CN201774786U - Heat-dissipating device - Google Patents
Heat-dissipating device Download PDFInfo
- Publication number
- CN201774786U CN201774786U CN2010202577294U CN201020257729U CN201774786U CN 201774786 U CN201774786 U CN 201774786U CN 2010202577294 U CN2010202577294 U CN 2010202577294U CN 201020257729 U CN201020257729 U CN 201020257729U CN 201774786 U CN201774786 U CN 201774786U
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- China
- Prior art keywords
- heat
- heat dissipation
- dissipation channel
- source element
- thermal source
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Abstract
The utility model discloses a heat-dissipating device which comprises a heat-dissipating channel, fans and a heat-conducting fin, wherein the heat-dissipating channel is a barrel body with two open ends, and at least one end of the heat-dissipating channel is provided with the fan; one end of the heat-conducting fin is attached to a heat source element, and the other end is attached to the outer wall of the heat-dissipating channel; and the heat source element is connected with the heat-dissipating channel. By adopting the heat-dissipating device, limited heat-dissipating space can be sufficiently utilized to well realize heat dissipation of the heat source element, thus being beneficial to the miniaturization of electronic products, and solving the problem of easy dust accumulation in the electronic products.
Description
Technical field
The utility model relates to the heat radiation field, relates to a kind of heat abstractor in particular.
Background technology
During electronic product work,, will influence the Performance And Reliability of electronic product if the heat that some electronic devices and components (being the thermal source element) produce can not obtain good heat radiation.Existing heat dissipating method normally is directly installed on all thermal source elements on one or more radiators, adopts natural heat dissipation, or uses radiator fan that radiator is carried out wind-cooling heat dissipating.In the time of need dispelling the heat for the more thermal source element of generation heat,, and be unfavorable for miniaturization of electronic products like this if will reach good heat-radiation effect then needs larger-size radiator.In addition, when fan work,, influence the Performance And Reliability of electronic product because the air-flow effect causes the inner dust stratification of electronic product easily.
The utility model content
In view of this, the utility model provides a kind of heat abstractor of electronic product, can make full use of limited heat-dissipating space and realize the thermal source element is carried out good heat radiation, helps miniaturization of electronic products, and has solved the inner problem of dust stratification easily of electronic product.
For achieving the above object, the utility model provides a kind of heat abstractor, and described heat abstractor comprises: heat dissipation channel, fan, conducting strip.Described heat dissipation channel is the cylindrical shell that two ends are not all sealed; At least one end at described heat dissipation channel is equipped with described fan; The fit outer wall of described heat dissipation channel of described conducting strip one end applying thermal source element, the other end is connected described thermal source element with described heat dissipation channel.
When the work of described thermal source element, the heat transferred that described conducting strip produces described thermal source element is to described heat dissipation channel, and described fan and described heat dissipation channel inner chamber formation cooling air channel dissipate heat, thereby reach good heat-radiation effect.This heat abstractor utilizes small-sized heat dissipation channel and fan to realize better radiating effect, has reached to make full use of the effect of limited heat-dissipating space realization to the good heat radiation of thermal source element, helps miniaturization of electronic products.Simultaneously, only just produce air-flow in the entire heat dissipation process at described heat dissipation channel inner chamber, can not make described thermal source element and other components and parts superficial dusts, solve the problem that the existing heat abstractor that has fan causes components and parts superficial dust in the electronic product easily effectively.
Description of drawings
In order to be illustrated more clearly in the technical scheme of the utility model embodiment, to do to introduce simply to the accompanying drawing of embodiment below, apparently, accompanying drawing in describing below only is embodiment of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to the accompanying drawing that provides.
Fig. 1 is the structure chart of the utility model embodiment heat abstractor;
Fig. 2 is the heat dissipation channel cross-sectional view of the utility model heat abstractor.
Embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
Fig. 1 is the structure chart of the utility model embodiment heat abstractor.
As shown in Figure 1, the described heat abstractor of the utility model embodiment comprises: heat dissipation channel 1, conducting strip 2, fan 3.
The square cylinder that heat dissipation channel 1 does not all seal for two ends, outer wall is flat; One end of heat dissipation channel 1 is equipped with fan 3; Conducting strip 2 is a rectangle, and an end is fitted in thermal source element 4 surfaces, other end applying heat dissipation channel 1 surface, and realization thermal source element 4 is connected with heat dissipation channel 1.
In the present embodiment, when thermal source element 4 work, the heat transferred that conducting strip 2 produces thermal source element 4 is to heat dissipation channel 1, and fan 3 forms cooling air channel with heat dissipation channel 1 inner chamber, heat is dissipated, thereby reach good heat-radiation effect.This heat abstractor makes full use of limited heat-dissipating space and realizes thermal source element 4 better heat radiating effect are helped miniaturization of electronic products.Simultaneously, only just produce air-flow in the entire heat dissipation process at described heat dissipation channel 1 inner chamber, can not make described thermal source element 4 and other components and parts superficial dusts, solve the problem that the heat abstractor that has fan in the prior art causes components and parts superficial dust in the electronic product easily effectively.
Preferably, the indoor design of described heat dissipation channel 1 is the fin shape.As shown in Figure 2, the projection that height rises and falls is set on the inside of described heat dissipation channel 1, corresponding two inwalls, has increased the heat transfer area of air and heat dissipation channel 1 inner chamber.Under the air blast cooling effect of fan 3, because air and heat dissipation channel 1 inner chamber have bigger heat transfer area, thereby heat dissipation channel 1 has good heat-radiation effect.
Preferably, conducting strip 2 is coated heat-conducting glue with heat dissipation channel 1 and with the coating surface of thermal source element 4 and is adopted screw fixings to fit.
Preferably, at the two ends of heat dissipation channel 1 fan 3 is installed all.
In actual applications, the shape of conducting strip 2 is not limited to rectangle.Conducting strip 2 can be designed as other shapes that can fit with heat dissipation channel 1 and thermal source element 4, as L type or I shape or T type or U type.
In the present embodiment, the profile of described heat dissipation channel 1 is square, and apparent, the profile of heat dissipation channel 1 is not limited to square, can also be other shapes, as circle or polygon.
For electronic product of concentrating for the thermal source element or the small-sized electronic product, then can adopt a plurality of thermal source elements to share the method for a heat abstractor.A plurality of thermal source elements are connected to same heat dissipation channel outer wall by one or more conducting strips, utilize same heat dissipation channel to carry out distributing of heat.So not only well save the space but also reached better heat radiating effect.
Situation for thermal source element in the electronic product disperses in order to reach better radiating effect, then can be provided with a plurality of heat abstractors in an electronic product.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from spirit or scope of the present utility model in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (1)
1. a heat abstractor is characterized in that, comprising: heat dissipation channel, fan, conducting strip;
Described heat dissipation channel is the cylindrical shell that two ends are not all sealed;
At least one end of described heat dissipation channel is equipped with described fan;
The fit outer wall of described heat dissipation channel of described conducting strip one end applying thermal source element, the other end is connected described thermal source element with described heat dissipation channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202577294U CN201774786U (en) | 2010-07-13 | 2010-07-13 | Heat-dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202577294U CN201774786U (en) | 2010-07-13 | 2010-07-13 | Heat-dissipating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201774786U true CN201774786U (en) | 2011-03-23 |
Family
ID=43754627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202577294U Expired - Lifetime CN201774786U (en) | 2010-07-13 | 2010-07-13 | Heat-dissipating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201774786U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014086152A1 (en) * | 2012-12-07 | 2014-06-12 | 中兴通讯股份有限公司 | Heat radiation apparatus of terminal |
-
2010
- 2010-07-13 CN CN2010202577294U patent/CN201774786U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014086152A1 (en) * | 2012-12-07 | 2014-06-12 | 中兴通讯股份有限公司 | Heat radiation apparatus of terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110323 |