CN201662996U - Adhesive radiator - Google Patents
Adhesive radiator Download PDFInfo
- Publication number
- CN201662996U CN201662996U CN 201020133256 CN201020133256U CN201662996U CN 201662996 U CN201662996 U CN 201662996U CN 201020133256 CN201020133256 CN 201020133256 CN 201020133256 U CN201020133256 U CN 201020133256U CN 201662996 U CN201662996 U CN 201662996U
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- CN
- China
- Prior art keywords
- radiator
- groove
- wave shaped
- cover plate
- bearing groove
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an adhesive radiator comprising a heat-conducting base body. The adhesive radiator is characterized in that the two sides of the bottom surface of the heat-conducting base body are respectively provided with a groove, the bottom surface of the heat-conducting base body is distributed with a bearing groove; and the direction of the bearing groove is consistent with that of the groove. Simultaneously, bosses are distributed between the bearing grooves, the heat-conducting base body is provided with wavy radiating fins, and the wave troughs of the wavy radiating fins are embedded into the bearing grooves. The wavy radiating fins are additionally provided with a cover plate, the bottom of the cover plate is embedded into the groove, and the cover plate is contacted with the wave troughs of the wavy radiating fins. In addition, the bearing grooves and the groove are filled with an adhesive. Therefore, when in manufacture, the adhesion can be realized without needing to design special tools to fix the radiating fins, so that the production efficiency of the radiator is improved.
Description
Technical field
The utility model relates to a kind of heating radiator, relates in particular to a kind of formula heating radiator that coheres.
Background technology
At present, utilizing binder to cohere in the field of heat radiator, for cohering of heat radiator, it is as follows usually that it coheres technology: i.e. moulding concave groove on heat conduction substrate, then toward the interior filler adhesive of concave groove, respectively the heat radiator of thin board type is installed in the corresponding concave groove again, utilizes the tool fixing cooling fins at last.
Because the contact area of heat radiator and heat conduction substrate is little, in order to fix heat radiator, will fill the binder of q.s, and is deep thereby the degree of depth of groove just requires, groove that can't the moulding desired depth on thin plate still.In order to fix heat radiator, also need the specialized designs tool, because heat spreader structures more complicated sometimes bring very big difficulty can for the design of tool and processing.Moreover existing heat radiator needs piecemeal installation, and the time that heat radiator is installed can be long, and production efficiency is low.
Summary of the invention
The purpose of this utility model is to overcome the above problem that prior art exists, and a kind of formula heating radiator that coheres is provided.
Cohere the formula heating radiator for the realization the purpose of this utility model, include heat conduction substrate, wherein: the both sides of described heat conduction substrate bottom surface offer groove respectively, and the heat conduction substrate bottom surface is distributed with the bearing groove structure, and the trend of described bearing groove is consistent with the groove trend; Described bearing groove is distributed with boss each other; Described heat conduction substrate is provided with wave shaped radiator, and the trough of wave shaped radiator embeds in the described bearing groove; Be equipped with cover plate on the described wave shaped radiator, the bottom of cover plate embeds in the groove, and cover plate contacts with the crest of wave shaped radiator; Be filled with binder in described bearing groove and the groove.
Further, the above-mentioned formula heating radiator that coheres, wherein, described bearing groove is a funnel-form, open top is greater than the bottom.
Further, the above-mentioned formula heating radiator that coheres, wherein, described cover plate is for falling " recessed " font, and the side plate thickness of cover plate both sides is corresponding with slot opening.
Further, the above-mentioned formula heating radiator that coheres, wherein, the width of described bearing groove is corresponding with the trough profile of wave shaped radiator with drafting angle.
Further, the above-mentioned formula heating radiator that coheres, wherein, the width of described boss is corresponding at interval with the trough of wave shaped radiator.
Again further, the above-mentioned formula heating radiator that coheres, wherein, the height of described boss is less than the trough thickness of wave shaped radiator.
Adopt technical solutions of the utility model, can be implemented in and cohere heat radiator on the thin plate, constitute one and cohere the formula heating radiator.Do not need to design special tool during fabrication and fix heat radiator and can realize cohering, improved the production efficiency of heating radiator with this.
The purpose of this utility model, advantage and characteristics will illustrate by the non-limitative illustration of following preferential embodiment and explain that these embodiment only provide as an example with reference to accompanying drawing.
Description of drawings
Fig. 1 is the organigram of heat conduction substrate;
Fig. 2 is the diagrammatic cross-section of Fig. 1 along the A-A line;
Fig. 3 is the local enlarged diagram of Fig. 2;
Fig. 4 is the organigram of wave shaped radiator;
Fig. 5 is the organigram of cover plate;
Fig. 6 is the organigram that coheres the formula heating radiator.
The implication of each Reference numeral is as follows among the figure:
1 heat conduction substrate, 2 grooves
3 bearing grooves, 4 boss
5 wave shaped radiators, 6 cover plates
Embodiment
Shown in Fig. 1～6, cohere the formula heating radiator, include heat conduction substrate 1, its special feature is: the both sides of described heat conduction substrate 1 bottom surface offer groove 2 respectively, and heat conduction substrate 1 bottom surface is distributed with bearing groove 3, and the trend of described bearing groove 3 is consistent with groove 2 trends.Simultaneously, described bearing groove 3 is distributed with boss 4 each other.And heat conduction substrate 1 is provided with wave shaped radiator 5, and the trough of wave shaped radiator 5 embeds in the described bearing groove 3.And, being equipped with cover plate 6 on the wave shaped radiator 5, the bottom of cover plate 6 embeds in the groove 2, and cover plate 6 contacts with the crest of wave shaped radiator 5.In order to play fixation, be filled with binder in bearing groove 3 and the groove 2.
