CN201681971U - LED light source module - Google Patents
LED light source module Download PDFInfo
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- CN201681971U CN201681971U CN2010201992711U CN201020199271U CN201681971U CN 201681971 U CN201681971 U CN 201681971U CN 2010201992711 U CN2010201992711 U CN 2010201992711U CN 201020199271 U CN201020199271 U CN 201020199271U CN 201681971 U CN201681971 U CN 201681971U
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- Prior art keywords
- light source
- source module
- substrate
- led light
- led
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Abstract
The utility model relates to a semi-conductor lighting technology, in particular to an LED surface light source module with better radiating effect; the LED light source module comprises circular substrates, LED wafers which are arranged on the substrates, and a circular side wall; the inner wall of the side wall is formed into a cup shape with bigger top and smaller bottom; the LED wafers are arranged in a substrate area which is enclosed by the cup shape; the substrate on the outer side of the side wall is provided with installation holes, and the installation holes are distributed along a circular shape which is concentric with the side wall; and the substrates on the outer side of the installation holes form a radiating edge. The utility model provides the light LED light source module with good radiating effect.
Description
Technical field
The utility model relates to the semiconductor lighting technology, relates in particular to a kind of LED modular surface light source with better heat dissipation effect.
Background technology
Polycrystalline sheet LED area source is applicable to a lot of occasions, has compact conformation, advantage easy for installation, is subjected to the favor of lamp decoration manufacturer deeply.
Yet, polycrystalline sheet LED area source is bigger because of its power, topic is outstanding between heat radiation, sending out the heat that produces in the time of the LED wafer can not being worked in time dissipates, can the Yin Wendu accumulation produce temperature rise, influence the operational environment of LED wafer on the one hand, influence light effect, can reduce the useful life of LED wafer even whole light source module to causing the LED wafer or light decay early occurring on the other hand.
In the prior art, also the someone adopts reverse side at light source module that the loose mode of wing of heat radiation is set and solves above-mentioned heat dissipation problem, but this mode can break can the LED area source total, thickness is increased, install and accept restriction.
The utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art part and frivolous led light source module that a kind of good heat dissipation effect is provided.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of led light source module comprises circular substrate and is arranged at LED wafer on the substrate, it is characterized in that: also comprise the sidewall of ring-type, the inwall of sidewall forms little cup-shaped in the big end, and described LED wafer promptly is arranged at the cup-shaped substrate regions that surrounds; The substrate in the sidewall outside is provided with mounting hole site, and described mounting hole site is along a circular distribution concentric with described sidewall; The substrate in the installing hole outside constitutes a heat radiation edge.
The led light source module is characterized in that: described interior is provided with sealing.
The led light source module is characterized in that: mix being provided with fluorescent material in the described sealing.
The led light source module is characterized in that: the top of described sidewall is provided with an optical sheet, and optical sheet has interlayer, is provided with phosphor powder layer in the interlayer.Traditional light source, for improving color rendering, generally at led chip surface-coated fluorescent material or stickup fluorescence film, luminous with the point-source of light form, as the disclosed chip-type LED of Chinese patent literature CN201204213, this chip-type LED comprises that chip, chip are arranged on the ceramics bracket upper surface, and chip is positioned at the enclosure space of ceramics bracket, glue shell, lens, the electrode of chip leads to the enclosure space outside by contact conductor, and the light-emitting area of chip is provided with the fluorescence film.But point-source of light is easy to generate the fluorescent material of dazzling dazzle and LED point-source of light and directly contacts with led chip and substrate, is subjected to temperatures involved, easy weather stain of fluorescent material and volatilization, and influence luminous intensity and useful life.For addressing the above problem, as far back as on April 11st, 2007 just the someone area source solution has been proposed, as the disclosed LED area source of Chinese patent literature CN1945099, it comprises LED substrate and several LED that are installed on the LED substrate, the one phosphor plate support around described LED is set on the LED substrate, described phosphor plate support has an outwardly open interior tapered reflecting surface, has reflectorized material on the reflecting surface, install one on the described phosphor plate support and cover described LED and with described LED the phosphor plate of certain intervals is arranged, phosphor plate is towards the coating fluorescent powder of described LED.Phosphor plate adopts light transmissive material to make.The LED substrate adopts Heat Conduction Material to make; The LED substrate is fixed on the housing by means of Heat Conduction Material.Solution with Bang Beier on the duty has solved the problems referred to above to a certain extent, but still has weak point.Last scheme weak point is clearly, and the fluorescence coating light of scattering is backward assembled back again in the led chip, and it is not high to get on the one hand optical efficiency, is the principal element that causes the led chip temperature rise on the other hand yet, and chip operation produces light decay prematurely after a period of time.Back one scheme is a kind of area source, produces oxidation but fluorescent material contacts meeting with air, gets optical efficiency and reduces gradually, and the unprocessed hot spot of LED is directly beaten at phosphor powder layer, hot spot is seriously inhomogeneous, and fluorescent material excites the efficient of bright dipping not high, and light is all even inadequately soft.Aforementioned two kinds of solutions all exist gets the not high deficiency of optical efficiency.For addressing the above problem, the utility model is provided with phosphor powder layer by having the optical sheet of interlayer in the interlayer, and in the utility model, optical sheet can be a glass, or ground glass, or transparent film.Fluorescent material is arranged on laminated glass inside, and ingress of air can not produce oxidation, thus the light extraction efficiency and the useful life of the led light source that improves.
The led light source module is characterized in that: the outer edge of described heat radiation edge has heat radiation wing or louvre.
The led light source module is characterized in that: the inwall of described sidewall and surround the surface of substrate regions all plate and be provided with reflectance coating.
