CN101922694A - Heat radiator for module chip type LED lamp - Google Patents
Heat radiator for module chip type LED lamp Download PDFInfo
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- CN101922694A CN101922694A CN2010101729580A CN201010172958A CN101922694A CN 101922694 A CN101922694 A CN 101922694A CN 2010101729580 A CN2010101729580 A CN 2010101729580A CN 201010172958 A CN201010172958 A CN 201010172958A CN 101922694 A CN101922694 A CN 101922694A
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a heat radiator for a module chip type LED lamp, which comprises a cavity, a heat radiation block and a heat pipe, wherein part of the heat pipe is inserted into the heat radiation block, the other part is inserted into the cavity, and the cavity is injected with heat conducting liquid. The heat conduction liquid, particularly heated convection of heat transfer oils, is used, and has the coefficient of heat conduction of larger more than aluminum (metal), the temperature of a light emitting chip module is directly transmitted into the heat conduction liquid through the heat pipe, the heat is soaked to an aluminum hull of a lamp body through the convection of liquid, and the contact surface with air is enlarged by wings on the aluminum hull for radiating the head, which ensures that the aluminum hull has good heat radiation affect.
Description
Technical field
The present invention relates to a kind of heat radiator for module chip type LED lamp.
Background technology
Light emitting diode is applied to lighting field, has advantages such as energy-conserving and environment-protective.But temperature is very big for the influence in service life of light emitting diode.LED light temperature and the influence in lamp life-span relation that table 1 is announced for U.S. Edison Co..
The junction temperature T of table 1 white light LEDs is when brightness decay 70% and life relation
From table, be not difficult to find out that after the LED lamp was heated, its life-span sharply shortened.Simultaneously, temperature also can influence the service efficiency of LED lamp, and the relation of temperature and efficient is seen Fig. 3.
Publication number be US7674012B1 U.S. Patent Publication a kind of module chip type LED lamp, it is to be delivered to rapidly on the radiator casing by the heat of heat pipe with LED illuminator module chip, and module chip is dispelled the heat.This structure is than the good heat dissipation effect of existing other LED lamp radiator structures, but also there is weak point: after 1, heat is passed to radiator casing, the secondary transmission effect of heat is bad, and is than higher, and low away from the temperature at heat pipe place along the temperature of the radiator of heat pipe periphery; 2, by many heat pipes, heat is fully scattered, cause the radiator structure complexity again, cavity volume is big, the processing cost height.
Summary of the invention
Goal of the invention: the objective of the invention is at the deficiencies in the prior art, a kind of model chip type LED lamp radiator of good heat dissipation effect is provided.
Technical scheme: heat radiator for module chip type LED lamp of the present invention, comprise cavity, radiating block and heat pipe, described radiating block is arranged on the inner surface or the outer surface of described cavity, described heat pipe section is inserted in the described radiating block, remainder stretches in the described cavity, be injected with heat-conducting liquid in the described cavity, carry out the soaking heat radiation by the conductive fluid convection current.The light emitting chip module of LED lamp is arranged on the cavity outside, is pasting described radiating block.
Higher in order to prevent the module chip type LED lamp temperature, causing heat-conducting liquid to expand causes danger, described cavity is an aluminum material, constitute by container and dissipating cover two parts, fit in the side of described dissipating cover and the side of described container, and, be lined with silicone rubber O-ring enhanced leaktightness effect between dissipating cover and the container by the PUR sealing, form piston type integral body.PUR varies with temperature the meeting deliquescing, has certain elasticity, and container and dissipating cover carry out the piston motion when the conductive fluid thermal expansion.When this structural design was expanded with heat and contract with cold inside cavity, the pressure in the container can not change too big, solved the too high or metal fatigue of container internal pressure and caused leakage (cold oil).
Described heat-conducting liquid is preferably conduction oil.
In order to enlarge area of dissipation, described dissipating cover outer surface be provided with the aluminium fin.
In order further to enlarge area of dissipation, described dissipating cover inner surface be provided with the fin of falling aluminium.
Can lateral flow for the ease of the liquid in the adjacent groove that falls fin, described fall fin transversely be provided with fracture.
