CN201258361Y - Microetch liquor regeneration and heavy metal recovery equipment - Google Patents
Microetch liquor regeneration and heavy metal recovery equipment Download PDFInfo
- Publication number
- CN201258361Y CN201258361Y CNU2008201362298U CN200820136229U CN201258361Y CN 201258361 Y CN201258361 Y CN 201258361Y CN U2008201362298 U CNU2008201362298 U CN U2008201362298U CN 200820136229 U CN200820136229 U CN 200820136229U CN 201258361 Y CN201258361 Y CN 201258361Y
- Authority
- CN
- China
- Prior art keywords
- mentioned
- etching solution
- micro
- heavy metal
- microetch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
A device for micro-etching solution and heavy metal recovery comprises a micro-etching device. The micro-etching device is provided with a container for accommodating a liquid, the container is filled with a micro-etching solution, and an overflow pipe is arranged at a predetermined altitude on one side of the container; a recovery device connected with the overflow pipe, wherein the recovery device is provided with an electrolytic bath for electrolyzing the micro-etching solution, a rectifier for AC/DC conversion is connected in an outside position of the electrolytic bath, and a delivery pipe is arranged outside the bottom of the electrolytic bath and connected with the lateral bottom of the micro-etching device. The device maintains the solution concentration by means of electrolytic treatment, changes the habit of discharge from the micro-etching bath every day, saves the time of preparing the bath and the bath solution, reduces the qualities of waste water and heavy metals, prolongs the service life of the bath solution, and recycles the heavy metals to achieve high economic benefits.
Description
Technical field
The equipment of relevant a kind of micro-etching solution regeneration of the utility model and heavy metal recovery refers to a kind of recycling and processing device of handling slight corrosion molten metal especially.
Background technology
General PTH (chemical copper) processing procedure is widely used in the process for processing of printed circuit board (PCB) of through hole, its main purpose is to deposit layer of copper by a series of chemical treatment methods on non-conductive substrate, make that non-conductor utilizes the electroless plating mode to make the hole conducting in the hole, then handle by follow-up electro-plating method thickening, make printed circuit board (PCB) reach the specific thicknesses of design.
See also shown in Figure 1, the making flow process system of general chemical copper (PTH) comes the grease of cleaner plate face and removes impurity in the hole via cleaning slot, hot water wash and two washing earlier, and utilize the interface promoting agent to make the film of attached one deck positive electricity on interior Resins, epoxy of hole wall and the glass fibre, utilize sulfuric acid/hydrogen peroxide (H by the microetch groove
2SO
4/ H
2O
2), solution such as Sodium Persulfate/sulfuric acid or ammonium persulphate/sulfuric acid, remove deoxidation and slight corrosion copper clad laminate surface to increase roughness, make follow-up when carrying out reactivation process, with catalyst the microetch of preferable adherence effect is arranged, remove persulfuric acid misfit thing after the microetch process via two washings and pickling again, and use pre-immersion trough to prevent that acidic substance from bringing activated bath into; By activated bath circuit card is soaked and to place the acid tank liquor that contains tin protochloride and Palladous chloride, make tin colloid be attached to hole wall, and utilize tin palladium colloid to have chlorion group (negative electricity) and hole wall interfacial agent (positive electricity) to form the Fan Dewali bond outward, make catalyst (palladium) be reduced and be deposited on substrate through-hole and lip-deep catalysis/activation, dissolve by the speed groove again and divest tin colloid layer colloidal tin excessive in panel and the hole, make the palladium layer that exposes out easily and chemical copper adhere to; Utilize formaldehyde to be used as reductive agent and catalyzer at last, the circuit card after the above-mentioned conductor processing is soaked place the chemical copper tank liquor, the bivalent cupric ion in the tank liquor promptly is reduced into metallic copper, and is deposited on substrate through-hole and lip-deep electroless copper.
See also shown in Figure 2ly, general secondary copper is electroplated system and is removed oxide compound and the surplus glue of the residual film of printing ink on the circuit copper face via the acid clean groove earlier, guarantees the bonding force between copper and pattern plating copper or the nickel, utilizes sulfuric acid/hydrogen peroxide (H via the microetch groove again
2SO
4/ H
2O
2), solution such as Sodium Persulfate/sulfuric acid or ammonium persulphate/sulfuric acid, remove deoxidation and slight corrosion copper clad laminate surface to increase roughness, engaging force is better when making copper facing; Remove the oxide compound and the activation panel of panel again by pickling; preventing that moisture from bringing into causes tank liquor sulfuric acid content instability; satisfy each circuit nominal current loading via electro-coppering again; make the certain thickness that each circuit and hole copper reach to be needed; remove the panel oxide compound via another time pickling process again, the resist layer that last eleetrotinplate is used as metal comes the protection circuit etching.
