CN201574208U - Circuit board clamping device for electroplating - Google Patents
Circuit board clamping device for electroplating Download PDFInfo
- Publication number
- CN201574208U CN201574208U CN2009202617547U CN200920261754U CN201574208U CN 201574208 U CN201574208 U CN 201574208U CN 2009202617547 U CN2009202617547 U CN 2009202617547U CN 200920261754 U CN200920261754 U CN 200920261754U CN 201574208 U CN201574208 U CN 201574208U
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- CN
- China
- Prior art keywords
- gripper
- edge
- frame
- held device
- plate holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model discloses a circuit board clamping device for electroplating, which comprises a two-layer clamping frame and a fixing mechanism thereof, each layer of the clamping frame comprises three clamping edges, wherein two clamping edges are two parallel first clamping edges, another clamping edge is a second clamping edge, two ends of the second clamping edge are respectively connected with one end of each first clamping edge, and the fixing mechanism is used for fixing the two-layer clamping frame. The clamping frame can be applicable to circuit boards with various sizes and specifications, thus greatly reducing the cost; the circuit board clamping device is particularly applied in thin plates, and can prevent folding and deformation of the plates; and the open structure does not need to process the thin plates and the ordinary plates separately, thereby facilitating the proceeding of the electroplating fabrication process.
Description
Technical field
The utility model relates to a kind of PCB (Printed Circuit Board, printed circuit board (PCB)) preparation equipment, relates in particular to a kind of plating and holds device with the circuit plate holder.
Background technology
PCB makes in the industry, the vertical plating refers to adopt vertical PTH and panel plating, the clamping plate mode of vertically electroplating traditional PCB thin plate adopts the Hanging Basket or the mode of clamp up and down, the course of processing must with common plate separate machined, easy fold of plate and distortion in electroplating process simultaneously.
As the circuit board clipping on No. 200820161436.9 disclosed upright plating line of disclosed Chinese utility model patent on August 5th, 2009, it comprises the inflexible rectangular shaped rim; The rigidity holder that at least one pair of can switch between working position and disengaging configuration.When being in the working position, form clip slot between this holder and the described frame, at least a portion at the edge of described wiring board is clamped in the described clip slot.This patent is described these anchor clamps can make slim wiring board not yielding behind upper plate smoothly with wiring board on upright plating line the upper plate of thickness less than 10MIL, and edges of boards can not be torn.
But, the rectangular shaped rim of this patented technology circuit board clipping has limited the size of clamping circuit card, make a kind of circuit card of dimensions need be equipped with a kind of anchor clamps, need to be equipped with the anchor clamps of many different sizes in practice, significantly increase equipment cost and the trouble of selecting use; In addition, the clip slot design between holder and the frame is also comparatively complicated, increases design, material cost; And, especially at the structure of thin plate design, make in the course of processing thin plate must with the common plate separate machined.
The utility model content
The technical problem that the utility model mainly solves provides a kind of plating and holds device with the circuit plate holder, can be suitable for various sizes circuit card, prevent plate fold and distortion, make that thin plate and common plate needn't separate machined.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide a kind of plating to hold device with the circuit plate holder, comprise two-layer gripper frame and fixed mechanism thereof, every layer interlayer frame comprises three gripper edges, wherein two gripper edges are two first parallel gripper edges, another root gripper edge is second gripper edge, and the second gripper edge two ends connect each end of described two first gripper edges respectively, and described fixed mechanism is fixed described two-layer gripper frame.
The beneficial effects of the utility model are: be different from prior art adopt Hanging Basket or up and down clamp cause easy fold of plate and distortion or adopt rectangular shaped rim to cause restricted application scope and the high situation of cost, the utility model adopts open gripper frame result, the existing design of four gripper edges is removed on one side, this that removes makes gripper frame become open architecture on one side, make the utility model gripper frame can be suitable for the circuit card of various sizes, significantly reduce cost; The utility model is particularly suitable for being applied to thin plate, and the shaped as frame clamping can prevent plate fold and distortion, and Open architecture makes that thin plate and common plate needn't separate machined, conveniently the carrying out of plating manufacture craft.
