CN201681925U - High-efficient array type LED packaging structure - Google Patents
High-efficient array type LED packaging structure Download PDFInfo
- Publication number
- CN201681925U CN201681925U CN2009202656880U CN200920265688U CN201681925U CN 201681925 U CN201681925 U CN 201681925U CN 2009202656880 U CN2009202656880 U CN 2009202656880U CN 200920265688 U CN200920265688 U CN 200920265688U CN 201681925 U CN201681925 U CN 201681925U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- metal circuit
- array
- encapsulating structure
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model relates to a high-efficient array type LED packaging structure, which comprises a metal circuit board, a plurality of LED chips, wires and sealing colloid. The LED packaging structure is characterized in that: the LED chips are mounted at the crystal positions of the metal circuit board, and are connected with the soldering positions of the metal circuit board through the wires; the LED chips are formed into more than two LED chip arrays, around which rubber retainer rings fixed on the metal circuit board are arranged; the sealing colloid is positioned in the rubber retainer rings, and the upper surface of the sealing colloid is higher than the upper surface of the rubber retainer ring. The utility model has the advantages of simple structure, reasonable design, small size, high power, good heat dispersion and high light-emitting efficiency.
Description
Technical field
The utility model relates to a kind of high efficiency array-type LED encapsulating structure, belongs to LED lighting technology category.
Background technology
As shown in Figure 1, the led array encapsulating structure that generally uses is to form circuit on a metal circuit board 1 on the market, and this circuit is built-in with led chip 2, and connects a lead 3 to bonding wire point from chip 2, covers chip through a glue 4; This kind led array encapsulating structure chip is more concentrated, therefore heating also can be more concentrated, directly have influence on radiating effect,, cause luminous efficiency low because of the radiating effect difference so plant the led array encapsulating structure because the good and bad degree of radiating effect is directly proportional with luminous efficiency; In addition, because the chip array area is bigger, when directly putting glue, packing colloid is difficult to form higher projection, because total reflection effect in the optics, the part rayed that chip sends is when the interface of colloid and air, can be because incident angle can't penetrate greater than Brewster's angle, if adopt the method for molding or use the anti-packing colloid that hangs down and flow, though can form certain projection, the consumption of packing colloid can increase on the one hand, on the other hand, light is the propagation distance lengthening in colloid, and packing colloid has a negative impact to luminous efficiency to the absorption meeting of light.
Summary of the invention
At the deficiencies in the prior art, the purpose of this utility model is intended to provide a kind of high efficiency array-type LED encapsulating structure, and it is rational in infrastructure, perfect heat-dissipating, and the light extraction efficiency height, and luminosity is strong.
For achieving the above object, the utility model adopts following technical scheme:
A kind of high efficiency array-type LED encapsulating structure; form by a metal circuit board, plurality of LEDs chip, lead and packing colloid; it is characterized in that: the connected mode design according to led chip on the metal circuit board has certain configuration; led chip is positioned on the solid brilliant position of metal circuit board; and be connected in the position of bonding wire of metal circuit board with respective wire; the led chip array is kept off cushion rubber and is divided into plural zone; packing colloid is in the retaining cushion rubber; and protruding certain altitude, led chip and lead are protected.
The another technical problem that the utility model solves is: the connected mode design according to led chip on the metal circuit board has certain configuration, the circuit connecting mode of led chip can be series, parallel, string and series-parallel connection, also can array way connect, led chip quantity can be adjusted according to demand.
The another technical problem that the utility model solves is: the led chip array is kept off cushion rubber and is divided into plural zone, the retaining cushion rubber can be the certain thickness printing ink circle of printing on the plate of direct-on-line road that has, also can make, fit together with metal circuit board then by other materials such as metal, potteries.
The another technical problem that the utility model solves is: packing colloid is in the retaining cushion rubber, and protruding certain altitude, and led chip and lead are protected.Used packing colloid can be a silica gel, also can be other encapsulating materials commonly used such as silicones, epoxy resin.
The another technical problem that the utility model solves is: metal circuit board is provided with the both positive and negative polarity pad or passes the PIN pin of metal circuit board, is used for forming connection with external power source.
The another technical problem that the utility model solves is: metal circuit board can be made into square, circular, rhombus according to concrete operating position, perhaps other arbitrary shapes, and can cooperate the assembling needs thereon, design various location, mounting structure.