The microetch groove is taked the foundation of copper content as discharging in above-mentioned chemical copper (PTH) and the galvanized processing procedure of secondary copper, when copper content reaches 20～30 gram/litres (g/L), can do copper bearing waste liquid of quantitative discharging and thin up copper ion concentration, the general factory that makes printed circuit board (PCB) is this type of waste liquid by oneself mostly, so most factory all directly is discharged into the waste water treatment plant with the waste liquid that produced every day and handles these metal waste liquids, its shortcoming is to be disposed to the pollution that can't confirm whether can cause environment in the way of waste water treatment plant, and the metal waste liquid recycling voluntarily that emits, the concentration that needs solution in the spended time repeated configuration microetch groove increases the cost of making printed circuit board (PCB).
The utility model content
The main purpose of the utility model, aim to provide the equipment of a kind of micro-etching solution regeneration and heavy metal recovery, by a retrieving arrangement that removes the microetch device winding one electrolysis micro-etching solution of deoxidation and slight corrosion metallic substrate surfaces, by retrieving arrangement with the heavy metal ion that is produced in the microetch process, see through electrolysis treatment and keep strength of solution, need not waste and join the groove time and join the content that groove solution reduces wastewater flow rate and heavy metal, and improve the custom of microetch groove discharging every day and the work-ing life of increase microetch device tank liquor.
Another purpose of the utility model, aim to provide the equipment of a kind of micro-etching solution regeneration and heavy metal recovery, see through the electrolysis treatment of retrieving arrangement, the negative potential that heavy metal is gathered in electrolyzer reclaims, deliver to refinery again and reclaim use again, make the cost of making printed circuit board (PCB) reduce.
For achieving the above object, the utility model comprises a microetch device, and this microetch device inside is provided with the container slot of a storing liquid, and this container slot inside is provided with etching solution, and is provided with an overflow passage in said vesse groove one side predetermined height; The retrieving arrangement of the above-mentioned overflow passage of one winding, this retrieving arrangement is provided with an electrolyzer in order to the above-mentioned etching solution of electrolysis, and above-mentioned electrolyzer one outer fix winding always, the rectifier of alternating-current conversion, and be provided with a transfer line that connects above-mentioned microetch device side bottom in the bottom outside of above-mentioned electrolyzer.
In possible embodiments, above-mentioned electrolyzer inside is provided with the reservoir of the molten metal of a ccontaining above-mentioned microetch device, and this reservoir has the yin, yang electrode of at least more than one relative spacing.
In possible embodiments, both sides, above-mentioned reservoir bottom respectively are provided with one and strengthen etching solution round-robin aerating pipelines, and the predeterminated position of above-mentioned reservoir delivered inside pipeline opening part is provided with a dividing plate.
In possible embodiments, the aforementioned barriers height is between the height of above-mentioned overflow passage and above-mentioned yin, yang electrode.
In possible embodiments, it is the plate electrode of ground with the stainless steel that above-mentioned negative electrode is made as one, and is covered with the non-conductive frame of one deck at its frame; It is the mesh electrode of ground with the titanium metal that above-mentioned positive electrode is made as one, and externally plants crystal and cover the last layer titanium oxide.
In possible embodiments, above-mentioned retrieving arrangement more comprises the filtration unit of a purification etching solution, and above-mentioned filtration unit is provided with a return line that is connected with above-mentioned microetch device side bottom, and is connected with above-mentioned retrieving arrangement by above-mentioned transfer line.
The equipment of regeneration of the utility model micro-etching solution and heavy metal recovery sees through electrolytic powerful redox effect, and the design of special anode and cathode, reclaims heavy metal, and tank liquor is recycled, and reaches the purpose that reduces metal waste liquid amount and heavy metal content.The utility model is with the heavy metal ion that is produced in the microetch process, see through electrolysis treatment and keep strength of solution, improve the custom of microetch device discharging every day, need not waste and join the groove time and join groove solution, and reduce the content that reduces wastewater flow rate and heavy metal, and increase the work-ing life of tank liquor, in addition, through electrolysis treatment heavy metal is recycled to refinery and makes use again, can increase the another kind of income of inside plants.
