CN201562743U - Novel LTCC microwave band-pass filter - Google Patents
Novel LTCC microwave band-pass filter Download PDFInfo
- Publication number
- CN201562743U CN201562743U CN2009201793202U CN200920179320U CN201562743U CN 201562743 U CN201562743 U CN 201562743U CN 2009201793202 U CN2009201793202 U CN 2009201793202U CN 200920179320 U CN200920179320 U CN 200920179320U CN 201562743 U CN201562743 U CN 201562743U
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- metallic conductor
- electric capacity
- pass filter
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Abstract
The utility model discloses a superminiature novel LTCC microwave band-pass filter applied to all kinds of hand-held terminal communication systems including Bluetooth system and Wireless Local Area Network (WLAN) system. The filter comprises a base and a circuit layer arranged in the base, the outside of the base is provided with a first input/output terminal, a second input/output terminal and an earth terminal, each circuit layer is arranged in parallel to form an inductance and an interplate capacitance. The utility model adopts the LTCC technology, not only the production time is saved and the cost is reduced, but also the dielectric medium is not easy to oxidize, the sacrificial protection is not required, and the size of the circuit is greatly reduced.
Description
Technical field
The utility model discloses a kind of SMD filter, and particularly a kind of being applicable in the various handheld terminal communication systems comprises the SMD microwave band-pass filter of microminiature in Bluetooth system and the wireless lan (wlan) system.
Background technology
In wireless communication system, microwave band-pass filter is one of very important element, and it can suppress the harmonic signal beyond the operating frequency range, and the loss of signal in the operating frequency range is little.The miniaturization of band-pass filter component is the irresistible trend of wireless communication system, and traditional filter progressively can not satisfy people's requirement.The appearance of LTCC technology is for the development of antenna miniaturization provides important support.From LTCC band pass filter 3225 sizes (3.2mm*2.5mm) 3216 sizes (3.2mm*1.6mm) finally before, again to 2012 sizes (2.0mm*1.2mm), each new miniaturization scheme of step brings new challenge all for the LTCC industry, in order to improve the performance of LTCC band pass filter, the band that improves the LTCC band pass filter suppresses outward, the band that will increase the LTCC band pass filter transmits zero point outward, not only will keep performance unaffected, reduces size of component again.
Summary of the invention
At the above-mentioned bulky shortcoming of mentioning of microwave band-pass filter of the prior art, the utility model provides the miniaturization microwave band-pass filter that adopts the LTCC technology to produce.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of novel LTCC microwave band-pass filter, filter comprises matrix and is arranged on the interior circuit layer of matrix, the matrix outside is provided with the first input output termination, second input output termination and the ground connection termination, each circuit layer be arranged in parallel, and circuit layer comprises successively:
Ground floor, a tabular metallic conductor;
The second layer, the tabular metallic conductor of two mutually insulateds, with two electric capacity that are connected in series of metallic conductor formation in the ground floor, two tabular metallic conductors in the second layer are electrically connected with an input output termination respectively;
The 3rd layer, two interconnective helical metal electric conductors, two helical metal electric conductors are symmetrically distributed about tie point, form two interconnective inductance;
The 4th layer, the tabular metallic conductor of two mutually insulateds is connected with a helical metal electric conductor in the 3rd layer by conductive pole respectively;
The technical scheme that its technical problem that solves the utility model adopts further comprises:
The described first input output termination and the second input output termination are separately positioned on the matrix two ends.
Described ground connection termination is arranged on the matrix centre position.
Described ground connection termination respectively is provided with one in the matrix both sides.
Metallic conductor in the described layer 7 is shape axisymmetricly, is electrically connected with ground connection termination, both sides respectively.
The beneficial effects of the utility model are: the utility model adopts the LTCC technology, has not only saved the production time, has reduced cost, and dielectric is difficult for oxidation, does not need to electroplate protection, has significantly reduced the size of circuit.
Below in conjunction with the drawings and specific embodiments the utility model is described further.
Description of drawings
Fig. 1 is the utility model perspective view.
Fig. 2 is the utility model internal structure schematic diagram.
Fig. 3 is the utility model equivalent circuit diagram.
Fig. 4 is the utility model ground floor circuit layer structural representation.
Fig. 5 is the utility model second layer circuit layer structural representation.
Fig. 6 is the 3rd layer of circuit layer structural representation of the utility model.
Fig. 7 is the 4th layer of circuit layer structural representation of the utility model.
Fig. 8 is the utility model layer 5 circuit layer structural representation.
