protective cover for titanium case for copper electroplating, and copper electroplating method |
| CN201309976Y (en) * | 2008-12-16 | 2009-09-16 | 健鼎（无锡）电子有限公司 | Adjustable anode |
| CN201778138U (en) * | 2010-08-31 | 2011-03-30 | 上海运青制版有限公司 | Anode device containing copper ball |
Non-Patent Citations (2)
| Title |
|---|
| 张健华: "镀铂钛电极的研究", 《广东有色金属学报》 * |
| 张招贤: "涂层电极的40年", 《电镀与涂饰》 * |
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Application publication date: 20120321 |