CN201656923U - Brand new packaged novel surface-mounted surface acoustic wave device - Google Patents
Brand new packaged novel surface-mounted surface acoustic wave device Download PDFInfo
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- CN201656923U CN201656923U CN2010201958528U CN201020195852U CN201656923U CN 201656923 U CN201656923 U CN 201656923U CN 2010201958528 U CN2010201958528 U CN 2010201958528U CN 201020195852 U CN201020195852 U CN 201020195852U CN 201656923 U CN201656923 U CN 201656923U
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- acoustic wave
- substrate
- surface acoustic
- cap
- ceramic
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Abstract
The utility model discloses a novel surface-mounted surface acoustic wave device, which comprises a substrate and a metal cap or a ceramic cap or a plastic cap for sealing, wherein the substrate is used for bearing a chip, and the metal cap or the ceramic cap or the plastic cap is fixedly bonded on the substrate for bearing the chip through a bonded adhesive; the substrate for bearing the chip is a low-temperature monolayer ceramic substrate, the surface smoothness is good, and small metalized holes are 0.2 to 0.3mm. A low-temperature laminated ceramic technology is utilized in the utility model, the monolayer ceramic substrate is produced as a pipe seat, and the design and the production of the novel surface-mounted surface acoustic wave device are finished. The novel surface-mounted surface acoustic wave device has low cost, simple and convenient process flow and easy operation. Because large-current fusion welding is not used, the device can avoid failures such as circuit opening and the like caused by fire striking, short circuiting and damage to an inner lead due to improper operation when packaged, so that the reliability is further ensured.
Description
Technical field
The utility model surface acoustic wave belongs to electronic devices and components encapsulation technology field, particularly, compares with traditional surface mount device, and the novel surface that relates to a kind of complete brand-new design on configuration design and method for packing mounts SAW (Surface Acoustic Wave) device.
Background technology
Since SAW (Surface Acoustic Wave) device is come out, has small-sized, advantage such as reliability is high, high conformity, multi-functional and flexible design with it, successfully enter numerous areas, as: be used widely at aspects such as radar, communication, air traffic control, microwave relay, radio-frequency (RF) identification as resonator, filter, delayer, surperficial acoustic convolver, transducer or the like; And SAW (Surface Acoustic Wave) device also makes SAW (Surface Acoustic Wave) device enter daily life in the application of aspects such as television set, mobile phone, wireless remote-controlled alarm, and is closely more apparent with people's relation.SAW (Surface Acoustic Wave) device miniaturization, highly reliable requirement are also more shown outstanding with requiring contradiction cheaply.
Usually, the chip surface of SAW (Surface Acoustic Wave) device is not made protective layer.No matter whether chip surface makes protective layer, can enter the practical stage for making SAW (Surface Acoustic Wave) device, the encapsulation of finishing chip is must an obligato important ring.Packaging cost according to the difference of packing forms, accounts for 40%～80% and does not wait in the device manufacturing cost, even more.Air-tight packaging generally is made of base and pipe cap (or loam cake).In order to realize the air-tight packaging of sound table device, at present, adopt following several packing forms usually.
1. metallic packaging: see Fig. 1, chip is attached on the metal base 1a, and the good lead that links to each other with outer lead of pressure welding, then with pulsating welder with pipe cap 2b welding on base 1a, finally form level Hermetic Package.
2. surface mount encapsulation: see Fig. 2, chip is attached on the low temperature multi-layered ceramic base 2a, and the good lead that links to each other with outer lead of pressure welding (being there is not outstanding outer lead) with the difference of metal base, be welded together with the weld-ring 2c of parallel welder then, finally form level Hermetic Package loam cake 2b and base 2a.
3. back-off welding technology: the profile similar surfaces mounts encapsulation, but because of chip adopts the back-off welding technology, no lead in the device, easier realization device miniaturization.