Description of drawings
Fig. 1 is a schema of commonly using chemical copper (PTH) processing procedure;
Fig. 2 is a schema of commonly using the plating of secondary copper;
Fig. 3 is the stereographic map of the utility model one preferred embodiment;
Fig. 4 is the sectional schematic diagram of the utility model retrieving arrangement; And
Fig. 5 is the schema that the utility model is applied to chemical copper (PTH) processing procedure.
The primary clustering nomenclature
10------microetch device 24------reservoir
11------container slot 25------negative electrode
12------etching solution 26------positive electrode
13------overflow passage 27------aerating pipelines
20------retrieving arrangement 28------dividing plate
21------electrolyzer 30------filtration unit
22------rectifier 31------return line
The 23------transfer line
Embodiment
For ease of structure, use and feature thereof further clear and definite, full and accurate understanding of darker one deck and understanding are arranged, now enumerate preferred embodiment, cooperate graphic being described in detail as follows the utility model:
At first see also Fig. 3 and Fig. 4, in preferred embodiment, the equipment system of regeneration of the utility model micro-etching solution and heavy metal recovery comprises a microetch device 10, these microetch device 10 inside are provided with the container slot 11 of a storing liquid, and container slot 11 inside are provided with the etching solution 12 except that deoxidation and slight corrosion metallic substrate surfaces, and are provided with an overflow passage 13 in said vesse groove 11 1 side predetermined heights; The retrieving arrangement 20 of the above-mentioned overflow passage 13 of one winding, above-mentioned retrieving arrangement 20 is provided with an electrolyzer 21 in order to the above-mentioned etching solution of electrolysis, and above-mentioned electrolyzer 21 1 outer fix windings always, the rectifier 22 of alternating-current conversion, and be provided with a transfer line 23 in the bottom outside of above-mentioned electrolyzer 21, above-mentioned electrolyzer 21 inside are provided with the reservoir 24 of the metal waste liquid of a ccontaining above-mentioned microetch device 10, and this reservoir 24 has the yin, yang electrode 25,26 of at least one group of above relative spacing; One is connected to above-mentioned transfer line 23 and in order to purify the filtration unit 30 of etching solution 12, this filtration unit 30 is provided with a return line 31 that is connected with above-mentioned microetch device 10 side bottoms; By electrolytic powerful redox reaction, with the heavy metal recycling.
In diagram one preferred embodiment, both sides, above-mentioned reservoir 24 bottom respectively are provided with one and strengthen etching solution 12 round-robin aerating pipelines 27, and the predeterminated position of above-mentioned reservoir 24 delivered inside pipelines 23 opening parts is provided with a dividing plate 28, wherein, this dividing plate 28 highly is between the height of above-mentioned overflow passage 13 and above-mentioned yin, yang electrode 25,26; Sample attitude with wherein a kind of feasible enforcement is an example, it is the plate electrode of ground with the stainless steel that above-mentioned negative electrode 25 can be one, and be covered with the non-conductive frame of one deck at its frame, collection in order to metal recovery, it is the mesh electrode of ground with the titanium metal that 26 of above-mentioned positive electrodes can be one, and externally plants crystal and cover the last layer titanium oxide.See also Fig. 5, with general printed circuit board (PCB) chemical copper (PTH) processing procedure system as an example, etching solution system adopts persulfuric acid to receive that (SPS, chemical formula are Na
2S
2O
8)/sulfuric acid increases the roughness of printed circuit board (PCB), make follow-up when carrying out reactivation process, with catalyst the processing printed circuit card of microetch of preferable adherence is arranged, the compound concentration of the inner microetch soup of general microetch device is that persulfuric acid is received not ear (mole) of (SPS)=60 gram/litres (g/L)=0.25; Sulfuric acid (H
2SO
4Milliliter/liter (ml/L)=0.56)=30 is ear (mole) not, and persulfuric acid receive (SPS) be via following reaction equation: Na
2S
2O
8+ H
2O → Na
2SO
4(sodium sulfate)+H
2SO
5(persulfuric acid), H
2SO
5+ H
2O → H
2SO
4+ H
2O
2(hydrogen peroxide), H
2O
2+ Cu → CuO (cupric oxide)+H
2O, CuO+H
2SO
4→ CuSO
4(copper sulfate)+H
2O produces, and above-mentioned reaction equation can be reduced to Na
2S
2O
8+ Cu → Na
2SO
4+ CuSO
4When the copper content of microetch device inside reaches 20～30 gram/litres (g/L), be sent to solution in the electrolyzer of retrieving arrangement by overflow passage, the direct current that provides by rectifier comes electrolysis to produce redox reaction, the cupric ion of solution inside is separated out in negative electrode, and its reaction formula is CuSO
4+ 2e
-→ Cu (s)+SO
4 2-, the solution after the electrolysis is transferred to the filtration unit self-filtering by transfer line, will contain a large amount of sulfate radical (SO by return line again
4 2-) solution be disposed to the microetch device, by sulfate radical (SO
4 2-) react and keep persulfuric acid and receive the concentration of (SPS) with copper on the printed circuit board (PCB).