Fig. 9 is the utility model layer 6 circuit layer structural representation.
Figure 10 is the utility model layer 7 circuit layer structural representation.
Among the figure, the 1-first electric capacity substrate, the 2-second electric capacity substrate, 3-the 3rd electric capacity substrate, the 4-first inductance substrate, the 5-second inductance substrate, 6-the 4th electric capacity substrate, 7-the 5th electric capacity substrate, 8-the 6th electric capacity substrate, 9-the 7th electric capacity substrate, 10-the 8th electric capacity substrate, 11-the 9th electric capacity substrate, 12-ground capacity substrate, the 13-first metallic conductor post, the 14-second metallic conductor post, 15-the 3rd metallic conductor post, 16-the 4th metallic conductor post, the 17-matrix, the 20-first I/O termination, 21-indicates, the 22-first ground connection termination, the 23-second ground connection termination, the 24-second I/O termination.
Embodiment
Present embodiment is the utility model preferred implementation, and other all its principles are identical with present embodiment or approximate with basic structure, all within the utility model protection range.
Please referring to accompanying drawing 3, the utility model equivalent electric circuit main body is two groups of filter units that are connected in series, comprise the inductance L 1 and the capacitor C 1 that are connected in parallel in first filter unit, comprise inductance L 2 and capacitor C 2 in second filter unit, the common end grounding of first filter unit and second filter unit, first filter unit by capacitor C C1 and first import output be connected, second filter unit by capacitor C C2 and second input output is connected, first import output and second import be connected with capacitor C between the output.Wherein, capacitor C C1 and capacitor C C2 are the I/O coupling capacitances, and capacitor C is a cross coupling capacitor, and capacitor C 1 and capacitor C 2 are two ground capacities.
Low-temp ceramics altogether burning technology (being LTCC) is meant in temperature and is lower than 1000 ℃, and the metals such as gold, silver, copper that can adopt high conductivity are as conducting medium, and all circuit are laminated in and carry out disposable sintering together.
Please referring to accompanying drawing 1, the utility model mainly comprises matrix 17 and is arranged on the circuit layer in the matrix of being arranged in the matrix 17, in the present embodiment, matrix 17 adopts relative dielectric constant to make than the ceramic medium material of higher (7～15), matrix 17 outsides are provided with the first input output termination 20, second input output termination 24 and the ground connection termination, in the present embodiment, the first input output termination 20 and the second input output termination 24 are separately positioned on matrix 17 two ends, the ground connection termination is arranged on matrix 17 centre positions, both sides respectively are provided with one, be symmetrical distribution, be respectively the first ground connection termination 22 and the second ground connection termination 23.In the present embodiment, each circuit layer in the matrix 17 be arranged in parallel, please referring to accompanying drawing 2 and accompanying drawing 4 to accompanying drawing 10, circuit layer comprises successively:
Please in conjunction with referring to accompanying drawing 2 and accompanying drawing 4, ground floor is a tabular metallic conductor, i.e. the first electric capacity substrate 1, and it utilizes screen printing technique to be printed on the ceramic dielectric substrate;
Please in conjunction with referring to accompanying drawing 2 and accompanying drawing 5, the second layer is the tabular metallic conductor of two mutually insulateds, the i.e. second electric capacity substrate 2 and the 3rd electric capacity substrate 3, the second electric capacity substrate 2 and the 3rd electric capacity substrate 3 respectively with ground floor in the first electric capacity substrate 1 form two electric capacity that are connected in series, two electric capacity that is connected in series is the capacitor C in the equivalent circuit diagram, two tabular metallic conductors in the second layer are electrically connected with the first input output termination 20 and the second input output termination 24 respectively, also there is the little electric capacity of mutual coupling between two electric capacity substrates in this layer, performance of the present utility model is had certain influence;
Please in conjunction with referring to accompanying drawing 2 and accompanying drawing 6, the 3rd layer is two interconnective snail shape metallic conductors, the i.e. first inductance substrate 4 and the second inductance substrate 5, the first inductance substrate 4 and the second inductance substrate, 5 outboard ends interconnect, the first inductance substrate 4 and the second inductance substrate 5 are symmetrical distribution about tie point, form two interconnective inductance, be inductance L 1 and inductance L 2 in the equivalent circuit diagram, coupling is contribution to space coupling amount M between two inductance substrates in this layer, and the operating frequency of LTCC filter is had conclusive effect;