Another technical problem to be solved in the utility model provides a kind of LED encapsulating structure, and a pad or PIN pin are respectively established in the metal circuit board both sides, can be directly on pad or PIN pin bonding wire be connected with outside line;
Because the led chip array is divided into zone more than two, the method of employing point glue just can form the projection of certain altitude, and reducing owing to area, required packing colloid consumption reduces significantly, the light that chip sends also reduces greatly in the absorption loss of packing colloid, by above technical measures, when reducing cost, improved the light extraction efficiency of array light source.
Compared with prior art, the beneficial effects of the utility model are:
1, member is simple, and is reasonable in design, and volume is little, the power height;
2, heat dispersion is good, and luminescent lifetime is long, can continue for a long time to light, and durable in use, luminosity is strong;
3, light extraction efficiency height reaches identical illuminating effect, and required led chip quantity is few, and production cost is low, energy savings during use.
Description of drawings
Fig. 1 is the schematic diagram of traditional LED encapsulating structure;
Fig. 2 is the structural representation of the utility model embodiment one;
Fig. 3 is the structural representation of the utility model embodiment two.
Embodiment
Below, with embodiment high efficiency array-type LED encapsulating structure of the present utility model is described further in conjunction with the accompanying drawings:
Embodiment one
As shown in Figure 2; be a kind of high efficiency array-type LED of the utility model encapsulating structure; wherein: the connected mode design according to led chip on the metal circuit board has certain configuration 5; led chip 2 is positioned on the metal circuit board; and be connected in the position of bonding wire of metal circuit board with respective wire 3; the certain thickness printing ink retaining cushion rubber 6 that has that the led chip array is printed on the plate of direct-on-line road is divided into four zones; packing colloid is in the retaining cushion rubber; and protruding certain altitude; led chip and lead are protected; metal circuit board is provided with both positive and negative polarity pad 7, is used for forming connection with external power source, is manufactured with installing hole 8 on the metal circuit board.
Embodiment two
As shown in Figure 3; be the another kind of high efficiency array-type LED of the utility model encapsulating structure; wherein: the connected mode design according to led chip on the metal circuit board has certain configuration; led chip 2 is positioned on the metal circuit board; and be connected in the position of bonding wire of metal circuit board with respective wire 3; the led chip array had certain thickness pottery retaining cushion rubber 9 be divided into about two zones; packing colloid 4 is in the retaining cushion rubber; and protruding certain altitude; led chip and lead are protected; metal circuit board is provided with two PIN pins 10, forms with external power source by these two PIN pins 10 to connect.
In the utility model, connected mode design according to led chip on the metal circuit board has certain configuration, the circuit connecting mode of led chip can be series, parallel, string and series-parallel connection, also can array way connect, and led chip quantity can be adjusted according to demand.
The led chip array is kept off cushion rubber and is divided into plural zone, and the material of retaining cushion rubber can also be that other materials such as metal, pottery are made, and fits together with metal circuit board then.
Packing colloid in the utility model can be a silica gel, also can be other encapsulating materials commonly used such as silicones, epoxy resin.
Metal circuit board can be made into square, circular, rhombus according to concrete operating position, perhaps other arbitrary shapes, and can cooperate the assembling needs thereon, design various location, mounting structure.
Because the led chip array is divided into zone more than two, the method of employing point glue just can form the projection of certain altitude, and reducing owing to area, required packing colloid consumption reduces significantly, the light that chip sends also reduces greatly in the absorption loss of packing colloid, by above technical measures, when reducing cost, improved the light extraction efficiency of array light source.
For a person skilled in the art, can make other various corresponding changes and distortion, and these all changes and distortion should belong within the protection range of the utility model claim all according to technical scheme described above and design.
Claims (6)
1. high efficiency array-type LED encapsulating structure; form by a metal circuit board, plurality of LEDs chip, lead and packing colloid; it is characterized in that: the connected mode design according to led chip on the metal circuit board has configuration; led chip is positioned on the solid brilliant position of metal circuit board; and be connected in the position of bonding wire of metal circuit board with respective wire; the led chip array is kept off cushion rubber and is divided into plural zone; packing colloid is protected led chip and lead in retaining cushion rubber internal projection.
2. high efficiency array-type LED encapsulating structure according to claim 1 is characterized in that: the circuit connecting mode of described led chip can be series, parallel, string and series-parallel connection, also can array way connect.
3. high efficiency array-type LED encapsulating structure according to claim 1 is characterized in that: described retaining cushion rubber can be the printing ink circle of printing on the plate of direct-on-line road, also can be made by metal, pottery, fits together with metal circuit board then.