Table one is received the experimental data of (SPS) concentration for the microetch speed of reaction and the persulfuric acid of microetch device inside, wherein, microetch speed representative be in the unit time, can reduce mean thickness (micron, μ "), voltage and electric current maintain 4.5V (volt) and 45 amperes of/square English Foot (1A/dm respectively
2=9.29asf).
| Microetch speed | Persulfuric acid is received SPS (g/L) (gram/litre) | Sulfuric acid H 2SO 4(gram/litre) | Copper Cu (g/L) (gram/litre) | Voltage (v) (volt) | Electric current (asf) (ampere/square English Foot) | ||
| Original tank liquor | 57 | 4.3 | 12.8575 | 4.5 | 45 | Add a large amount of persulfuric acid and receive (SPS) and copper | |
| 55.428 | 31.275 | ||||||
| 1 hour | 42.912 | 31.6225 | |||||
| 2 hours | 28.75 | 82.2 | 21.8 | ||||
| 3 hours | 33.18 | 80.758 | 33.8 | ||||
| 4 hours | 33.18 | 77.48 | 35.445 | ||||
| 5 hours | 30.9 | 59.3 | 39 | ||||
| 6 hours | 37.7 | 50.3 | 40.8 | ||||
| 7 hours | 26.5 | 46.4 | 42.3 | ||||
| 8 hours | 19.9 | 36.6 | 41.8 | The persulfuric acid that adds two glasss 300 milliliters (cc) is received (SPS) | |||
| 9 hours | 26.54 | 67.9 | 42 | ||||
| 10 hours | 33.18 | 72.4 | 42.9 | ||||
| 11 hours | 35.39 | 90.5 | 42 | ||||
| 12 hours | 37.6 | 103.49 | 42.5 | Do not dissolved as yet | |||
| 13 hours | 37.6 | 106.9 | 42.5 | ||||
| 15 hours | 33.18 | 104.5 | 40.8 | ||||
| 17 hours | 39.8 | 112 | 41 | ||||
| 18 hours | 28.75 | 105.2 | 40.1 | ||||
| 20 hours | 48.66 | 105.4 | 39.2 | ||||
| 22 hours | 37.6 | 103.1 | 39.2 | ||||
| 24 hours | 39.8 | 104.8 | 37.8 | Do not dissolved as yet | |||
| 25 hours | 42 | 108.4 | 36.4 | ||||
| 27 hours | 55.3 | 115.3 | 7.3 | 33.1 | |||
| 29 hours | 46.45 | 109.6 | 33.7 | ||||
| 31 hours | 44.2 | 110.2 | 31.6 | ||||
| 33 hours | 42 | 114.73 | 26.9 | ||||
| 35 hours | 48 | 109.6 | 26.4 | ||||
| 37 hours | 42 | 100.4 | 24.8 | ||||
| 39 hours | 42 | 103.4 | 24.1 | ||||
| 41 hours | 50 | 99.2 | 21.3 |
Calculate with chemical copper (PTH) line microetch groove, the microetch cell body is long-pending to be assumed to 1000 liters (L) and to join groove, persulfuric acid is received (SPS) content 70 gram/litres (g/L), with every day when half groove and joined once new groove in per two days and calculate needed persulfuric acid to receive (SPS) consumption be (70*1000)+(35*1000)=105000 g (g)/1000=105 kilograms (kg) (two days desired amounts), can become the interior solution of two weeks replacing groove once after using retrieving arrangement, the consumption in two weeks is with analysis data be as the criterion (adding 10 kilograms about every day with empirical value), but because the volume of many electrolytic recovery grooves also is 1000 liters, so 14 days consumption is (70*2000)+(10000*13)=205000/1000=270 kilogram, one month is received (SPS) usage quantity and is (28/2) * 105=1470 kilogram (kg) to calculate persulfuric acid in 28 days, and persulfuric acid of the present utility model is received (SPS) usage quantity for (28/14) * 270=540 kilogram (kg), it is 1470-540=930 kilogram (kg) that every month desirable savable persulfuric acid is received (SPS) consumption, calculate with chemical copper (PTH) line microetch groove, long-pending 1000 liters (L) generation copper content 25 gram/litres (g/L), then 25*1000*28 days/1000=700 of the recovery benefit rough estimate kilogram copper of 28 days metallic copper reality of being assumed to of cell body.