Please in conjunction with referring to accompanying drawing 2 and accompanying drawing 7, the 4th layer is the tabular metallic conductor of two mutually insulateds, be the 4th electric capacity substrate 6 and the 5th electric capacity substrate 7, the 4th electric capacity substrate 6 is electrically connected with the medial extremity of the first inductance substrate 4 by the 3rd metallic conduction post 15, and the 5th electric capacity substrate 7 is electrically connected with the medial extremity of the second inductance substrate 5 by the 4th metallic conduction post 16;
Please in conjunction with referring to accompanying drawing 2 and accompanying drawing 8, layer 5 is the tabular metallic conductor of two mutually insulateds, be the 6th electric capacity substrate 8 and the 7th electric capacity substrate 9, the 6th electric capacity substrate 8 is electrically connected with the first input output termination 20, the 7th electric capacity substrate 9 is electrically connected with the second input output termination 24, the 4th electric capacity substrate 6 of the 6th electric capacity substrate 8 and the 4th layer forms electric capacity, be the capacitor C C1 in the equivalent circuit diagram, the 5th electric capacity substrate 7 of the 7th electric capacity substrate 9 and the 4th layer forms electric capacity, be the capacitor C C2 in the equivalent circuit diagram;
Please in conjunction with referring to accompanying drawing 2 and accompanying drawing 9, layer 6 is the tabular metallic conductor of two mutually insulateds, i.e. the 8th electric capacity substrate 10 and the 9th electric capacity substrate 11, the 8th electric capacity substrate 10 is electrically connected by the 4th electric capacity substrate 6 of the first metallic conductor post 13 with the 4th layer, and the 9th electric capacity substrate 11 passes through second metallic conductor and firmly 14 is electrically connected with the 4th layer the second inductance substrate 5;
Please in conjunction with referring to accompanying drawing 2 and accompanying drawing 10, layer 7 is one a tabular metallic conductor, i.e. the tenth electric capacity substrate 12, the tenth electric capacity substrate 12 is electrically connected with the first ground connection termination 22 and the second ground connection termination 23 respectively, the 8th electric capacity substrate 10 in the tenth electric capacity substrate 12 and the layer 6 forms electric capacity, the 9th electric capacity substrate 11 that is in capacitor C 1, the ten electric capacity substrate 12 and the layer 6 forms electric capacity, is capacitor C 2.
In the present embodiment, the first input output termination 20 and the second input output termination 24 all are to adopt the electrocondution slurry dipping and electroplate tin, the first ground connection termination 22 and the second ground connection termination 23 are to adopt the electrocondution slurry printing and electroplate tin, and half guarantees its conductivity and welding easily.In the present embodiment, matrix 17 surfaces are provided with and indicate 21, are used for discerning the bottom surface and the front of product structure, indicate 21 and adopt the glaze printing of special colors and burn till type altogether with the LTCC band pass filter.In order to guarantee the weldability of the first ground connection termination 22 and the second ground connection termination 23 in the utility model, leave ledge at upper surface of the present utility model and lower surface.
The size of the conventional capacity plate antenna (metal-insulator-metal) in the utility model is decided by the size of the relative dielectric constant of dull and stereotyped area size, insulating medium layer, and the distance between two flat boards.Platen area is big more, and electric capacity is big more; Relative dielectric constant is big more, and electric capacity is big more; Dull and stereotyped distance is more little, and electric capacity is bigger.5 two spiral metal conductor lines of the first inductance substrate 4 in the utility model and the second inductance substrate form the inductance of two mutual coupling, these two inductance are coupled mutually and form the key that the space electromagnetic coupled is the coupling of the utility model band self-energy, are determining the insertion loss in the passband.Can regulate space electromagnetic coupled amount by regulating two distances between coupling coil, make it can in operating frequency range, form the space coupled resonance.
The utility model can be by the length and the wide size of adjusting electric capacity of regulating each electric capacity substrate, and two planar inductors are the main body of the utility model coupling energy, have determined the central task frequency of filter.The utility model can replace conventional filter and be widely used in fields such as communication.