Description of drawings
Fig. 1 is that the utility model is electroplated the synoptic diagram of holding device embodiment with the circuit plate holder;
Fig. 2 is the synoptic diagram one that adopts Fig. 1 embodiment clamping circuit card;
Fig. 3 is the synoptic diagram two that adopts Fig. 1 embodiment clamping circuit card;
Fig. 4 is the synoptic diagram three that adopts Fig. 1 embodiment clamping circuit card;
Fig. 5 adopts the synoptic diagram that splices behind Fig. 1 embodiment clamping circuit card.
Embodiment
By describing technology contents of the present utility model, structural attitude in detail, realized purpose and effect, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
See also Fig. 1, the utility model plating is held device with the circuit plate holder and comprised: two-layer gripper frame (only shows one deck among the figure, another layer is blocked) and fixed mechanism (pilot hole 13 among Fig. 2 and wiring 14 are an embodiment), every layer interlayer frame comprises three gripper edges, wherein two gripper edges are two first parallel gripper edges 11, another root gripper edge is second gripper edge 12, second gripper edge, 12 two ends connect each end of described two first gripper edges 11 respectively, and described fixed mechanism is fixed described two-layer gripper frame.
Consult Fig. 2 together, during use, circuit card 20 is positioned between the two-layer gripper frame, three edges of circuit card are by two-layer gripper frame clamping, and fix the whole then enterprising electroplating of upright plating line that is positioned over by fixed mechanism.Take off circuit card 20 from gripper frame after plating finishes, change other circuit cards and continue to electroplate.
Be different from prior art adopt Hanging Basket or up and down clamp cause easy fold of plate and distortion or adopt rectangular shaped rim to cause restricted application scope and the high situation of cost, the utility model adopts open gripper frame result, the existing design of four gripper edges is removed on one side, on one side this that removes makes gripper frame become open architecture.As Fig. 2, Fig. 3, shown in Figure 4, this Open architecture can significantly reduce cost so that the utility model gripper frame can be suitable for the circuit card of various sizes;
The utility model is particularly suitable for being applied to thin plate, and the shaped as frame clamping can prevent plate fold and distortion, and Open architecture makes that thin plate and common plate needn't separate machined, conveniently the carrying out of plating manufacture craft.
Consult Fig. 2 again, in one embodiment, described fixed mechanism comprises a plurality of pilot holes 13 that are arranged at two-layer gripper frame upper clamp side and the wiring 14 that is arranged in each pilot hole 13 on the two-layer gripper frame continuously respectively, described wiring 14 can be a copper cash, this structure is very simple and practical, and cost is extremely low.
In another embodiment, the length corresponding circuits plate length of described second gripper edge 12 can design according to the pcb board stock size, as 400mm, and 508mm etc.And the material of gripper frame can for: 316 stainless steels, 316 stainless steel thickness, second gripper edge, 12 thickness can be 2mm, and the thickness of first gripper edge 11 can be 1mm.
Wherein, on described first gripper edge 11 each pilot hole 13 from the corresponding various width of circuit board of the distance of second gripper edge 12.Pilot hole 13 spacings are between 50～110mm on described first gripper edge 11.Pilot hole 13 spacings are 80mm on described first gripper edge 11.Described pilot hole 13 diameters can be 5mm, are 2.5mm from the edges of boards distance.
In one embodiment, the length of described first gripper edge 11 is less than the length of described second gripper edge 12.Such as, the length of described first gripper edge 11 is less than the length 50mm of described second gripper edge 12.
Consult Fig. 5, when reality is used, two-layer gripper frame is one group, can use many group gripper frames, described many group gripper frames fixedly install side by side, first gripper edge 11 of gripper frame fixedly first gripper edge 11 of adjacent set gripper frame that continues, first gripper edge 11 and second gripper edge 12 of two adjacent groups gripper frame have been constructed a complete rectangle frame jointly, realize higher physical strength.
Wherein, the edge of the circuit card of the corresponding clamping of point of fixity that continues of described adjacent set gripper frame.
In a word, the utility model designs and produces simply; One frame is used more; Adopt this thin plate frame processing sheet, can together process no particular requirement at upright plating line with common plate.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification sheets and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (10)
1. a plating is held device with the circuit plate holder, it is characterized in that, comprise two-layer gripper frame and fixed mechanism thereof, every layer interlayer frame comprises three gripper edges, wherein two gripper edges are two first parallel gripper edges, another root gripper edge is second gripper edge, and the second gripper edge two ends connect each end of described two first gripper edges respectively, and described fixed mechanism is fixed described two-layer gripper frame.
2. plating according to claim 1 is held device with the circuit plate holder, it is characterized in that: described fixed mechanism comprises a plurality of pilot holes that are arranged at two-layer gripper frame upper clamp side and the wiring that is arranged in each pilot hole on the two-layer gripper frame continuously respectively.
3. plating according to claim 2 is held device with the circuit plate holder, it is characterized in that: the length corresponding circuits plate length of described second gripper edge.
4. plating according to claim 3 is held device with the circuit plate holder, it is characterized in that: each pilot hole is from the corresponding various width of circuit board of the distance of second gripper edge on described first gripper edge.
5. plating according to claim 3 is held device with the circuit plate holder, it is characterized in that: the pilot hole spacing is between 50～110mm on described first gripper edge.
6. plating according to claim 5 is held device with the circuit plate holder, it is characterized in that: the pilot hole spacing is 80mm on described first gripper edge.
7. plating according to claim 3 is held device with the circuit plate holder, it is characterized in that: the length of described first gripper edge is less than the length of described second gripper edge.
8. plating according to claim 6 is held device with the circuit plate holder, it is characterized in that: the length of described first gripper edge is less than the length 50mm of described second gripper edge.
9. each described plating is held device with the circuit plate holder according to claim 2 to 8, it is characterized in that: two-layer gripper frame is one group, comprise many group gripper frames, described many group gripper frames fixedly install side by side, first gripper edge of gripper frame fixedly first gripper edge of adjacent set gripper frame that continues.
10. plating according to claim 9 is held device with the circuit plate holder, it is characterized in that: the edge of the circuit card of the corresponding clamping of point of fixity that continues of described adjacent set gripper frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202617547U CN201574208U (en) | 2009-12-15 | 2009-12-15 | Circuit board clamping device for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202617547U CN201574208U (en) | 2009-12-15 | 2009-12-15 | Circuit board clamping device for electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201574208U true CN201574208U (en) | 2010-09-08 |
Family
ID=42694084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202617547U Expired - Fee Related CN201574208U (en) | 2009-12-15 | 2009-12-15 | Circuit board clamping device for electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201574208U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427683A (en) * | 2011-09-30 | 2012-04-25 | 常州市协和电路板有限公司 | PTH (Plated Through Hole) production process of thin plate and tool of PTH production process |
| CN102828224A (en) * | 2012-08-06 | 2012-12-19 | 景旺电子科技(龙川)有限公司 | Board clamping method used in electroplating of PCB board |
-
2009
- 2009-12-15 CN CN2009202617547U patent/CN201574208U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427683A (en) * | 2011-09-30 | 2012-04-25 | 常州市协和电路板有限公司 | PTH (Plated Through Hole) production process of thin plate and tool of PTH production process |
| CN102828224A (en) * | 2012-08-06 | 2012-12-19 | 景旺电子科技(龙川)有限公司 | Board clamping method used in electroplating of PCB board |
| CN102828224B (en) * | 2012-08-06 | 2015-08-19 | 景旺电子科技(龙川)有限公司 | Splinting approach during a kind of pcb board plating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100908 Termination date: 20131215 |