Calculate with two copper cash microetch grooves, cell body amasss and is assumed to 1000 liters (L), join the groove persulfuric acid and receive (SPS) content 70 gram/litres (g/L), worked as half groove and joined once new groove in per seven days with per three days, and the consumption of every day is with chemical examination be as the criterion (with about 10 kilograms of empirical value), calculating seven days needed persulfuric acid, to receive (SPS) consumption be (70*1000)+(35*1000)+(10000*5)=155000/1000=155 kilogram (kg), then received (SPS) usage quantity and be (28/7) * 155=62 kilogram (kg) to calculate persulfuric acid in 28 days in one month, can become month interior solution of replacing groove once after using retrieving arrangement, the consumption of every day is as the criterion (with about 10 kilograms of empirical value) with chemical examination but because the volume of many electrolytic recovery grooves also is 1000 liters (L), so it is (70*2000)+(10000*28)=420000/1000=420 kilogram (kg) that 28 days persulfuric acid is received (SPS) consumption, then to receive (SPS) consumption be 620-420=200 kilogram (kg) for every month desirable savable persulfuric acid, calculate with two copper cash microetch grooves, cell body is long-pending to be that 1000 liters (L) produces copper amount 5 gram/litres (g/L), and then 28 days recuperable metallic coppers are 5*1000*28 days/1000=140 kilogram copper.
Above illustrated embodiment only is not in a limitative way with the utility model for convenience of description, not from the utility model spirit category, is familiar with various simple and easy distortion and modification that this industry skill personage can be done, all must include in following claim.
Claims (6)
1. the equipment of micro-etching solution regeneration and heavy metal recovery, it is characterized in that comprise a microetch device, this microetch device inside is provided with the container slot of a storing liquid, described container slot inside is provided with etching solution, and is provided with an overflow passage in said vesse groove one side predetermined height; The retrieving arrangement of the above-mentioned overflow passage of one winding, this retrieving arrangement is provided with an electrolyzer in order to the above-mentioned etching solution of electrolysis, and above-mentioned electrolyzer one outer fix winding always, the rectifier of alternating-current conversion, and be provided with a transfer line that connects above-mentioned microetch device side bottom in the bottom outside of above-mentioned electrolyzer.
2. the equipment of micro-etching solution regeneration according to claim 1 and heavy metal recovery, it is characterized in that, above-mentioned electrolyzer inside is provided with the reservoir of the molten metal of a ccontaining above-mentioned microetch device, and this reservoir has the yin, yang electrode of at least one group of above relative spacing.
3. the equipment of micro-etching solution regeneration according to claim 2 and heavy metal recovery, it is characterized in that, both sides, above-mentioned reservoir bottom respectively are provided with one and strengthen etching solution round-robin aerating pipelines, and the predeterminated position of above-mentioned reservoir delivered inside pipeline opening part is provided with a dividing plate.
4. the equipment of micro-etching solution regeneration according to claim 3 and heavy metal recovery is characterized in that the aforementioned barriers height is between the height of above-mentioned overflow passage and above-mentioned yin, yang electrode.
5. the equipment of micro-etching solution according to claim 2 regeneration and heavy metal recovery is characterized in that, it is the plate electrode of ground with the stainless steel that above-mentioned negative electrode is made as one, and is covered with the non-conductive frame of one deck at its frame; It is the mesh electrode of ground with the titanium metal that above-mentioned positive electrode is made as one, and externally plants crystal and cover the last layer titanium oxide.