As mentioned above, from profile, the encapsulation of SAW (Surface Acoustic Wave) device can be divided into again to be had the outer lead encapsulation and not to have the outer lead encapsulation.The aforementioned metal encapsulation belongs to the outer lead packaging, and adopts surface mount encapsulation and back-off welding technology packaged device to belong to no outer lead packaging (generally claiming surface mount device).According to using needs, more than multi-form packaging be used widely in different occasions.The realization of above-mentioned encapsulation, without exception the equipment input or the big electric current welder of needs that all need costliness, plant capacity does not wait at thousands of watts to tens of kilowatts usually.Specifically be compared as follows.
The metallic packaging form has characteristics such as investment is little, encapsulation is originated wide with shell and price is lower, easily start, thereby is widely adopted.But along with people are more and more higher to the requirement of complete machine miniaturization (slimming), the device of metallic packaging form is difficult to satisfy complete machine to the device demand of miniaturization more and more.
The surface mount encapsulation both can have been satisfied the demand of miniaturization, and the applying frequency of device also can increase substantially.Especially after adopting the back-off welding technology, device overall dimension can be littler.But for to purchase the equipment investment of finishing encapsulation big, the parallel welder that efficient is extremely low, price does not wait to hundreds of thousands at tens0000 yuan; The higher parallel welder price of automaticity reaches up to a million between millions of.In addition, the shell that the surface mount encapsulation is used, the Japan that mostly is of present domestic use produces, and domestic production producer is few.Because production equipment has high input, the production technology difficulty is big, make the base price just high originally, and under the situation that the SAW (Surface Acoustic Wave) device price keeps falling, shell is also significantly raised the price.Cause packaging cost high.
As everyone knows, because popularizing of paster components and parts, complete machine manufacturer uses the paster components and parts in a large number, the circuit board solder technology changes to Reflow Soldering from wave-soldering, but for cost consideration, some complete machine manufacturers can not adopt the SAW (Surface Acoustic Wave) device of surface mount encapsulation, still adopt the SAW (Surface Acoustic Wave) device of the relatively low metallic packaging of price.So the layout of board production flow process faces contradiction.Two kinds of different being encapsulated in when producing circuit board, technology can not be compatible.For this reason, the way that manufacturer have to take manual welding to circuit board, has expended extra labour cost with leaded components and parts repair welding.For this reason, the inventor released a kind of low-cost glue envelope SAW (Surface Acoustic Wave) device (having carried out patent declares) in 2009, and this new device is with 99%Al
2O
3Pottery is made substrate and is stamped electrode at substrate surface with the silver slurry, replaces metal base or ceramic surface commonly used and mounts base, finishes seal with bonded adhesives technology again, finally reached reduce cost, the convenient effect of use.Product is once release, and the metallic packaging product reflects fine as an alternative.This application patented product can corresponding production overall dimension 5mm * 3.5mm and the ceramics of 3.8mm * 3.8mm (as Fig. 3), but is subjected to the restriction of ceramic substrate manufacturing technology, littler overall dimension and need more multielectrode suitable ceramics production just to have any problem.Yet market actual requirement inventor can further dwindle the ceramics size, reduce cost, and replaces the surface mount SAW (Surface Acoustic Wave) device of producing now.
In fact, no matter consider from the profile size or from production efficiency, as long as cost performance is suitable, the SAW (Surface Acoustic Wave) device of surface mount encapsulation more is willing to use by complete machine manufacturer.Especially SAW (Surface Acoustic Wave) device is used for such as behind mobile phone, television set etc. and the closely related product of people's daily life, requires Yu to show urgent to the low cost of the SAW (Surface Acoustic Wave) device of surface mount encapsulation.But surface-pasted base adopts low temperature multi-layered ceramic technology to produce, core technology grasp in the Japanese staff, sell initiative and also grasp in their hand, it is easier said than done to want to reduce purchase cost!
In sum, for the surface mount SAW (Surface Acoustic Wave) device, need a kind of new packing forms.
Summary of the invention
In order to solve the defective that exists in the prior art, the present invention adopts following technical scheme:
A kind of novel surface mounts SAW (Surface Acoustic Wave) device, it is characterized in that, it is made up of with metal cap or ceramic cap or plastic cap the substrate of carries chips and sealing, and described metal cap or ceramic cap or plastic cap are cemented on the substrate of described carries chips with bonded adhesives.
Above-mentioned novel surface mounts SAW (Surface Acoustic Wave) device, it is characterized in that, the substrate of described carries chips is a low temperature single-layer ceramic substrate, and surface smoothness is good, and the metallization aperture is at 0.2～0.3mm.
The beneficial effect of the invention:
On the basis of the low-cost glue sealing envelope SAW (Surface Acoustic Wave) device that patent applied for, product lot quantity are introduced to the market, according to market demand, utilize low temperature multi-layered ceramic technology, produce the individual layer ceramic substrate, finished novel surface and mounted the SAW (Surface Acoustic Wave) device design, produce as base.
This novel surface mounts SAW (Surface Acoustic Wave) device and can substitute original surface fully and mount SAW (Surface Acoustic Wave) device, and has low cost, and technological process is also simple and easy to do.This device is because electric current welding greatly, can avoid when encapsulating owing to misoperation induce one to strike sparks short circuit, the lead of damaging causes inefficacies such as open circuit, thereby reliability is more guaranteed.
Description of drawings
Fig. 1 is the three-dimensional outline drawing of the metallic packaging of prior art;
Fig. 2 is the three-dimensional outline drawing of the surface mount of prior art;
Fig. 3 a, Fig. 3 b are existing glue envelope ceramics (5mm * 3.5mm) vertical view, upward view;
Fig. 3 c, Fig. 3 d are existing glue envelope ceramics (3.8mm * 3.8mm) vertical view, upward view;
Fig. 4 is the three-dimensional outline drawing of the utility model surface mount;
Fig. 5 a is that original surface mounts the encapsulating structure schematic diagram;
Fig. 5 b is the utility model surface mount encapsulating structure schematic diagram;
Fig. 6, Fig. 6 ' are the utility model embodiment packaging ceramic substrate (5mm * 3.5mm) vertical view, upward view;
Fig. 7, Fig. 7 ' are the utility model embodiment packaging ceramic substrate (3.8mm * 3.8mm/6pin, 3mm * 3mm/6pin) vertical view, upward view;
Fig. 8, Fig. 8 ' are the utility model embodiment packaging ceramic substrate (3.8mm * 3.8mm/8pin, 3mm * 3mm/8pin) vertical view, upward view.
Embodiment
The invention is specifically introduced as follows below in conjunction with the drawings and specific embodiments:
Consideration with substrate with material from 99%Al
2O
3Pottery makes low-temp ceramics into; To be communicated with positive counterelectrode in the substrate surface printing and change aperture metallization connection into.Like this, sizes of substrate can be dwindled on demand.
Such change is just designed and is a kind ofly mounted the different encapsulation of form (Fig. 4) with original surface, and these two kinds are encapsulated in the structural Fig. 5 that relatively sees.Wherein Fig. 5 a is that original surface mounts form, and 5a1 is the base of carries chips, and 5a2 is the sealing metal top cover; Fig. 5 b is the surface mount form after retrofiting, and 5b1 is the substrate of carries chips, and 5b2 is sealing metal (pottery, a plastics) cap.Surface mount behind the remodeling does not need with welding equipment base and loam cake to be welded together, and is to use a kind of selected bonded adhesives that pipe cap is bonded on the ceramics securely, thereby forms level Hermetic Package, reaches the purpose of encapsulation.
It is little that this novel surface mounts SAW (Surface Acoustic Wave) device overall dimension, on performance, reach the level that original surface mounts SAW (Surface Acoustic Wave) device, but because the manufacturing of low-temp ceramics substrate does not need stack technology, only use the aperture metallization technology at the positive and negative surface forming electrode of low-temp ceramics substrate, production difficulty and production cost reduce simultaneously, ceramic substrate is compared with original surface mount base, and cost reduction amplitude reaches more than 50%, and the low cost that novel surface mounts SAW (Surface Acoustic Wave) device is achieved.
For realizing this glue seal technology, mainly solve the problem of following several respects:
1. substrate is required: surface smoothness is good, and the metallization aperture is at 0.2～0.3mm etc.For this reason, select competent substrate manufacturer.The low-temp ceramics substrate of satisfying the demand is seen Fig. 6.
2. select the adhesive glue that satisfies the device manufacture characteristic for use: usually, the SAW (Surface Acoustic Wave) device chip surface is not made protective layer, and the atmosphere in the device sealing chamber directly influences the performance even the life-span of device.So, must guarantee adhesive glue non-volatile material that goes out may damage chip surface in solidification process of selecting for use.Through overtesting relatively, first-selected X9020x x glue is as glue envelope scheme implementation adhesive glue.
3. condition of cure is selected: X9020x x glue solidifies slowly at normal temperatures, and along with the temperature rising, curing rate is accelerated gradually, and is minute promptly curable to 90 ℃ of numbers.Consider efficient and obtain optimum adhesion intensity, select for use (180 ℃, 3～5 minutes) to be condition of cure.No matter adopt 90 ℃, or adopt 180 ℃ as curing temperature, when implementing to solidify, owing to be subjected to the instantaneous influence that adds high temperature, the gas that is fixed in cavity by glue expands rapidly, surpasses an atmospheric pressure, and pipe cap may be dashed.For avoiding influencing adhesive effect, take pressurization (making the curing oven internal gas pressure) greater than an atmospheric pressure or directly artificially pressurization on pipe cap, finally reach satisfied packaging effect.
The encapsulation flow process is as follows:
Aborning, embodiment is as follows: manufacturing and designing after good ceramic substrate front mounts tube core and the good lead of pressure welding, the baking oven of putting into 90 ℃ gives baking taking-up half an hour, the pipe cap that dips in gluing in lacquer disk(-sc) is covered in the ceramics front, shelve half an hour, on pipe cap, add upper holder block at last, put into 180 ℃ of baking oven constant temperature and take out after 3～5 minutes.The glue envelope is promptly accused and is finished.
According to the above, the inventor thinks, to the encapsulation of SAW (Surface Acoustic Wave) device, from by the technology of big electric current welding to sticking with glue the realization level Hermetic Package, be a kind of brand-new design; And become practical technique according to low-cost glue envelope SAW (Surface Acoustic Wave) device (having carried out the patent declares) production of this brand-new realization of conceiving.On this basis, the inventor further develops serial novel surface and mounts the scope that SAW (Surface Acoustic Wave) device belongs to rights protection.
Claims (2)
1. a novel surface mounts SAW (Surface Acoustic Wave) device, it is characterized in that, it is made up of with metal cap or ceramic cap or plastic cap the substrate of carries chips and sealing, and described metal cap or ceramic cap or plastic cap are cemented on the substrate of described carries chips with bonded adhesives.
2. novel surface according to claim 1 mounts SAW (Surface Acoustic Wave) device, it is characterized in that, the substrate of described carries chips is a low temperature single-layer ceramic substrate, and surface smoothness is good, and the metallization aperture is at 0.2～0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201958528U CN201656923U (en) | 2010-05-18 | 2010-05-18 | Brand new packaged novel surface-mounted surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201958528U CN201656923U (en) | 2010-05-18 | 2010-05-18 | Brand new packaged novel surface-mounted surface acoustic wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201656923U true CN201656923U (en) | 2010-11-24 |
Family
ID=43122151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201958528U Expired - Lifetime CN201656923U (en) | 2010-05-18 | 2010-05-18 | Brand new packaged novel surface-mounted surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201656923U (en) |
-
2010
- 2010-05-18 CN CN2010201958528U patent/CN201656923U/en not_active Expired - Lifetime
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101124 |
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| CX01 | Expiry of patent term |