CN201688194U - Module chip type LED lamp - Google Patents
Module chip type LED lamp Download PDFInfo
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- CN201688194U CN201688194U CN201020191205XU CN201020191205U CN201688194U CN 201688194 U CN201688194 U CN 201688194U CN 201020191205X U CN201020191205X U CN 201020191205XU CN 201020191205 U CN201020191205 U CN 201020191205U CN 201688194 U CN201688194 U CN 201688194U
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- heat
- lamp body
- led lamp
- type led
- module
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Abstract
The utility model discloses a module chip type LED lamp, which comprises a lamp body, a luminous chip module, a heat dissipation block and a heat pipe, wherein the lamp body has a closed cavity structure; the luminous chip module is attached to the heat dissipation block; a part of the heat pipe is inserted into the heat dissipation block, and the other part of the heat pipe extends into the cavity of the lamp body; and heat conducting liquid is injected into the cavity of the lamp body. By using the property that the specific heat of heating convection of the heat conducting liquid, in particular heat conducting oil is greater than the specific heat of aluminum, the temperature of the luminous chip module is directly transferred into the heat conducting liquid through the heat pipe, and the heat is uniformly transferred to a shell of the lamp body by using liquid convection to perform heat dissipation, so the heat dissipation effect is good.
Description
Technical field
The utility model relates to a kind of module chip type LED lamp.
Background technology
Light emitting diode is applied to lighting field, has advantages such as energy-conserving and environment-protective.But temperature is very big for the influence in service life of light emitting diode.LED light temperature that table 1 is announced for U.S. Edison Co. and lamp life-span influence graph of a relation.
The junction temperature T of table 1 white light LEDs is when brightness decay 70% and life relation
From table, be not difficult to find out that after the LED lamp was heated, its life-span sharply shortened.Simultaneously, temperature also can influence the service efficiency of LED lamp, and the relation of temperature and efficient sees Table 2.
The relation of table 2LED light temperature and relative light emission rate
Publication number be US7674012B1 U.S. Patent Publication a kind of module chip type LED lamp, it is to be delivered to rapidly on the radiator casing by the heat of heat pipe with LED illuminator module chip, and module chip is dispelled the heat.This structure is than the good heat dissipation effect of existing other LED lamp radiator structures, but also there is weak point: after 1, heat is passed to radiator casing, the secondary transmission effect of heat is bad, and is than higher, and low away from the temperature at heat pipe place along the temperature of the radiator of heat pipe periphery; 2, by many heat pipes, heat is fully scattered, cause the radiator structure complexity again, the lamp body volume is big, the processing cost height.
The utility model content
The utility model purpose: the purpose of this utility model is at the deficiencies in the prior art, and a kind of LED lamp of good heat dissipation effect is provided.
Technical scheme: a kind of high-power module LED lamp described in the utility model, comprise lamp body, light emitting chip module, radiating block and heat pipe, described lamp body is airtight cavity body structure, described radiating block is arranged on the cavity inner surface or the outer surface of described lamp body, described light emitting chip module is arranged on the cavity outside, pasting described radiating block, described heat pipe section is inserted in the described radiating block, remainder stretches in the cavity of described lamp body, be injected with heat-conducting liquid in the cavity of described lamp body, carry out the soaking heat radiation by the conductive fluid convection current.
Higher in order to prevent the module chip type LED lamp temperature, causing heat-conducting liquid to expand causes danger, described lamp body is an aluminum material, constitute by container and dissipating cover two parts, fit in the side of described dissipating cover and the side of described container, and, form piston type integral body by PUR and silicone rubber gasket sealing.PUR is heated and understands deliquescing, has certain elasticity, and container and dissipating cover carry out the piston motion when the conductive fluid thermal expansion.
Described heat-conducting liquid is preferably conduction oil.
In order to enlarge area of dissipation, the outer surface of described dissipating cover is provided with the aluminium fin.
In order further to enlarge area of dissipation, the inner surface of described dissipating cover is provided with the fin of falling aluminium.
Can lateral flow for the ease of the liquid in the adjacent groove that falls fin, described fall fin transversely be provided with fracture.