Claims (5)
1. novel LTCC microwave band-pass filter, it is characterized in that: described filter comprises matrix and is arranged on the interior circuit layer of matrix, the matrix outside is provided with the first input output termination, second input output termination and the ground connection termination, and each circuit layer be arranged in parallel, and circuit layer comprises successively:
Ground floor, a tabular metallic conductor;
The second layer, the tabular metallic conductor of two mutually insulateds, with two electric capacity that are connected in series of metallic conductor formation in the ground floor, two tabular metallic conductors in the second layer are electrically connected with an input output termination respectively;
The 3rd layer, two interconnective helical metal electric conductors, two helical metal electric conductors are symmetrically distributed about tie point, form two interconnective inductance;
The 4th layer, the tabular metallic conductor of two mutually insulateds is connected with a helical metal electric conductor in the 3rd layer by conductive pole respectively;
Layer 5, the tabular metallic conductor of two mutually insulateds, with two shunt capacitances of metallic conductor formation of the 4th layer, two tabular metallic conductors in the layer 5 are electrically connected with an input output termination respectively;
Layer 6, the tabular metallic conductor of two mutually insulateds, two metallic conductors in the layer 6 are electrically connected with a metallic conductor in the 4th layer by conductive pole respectively;
Layer 7, one tabular metallic conductor is electrically connected with the ground connection termination, and respectively with layer 6 in two tabular metallic conductors form an electric capacity.
2. novel LTCC microwave band-pass filter according to claim 1 is characterized in that: the described first input output termination and the second input output termination are separately positioned on the matrix two ends.
3. novel LTCC microwave band-pass filter according to claim 1 is characterized in that: described ground connection termination is arranged on the matrix centre position.
4. novel LTCC microwave band-pass filter according to claim 1 is characterized in that: described ground connection termination respectively is provided with one in the matrix both sides.
5. novel LTCC microwave band-pass filter according to claim 4, it is characterized in that: the metallic conductor in the described layer 7 is shape axisymmetricly, is electrically connected with ground connection termination, both sides respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201793202U CN201562743U (en) | 2009-09-19 | 2009-09-19 | Novel LTCC microwave band-pass filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201793202U CN201562743U (en) | 2009-09-19 | 2009-09-19 | Novel LTCC microwave band-pass filter |
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| Publication Number | Publication Date |
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| CN201562743U true CN201562743U (en) | 2010-08-25 |
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| CN2009201793202U Expired - Lifetime CN201562743U (en) | 2009-09-19 | 2009-09-19 | Novel LTCC microwave band-pass filter |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950834A (en) * | 2010-09-26 | 2011-01-19 | 深圳市麦捷微电子科技股份有限公司 | Minitype WiFi band-pass filter |
| CN102231452A (en) * | 2011-04-15 | 2011-11-02 | 深圳市麦捷微电子科技股份有限公司 | Low temperature co-fired ceramic (LTCC) filter production process and LTCC filter |
| CN103066347A (en) * | 2013-01-15 | 2013-04-24 | 深圳市麦捷微电子科技股份有限公司 | Novel low temperature co-fired ceramic (LTCC) laminated slice-type duplexer |
| CN103413994A (en) * | 2013-08-01 | 2013-11-27 | 南京理工大学 | X-band high-suppression micro band-pass filter |
| WO2020093697A1 (en) * | 2018-11-08 | 2020-05-14 | 京信通信技术(广州)有限公司 | Dielectric waveguide filter and input/output structure thereof |
-
2009
- 2009-09-19 CN CN2009201793202U patent/CN201562743U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950834A (en) * | 2010-09-26 | 2011-01-19 | 深圳市麦捷微电子科技股份有限公司 | Minitype WiFi band-pass filter |
| CN101950834B (en) * | 2010-09-26 | 2012-11-28 | 深圳市麦捷微电子科技股份有限公司 | Minitype WiFi band-pass filter |
| CN102231452A (en) * | 2011-04-15 | 2011-11-02 | 深圳市麦捷微电子科技股份有限公司 | Low temperature co-fired ceramic (LTCC) filter production process and LTCC filter |
| CN103066347A (en) * | 2013-01-15 | 2013-04-24 | 深圳市麦捷微电子科技股份有限公司 | Novel low temperature co-fired ceramic (LTCC) laminated slice-type duplexer |
| CN103066347B (en) * | 2013-01-15 | 2015-07-01 | 深圳市麦捷微电子科技股份有限公司 | Novel low temperature co-fired ceramic (LTCC) laminated slice-type duplexer |
| CN103413994A (en) * | 2013-08-01 | 2013-11-27 | 南京理工大学 | X-band high-suppression micro band-pass filter |
| CN103413994B (en) * | 2013-08-01 | 2015-09-30 | 南京理工大学 | X-band high-suppression micro band pass filter |
| WO2020093697A1 (en) * | 2018-11-08 | 2020-05-14 | 京信通信技术(广州)有限公司 | Dielectric waveguide filter and input/output structure thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100825 |