The led light source module is characterized in that: described LED wafer gross power is not less than under the situation of 60w, and the thickness of described substrate is more than or equal to 1.2mm, described heat radiation edge at the thickness of radial direction more than or equal to 10mm.
The led light source module is characterized in that: described substrate, described sidewall, described heat radiation edge are integral structures.
Led light source module of the present utility model, the substrate in the installing hole outside is provided with the heat radiation edge, mainly by the side heat radiation, compares with the back heat radiation of prior art during use, has good heat dissipation effect and frivolous characteristics; In the utility model; installing hole is arranged at heat radiation edge inboard; the bright dipping part that can guarantee substrate center is with combining closely be mounted part (part of the led light source module of the utility model promptly is installed) on it, and the back of led light source module becomes effective auxiliary heat dissipation passage.Compared with prior art, the utlity model has good heat dissipation effect and frivolous characteristics.
Description of drawings
Fig. 1 is the cutaway view of first embodiment of the utility model.
Fig. 2 is the front schematic view of first embodiment of the utility model.
Fig. 3 is the front schematic view of second embodiment of the utility model.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
With reference to figure 1, Fig. 2, first embodiment of the utility model is a kind of led light source module, comprise circular substrate 101 and the LED wafer 102 that is arranged on the substrate 101, the sidewall 105 that also comprises ring-type, the inwall of sidewall 105 forms little cup-shaped in the big end, and described LED wafer promptly is arranged at the cup-shaped substrate that surrounds 101 zones; The substrate 101 in sidewall 105 outsides is provided with installing hole 104, and described installing hole 104 is along a circular distribution concentric with described sidewall 105; The substrate 101 in installing hole 104 outsides constitutes a heat radiation edge 103.In the present embodiment, described sidewall 105 inside are provided with sealing 108.The top of described sidewall 105 is provided with an optical sheet 106, and in the present embodiment, described optical sheet 106 has interlayer, is provided with phosphor powder layer 107 in the interlayer.Fluorescent material is arranged on laminated glass inside, and ingress of air can not produce oxidation, thus the light extraction efficiency and the useful life of the led light source that improves.The inwall of described sidewall 105 and surround the surface in substrate 101 zones all plate and be provided with reflectance coating 109.In the present embodiment, described LED wafer gross power is 60w, and the thickness of described substrate is 1.2mm, and described heat radiation edge equals 10mm at the thickness of radial direction.Described substrate 101, described sidewall 105, described heat radiation edge 103 are integral structures, the aluminum component of processing by the microdiecast mode.A kind of distortion as present embodiment, also can adopt traditional approach that fluorescent material is set, promptly mix and be located in the sealing, because of sealing is a macromolecular structure, inside has air, after use a period of time, fluorescent material can wear out, the color rendering of light source can change, and can adopt this kind deformation program for the less demanding occasion of color rendering, to reduce cost.
With reference to figure 2, second embodiment of the utility model also is a kind of led light source module, be with the difference of first embodiment of the utility model,: the outer edge of described heat radiation edge has heat radiation wing 210, certainly, in the present embodiment, also can open some small louvres, realize heat radiation in the side of heat radiation edge.
Claims (7)
1. led light source module comprises circular substrate and is arranged at LED wafer on the substrate, it is characterized in that: also comprise the sidewall of ring-type, the inwall of sidewall forms little cup-shaped in the big end, and described LED wafer promptly is arranged at the cup-shaped substrate regions that surrounds; The substrate in the sidewall outside is provided with mounting hole site, and described mounting hole site is along a circular distribution concentric with described sidewall; The substrate in the installing hole outside constitutes a heat radiation edge.
2. led light source module according to claim 1 is characterized in that: described interior is provided with sealing.
3. led light source module according to claim 2 is characterized in that: the top of described sidewall is provided with an optical sheet, and optical sheet has interlayer, is provided with phosphor powder layer in the interlayer.
4. led light source module according to claim 1 is characterized in that: the outer edge of described heat radiation edge has heat radiation wing or louvre.
5. led light source module according to claim 1 is characterized in that: the surface of the inwall of described sidewall and the substrate regions that surrounds thereof is all plated and is provided with reflectance coating.
6. led light source module according to claim 1 is characterized in that: the thickness of described substrate is more than or equal to 1.2mm, described heat radiation edge at the thickness of radial direction more than or equal to 10mm.
7. according to any described led light source module of claim 1-6, it is characterized in that: described substrate, described sidewall, described heat radiation edge are integral structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201992711U CN201681971U (en) | 2010-05-23 | 2010-05-23 | LED light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201992711U CN201681971U (en) | 2010-05-23 | 2010-05-23 | LED light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201681971U true CN201681971U (en) | 2010-12-22 |
Family
ID=43347006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201992711U Expired - Fee Related CN201681971U (en) | 2010-05-23 | 2010-05-23 | LED light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201681971U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889477A (en) * | 2011-07-20 | 2013-01-23 | 黄裕仁 | LED (Light Emitting Diode) lamp bulb |
| CN111106099A (en) * | 2019-12-10 | 2020-05-05 | 温州大学新材料与产业技术研究院 | High-power COB heat dissipation packaging structure |
-
2010
- 2010-05-23 CN CN2010201992711U patent/CN201681971U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889477A (en) * | 2011-07-20 | 2013-01-23 | 黄裕仁 | LED (Light Emitting Diode) lamp bulb |
| CN111106099A (en) * | 2019-12-10 | 2020-05-05 | 温州大学新材料与产业技术研究院 | High-power COB heat dissipation packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20120523 |