Beneficial effect: the present invention compared with prior art, its beneficial effect is: 1, the present invention utilizes heat-conducting liquid, especially conduction oil is subjected to thermal convection current, its coefficient of heat conduction is more much bigger than aluminum (metal), be directly delivered in the heat-conducting liquid by the temperature of heat pipe, utilize liquid convection, heat is soaked to the aluminium shell of lamp body light emitting chip module, the contact-making surface that has enlarged with air by the wing on the aluminum hull dispels the heat, and makes it obtain fabulous radiating effect; 2, cavity of the present invention is tightly connected by PUR by container and dissipating cover two parts, and after heated liquid expanded, colloid was softening, and container and dissipating cover can be done relative displacement, prevent danger; 3, by inside and outside surface fin is set, strengthens area of dissipation, further improve radiating effect at shell cavity; 4, LED lamp good heat dissipation effect of the present invention, after testing, the module chip surface is no more than 10 ℃ with the temperature difference of conductive fluid, and the temperature difference of conductive fluid and chamber outer surface is no more than 15 ℃; 5, product structure of the present invention is simple, volume is little, in light weight, save heat sink material than general nature heat radiation, save processing cost, excellent in heat dissipation effect.
Description of drawings
Fig. 1 is the structural representation of the LED lamp of use product of the present invention;
Fig. 2 is a cavity body structure schematic diagram of the present invention.
The relation of Fig. 3 LED light temperature and relative light emission rate.
The specific embodiment
Below in conjunction with accompanying drawing, by a most preferred embodiment, technical solution of the present invention is elaborated, but protection scope of the present invention is not limited to described embodiment.
As shown in Figure 1, a kind of module group type LED lamp radiator comprises cavity 1, radiating block 2 and heat pipe 3, and described heat pipe 3 parts are inserted in the described radiating block 2, and remainder stretches in the cavity of described cavity 1, is injected with conduction oil in the cavity of described cavity 1.
Described cavity 1 is an aluminum material, is made of container 4 and dissipating cover 5 two parts, fits in the side of the side of described dissipating cover 5 and described container 4, and by silicone rubber O-ring and PUR sealing.
Described dissipating cover 5 outer surface be provided with aluminium fin 6, described dissipating cover 5 inner surface be provided with the fin of falling aluminium 7, the described fin of falling aluminium 7 transversely be provided with fracture.
Light emitting chip module is being pasted described radiating block 2, and the light emitting chip module below is provided with lampshade 8.
Claims (6)
1. heat radiator for module chip type LED lamp, comprise cavity (1), radiating block (2) and heat pipe (3), described heat pipe (3) part is inserted in the described radiating block (2), and remainder stretches in the described cavity (1), it is characterized in that: described cavity is injected with heat-conducting liquid in (1).
2. heat radiator for module chip type LED lamp according to claim 1, it is characterized in that: described cavity (1) is an aluminum material, being made of container (4) and dissipating cover (5) two parts, fits in the side of the side of described dissipating cover (5) and described container (4), and seals by PUR.
3. heat radiator for module chip type LED lamp according to claim 1 is characterized in that: described heat-conducting liquid is a conduction oil.
4. heat radiator for module chip type LED lamp according to claim 2 is characterized in that: described dissipating cover (5) outer surface be provided with aluminium fin (6).
5. heat radiator for module chip type LED lamp according to claim 2 is characterized in that: described dissipating cover (5) inner surface be provided with the fin of falling aluminium (7).
6. heat radiator for module chip type LED lamp according to claim 5 is characterized in that: the described fin of falling aluminium (7) transversely be provided with fracture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101729580A CN101922694A (en) | 2010-05-14 | 2010-05-14 | Heat radiator for module chip type LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101729580A CN101922694A (en) | 2010-05-14 | 2010-05-14 | Heat radiator for module chip type LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101922694A true CN101922694A (en) | 2010-12-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101729580A Pending CN101922694A (en) | 2010-05-14 | 2010-05-14 | Heat radiator for module chip type LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101922694A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107958949A (en) * | 2017-11-27 | 2018-04-24 | 安徽西马新能源技术有限公司 | A kind of bloom formula LED radiating subassemblies |
-
2010
- 2010-05-14 CN CN2010101729580A patent/CN101922694A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107958949A (en) * | 2017-11-27 | 2018-04-24 | 安徽西马新能源技术有限公司 | A kind of bloom formula LED radiating subassemblies |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20101222 |