In conjunction with the utility model one preferred implementation, bearing groove 3 is a funnel-form, and open top is greater than the bottom.Thus, bearing groove 3 need not be offered too the binder that just can fill q.s deeply and fixes wave shaped radiator 5.And such design can guarantee that wave shaped radiator 5 has sufficient the contact with heat conduction substrate 1, helps cohering fixing.
Further, for the best that helps 6 pairs of wave shaped radiators 5 of cover plate covers, the cover plate 6 that the utility model adopts is for falling " recessed " font, and the side plate thickness of cover plate 6 is corresponding with groove 2 openings.Simultaneously, consider the overall firmly degree after cohering, the width of bearing groove 3 is corresponding with the trough profile of wave shaped radiator 5 with drafting angle, and the width of boss 4 is corresponding at interval with the trough of wave shaped radiator 5.
Moreover, owing to need the height of boss 4 moderate, when being installed, wave shaped radiator 5 can not cause overflowing of binder.Simultaneously, allow boss 4 play the auxiliary fixedly effect of wave shaped radiator 5, the height of boss 4 is less than the trough thickness of wave shaped radiator 5.
Originally the assembling process that coheres the formula heating radiator is roughly as follows: filler adhesive in bearing groove 3 and groove 2 at first, prepare for follow-up.Afterwards, wave shaped radiator 5 is installed on the heat conduction substrate 1.During this period, the trough of wave shaped radiator 5 embeds in the bearing groove 3 just.Then, cover plate 6 is covered on the wave shaped radiator 5, wave shaped radiator 5 is formed an encirclement.Meanwhile, allow wave shaped radiator 5 crests contact, make the side plate bottom at cover plate 6 two ends be embedded in the groove 2 with cover plate 6.Treat to get final product completed assembled after binder parches, obtain finished product.
By above-mentioned character express also in conjunction with the accompanying drawings as can be seen, behind employing the utility model, can be implemented in and cohere heat radiator on the thin plate, constitute one and cohere the formula heating radiator.Because this heating radiator is simple in structure, therefore not needing to design special tool during fabrication fixes heat radiator.Simultaneously, wave shaped radiator helps increasing area of dissipation, and can disposable installation.What is more important is cohered the quick assembling of formula by respective outer side edges of the present utility model, has improved the production efficiency of heating radiator.
Certainly, more than only be concrete exemplary applications of the present utility model, protection domain of the present utility model is not constituted any limitation.In addition to the implementation, the utility model can also have other embodiment.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop within the utility model scope required for protection.
Claims (6)
1. cohere the formula heating radiator, include heat conduction substrate, it is characterized in that: the both sides of described heat conduction substrate bottom surface offer groove respectively, are distributed with the bearing groove structure in the heat conduction substrate bottom surface, and the trend of described bearing groove is consistent with the groove trend; Be distributed with boss between the described bearing groove; Be connected with wave shaped radiator on the described heat conduction substrate, the trough of wave shaped radiator embeds in the described bearing groove; Be equipped with cover plate on the described wave shaped radiator, the bottom of cover plate embeds in the groove; Described cover plate contacts with the crest of wave shaped radiator; Be filled with binder in described bearing groove and the groove.
2. the formula heating radiator that coheres according to claim 1, it is characterized in that: described bearing groove is a funnel-form, and open top is greater than the bottom.
3. the formula heating radiator that coheres according to claim 1 is characterized in that: described cover plate is for falling " recessed " font, and the side plate thickness of cover plate both sides is corresponding with slot opening.
4. the formula heating radiator that coheres according to claim 1 is characterized in that: the width of described bearing groove is corresponding with the trough profile of wave shaped radiator with drafting angle.
5. the formula heating radiator that coheres according to claim 1 is characterized in that: the width of described boss is corresponding at interval with the trough of wave shaped radiator.
6. the formula heating radiator that coheres according to claim 1 is characterized in that: the height of described boss is less than the trough thickness of wave shaped radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020133256 CN201662996U (en) | 2010-03-10 | 2010-03-10 | Adhesive radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020133256 CN201662996U (en) | 2010-03-10 | 2010-03-10 | Adhesive radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201662996U true CN201662996U (en) | 2010-12-01 |
Family
ID=43233415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020133256 Expired - Fee Related CN201662996U (en) | 2010-03-10 | 2010-03-10 | Adhesive radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201662996U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102192675A (en) * | 2010-03-10 | 2011-09-21 | 苏州春兴精工股份有限公司 | Bonding radiator |
-
2010
- 2010-03-10 CN CN 201020133256 patent/CN201662996U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102192675A (en) * | 2010-03-10 | 2011-09-21 | 苏州春兴精工股份有限公司 | Bonding radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101201 Termination date: 20140310 |