Beneficial effect: the utility model compared with prior art, its beneficial effect is: 1, the utility model utilizes heat-conducting liquid, especially conduction oil is subjected to thermal convection current, its specific heat is much larger than the characteristic of the specific heat of aluminium, be directly delivered in the heat-conducting liquid by the temperature of heat pipe light emitting chip module, utilize liquid convection, the shell that heat is soaked to lamp body dispels the heat, good heat dissipation effect; 2, lamp body of the present utility model is tightly connected by PUR by container and dissipating cover two parts, and after heated liquid expanded, PUR was softening, and container and dissipating cover can be done relative displacement, prevent danger; 3, by inside and outside surface fin is set, strengthens area of dissipation, further improve radiating effect at the lamp body shell; 4, LED lamp good heat dissipation effect of the present utility model, after testing, the module chip surface is no more than 10 ℃ with the temperature difference of conductive fluid, and the temperature difference of conductive fluid and lamp body outer surface is no more than 15 ℃; 5, the utility model product structure is simple, volume is little, in light weight, save heat sink material than general nature heat radiation, save processing cost, excellent in heat dissipation effect.
Description of drawings
Fig. 1 is the structural representation of the utility model product;
Fig. 2 is the utility model lamp body structure schematic diagram.
The specific embodiment
Below in conjunction with accompanying drawing, by a most preferred embodiment, technical solutions of the utility model are elaborated, but protection domain of the present utility model is not limited to described embodiment.
As shown in Figure 1, a kind of module chip type LED lamp, comprise lamp body 1, light emitting chip module, radiating block 2 and heat pipe 3, described lamp body 1 is airtight cavity body structure, described light emitting chip module is being pasted described radiating block 2, described heat pipe 3 parts are inserted in the described radiating block 2, and remainder stretches in the cavity of described lamp body 1, is injected with conduction oil in the cavity of described lamp body 1.
Described lamp body 1 is an aluminum material, is made of container 4 and dissipating cover 5 two parts, fits in the side of the side of described dissipating cover 5 and described container 4, and by 45 degree glue sealings.
Described dissipating cover 5 outer surface be provided with aluminium fin 6, described dissipating cover 5 inner surface be provided with the fin of falling aluminium 7, the described fin of falling aluminium 7 transversely be provided with fracture.
The light emitting chip module below is provided with lampshade 8.
Claims (6)
1. module chip type LED lamp, comprise lamp body (1), light emitting chip module, radiating block (2) and heat pipe (3), described lamp body (1) is airtight cavity body structure, described light emitting chip module is being pasted described radiating block (2), described heat pipe (3) part is inserted in the described radiating block (2), remainder stretches in the cavity of described lamp body (1), it is characterized in that: be injected with heat-conducting liquid in the cavity of described lamp body (1).
2. module chip type LED lamp according to claim 1, it is characterized in that: described lamp body (1) is an aluminum material, being made of container (4) and dissipating cover (5) two parts, fits in the side of the side of described dissipating cover (5) and described container (4), and seals by PUR.
3. module chip type LED lamp according to claim 1 is characterized in that: described heat-conducting liquid is a conduction oil.
4. module chip type LED lamp according to claim 2 is characterized in that: the outer surface of described dissipating cover (5) is provided with aluminium fin (6).
5. module chip type LED lamp according to claim 2 is characterized in that: the inner surface of described dissipating cover (5) is provided with the fin of falling aluminium (7).
6. module chip type LED lamp according to claim 5 is characterized in that: the described fin of falling aluminium (7) transversely be provided with fracture.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201020191205XU CN201688194U (en) | 2010-05-14 | 2010-05-14 | Module chip type LED lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201020191205XU CN201688194U (en) | 2010-05-14 | 2010-05-14 | Module chip type LED lamp |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201688194U true CN201688194U (en) | 2010-12-29 |
Family
ID=43376474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201020191205XU Expired - Fee Related CN201688194U (en) | 2010-05-14 | 2010-05-14 | Module chip type LED lamp |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201688194U (en) |
-
2010
- 2010-05-14 CN CN201020191205XU patent/CN201688194U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101229 Termination date: 20140514 |