6. the equipment of micro-etching solution regeneration according to claim 1 and heavy metal recovery, it is characterized in that, above-mentioned retrieving arrangement more comprises the filtration unit of a purification etching solution, above-mentioned filtration unit is provided with a return line that is connected with above-mentioned microetch device side bottom, and is connected with above-mentioned retrieving arrangement by above-mentioned transfer line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201362298U CN201258361Y (en) | 2008-09-18 | 2008-09-18 | Microetch liquor regeneration and heavy metal recovery equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201362298U CN201258361Y (en) | 2008-09-18 | 2008-09-18 | Microetch liquor regeneration and heavy metal recovery equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201258361Y true CN201258361Y (en) | 2009-06-17 |
Family
ID=40772596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201362298U Expired - Fee Related CN201258361Y (en) | 2008-09-18 | 2008-09-18 | Microetch liquor regeneration and heavy metal recovery equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201258361Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101988199A (en) * | 2009-08-04 | 2011-03-23 | 章晓冬 | Micro-etching solution cyclic regeneration and copper reclamation device |
| CN102251254A (en) * | 2011-06-24 | 2011-11-23 | 深圳市惠尔能科技有限公司 | Circular treatment equipment for recovery of copper from microetching liquid and special eddy flow electrolysis unit thereof |
-
2008
- 2008-09-18 CN CNU2008201362298U patent/CN201258361Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101988199A (en) * | 2009-08-04 | 2011-03-23 | 章晓冬 | Micro-etching solution cyclic regeneration and copper reclamation device |
| CN102251254A (en) * | 2011-06-24 | 2011-11-23 | 深圳市惠尔能科技有限公司 | Circular treatment equipment for recovery of copper from microetching liquid and special eddy flow electrolysis unit thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204417598U (en) | A kind of cupric micro-etched waste liquid recycling device | |
| CN202359203U (en) | Micro-etching fluid regeneration recovery system | |
| CN104313584A (en) | Method and system for electrolyzing copper-containing etching liquid to obtain copper plate and regenerating and recycling etching liquid | |
| CN101988200A (en) | Cyclic regeneration and metal reclamation equipment for acid chloride-containing etchant | |
| CN201534880U (en) | Device for electrolyzing and recycling copper from low-concentration waste liquid with copper generated from microetching and pickling | |
| CN112663119A (en) | Device and method for preventing conductive roller from being plated with copper | |
| CN102912375B (en) | Method and the special purpose device thereof of copper is reclaimed from acidic etching liquid | |
| CN202492580U (en) | Acid etching liquid recycling device of PCB (Printed Circuit Board) | |
| CN102618873A (en) | Ammonia washing water circulation system and method of PCB (Printed Circuit Board) etching line | |
| CN201258361Y (en) | Microetch liquor regeneration and heavy metal recovery equipment | |
| CN102560499A (en) | Device for recycling printed circuit board acidic etching solution | |
| CN101982566A (en) | Device and method thereof for recovering metallic nickel ions in electroplating wastewater | |
| CN101988199A (en) | Micro-etching solution cyclic regeneration and copper reclamation device | |
| CN104512946B (en) | The online electro-deposition method and device of metallic wastewater | |
| CN101285195A (en) | Indirect regeneration for waste etching solution and recovery processing system for copper | |
| CN104152947A (en) | Suspended electrolyzing device for separating and recovering metals in waste circuit board | |
| CN203486944U (en) | Online electro-deposition device for metal waste water | |
| CN204982072U (en) | Acid etching waste liquid copper recovery device | |
| CN201704154U (en) | Integrated PCB cupric waste liquid treatment system | |
| CN200985363Y (en) | Electroplating liquid container | |
| CN202272952U (en) | Device for cyclically regenerating micro-etching solution and recovering copper | |
| CN203382824U (en) | Device for recovering refined copper from low-copper-content wastewater | |
| CN213977941U (en) | Auxiliary groove for preventing copper plating of conductive roller on upper side of coating film | |
| CN202519336U (en) | Ammonia washing water circulating system for PCB (Printed Circuit Board) etching line | |
| CN204417260U (en) | A kind for the treatment of system of lower concentration copper-containing wastewater |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090617 Termination date: 20120918 |