4. high efficiency array-type LED encapsulating structure according to claim 1 is characterized in that: described packing colloid can be a silica gel, also can be silicones, epoxy resin.
5. high efficiency array-type LED encapsulating structure according to claim 1 is characterized in that: metal circuit board is provided with the both positive and negative polarity pad or passes the PIN pin of metal circuit board, is used for forming connection with external power source.
6. high efficiency array-type LED encapsulating structure according to claim 1, it is characterized in that: metal circuit board can be made into square, circular, rhombus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202656880U CN201681925U (en) | 2009-12-28 | 2009-12-28 | High-efficient array type LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202656880U CN201681925U (en) | 2009-12-28 | 2009-12-28 | High-efficient array type LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201681925U true CN201681925U (en) | 2010-12-22 |
Family
ID=43346961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202656880U Expired - Fee Related CN201681925U (en) | 2009-12-28 | 2009-12-28 | High-efficient array type LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201681925U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194808A (en) * | 2011-05-10 | 2011-09-21 | 江西科技师范学院 | LED (light emitting diode) integrated packaging device with up-down power type electrodes and packaging method thereof |
| CN108231988A (en) * | 2018-01-10 | 2018-06-29 | 苏州市悠文电子有限公司 | Ultrathin display board technique and ultrathin display board |
-
2009
- 2009-12-28 CN CN2009202656880U patent/CN201681925U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194808A (en) * | 2011-05-10 | 2011-09-21 | 江西科技师范学院 | LED (light emitting diode) integrated packaging device with up-down power type electrodes and packaging method thereof |
| CN108231988A (en) * | 2018-01-10 | 2018-06-29 | 苏州市悠文电子有限公司 | Ultrathin display board technique and ultrathin display board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201866575U (en) | LED (light-emitting diode) daylight lamp | |
| CN202268388U (en) | Large power LED packaging structure of radial-type heat dissipating ceramic substrate | |
| CN201732785U (en) | LED module and LED lighting fixture | |
| CN101853914A (en) | High-power LED white lighting source structure | |
| CN201751679U (en) | High-power LED packaging single lamp with batwing light distribution function | |
| CN201285000Y (en) | LED three-dimensional luminous plate | |
| CN102222665B (en) | Integrated LED (light emitting diode) module with thin fly's-eye lens | |
| CN201681925U (en) | High-efficient array type LED packaging structure | |
| CN201428943Y (en) | Led lamp | |
| CN201417791Y (en) | LED used for fix-feet three-in-one RGB display screen | |
| CN208620092U (en) | A kind of steady type luminous lamp strip | |
| CN202259437U (en) | Multi-reflection cup integrated type LED (light emitting diode) packaging structure | |
| CN202796938U (en) | Flip chip of white-light module | |
| CN102244155A (en) | Method for integrally packaging LED (light-emitting diode) light source curved surface | |
| CN201681972U (en) | Light-emitting diode encapsulated by transparent crystal glass | |
| CN203147329U (en) | LED ball lamp | |
| CN201844276U (en) | LED (light-emitting diode) backlight module, display and TV (television) | |
| CN206036806U (en) | LED railway signal light source | |
| CN205609561U (en) | High -power LED multicore sheet laser module with structure of falling trapezoid table | |
| CN204885156U (en) | LED light source module | |
| CN205303506U (en) | High light efficiency led light source | |
| CN204391110U (en) | A kind of LED integrated light-emitting device | |
| CN202660374U (en) | Light-emitting diode (LED) optical engine module | |
| CN203010337U (en) | Light-emitting diode (LED) warhead candle bulb | |
| CN202442149U (en) | LED (Light-Emitting Diode) module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN CHENGGUANGXING PHOTOELECTRIC TECHNOLOGY C Free format text: FORMER NAME: SHENZHEN CHENGGUANGXING INDUSTRIAL DEVELOPMENT CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 518000 Guangdong Province, Shenzhen city Longhua District Guanlan Pavilion East Village Community chapter chapter Gelao No. 168 (PO view science and Technology Park building B) Patentee after: SHENZHEN CGX OPTOELECTRONIC TECHNOLOGY, INC. Address before: 518131 Guangdong city of Shenzhen province Baoan District Longhua Pine Village Pelton Industrial Zone No. 2 three or four floor Patentee before: Shenzhen Chengguangxing Industrial Development Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20171228 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |