CN201655763U - Quickly sharing device of process parameter and equipment parameter of wafer fabrication equipment - Google Patents
Quickly sharing device of process parameter and equipment parameter of wafer fabrication equipment Download PDFInfo
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- CN201655763U CN201655763U CN2010203025370U CN201020302537U CN201655763U CN 201655763 U CN201655763 U CN 201655763U CN 2010203025370 U CN2010203025370 U CN 2010203025370U CN 201020302537 U CN201020302537 U CN 201020302537U CN 201655763 U CN201655763 U CN 201655763U
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Abstract
The utility model discloses a quickly sharing device of process parameters and equipment parameters of wafer fabrication equipment, which comprises a computer with a data transmission interface, an interface conversion device and a plug and play device. The interface conversion device comprises a virtual module and is provided with an input end and an output end, wherein the output end is connected with the data transmission interface, and the input end is connected with the plug and play device and is used by media to store or read data. When the process parameters and equipment parameters of the wafer fabrication equipment are to be quickly stored or shared, the virtual module can simulate the action of the actual floppy disk drive to read the process parameters and equipment parameters to be stored or shared through inserting the media into the plug and play device connected with the computer of the wafer fabrication equipment, thereby realizing the purpose of quick storage or sharing of the process parameters and equipment parameters of the wafer fabrication equipment.
Description
Technical field:
The utility model relates to a kind of process parameter and quick sharing apparatus of device parameter of wafer production equipment, especially refer to a kind of more old-fashioned floppy drive and diskette sheet of industrial computer that can replace wafer production equipment, in case the process parameter of wafer production equipment and device parameter have necessary quick storage or share need the time, i.e. the process parameter and the quick sharing apparatus of device parameter of the wafer production equipment that can store in large quantities fast and share.
Background technology:
The wafer manufacturing is capital and technology-intensive industry.Modern turns a crude essay into a literary gem, and what approximately refer to is exactly the wafer manufacturing industry.Yet, the silicon raw material is become the IC chip, intermediate demand has much more very processing procedures, as the silicon → exquisiteness → high purity silicon → single crystals formation → single crystal silicon → cutting of silicon raw material → reduction → slightly scrub → wafer → oxide-film formation → emulsion coating → dry plate composite design → exposure imaging → photographic fixing video picture → etching dissolving → High temperature diffusion ion injection → metal steaming → shaping wafer → wafer inspection → IC chip → film joint → wire-bonds → sealing, involution → final inspection → test → goods etc.
With regard to the aforesaid semiconductor procedure for producing, mainly can be divided into the leading portion wafer makes and back segment Chip Packaging test two large divisions, the manufacturing of leading portion wafer comprises processing procedures such as oxidation, little shadow, etching, deposition, diffusion, ion implantation, metal sputtering, and production equipment is as follows with the processing procedure classification results:
(1) thin film deposition process comprises PVD, CVD and oxidation furnaces;
(2) micro-photographing process comprises stepper, EB equipment and developing apparatus;
(3) etch process comprises two kinds of wet type and dry-etching equipment;
(4) ion implantation manufacture process comprises ion implantation equipment, tempering equipment and diffusion furnace;
(5) cleaning equipment comprises dry type cleaning, wet-cleaned and drying equipment;
In semiconductor production process, production stages such as thin film deposition, little shadow, diffusion and etching need carry out repeatedly back and forth owing to the demand on the processing procedure, so the equipment that these several processing procedures use belongs to the main process apparatus in the leading portion production process; The semiconductor rear section encapsulation procedure mainly is encapsulation and the test of carrying out after the wafer manufacturing is finished, and capital equipment is wafer cutting, glutinous crystalline substance, bonding wire, sealing and impresses, and finishes the testing electrical property that is carried out product after the above encapsulation step again by testing equipment.
Because in the middle of these processing procedures, involved the variation of the physics and the chemistry of very many materials, and relevant plant equipment, therefore, can have influence on the yield in the production, especially import new processing procedure or more accurate trickle processing procedure, fraction defective all can be very high, and cost can be in any more, needs the constantly improvement always of very many time, just the certain ratio of this fraction defective decline just may there be real commercial value.
Certainly, with regard to above-mentioned improvement, owing to need expend many human and material resources, time etc., when yield promotes, relative empirical value is unusual preciousness just, because the lifting of this yield, the cost that just equals wafer foundry comparatively speaking reduces, the friendship phase quickens, and increases the advantage of competition at the Foundry inter-plant.
And above-mentioned improvement, with noun, be referred to as process parameter and device parameter again, usually, each wafer foundry all can be considered as top secret with process parameter and the device parameter of oneself, relevant parameter is taken care of with safest mode in the capital, with secret and the competitiveness that ensures oneself, avoid outflow, avoid making oneself spent many human and material resources, and the parameter that obtains of time become the easy weapon that catch up with oneself of rival.
Process parameter and device parameter, except belonging to top secret, usually the parameter that produced in also all can each board certain hour of time recording of wafer foundry, the parameter that yield is high, can be used as the reference of board of the same race, even can duplicate board of the same race and directly improve fraction defective, the parameter that yield is low, also can be used as and revise and follow the trail of the data that fraction defective produces the source, so aforementioned parameters is duplicated and is stored, has very high importance, therefore, how under the requirement of high secret (as banning use of the internet), how will need the parameter of timed backup be fetched in control personnel backup, analyze, be shared with other board to the parameter with the best, this is the problem that anxious desire solves.
In recent years; because the quick prosperity of semiconductor science and technology; make the size of wafer by early stage 5 o'clock; 6 o'clock; 8 o'clock and extremely present 12 o'clock; and with respect to the increase of this wafer size that is representing the raising of chip production capacity and the reduction of cost; and along with the development of different wafer sizes; relative just can have the production equipment that is used for making this epoch wafer; though and the production capacity of the production equipment of this production small size wafer can't compare with the production equipment of large scale wafer; yet; because chip and indifference that both produced; and its difference only is on the production capacity; therefore under the consideration based on cost and economic benefit; can not once the production equipment of old making than the small dimension wafer be eliminated fully; so at present though semiconductor industry has been entered in the field of 12 o'clock wafers; but also there is considerable 8 o'clock wafer production equipment still to devote among the production line in the industry; continuous secondary is waved its economic benefit; but because equipment vendors' based semiconductor technical development speed is quick; all reasons such as consideration of the market demand and cost; therefore its most manpower and material resources all devote in the exploitation and design of new technology; so for the just big neither service that renewal is provided again of wafer production equipment old and that soon eliminate; therefore; the wafer production equipment of this old machine can be utilized to there not being economic benefit till the natural selection usually; and the wafer production equipment of this old machine is brought into play to maximum economic benefits before eliminating; so that obtain bigger interests, be the problem place that the anxious desire of dealer is considered.
Because no longer having, the wafer production equipment of general old machine is updated and service such as upgrading, so it only can only use the software and the hardware of old specification usually, yet because of the development and the renewal speed soft, hardware of computer science and technology very fast, therefore the wafer production equipment of this old specification just can be subjected to this can't upgrading software and the restriction of hardware, and influence its prouctiveness, especially hardware especially regular meeting the embarrassed shape that old specification is no longer produced and be can not find on the market takes place; Come again, because the complexity of wafer equipment, the wafer manufacturing machine is for the spare part of being purchased, in order to allow wafer manufacturing machine steady quality, nearly all adopt full authentication measures, just allow all be used in spare part on the wafer manufacturing machine, can both produce the highest effect, and do not produce the phase mutual interference, allow all spare parts of all wafer manufacturing machines, under its certain communications protocol, finish the work of wafer manufacturing machine peak efficiency, and meet the expectation that wafer factory gives a long price for, and have 3 to 5 years guarantors solid, Part supplying guaranteed in 5 to 15 years.
As under the quality requirement and certain communications protocol of strictness, the industrial computer specification of wafer production equipment is all strictly regulated, for example, Figure 1 and Figure 2, the control system of 8 o'clock wafer production equipment all is designed to the scsi coffret, but to today, scsi coffret equipment very difficulty is sought.
But the front was carried, because the secret of strict software and hardware approval procedure and height, floppy drive becomes the equipment that data are gone in important output at aforementioned wafer manufacturing equipment, but the capacity (1.44MB) that floppy drive is too small, promptly become very slow storage now and read action, and floppy drive is the equipment that has mechanical action and electrical action simultaneously, damage easily and well imagine, diskette sheet is very easy to the damage of making moist again, well imagine that diskette sheet has taken place makes moist and damage and the floppy drive mechanical failure, how poor situation has, even will look for the floppy drive of scsi coffret temporarily, former factory is possible again because spent 5 to 15 year Part supplying guarantee period, and can't continue to provide, and the present computer of floppy drive has not re-used, to buy the difficulty especially of same size on the market, floppy drive can't buy, diskette sheet also very difficulty obtain, this problem is perplexing the user always.
So, in order to store wafer manufacturing machine process parameter and device parameter, and the existing disappearance of floppy drive and diskette sheet, the inventor is design and active research at above-mentioned problem and deeply, goes through long-term effort and improves and have a fling at and development and Design goes out the utility model.
The utility model content:
Technical problem to be solved in the utility model is: at above-mentioned the deficiencies in the prior art, a kind of process parameter and the quick sharing apparatus of device parameter of wafer production equipment are provided, can replace the more old-fashioned floppy drive and the diskette sheet of computer of wafer production equipment, in case the process parameter of wafer production equipment and device parameter have necessary quick storage or share need the time, i.e. the process parameter and the quick sharing apparatus of device parameter of the wafer production equipment that can store in large quantities fast and share.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: the quick sharing apparatus of a kind of process parameter of wafer production equipment and device parameter, it comprises the computer with data transmission interface, be characterized in: also comprise interface switching device, reach plug-in device, this interface switching device comprises virtual module, and have input and an output, this output is connected with described data transmission interface, this input is connected with this plug-in device, and this plug-in device stores or reading of data for medium.
So, the action of virtual module emulation floppy drive is arranged because of this device, allow the industrial computer of original wafer production equipment still differentiate it and be floppy drive, but it all is an electrical action, more than the action of floppy drive complicated machinery fast, more factor is reportedly defeated speeds up, and more can save the time that parameter is uploaded downloads of media, and the usefulness of work is significantly increased; Because of being to utilize existing medium, do not worry therefore that diskette sheet is made moist to damage and the out-of-date and problem that is difficult for seeking of diskette sheet; Because it is many that the medium storage area strengthens than previous diskette sheet, so more can satisfy the industrial computer of wafer factory multi-section wafer production equipment.
Description of drawings:
Fig. 1 is the use embodiment of known 8 o'clock wafer production equipment.
Fig. 2 is known partial enlarged drawing.
Fig. 3 is a stereogram of the present utility model.
Fig. 4 is a system block diagrams of the present utility model.
Fig. 5 is the schematic diagram of interface switching device of the present utility model.
Fig. 6 is the schematic diagram of interface switching device another side of the present utility model.
Label declaration:
1 computer, 2 data transmission interfaces
3 interface switching devices, 31 inputs
32 outputs, 33 chips
34 program languages, 4 virtual modules
5 plug-in devices, 51 calculating punches
52USBPORT 6 medium
61SD 62CF
Carry-on dish 7 floppy drives of 63USB
71 diskette sheets
Embodiment:
Please referring to Fig. 3 to Fig. 6, be a kind of 8 o'clock wafer production equipment, wherein the computer 1 of this 8 o'clock wafer production equipment has data transmission interface 2, and this data transmission interface is as data transfer mode with scsi; One interface switching device 3, it changes the scsi data transmission interface for the usb data coffret, this interface switching device 3 has input 31 and output 32, this input 31 is the usb coffret, output 32 is a scs i coffret, this input 31 connects plug-in device 5, output 32 connects scsi data transmission interface 21, this interface switching device 3 has chip 33, and write the function of interface conversion and the function of virtual module 4 with program language 34, but these virtual module 4 emulation floppy drives read action; This plug-in device 5 is connected in interface switching device 3, and be connected in the input 31 of interface switching device 3, this plug-in device 5 is the usb data coffret, identical with input 31 interfaces, this plug-in device 5 can be calculating punch 51 or USBPORT52, and for medium 6 storage or reading of data, these medium can be SD61, CF62 or when plug-in device was USBPORT52, these medium were the carry-on dish 63 of USB.
So, when medium 6 insert plug-in device 5, write the function of interface switching device and virtual module with program language 34 in its chip 33 because of interface switching device 3, when inserting plug-in device 5, after reading the data of medium 6 earlier, the characteristic of virtual module 4 emulation floppy drives forms data after floppy drive reads with the data that read, and will import USB coffret data via interface switching device 3 and be converted to scsi data transmission interface output, therefore, these data promptly have through floppy drive and read, and tool scsi data transmission interface is exported to computer 1, computer 1 interpretation is previous employed scsi data transmission interface floppy drive, thereby successfully replace commercially available plug-in device 5 with commercially available cheap, fast, jumbo medium 6, (2009, the SD of 16G amount of capacity, CF, the carry-on dish of USB needs only about 30 yuan of U.S. dollar).
So, when the process parameter of wafer production equipment and device parameter have necessary quick storage or share need the time, medium are inserted the plug-in device that is connected in the wafer production equipment computer, virtual module promptly can artificial physical the floppy drive action, the process parameter and the device parameter that read the desire storage or share are reached replacement of wafer production device simple and quick storage or are shared process parameter and the purpose of device parameter.
Owing to the utlity model has said structure, on implementing to use, reality has following plurality of advantages:
1, the action of virtual module emulation floppy drive is arranged because of the utility model, allow the industrial computer of original wafer production equipment still differentiate it and be floppy drive, but it all is an electrical action, more than the action of floppy drive complicated machinery fast, more factor is reportedly defeated speeds up, more can save the time that parameter is uploaded downloads of media, and the usefulness of work is significantly increased.
Therefore 2,, do not worry that diskette sheet is made moist to damage and the out-of-date and problem that is difficult for seeking of diskette sheet because the utility model utilizes existing medium.
3, because the utility model medium storage area strengthens many than previous diskette sheet, so more can satisfy the industrial computer of wafer factory multi-section wafer production equipment, therefore need not be required to be as the industrial computer of previous every wafer production equipment and oneself prepare a slice, solve the problem that keeping is difficult for to several pieces diskette sheets.
Claims (10)
1. the quick sharing apparatus of the process parameter of a wafer production equipment and device parameter, it comprises the computer with data transmission interface, it is characterized in that: also comprise interface switching device, reach plug-in device, this interface switching device comprises virtual module, and have input and an output, this output is connected with described data transmission interface, and this input is connected with this plug-in device, and this plug-in device stores or reading of data for medium.
2. the quick sharing apparatus of the process parameter of wafer production equipment as claimed in claim 1 and device parameter is characterized in that: described data transmission interface is the scsi interface.
3. the quick sharing apparatus of the process parameter of wafer production equipment as claimed in claim 1 and device parameter is characterized in that: described interface switching device is the conversion equipment that usb changes the scsi interface.
4. the quick sharing apparatus of the process parameter of wafer production equipment as claimed in claim 3 and device parameter is characterized in that: described input is the usb coffret, and output is the scsi coffret.
5. the quick sharing apparatus of the process parameter of wafer production equipment as claimed in claim 1 and device parameter is characterized in that: described interface switching device is made of chip.
6. the quick sharing apparatus of the process parameter of wafer production equipment as claimed in claim 5 and device parameter is characterized in that: described virtual module and interface switching device are shared chip.
7. the quick sharing apparatus of the process parameter of wafer production equipment as claimed in claim 1 and device parameter is characterized in that: described virtual module is an emulation floppy drive pattern.
8. the quick sharing apparatus of the process parameter of wafer production equipment as claimed in claim 1 and device parameter is characterized in that: described plug-in device is a calculating punch.
9. the quick sharing apparatus of the process parameter of wafer production equipment as claimed in claim 1 and device parameter is characterized in that: described plug-in device is USBPORT.
10. the quick sharing apparatus of the process parameter of wafer production equipment as claimed in claim 1 and device parameter is characterized in that: described medium are SD, CF or the carry-on dish of USB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010203025370U CN201655763U (en) | 2010-02-08 | 2010-02-08 | Quickly sharing device of process parameter and equipment parameter of wafer fabrication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010203025370U CN201655763U (en) | 2010-02-08 | 2010-02-08 | Quickly sharing device of process parameter and equipment parameter of wafer fabrication equipment |
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| Publication Number | Publication Date |
|---|---|
| CN201655763U true CN201655763U (en) | 2010-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010203025370U Expired - Fee Related CN201655763U (en) | 2010-02-08 | 2010-02-08 | Quickly sharing device of process parameter and equipment parameter of wafer fabrication equipment |
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| CN (1) | CN201655763U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105573269A (en) * | 2014-11-05 | 2016-05-11 | 中芯国际集成电路制造(上海)有限公司 | Parameter monitoring system for semiconductor manufacturing machine and method |
-
2010
- 2010-02-08 CN CN2010203025370U patent/CN201655763U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105573269A (en) * | 2014-11-05 | 2016-05-11 | 中芯国际集成电路制造(上海)有限公司 | Parameter monitoring system for semiconductor manufacturing machine and method |
| CN105573269B (en) * | 2014-11-05 | 2018-06-01 | 中芯国际集成电路制造(上海)有限公司 | The parameter monitoring system and method for semiconductor manufacturing board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101124 Termination date: 20180208 |